CN217484795U - Mini computer convenient to heat dissipation - Google Patents

Abstract

The application relates to the technical field of computer hosts, in particular to a mini computer convenient for heat dissipation, which comprises a shell, a mainboard and a heat dissipation fan; the main board is arranged at the middle section in the shell, and the heat dissipation fan is arranged above one surface of the main board; the side wall of the shell is provided with heat dissipation holes; a wind channel plate is fixedly connected to one side, close to the heat dissipation holes, of the inside of the shell, and a guide wind channel used for guiding wind blowing from the upper portion of the main board to the two sides of the main board to the lower portion of the main board is arranged on the wind channel plate. This application has the effect with the timely discharge of the heat that mainboard top and below produced simultaneously.

Description

Mini computer convenient to heat dissipation

Technical Field

The application relates to the technical field of computer hosts, in particular to a mini computer convenient for heat dissipation.

Background

With the increasing application level and the expanding application range, the mini computer becomes an intelligent electronic device with more use. In the mini computer, a main board, a Central Processing Unit (CPU), a memory, a hard disk and the like of a conventional desktop computer are put into a unique and exquisite box, and the size of the mini computer is similar to that of a book. However, like a conventional desktop computer, a mini computer also generates heat during use, and therefore, the heat needs to be removed to ensure normal use.

In the related art, a mini computer usually has a fan mounted on a CPU above a main board to blow heat away from the CPU. Besides the CPU, other electronic components or batteries below the motherboard of the mini-computer may also generate heat.

In the related art, because the fan is installed above the CPU, heat generated by electronic components or batteries on the other side of the motherboard cannot be blown away, and therefore, the problem that heat below the motherboard cannot be discharged in time exists.

SUMMERY OF THE UTILITY MODEL

In order to discharge the heat that produces mainboard top and below in time simultaneously, this application provides a mini computer convenient to heat dissipation.

The application provides a mini computer convenient to heat dissipation adopts following technical scheme:

a mini computer convenient for heat dissipation comprises a shell, a mainboard and a heat dissipation fan; the main board is arranged in the middle section in the shell, and the heat dissipation fan is arranged above one surface of the main board; the side wall of the shell is provided with heat dissipation holes; a wind path board is fixedly connected to one side, close to the heat dissipation holes, of the inner portion of the shell, and a guide wind path used for guiding wind blowing to the two sides above the main board to the lower portion of the main board is arranged on the wind path board.

Through adopting above-mentioned technical scheme, the mainboard is two parts about the middle section in the casing falls into casing inside, and radiator fan installs the one side top of mainboard, takes away the mainboard top from the heat. The wind path board is fixedly connected to one side in the shell, and meanwhile, the wind path board is provided with the guide wind channel.

Optionally, the air circuit board has an air inlet portion, a reversing portion and an air outlet portion, the reversing portion is located between the air inlet portion and the air outlet portion, and the reversing portion is aligned with the main board; the air inlet part is positioned above the reversing part and is positioned on the same surface with the radiating fan, and meanwhile, the air inlet part inclines towards the main board; the air outlet part is positioned below the reversing part and faces the main board in an inclined mode.

By adopting the technical scheme, the radiating fan and the air inlet part are positioned on the same surface, and meanwhile, the air inlet part inclines towards the main board, so that the wind blown by the radiating fan can enter the reversing part from the air inlet part. Wind gets into behind the switching-over portion and is changed the wind direction, gets into air-out portion because air-out portion is towards the mainboard slope for wind blows to the another side of mainboard from air-out portion, thereby realizes the leading-in below to the mainboard of wind.

Optionally, an air passing groove is formed in the upper surface of the air duct plate; the air passing groove penetrates through the air duct plate towards the direction close to or far away from the heat dissipation hole.

Through adopting above-mentioned technical scheme, when wind blows to the wind circuit board, partly pass from the overfire wind groove and directly blow to the louvre, take away partly heat earlier, thereby avoid leading to the heat too high with the heat stack of other parts of mainboard. Meanwhile, the other part of air flows to the lower part of the mainboard after absorbing heat through the air path plate, takes away the heat below the mainboard and flows out of the heat dissipation holes.

Optionally, the mini computer convenient for heat dissipation further comprises a heat dissipation module; the heat dissipation module comprises a heat radiator which is arranged on the mainboard and is positioned on the same surface with the heat dissipation fan; and a plurality of radiating fins facing the radiating holes are arranged on one side of the radiator away from the main board, and radiating channels are formed among the radiating fins.

Through adopting above-mentioned technical scheme, the heat that the mainboard produced can be absorbed to the fin, and the heat dissipation channel that forms between the fin makes radiator fan blow off wind not in disorder scatter towards all directions again simultaneously, can effectually blow toward the louvre direction with wind restriction.

Optionally, a top surface wind shielding plate is installed at the top of the radiator, and a side surface wind shielding plate for blocking an outlet at one side of the heat dissipation channel is installed on the side surface of the radiator; the side wind shielding plate is arranged on one side far away from the wind path plate.

By adopting the technical scheme, the top surface of the top of the radiator is provided with the wind shielding plate, so that wind blown out by the radiating fan is not dissipated from the upper part of the radiator any more, and the wind is ensured to flow out of the radiating channel between the radiators and take away heat as far as possible. Meanwhile, the side wind shielding plate shields an outlet on one side of the heat dissipation channel, which is far away from the wind circuit board, and ensures that wind blows to the wind circuit board as far as possible, thereby blowing to the lower part of the main board and blowing to the heat dissipation holes to take away heat.

Optionally, a fan mounting boss and a fan mounting groove are arranged on the radiator; the heat radiation fan comprises a mounting strip mounted on the fan mounting boss and a fan main body fixedly connected with the mounting strip; the top surface wind shielding plate is provided with a fan mounting hole, and the fan main body penetrates through the fan mounting hole to be buckled and connected in the fan mounting groove.

Through adopting above-mentioned technical scheme, mounting bar and fan main part fixed connection, and the mounting bar is connected with fan installation boss for fan main part passes fan mounting hole lock in the fan mounting groove, guarantees in the wind that fan main part blew off directly gets into the radiating passage between the radiator as far as, thereby more takes away the heat.

Optionally, the heat dissipation module further includes a compression spring and a compression column connected to the compression spring, the heat sink has a connection and installation through hole connected to the compression column, and the column main board is provided with a heat dissipation installation through hole; the compressing column is provided with a locking section, a connecting section and a limiting section, the part of the compressing column, which penetrates through the connecting and mounting through hole in the heat dissipation module and is locked with the heat dissipation mounting through hole, is the locking section, the connecting part of the compressing spring and the compressing column is the connecting section, and one end of the compressing column, which is far away from the locking section, is the limiting section; the hold-down spring simultaneously the radiator with spacing section butt joint.

Through adopting above-mentioned technical scheme, when the locking section that compresses tightly the post was locked with the heat dissipation installation through-hole, hold-down spring on the linkage segment was with radiator and the spacing section butt simultaneously that compresses tightly the post, and hold-down spring is owing to compressed tightly the production elasticity for the radiator is compressed tightly by elasticity. Meanwhile, the compressing column does not directly contact with the radiator, so that the phenomenon that the radiator is stressed unevenly due to over looseness or over tightness when the compressing column is directly used is avoided.

Optionally, the outer surface of the shell is provided with a mounting buckle fixedly connected with the shell and a mounting rack connected with the mounting buckle; the mounting frame is provided with a buckling mounting hole connected with the mounting buckle and a shell connecting hole connected with the outside, and the mounting buckle comprises a mounting head and a mounting rod; the buckling mounting hole is provided with an extending part for extending into the mounting head and a fixing part for fixing the mounting rod, and the extending part is communicated with the fixing part. After the mounting head enters the extending part, the mounting rod slides to the fixing part, and the mounting head is limited by the fixing part.

Through adopting above-mentioned technical scheme, the installation is detained fixed connection on the casing, and after installation head got into the portion of stretching into on the lock mounting hole, the installation pole slided to the fixed part, and the installation head was spacing by the fixed part for the installation head can't break away from the fixed part, thereby realizes that the mounting bracket fixes on the casing. The shell connecting hole on the mounting rack can be connected with an external part, so that the whole mini computer is fixed.

In summary, the present application includes at least one of the following beneficial technical effects:

1. and circularly radiating. The heat dissipation fan is arranged in a fan installation groove of the radiator, heat dissipation fins on the radiator absorb heat, a heat dissipation channel is formed between the heat dissipation fins, and meanwhile the top surface wind shielding plate and the side surface wind shielding plate shield the four scattered wind so that the wind blows to the wind path board as far as possible. One part of wind passes through the wind passing groove and blows away from the heat dissipation holes, the other part of wind passes through the guide wind channel on the wind path plate, and the wind enters from the wind inlet part and blows to the reversing part, changes direction at the reversing part, and then blows to the lower part of the main board from the wind outlet part, and takes away heat below the main board.

2. And is connected with the outside. The installation is detained fixed connection and is being connected on the casing, and after installation head got into the portion of stretching into on the lock mounting hole, the installation pole slided to the fixed part, and the installation head is spacing by the fixed part to realize that the mounting bracket is fixed on the casing. The shell connecting hole on the mounting rack can be connected with an external part, so that the whole mini computer is fixed.

Drawings

FIG. 1 is a schematic diagram illustrating an overall structure of a mini computer with heat dissipation convenience according to an embodiment of the present disclosure;

FIG. 2 is an exploded view of a mini computer for dissipating heat according to an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view of a housing of a mini computer for facilitating heat dissipation according to an embodiment of the present application;

FIG. 4 is a cross-sectional front view of a housing of a mini computer for facilitating heat dissipation according to an embodiment of the present application;

FIG. 5 is an exploded view of the motherboard, the heat dissipation module and the heat dissipation fan of a mini computer for facilitating heat dissipation according to an embodiment of the present application;

FIG. 6 is an enlarged partial cross-sectional view of a mini computer compression post for facilitating heat dissipation according to an embodiment of the present application.

Description of the reference numerals

1. A housing; 11. a wind path plate; 111. a guide air duct; 112. an air passing groove; 113. an air inlet part; 114. a commutation section; 115. an air outlet part; 12. heat dissipation holes; 13. installing a buckle; 131. a mounting head; 132. mounting a rod; 14. a mounting frame; 141. a housing attachment hole; 142. buckling the mounting hole; 143. an insertion portion; 144. a fixed part;

2. a main board; 21. a heat dissipating mounting through hole;

3. a heat radiation fan; 31. mounting a bar; 32. a fan main body;

4. a heat dissipation module; 41. a heat sink; 411. a fan mounting boss; 412. a fan mounting groove; 413. a heat sink; 414. a heat dissipation channel; 415. connecting the mounting through holes; 42. a top surface wind shield plate; 421. a fan mounting hole; 43. a side wind shield plate; 44. a compression spring; 45. a compression post; 451. a locking section; 452. a connecting section; 453. a limiting section.

Detailed Description

The present application is described in further detail below with reference to fig. 1-6.

Referring to fig. 1 and 2, a mini computer convenient for heat dissipation includes a housing 1, a main board 2, a heat dissipation fan 3, and a heat dissipation module 4. Mainboard 2 passes through the bolt mounting in the inside middle section of casing 1, and heat dissipation module 4 installs the one side near CPU on mainboard 2, and radiator fan 3 passes through the bolt mounting on heat dissipation module 4 simultaneously. The outer portion of the casing 1 is provided with an installation buckle 13 and an installation frame 14, the installation buckle 13 is fixedly connected to the outer portion of the casing 1, and the installation buckle 13 is connected with the installation frame 14. The mounting frame 14 has a housing connecting hole 141 and a fastening mounting hole 142, while the mounting fastener 13 is divided into a mounting head 131 and a mounting rod 132, the fastening mounting hole 142 can be divided into an extending part 143 for extending into the mounting head 131 and a fixing part 144 for fixing the mounting rod 132, and the extending part 143 is communicated with the fixing part 144. After the mounting head 131 enters the extending portion 143, the mounting rod 132 slides to the fixing portion 144 and the mounting head 131 is limited by the fixing portion 144, so that the mounting head 131 cannot be separated from the fixing portion 144, and the mounting frame 14 is fixed by the mounting buckle 13. In addition, the housing attachment hole 141 of the mounting rack 14 can be connected to the outside, so that the mini computer can be connected to other components through the mounting rack 14.

Referring to fig. 2 and 3, heat dissipation holes 12 for dissipating heat are formed in the side walls of the housing 1, and a wind plate 11 is fixedly connected to one side of the housing 1 near the heat dissipation holes 12. The wind channel plate 11 comprises a guide wind channel 111 and a wind passing groove 112, and the wind passing groove 112 is arranged to enable a part of wind to pass through the wind passing groove 112 on the wind channel plate 11 and flow out from the heat dissipation holes 12, so that heat superposition with other places is avoided.

Referring to fig. 3 and 4, another portion of the wind passes through the guide duct 111, and the guide duct 111 is specifically divided into an air inlet portion 113, a direction changing portion 114, and an air outlet portion 115. The diverter 114 is aligned with the main panel 2 and is located intermediate the air inlet 113 and air outlet 115. The air inlet portion 113 is located above the reversing portion 114, the air outlet portion 115 is located below the reversing portion 114, the air inlet portion 113 and the air outlet portion 115 are inclined towards the main board 2, and meanwhile the air inlet portion 113, the reversing portion 114 and the air outlet portion 115 are fixedly connected and integrally formed. The air enters from the air inlet portion 113, changes the direction of the air when flowing through the reversing portion 114, and blows from the air outlet portion 115 to the lower portion of the main board 2, thereby taking away the heat generated by the electronic components below the main board 2.

Referring to fig. 5 and 6, the heat dissipation fan 3 includes a mounting bar 31 and a fan main body 32 fixedly connected to the mounting bar 31, the fan main body 32 can continuously blow air, and the mounting bar 31 is used for fixing the fan main body 32. The heat dissipation module 4 includes a heat sink 41, a top surface wind shielding plate 42, and a side surface wind shielding plate 43. The heat sink 41 includes a plurality of heat dissipating fins 413 for absorbing heat, a heat dissipating channel 414 facing the heat dissipating holes 12 is formed between the plurality of heat dissipating fins 413, and the heat on the heat dissipating fins 413 is taken away by the wind through the heat dissipating channel 414 and flows out of the heat dissipating holes 12. The heat sink 41 has a fan mounting groove 412 for mounting the fan body 32 thereon, and wind from the fan is blown into the fan mounting groove 412. In order to cooperate with the mounting bar 31, the heat sink 41 further includes a fan mounting boss 411 bolted to the mounting bar 31 for securing the fan body 32 in the fan mounting groove 412.

Referring to fig. 5 and 6, the top surface louver 42 is installed on the top of the heat sink 41 to prevent the wind blown from the heat dissipation fan 3 from escaping from the top, and the top surface louver 42 is provided with a fan installation hole 421 to ensure that the heat dissipation fan 3 can be installed on the heat sink 41. The side wind shielding plate 43 is installed on one side of the heat sink 41 far away from the wind path plate 11, and blocks one side of wind, so that the wind blows to the wind path plate 11 as much as possible. In order to fix the heat sink 41, the main board 2 is provided with a heat dissipating mounting through hole 21, the heat dissipating module 4 comprises a pressing column 45 locked with the heat dissipating mounting through hole 21, the heat dissipating module 4 is provided with a connecting mounting through hole 415 for the pressing column 45 to pass through and lock the heat sink 41, and the pressing column 45 is connected with a pressing spring 44. The locking part of the pressing column 45 and the heat dissipation installation through hole 21 is a locking section 451, the part of the pressing column 45 connected with the pressing spring 44 is a connecting section 452, and the part of the pressing column 45 far away from the locking section 451 is a limiting section 453. When the pressing column 45 penetrates through the heat sink 41 and is locked on the main board 2, the pressing spring 44 abuts against the heat sink 41 and the limiting section 453 at the same time, the pressing spring 44 is pressed tightly to have elastic force, so that the heat sink 41 is pressed tightly through the elastic force, and meanwhile, because the pressing column 45 does not directly contact the heat sink 41, the phenomenon that the stress of the heat sink 41 is uneven due to the fact that the pressing column 45 is too loose or too tight when being directly used is avoided.

The implementation principle is as follows:

when the mini computer is working, heat is generated, the heat sink 413 on the heat dissipation module 4 absorbs the heat and the heat dissipation fan 3 blows out the air, and the air takes away the heat from the heat dissipation channel 414. Part of the air passes through the air passing groove 112 on the air duct plate 11 and is blown out from the heat dissipation holes 12, and part of the air is blown to the lower part of the main plate 2 through the air inlet part 113, the reversing part 114 and the air outlet part 115, takes away the heat below the main plate 2 and is blown out from the heat dissipation holes 12 on the other side. The top surface louver 42 and the side surface louver 43 prevent the dissipation of the air blown from the heat dissipating fan 3, and blow the air toward the air passage plate 11 as much as possible.

The embodiments of the present invention are preferred embodiments of the present application, and the protection scope of the present application is not limited thereby, wherein like parts are denoted by like reference numerals. Therefore, the method comprises the following steps: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. A mini computer convenient for heat dissipation is characterized by comprising a shell (1), a mainboard (2) and a heat dissipation fan (3); the main board (2) is arranged at the middle section in the shell (1), and the heat radiation fan (3) is arranged above one surface of the main board (2); the side wall of the shell (1) is provided with heat dissipation holes (12); casing (1) inside is close to one side fixed connection of louvre (12) has wind circuit board (11), just be provided with on wind circuit board (11) and be used for with mainboard (2) top blow to leading-in mainboard (2) below direction wind channel (111) of wind of both sides.

2. The mini computer facilitating heat dissipation according to claim 1, wherein the air circuit board (11) has an air inlet portion (113), a direction changing portion (114), and an air outlet portion (115), the direction changing portion (114) is located between the air inlet portion (113) and the air outlet portion (115), and the direction changing portion (114) is aligned with the main board (2); the air inlet part (113) is positioned above the reversing part (114) and is positioned on the same surface with the heat radiation fan (3), and meanwhile, the air inlet part (113) inclines towards the main board (2); the air outlet part (115) is positioned below the reversing part (114) and inclines towards the main board (2).

3. The mini computer facilitating heat dissipation according to claim 1, wherein the air duct plate (11) is provided with an air passing groove (112) on the upper surface; the air passing groove (112) penetrates through the air duct plate (11) towards the direction close to or far away from the heat dissipation hole (12).

4. The mini computer facilitating heat dissipation according to claim 1, further comprising a heat dissipation module (4); the heat dissipation module (4) comprises a heat sink (41) which is arranged on the main board (2) and is positioned on the same surface with the heat dissipation fan (3); and a plurality of radiating fins (413) facing the radiating holes (12) are arranged on one side of the radiator (41) far away from the mainboard (2), and radiating channels (414) are formed among the radiating fins (413).

5. The mini computer facilitating heat dissipation according to claim 4, wherein a top surface wind shielding plate (42) is installed on top of the heat sink (41); a side wind shielding plate (43) for blocking an outlet on one side of the heat dissipation channel (414) is arranged on the side surface of the heat radiator (41); the side wind shielding plate (43) is arranged on one side far away from the wind path plate (11).

6. The mini computer convenient for heat dissipation as defined in claim 5, wherein the heat sink (41) is provided with a fan mounting boss (411) and a fan mounting groove (412); the heat radiation fan (3) comprises a mounting bar (31) mounted on the fan mounting boss (411) and a fan main body (32) fixedly connected with the mounting bar (31); the top surface wind shielding plate (42) is provided with a fan mounting hole (421), and the fan main body (32) penetrates through the fan mounting hole (421) to be connected in the fan mounting groove (412) in a buckling mode.

7. The mini computer facilitating heat dissipation according to claim 4, wherein the heat dissipation module (4) further comprises a compression spring (44) and a compression post (45) connected to the compression spring (44), the heat sink (41) has a connection mounting through hole (415) connected to the compression post (45), and the main board (2) is provided with a heat dissipation mounting through hole (21); the pressing column (45) is provided with a locking section (451), a connecting section (452) and a limiting section (453), the part of the pressing column (45) which penetrates through the connecting and mounting through hole (415) in the heat dissipation module (4) and is locked with the heat dissipation mounting through hole (21) is the locking section (451), the connecting part of the pressing spring (44) and the pressing column (45) is the connecting section (452), and one end of the pressing column (45) far away from the locking section (451) is the limiting section (453); the pressing spring (44) is simultaneously abutted with the radiator (41) and the limiting section (453).

8. The mini computer facilitating heat dissipation as claimed in claim 1, wherein the housing (1) is externally provided with a mounting buckle (13) fixedly connected and a mounting rack (14) connected with the mounting buckle (13); the mounting frame (14) is provided with a buckling mounting hole (142) connected with the mounting buckle (13) and a shell connecting hole (141) connected with the outside, and the mounting buckle (13) comprises a mounting head (131) and a mounting rod (132); the buckling installation hole (142) is provided with an extending part (143) for extending into the installation head (131) and a fixing part (144) for fixing the installation rod (132), and the extending part (143) is communicated with the fixing part (144); after the installation head (131) enters the extending part (143), the installation rod (132) slides to the fixing part (144), and the installation head (131) is limited by the fixing part (144).

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