CN217479573U

CN217479573U - Metal electroplating processing device

Info

Publication number: CN217479573U
Application number: CN202220666493.2U
Authority: CN
Inventors: 吴卫东; 庹钧; 石兴无; 余必伟
Original assignee: Sichuan Ruiboda Technology Co ltd
Current assignee: Sichuan Ruiboda Technology Co ltd
Priority date: 2022-03-24
Filing date: 2022-03-24
Publication date: 2022-09-23
Anticipated expiration: 2032-03-24

Abstract

The utility model discloses a metal electroplating processing device, relating to the technical field of electroplating devices. Including electroplating mechanism, electroplating mechanism back mounted has the transfer mechanism, electroplating mechanism is including electroplating the pond, and anodal subassembly is installed to electroplating pond top one side, and electroplating pond top opposite side is embedded installs the current conducting plate, and the position of electroplating pond top position in current conducting plate top is installed and is processed the subassembly, and processing subassembly and current conducting plate looks adaptation are electroplated mutually installed to the pond, and electroplating pond openly installs the power box, and the power box both sides are connected with anodal subassembly and current conducting plate through the wire respectively, and electroplating pond back fixedly connected with backplate. The utility model discloses a current conducting plate of connecting between the utilization power supply box that sets up can utilize the distribution board to transmit the electric current to the power supply of fixing between the splint through contact picture peg and current conducting plate and combination on the processing subassembly when placing with the processing subassembly, and the formation is opened circuit when taking out the processing subassembly from to do not need frequent break-off current, improve the convenience of operation with this.

Description

Metal electroplating processing device

Technical Field

The utility model relates to an electroplate device technical field, specifically be a metal electroplating processing device.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), improve the appearance and the like, and electroplating equipment is required to be used for operation during electroplating.

The existing electroplating equipment is complicated in the feeding and discharging processes, and needs to frequently cut off the power supply of the equipment during use, so that the complexity of equipment operation is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a metal electroplating processing device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a metal electroplating processing device, includes electroplating mechanism, electroplating mechanism back mounted has the transfer mechanism, electroplating mechanism includes the electroplating pool, and the anodal subassembly is installed to electroplating pool top one side, and electroplating pool top opposite side is embedded installs the current conducting plate, and electroplating pool top position installs the processing subassembly in the position of current conducting plate top, and processing subassembly and current conducting plate looks adaptation, electroplating pool openly installs the power box, and the power box both sides are connected with anodal subassembly and current conducting plate through the wire respectively, electroplating pool back fixedly connected with backplate, the transfer mechanism is installed at the backplate top.

Preferably, the processing subassembly includes the diaphragm, diaphragm top fixedly connected with steadying frame, steadying frame top center fixedly connected with rings, rings and transfer mechanism looks adaptation, the embedded distributor plate that installs in diaphragm bottom, distributor plate bottom both sides fixedly connected with contact picture peg respectively, contact picture peg and conducting plate looks adaptation, distributor plate bottom equidistance is provided with two liang splint that set up in groups, and the splint side all runs through and is provided with fixing bolt.

Preferably, the positive electrode assembly comprises a sealing plate fixed at the top of the electroplating pool, at least two graphite columns are installed at the bottom of the sealing plate, and the graphite columns are connected with the wires.

Preferably, the transfer mechanism includes the swivel mount, and the swivel mount is fixed at the backplate top, swivel mount top fixedly connected with fixed plate, and fixed plate top both sides are fixed respectively and have the limit frame, and the position between two limit rest bottoms is rotated and is connected with the wind-up roll, one of them limit frame side-mounting has the driving motor of drive wind-up roll, and the position between two limit rest tops is rotated and is connected with the knock-out roll, the winding of wind-up roll outer wall has the lifting rope, and the lifting rope other end is through fixedly connected with lifting hook behind the knock-out roll, lifting hook and processing subassembly looks adaptation.

Preferably, a push rod is installed at the center of the top of the fixing plate, a balancing weight is fixedly connected to the output end of the push rod, and the balancing weight can slide on the fixing plate.

Preferably, the top of the electroplating pool is fixedly connected with a central cover plate at a position between the processing assembly and the positive assembly.

Preferably, the controller is installed to the electroplating pond side, power box and transfer mechanism respectively with controller electric connection.

Compared with the prior art, the beneficial effects of the utility model are that:

this metal plating processingequipment through the current conducting plate that connects between the utilization power supply box that sets up, can be when the processing subassembly is placed through contact picture peg and the current conducting plate on the processing subassembly and combine, utilize the distribution board to transmit the electric current to fixing on the power supply between the splint, will process the subassembly and take out the time formation and open circuit to do not need frequent disconnection current, improve the convenience of operation with this.

Meanwhile, the transfer mechanism is arranged on the back face of the electroplating mechanism, and the drive motor on the transfer mechanism is used for driving the winding roller to wind and unwind the lifting rope, so that the transfer and installation of the machining assembly can be controlled, and tools can be conveniently installed and placed.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of the transfer mechanism of the present invention;

FIG. 3 is a schematic view of the structure of the electroplating mechanism of the present invention;

FIG. 4 is a schematic view of a disassembly structure of the electroplating mechanism of the present invention;

fig. 5 is a schematic view of the structure of the processing assembly of the present invention.

In the figure: 1. an electroplating mechanism; 101. electroplating pool; 102. a positive electrode assembly; 103. a central cover plate; 104. processing the assembly; 105. a power supply box; 106. a back plate; 107. a controller; 108. a transverse plate; 109. a stabilizer frame; 110. a hoisting ring; 111. a conductive plate; 112. a distributor plate; 113. a contact plug board; 114. a splint; 115. fixing the bolt; 116. a graphite column; 117. closing the plate; 2. a transfer mechanism; 201. rotating; 202. a fixing plate; 203. a side frame; 204. a drive motor; 205. a wind-up roll; 206. a top roll; 207. a lifting rope; 208. a hook; 209. a push rod; 210. and a balancing weight.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that, in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Further, it will be appreciated that the dimensions of the various elements shown in the figures are not drawn to scale, for ease of description, and that the thickness or width of some layers may be exaggerated relative to other layers, for example.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined or illustrated in one figure, it will not need to be further discussed or illustrated in detail in the description of the following figure.

Examples

When carrying out the electroplating operation of panel, used, the utility model provides a pair of metal electroplating processing device, can convenient and fast carry out the electroplating operation of panel, need guarantee direct current's supply when using this equipment, the inside rectifier that is provided with of power supply line, can shift the direct current with the alternating current of input, and can change the voltage of inputing on processing subassembly 104 and positive subassembly 102, realize the constitution of circuit part with this, need place the plating solution in electroplating bath 101 inside when electroplating, thereby can utilize the inside metal ion completion of plating solution to electroplate the effect, the graphite rod on positive subassembly 102 can be changed to the metal rod of plating the material.

As shown in fig. 1-5, the utility model provides a technical solution: the utility model provides a metal electroplating processingequipment, including electroplating mechanism 1, electroplating mechanism 1 back mounted has transfer mechanism 2, electroplating mechanism 1 includes electroplating bath 101, positive pole subassembly 102 is installed to electroplating bath 101 top one side, electroplating bath 101 top opposite side is embedded installs current-conducting plate 111, processing subassembly 104 is installed to the position that electroplating bath 101 top is located current-conducting plate 111 top, processing subassembly 104 and current-conducting plate 111 looks adaptation, electroplating bath 101 openly installs power box 105, power box 105 both sides are connected with positive pole subassembly 102 and current-conducting plate 111 through the wire respectively, electroplating bath 101 back fixedly connected with backplate 106, transfer mechanism 2 installs at backplate 106 top, electroplating bath 101 top is located the position fixedly connected with center apron 103 between processing subassembly 104 and the positive pole subassembly 102, electroplating bath 101 side-mounting has controller 107, power box 105 and transfer mechanism 2 respectively with controller 107 electric connection.

It should be noted that the power supply box 105, the positive electrode assembly 102, the processing assembly 104 and the plating solution inside the plating cell 101 form a loop together, the connection between the processing assembly 104 and the power supply box 105 is completed through the U-shaped conductive plate 111, the processing assembly 104 can be lifted and lowered by the transfer mechanism 2, the path of the whole plating circuit can be realized when the processing assembly 104 is placed into the plating cell 101, the whole circuit is broken when the processing assembly 104 is lifted, the current is transmitted to the power supply fixed between the clamping plates 114 through the contact insertion plate 113 and the conductive plate 111 on the processing assembly 104 and the combination, and the processing assembly 104 is broken when the processing assembly 104 is pulled away, so that the current does not need to be disconnected frequently, thereby improving the convenience of operation.

The processing assembly 104 comprises a transverse plate 108, a stabilizing frame 109 is fixedly connected to the top of the transverse plate 108, a lifting ring 110 is fixedly connected to the center of the top of the stabilizing frame 109, the lifting ring 110 is matched with the transfer mechanism 2, a distribution plate 112 is installed at the bottom of the transverse plate 108 in an embedded mode, contact insertion plates 113 are fixedly connected to two sides of the bottom of the distribution plate 112 respectively, the contact insertion plates 113 are matched with a conductive plate 111, two clamping plates 114 which are arranged in groups in pairs are arranged at the bottom of the distribution plate 112 at equal intervals, fixing bolts 115 are arranged on the side faces of the clamping plates 114 in a penetrating mode, the positive assembly 102 comprises a sealing plate 117 fixed to the top of the electroplating pool 101, at least two graphite columns 116 are installed at the bottom of the sealing plate 117, and the graphite columns 116 are connected with wires.

Transfer mechanism 2 includes swivel mount 201, swivel mount 201 is fixed at backplate 106 top, swivel mount 201 top fixedly connected with fixed plate 202, fixed plate 202 top both sides are the fixed limit frame 203 that has even respectively, position between two limit frame 203 bottoms is rotated and is connected with wind-up roll 205, one of them limit frame 203 side-mounting has the driving motor 204 of drive wind-up roll 205, position between two limit frame 203 tops is rotated and is connected with top roll 206, wind-up roll 205 outer wall winding has lifting rope 207, the lifting rope 207 other end is through top roll 206 back fixedly connected with lifting hook 208, lifting hook 208 and processing subassembly 104 looks adaptation, push rod 209 is installed at fixed plate 202 top center, push rod 209 output fixedly connected with balancing weight 210, balancing weight 210 can slide on fixed plate 202.

It should be noted that, the transfer mechanism 2 disposed on the back of the electroplating mechanism 1 can suspend and rotate the machining assembly 104 as a whole, and can assist with other adaptations, and the drive motor 204 on the transfer mechanism 2 drives the wind-up roller 205 to wind and unwind the lifting rope 207, so as to control the transfer and installation of the machining assembly 104, and thus, the installation and placement of tools can be performed conveniently.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a metal plating processingequipment, includes electroplating mechanism (1), its characterized in that: electroplating mechanism (1) back mounted has transfer mechanism (2), electroplating mechanism (1) is including electroplating pond (101), and anodal subassembly (102) are installed to electroplating pond (101) top one side, and electroplating pond (101) top opposite side is embedded installs current-conducting plate (111), and electroplating pond (101) top is located the position of current-conducting plate (111) top and installs processing subassembly (104), processing subassembly (104) and current-conducting plate (111) looks adaptation, electroplating pond (101) openly install power box (105), and power box (105) both sides are connected with anodal subassembly (102) and current-conducting plate (111) through the wire respectively, and electroplating pond (101) back fixedly connected with backplate (106), transfer mechanism (2) are installed at backplate (106) top.

2. A metal plating processing apparatus according to claim 1, characterized in that: processing subassembly (104) is including diaphragm (108), diaphragm (108) top fixedly connected with stabilizer (109), stabilizer (109) top center fixedly connected with rings (110), rings (110) and transfer mechanism (2) looks adaptation, diaphragm (108) bottom embedded the installing has distribution board (112), distribution board (112) bottom both sides respectively fixedly connected with contact picture peg (113), contact picture peg (113) and current conducting plate (111) looks adaptation, distribution board (112) bottom equidistance is provided with splint (114) of two liang setting in groups, and splint (114) side all runs through and is provided with fixing bolt (115).

3. A metal plating processing apparatus according to claim 1, characterized in that: the positive electrode assembly (102) comprises a sealing plate (117) fixed to the top of the electroplating pool (101), at least two graphite columns (116) are mounted at the bottom of the sealing plate (117), and the graphite columns (116) are connected with a lead.

4. A metal plating processing apparatus according to claim 1, characterized in that: transfer mechanism (2) including swivel mount (201), swivel mount (201) are fixed at backplate (106) top, swivel mount (201) top fixedly connected with fixed plate (202), and fixed plate (202) top both sides are fixed respectively and have limit frame (203), and position between two limit frame (203) bottoms rotates and is connected with wind-up roll (205), one of them limit frame (203) side-mounting has driving motor (204) of drive wind-up roll (205), and position between two limit frame (203) tops rotates and is connected with top roll (206), wind-up roll (205) outer wall winding has lifting rope (207), and fixedly connected with lifting hook (208) behind top roll (206), lifting hook (208) and processing subassembly (104) looks adaptation are crossed to the other end of lifting rope (207).

5. A metal plating processing apparatus according to claim 4, characterized in that: push rod (209) are installed at fixed plate (202) top center, and push rod (209) output end fixedly connected with balancing weight (210), and balancing weight (210) can slide on fixed plate (202).

6. A metal plating processing apparatus according to claim 1, characterized in that: the top of the electroplating pool (101) is fixedly connected with a central cover plate (103) at a position between the processing assembly (104) and the positive assembly (102).

7. A metal plating processing apparatus according to claim 1, characterized in that: the side surface of the electroplating pool (101) is provided with a controller (107), and the power supply box (105) and the transfer mechanism (2) are respectively electrically connected with the controller (107).