CN217459314U

CN217459314U - Condensate drop springboard

Info

Publication number: CN217459314U
Application number: CN202123433609.2U
Authority: CN
Inventors: 马晨; 袁志平; 郑泉水
Original assignee: Tsinghua University
Current assignee: Tsinghua University
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-09-20
Anticipated expiration: 2031-12-30

Abstract

The utility model discloses a condensation liquid drop springboard, condensation liquid drop springboard has the thin wall pit micro-structure of micron yardstick, the condensation liquid drop only grows in each single pit of thin wall pit micro-structure and not grow on the lateral wall top surface of single pit, condensation liquid drop springboard surface is equipped with the super hydrophobic layer. The utility model discloses a condensation liquid drop springboard, condensation liquid drop bounce probability is stable, can be used to antifog/prevent dew, anti-icing material and use, also can be arranged in the soaking plate of heat dissipation usefulness.

Description

Condensate drop springboard

Technical Field

The utility model belongs to the technical field of antifog dew, anti-freeze, heat dissipation etc. and specifically relates to a condensation liquid drop springboard is related to.

Background

Condensation is a physical phenomenon that is visible everywhere in life, such as dew in the morning, fogging of swimming goggles, water drops in a mask, and the like. Meanwhile, the method is also an indispensable important link in industrial production, hot steam of a power plant needs to be returned to a liquid state again through condensation, a drought area needs to evaporate and condense seawater to extract water resources, and a refrigerator/air conditioner realizes refrigeration by means of evaporation and condensation circulation of working media.

The super-hydrophobic surface is taken as a novel research hotspot in the year 2000, and has great superiority in the fields of antifogging, high-efficiency condensation and the like. The chip has wide application prospect in the aspects of surface antifogging/dewing prevention, anti-icing, efficient chip heat dissipation, aerospace craft heat management and the like.

Because the droplet adhesion on the super-hydrophobic surface is extremely low, when the micro droplets (10-100 mu m) generated by condensation are combined, the released surface energy is converted into kinetic energy, and the droplets are promoted to bounce off the surface. Due to the efficient drop separation mode of 'bounce separation', the radius of the residual condensed drops on the super-hydrophobic surface is hundreds of microns, and is far smaller than the drop separation radius (mm order) of the traditional columnar condensed surface. On the one hand, smaller residual droplets, less residual volume means better antifog properties. On the other hand, the smaller the residual droplets, the greater the number of droplets participating in condensation, at the same surface area. Because the condensation heat resistance of the small liquid drops is lower, the super-hydrophobic surface shows a higher heat exchange coefficient and is also the representation of the heat exchange efficiency.

However, at present, the size of the droplets cannot be controlled by all super-hydrophobic surfaces, and the separation probability of the condensed droplets cannot be guaranteed due to the randomness of nucleation, growth, combination and separation of the condensed droplets. With the lapse of condensation time, the occurrence of large droplets is inevitable, so that the antifogging/dewing-preventing, anti-icing and heat-dissipating efficiencies are deteriorated.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a condensed liquid drop springing board, which has stable bouncing probability of condensed liquid drop, can be used as an anti-fog/anti-dew, anti-icing material, and can also be used in a vapor chamber for heat dissipation.

According to the utility model discloses condensate drop springboard, condensate drop springboard surface has the thin wall pit micro-structure of micron yardstick, the condensate drop only grows in each single pit of thin wall pit micro-structure and not grow on the lateral wall top surface of single pit, condensate drop springboard surface is equipped with super hydrophobic layer.

According to the embodiment of the utility model, the condensate drop springboard adopts a micron-scale thin-wall pit microstructure, and utilizes the reinforced bouncing principle, so that the high-stability bouncing of condensate drops can be realized, the high-stability bouncing rate of the condensate drops reaches 95% -100%, the bouncing speed can reach 2 m/s-4 m/s, and the residue of the condensate drops on the condensate drop springboard is avoided or greatly reduced, so that the springboard can be used as an anti-fog/anti-dew and anti-icing material; the heat exchange coefficient of the springboard is calculated by theory and is improved by 40 percent compared with the best level in the world at present, therefore, the springboard can also be used as a high-efficiency condensing material, for example, the springboard is used as a condensing board in a soaking board, and the heat conduction capability of the soaking board can be greatly improved.

In some embodiments, a plurality of pits are arranged in the thin-wall pit microstructure, and the plurality of pits are uniformly arranged on the surface of the condensed liquid drop bouncing plate.

In some embodiments, the shape and size of individual pits of the thin-walled pit microstructure are the same or different.

In some embodiments, the thickness of the side wall of each pit in the thin-wall pit microstructure is 0.5-2 microns.

In some embodiments, the cross-sectional area of a single condensed droplet is less than or equal to 150% of the cross-sectional area of a single dimple of the thin-walled dimple microstructure.

In some embodiments, the cross-sectional area of a single pit in the thin-walled pit microstructure is 250-600 μm ² 。

In some embodiments, the thin-walled dimple microstructure is a grid microstructure or an egg-tray microstructure.

In some embodiments, individual grid shapes in the grid microstructure are square, triangular, or polygonal.

In some embodiments, the thickness of the side wall of each grid in the grid microstructure is 0.8-2 microns; the height of the grid microstructure is 8-12 micrometers; the width of the grid microstructure is 15-25 micrometers.

In some embodiments, the super-hydrophobic layer is a copper oxide layer and/or a Glaco coating.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural view of a condensate droplet springboard according to an embodiment of the present invention.

Fig. 2a is a schematic view illustrating the growth of condensate droplets in the thin-walled pit microstructure of the condensate droplet springboard according to the embodiment of the present invention.

Fig. 2b is a schematic diagram of the condensation droplet fusion in the thin-walled pit microstructure of the condensation droplet springboard according to the embodiment of the present invention.

Fig. 2c is a schematic diagram of the condensate droplet enhanced bounce after the condensate droplet is fused in the thin-wall pit microstructure of the condensate droplet bounce plate according to the embodiment of the present invention.

Fig. 3a is a schematic diagram of a grid microstructure of a condensate droplet springboard according to an embodiment of the present invention, wherein each individual grid of the grid microstructure is square in shape.

Fig. 3b is a schematic diagram of a grid microstructure of a condensate droplet springboard according to an embodiment of the present invention, wherein each individual grid of the grid microstructure is in a regular hexagon shape.

Fig. 3c is a schematic diagram of a grid microstructure of a condensate droplet springboard according to an embodiment of the present invention, wherein each individual grid of the grid microstructure is in a regular triangle shape.

Fig. 4a is a schematic perspective view of a grid microstructure of a condensate droplet springboard according to an embodiment of the present invention, wherein each individual grid of the grid microstructure is square.

Fig. 4b is a top view of fig. 4 a.

Fig. 4c is a cross-sectional view at a-a of fig. 4 b.

Fig. 5 to 7 are effect views of comparative experiments of the thin-wall pit microstructure (grid microstructure) of the condensate droplet springboard and the traditional superhydrophobic surface according to the embodiment of the present invention.

Fig. 8 and 9 are electron micrographs of the positive direction grid microstructure of the condensate droplet springboard of the embodiment of the present invention before and after coating the Glaco coating.

Reference numerals:

condensate drop springboard 1000 thin-wall pit microstructure 1 side wall thickness D, height H, width W

Multiple sidewall intersections G capillary driving force F

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The condensate droplet springboard 1000 of the embodiment of the present invention is described below with reference to fig. 1 to 9.

As shown in fig. 1 to 4c, a condensate droplet springboard 1000 according to an embodiment of the present invention. The surface of the condensate droplet springboard 1000 is provided with a micrometer-scale thin-wall pit microstructure 1, condensate droplets only grow in each single pit of the thin-wall pit microstructure 1 and do not grow on the top surface of the side wall of the single pit, and the surface of the condensate droplet springboard 1000 is provided with a super-hydrophobic layer.

Specifically, the surface of the condensate droplet springboard 1000 has a micrometer-scale thin-wall pit microstructure 1, where the "micrometer scale" in the "micrometer-scale thin-wall pit microstructure 1" is understood to mean that the sidewall thickness D (refer to fig. 4c), the width W (refer to fig. 4b), and the height H (refer to fig. 4c) of each single pit in the thin-wall pit microstructure 1 are all in the micrometer scale range; the thin wall in the thin-wall pit microstructure 1 refers to the side wall with the micrometer-scale thickness of each single pit in the thin-wall pit microstructure 1, namely the side wall between every two adjacent pits, the side wall thickness D (shown in fig. 4c) of each single pit is designed to be a specific micrometer scale, the top surface area of the side wall of each single pit can be ensured to be very small, and the condensate droplets can not grow on the top surface of the side wall of each single pit, so that the condensate droplets can be prevented from growing on the top surface of the side wall of each single pit, the condensate droplets can only nucleate and grow in each single pit (shown in fig. 1 and fig. 2 a), the condensate droplets can be considered as grown condensate droplets when growing to the size equivalent to the size of the pits (shown in fig. 2 a), the grown condensate droplets in two adjacent pits are fused (shown in fig. 2 b), due to the existence of the thin wall, the internal flow direction of the fused condensed liquid drop is induced to the out-of-plane direction, and the thin wall provides the out-of-plane capillary driving force F for the liquid drop, and under the action of the capillary driving force F, the fused liquid drop can bounce off the condensed liquid drop bouncing plate 1000 at high speed like an arrow (as shown in fig. 2 c). Because the width W and the height H of the pit in the thin-wall pit microstructure 1 are both in the micrometer scale range, the radius size of the condensed liquid drop grown in the thin-wall pit microstructure 1 can be better limited, the size of the condensed liquid drop is controlled in the range invisible to naked eyes, and the maximum condensed liquid drop radius is lower than the highest level of the world by more than 30%. Ensuring that no large droplets (as shown with reference to fig. 5) are present on the condensate droplet springboard 1000; then, because the super-hydrophobic layer is arranged on the surface of the condensate drop springing board 1000, the condensate drops in the pits almost grow in a spherical shape, and the grown condensate drops in the adjacent pits are fused and then are easier to separate from the surfaces of the pits for bouncing; therefore, the micrometer-scale thin-wall pit microstructure 1 can realize the high-stability bounce of condensed liquid drops, the high-stability bounce rate of the condensed liquid drops reaches 95% -100%, the bounce speed can reach 2 m/s-4 m/s, the residue of the condensed liquid drops on the condensed liquid drop springboard 1000 is avoided or greatly reduced, and the volume of the residual liquid is lower than the highest level of the world by more than 30%, so that the springboard 1000 can be used as an anti-fog/anti-dew and anti-icing material; the springboard 1000 may also be used as a high efficiency condensing material, for example, as a cold plate in a vapor chamber.

As shown in fig. 5 to fig. 7, the condensing effect between the thin-walled pit microstructure 1 with a super-hydrophobic layer and the common planar super-hydrophobic surface of the condensate droplet springboard 1000 of the present invention is described through experimental data.

As shown in fig. 5, because the utility model discloses a thin wall pit microstructure 1 of super hydrophobic layer of taking of condensate droplet springboard 1000 is to the intensive spring effect of liquid drop, and the condensate droplet on thin wall pit microstructure 1 surface can break away from the surface earlier, can not appear big liquid drop, and the liquid droplet radius on thin wall pit microstructure 1 surface can be restricted below 20 microns, and naked eye is invisible. But the droplet radius of the superhydrophobic surface, which was not machined with the thin-walled pitted microstructure 1 but obtained in the same manner, exceeded 100 microns, with large droplets visible to the naked eye.

The maximum droplet radius and the residual liquid volume are important parameters for the condensation effect of both reactions. The maximum droplet radius refers to the radius of the largest droplet that appears on the surface at a certain moment, and the residual liquid volume refers to the volume of residual liquid per unit area at a certain moment. The smaller the maximum drop radius and the residual liquid volume, the better, the smaller means the greater the drainage capacity. As shown in fig. 6 and 7, the surface of the thin-wall pit microstructure 1 is greatly improved compared with the super-hydrophobic surface obtained in the same manner, the maximum liquid drop radius and the residual liquid volume can be quickly stabilized and kept at a lower level, the stabilized residual liquid volume is more than 30% lower than the best result in the world, and the heat exchange coefficient of the condensed liquid drop springboard 1000 is theoretically estimated to be 40% higher than the best result in the world.

The experimental result fully reflects the effect of the thin-wall pit microstructure 1 on promoting the condensate drop to bounce off the surface.

According to the utility model discloses condensate droplet springboard 1000, adopt thin wall pit microstructure 1 of micron yardstick, utilize and strengthen the bounce principle, can realize the high stable bounce of condensate droplet, the high stable bounce rate of condensate droplet reaches 95% ~ 100%, bounce speed can reach 2 ms ~ 4 ms, avoid or reduce the condensate droplet residue on condensate droplet springboard 1000 widely, thereby make springboard 1000 can be used as antifog/anti-dew, anti-icing material, for example, when this springboard 1000 is used in the shell of basic station, can prevent that the shell surface of basic station has fog or dew or ice to produce, thereby can reduce the interference of fog, dew, ice to the basic station signal, guarantee the stability of basic station signal; the heat exchange coefficient of the springboard 1000 is calculated by theory and is improved by 40% compared with the current best level in the world, therefore, the springboard 1000 can also be used as a high-efficiency condensing material, for example, as a condensing board in a soaking board, and the heat conduction capability of the soaking board can be greatly improved.

In some embodiments, a plurality of pits are arranged in the thin-wall pit microstructure 1, and the plurality of pits are uniformly arranged on the surface of the condensed liquid drop bouncing plate. That is to say, a plurality of pits in the thin-wall pit microstructure 1 are uniformly arranged, so that condensed liquid drops on the thin-wall pit microstructure 1 are uniformly distributed, the condensed liquid drops are more easily fused and bounce, and the stable bounce probability is high.

In some embodiments, the shape and size of the individual pits of the thin-walled pit microstructure 1 are the same or different. Specifically, the shapes of the single pits of the thin-wall pit microstructure 1 may be the same, for example, the shapes of the single pits of the thin-wall pit microstructure 1 shown in fig. 3a are all squares, the shapes of the single pits of the thin-wall pit microstructure 1 shown in fig. 3b are all regular hexagons, and the shapes of the single pits of the thin-wall pit microstructure 1 shown in fig. 3c are all regular triangles; the shapes of the single pits of the thin-wall pit microstructure 1 can also be different, for example, part of the pits are square, part of the pits are circular, and part of the pits can also be in other shapes. In short, as long as the thin-wall pit microstructure enables condensed liquid drops to grow only in each single pit of the thin-wall pit microstructure 1 and not on the top surface of the side wall of the single pit, the grown condensed liquid drops in two adjacent pits are fused and bounced, and the shapes of the single pits of the thin-wall pit microstructure 1 can be the same or different without specific limitation. The sizes of the single pits of the thin-wall pit microstructure 1 may be the same, for example, the sizes of the single square pits of the thin-wall pit microstructure 1 shown in fig. 3a are the same, the sizes of the single regular hexagonal pits of the thin-wall pit microstructure 1 shown in fig. 3b are the same, and the sizes of the single regular triangular pits of the thin-wall pit microstructure 1 shown in fig. 3c are the same; the individual pit sizes of the thin-walled pit microstructure 1 may also be different or slightly different.

In some embodiments, the sidewall thickness D of an individual dimple in the thin-walled dimple microstructure 1 is 0.5 to 2 microns. The thickness of the side wall of each single pit is designed within the range of 0.5-2 microns, so that the area of the top surface of the side wall of each single pit is very small, and condensed liquid drops generated by high-temperature working medium steam on the top surface of the side wall of each single pit can be avoided.

In some embodiments, the cross-sectional area of a single condensed droplet is less than or equal to 150% of the cross-sectional area of a single dimple in the thin-walled dimple microstructure 1. This is because when the condensed droplets grow to 150% of the cross-sectional area of the pit, they will inevitably merge with the droplets in the adjacent pits and bounce off the surface under the enhanced condensation effect of the thin wall, creating a good cycle on the surface of the thin-walled pit microstructure 1. Therefore, in some embodiments of the present invention, the cross-sectional area of a single condensed droplet on the cold surface is always less than or equal to 150% of the cross-sectional area of a single pit in the thin-walled pit microstructure 1, and the condensed droplets on the cold surface are all small droplets with a dense and uniformly distributed hemp (refer to the small droplets represented by the thin-walled grid microstructure in fig. 5), when the cross-sectional area of a single condensed droplet reaches 150% of the cross-sectional area of a single pit in the thin-walled pit microstructure 1, adjacent condensed droplets will merge and bounce off the cold surface, and since the condensation thermal resistance of a large droplet is greater than that of a small droplet, the surface of the thin-walled pit microstructure 1 can greatly improve the condensation efficiency of the condensed droplet bounce plate 1000.

In some embodiments, the cross-sectional area of a single pit in the thin-walled pit microstructure 1 is 250-600 μm ² . This is because the size of the condensate droplets is related to the size of the individual pits, which means that the maximum size of the condensate droplets in a pit becomes larger if the cross-sectional area of the pit is designed to be too largeBecause the thermal resistance of the large condensed liquid drops is higher, if the cross section area of the pit is designed to be too small, the maximum size of the condensed liquid drops in the pit is too small, and because the viscous dissipation of merging and bouncing of the small liquid drops is stronger, when adjacent liquid drops are merged, the success probability of merging and bouncing of the condensed liquid drops is reduced, namely, the condensed liquid drops can bounce without being merged. Therefore, when the cross section area of a single pit in the thin-wall pit microstructure 1 is 250-600 μm ² The size of the condensed droplets on the surface of the thin-wall pit microstructure 1 and the size of the maximum condensed droplets are limited to a certain extent, so that the condensed droplets on the cold surface are all small droplets with dense hemp distribution being uniform and proper size (refer to the small droplets on the thin-wall grid microstructure shown in fig. 5), and the grown adjacent condensed droplets are fused and can bounce off the cold surface, so that a good cycle can be formed on the surface of the thin-wall pit microstructure 1.

Preferably, the cross section area of a single pit in the thin-wall pit microstructure 1 is 250-600 mu m ² When used, the height dimension of a single pit in the thin-walled pit microstructure 1 may be 10 μm.

In some embodiments, the thin-walled dimple microstructure 1 is a grid microstructure (as shown in fig. 1-4 c) or an egg-tray microstructure. Wherein, regarding the grid microstructure, the side wall thickness D (as shown in fig. 4c) of each single grid in the grid microstructure is designed to a specific micrometer scale, which can ensure that the top surface area of the side wall of each single grid is very small, which is not enough for the high-temperature working medium vapor to grow the condensed liquid drops on the top surface of the side wall of each single grid, thereby avoiding the growth of condensed liquid drops on the top surface of the side wall of each single grid by the high-temperature working medium vapor, ensuring that the condensed liquid drops can only nucleate and grow in each single grid (as shown in fig. 1 and fig. 2 a), when the condensed liquid drops grow to a size equivalent to the size of the grid, the condensed liquid drops can be considered as grown condensed liquid drops (as shown in fig. 2 a), the grown condensed liquid drops in two adjacent grids are fused (as shown in fig. 2 b), due to the existence of a thin wall (i.e. the side wall thickness D with the thickness D), the internal flow direction of the fused condensed liquid drops will be induced to the out-of-plane direction, and the thin wall provides an off-plane capillary driving force F for the liquid drop, and under the action of the capillary driving force F, the fused liquid drop bounces off the cold surface at a high speed like an arrow to bounce (as shown in fig. 2 c). Because the grids in the grid microstructure are uniform in size and consistent in size and are in a micrometer scale range, the well-grown condensed liquid drops in the grid microstructure can be guaranteed to be uniformly distributed and basically consistent in size, the sizes of the condensed liquid drops are invisible to naked eyes, and large liquid drops cannot appear on a cold surface (refer to fig. 5).

As shown in fig. 5 to 7, the condensing effect of the grid microstructure surface and the common planar superhydrophobic surface of the present invention is illustrated by experimental data.

As shown in fig. 5, because the utility model discloses a grid micro-structure of taking super hydrophobic layer of condensate droplet springboard 1000 is to the intensive spring effect of liquid droplet, the condensate droplet on grid micro-structure surface can break away from the surface earlier, the big liquid droplet can not appear, and the liquid droplet radius on thin wall grid surface can be restricted below 20 microns, and naked eye is invisible. However, the droplet radius of a common conventional superhydrophobic surface exceeds 100 microns, and large droplets are present that are visible to the naked eye.

Two important parameters of the condensation effect of the reaction are: maximum drop radius and residual liquid volume. The maximum droplet radius refers to the radius of the largest droplet that appears on the surface at a certain moment, and the residual liquid volume refers to the volume of residual liquid per unit area at a certain moment. The smaller the maximum drop radius and the residual liquid volume, the better, the smaller means the greater the drainage capacity. As shown in fig. 6 and 7, the thin-wall grid microstructure surface is greatly improved compared with the conventional superhydrophobic surface, the maximum droplet radius and the residual liquid volume can be quickly stabilized and kept at a low level, the stabilized residual liquid volume is more than 30% lower than the current world best result, and the heat exchange coefficient of the condensed droplet springboard 1000 is theoretically estimated to be 40% higher than the current world best result.

The experimental result fully reflects the effect of the grid microstructure on promoting the condensed liquid drop to bounce off the surface.

In some embodiments, individual grid shapes in the grid microstructure are square, triangular, or polygonal. That is, the grid shape is designed to be square, triangular or polygonal, and can be continuously spread out, as long as it is ensured that the condensate droplets only grow within the grid and not at the top surfaces of the grid sidewalls.

Preferably, the shape of the individual grids in the grid microstructure is square (as shown in fig. 3a, 4a to 4c), regular hexagon (as shown in fig. 3 b) or regular triangle (as shown in fig. 3 c). This is because the square, regular hexagon or regular triangle can realize the dense laying of the grid, and avoid the growth of condensed droplets on the top surface of the intersection G of the plurality of side walls (refer to the position marked by G in fig. 3a, 3b and 3 c) caused by the large area of the top surface of the intersection G of the plurality of side walls in the grid microstructure; that is, using a square, regular hexagon, or regular triangle shape for a single grid in a grid microstructure can allow the condensate droplets to grow within the grid and not at the top surface of the grid sidewalls.

In some embodiments, the sidewall thickness D (see FIG. 4c) of an individual grid in the grid microstructure is 0.8-2 microns; the height H (refer to FIG. 4c) of the grid microstructure is 8-12 microns; the width W (refer to FIG. 4b) of the grid microstructure is 15-25 μm. It can be understood that the thickness D of the side wall of each single grid in the grid microstructure is 0.8-2 micrometers, so that condensed liquid drops can only grow in each single grid (i.e. in grid pits) in the grid microstructure; the height H of the grid microstructure is 8-12 micrometers; the width W of the grid microstructure is 15-25 micrometers, so that the radius size of grown condensation liquid drops can be limited in an invisible area, the grown condensation liquid drops are good in size consistency and uniform in distribution, and large liquid drops cannot appear. It should be noted that the thickness D, height H, and width W of the side wall of the grid in the grid microstructure can be selected according to actual needs, for example, the thickness D of the side wall of the grid can be 0.8 micrometer, 1.0 micrometer, 1.2 micrometer, 1.4 micrometer, 1.6 micrometer, 1.8 micrometer, or 2.0 micrometer, and the height H of the side wall of the grid can be 8 micrometer, 9 micrometer, 10 micrometer, 11 micrometer, or 12 micrometer.

In one embodiment, the individual cells in the cell microstructure have a sidewall thickness D of 1 micron, a height H of 10 microns, and a width W of 20 microns, thereby achieving 100% bounce of the condensed droplets, up to 4 m/s.

It should be noted here that for a square or regular hexagonal grid, the width W may be defined as the distance between the opposite sides; for a regular triangular grid, the width W may be understood as the distance from one vertex to the opposite side.

In some embodiments, the superhydrophobic layer is a copper oxide layer and/or a Glaco coating. That is, the super-hydrophobic layer may be selected from a copper oxide layer, a Glaco coating layer, or a combination of a copper oxide layer and a Glaco coating layer according to actual needs. As explained herein for the Glaco coating, the Glaco coating is commercially available under the specific names Glaco Mirror Coat 'Zero', Soft 99Co.

As shown in fig. 1 to 2c, 4a to 4c and 8 to 9, a specific example is given below to illustrate the condensate droplet springboard 1000 according to the embodiment of the present invention.

The micrometer-sized thin-walled dimple microstructure 1 on the condensate droplet springboard 1000 of this specific example is a grid microstructure. Wherein each single grid is square, the thickness of the side wall of the grid is 1 micron, the height is 10 microns, and the width is 20 microns. The grid microstructure enables condensate droplets to only grow in each single pit of the grid microstructure but not on the top surface of the side wall of each single pit, and the surface of the condensate droplet springboard 1000 is provided with a super-hydrophobic layer which is a Glaco coating with the thickness of 300 nm.

The condensate droplet springboard 1000 of this specific example can be processed by processing a square grid microstructure on one surface of a substrate by photolithography (as shown in fig. 8), cleaning the surface of the grid microstructure, performing plasma treatment, soaking the grid microstructure in a Glaco solution, and drying to obtain a Glaco coating with a coating thickness of 300nm (as shown in fig. 9), thereby obtaining a grid microstructure with a Glaco coating.

The condensation comparative experiment was performed on the condensate droplet springboard 1000 of this specific example and the conventional superhydrophobic, and the condensation experiment employed a Nikon inverted microscope system, the humidity of the experimental environment atmosphere was 90%, and the temperature of the experimental environment was 26 ℃, to obtain the experimental results shown in fig. 5 to 7.

The condensate droplet springboard 1000 of this specific example can realize high stable bouncing of condensate droplets by using a grid microstructure for strengthening a bouncing principle, the high stable bouncing rate of the condensate droplets is close to 100%, and the bouncing speed is close to 4m/s, so that the condensate droplets are prevented from remaining on the condensate droplet springboard 1000, and the springboard 1000 can be used as an anti-fog/anti-dew and anti-icing material, for example, when the springboard 1000 is used on a housing of a base station, fog or dew or ice on the surface of the housing of the base station can be prevented, so that the interference of the fog, dew and ice on a base station signal can be reduced, and the stability of the base station signal can be ensured; the heat exchange coefficient of the springboard 1000 is calculated by theory and is improved by 40% compared with the current best level in the world, therefore, the springboard 1000 can also be used as a high-efficiency condensing material, for example, as a condensing board in a soaking board, and the heat conduction capability of the soaking board can be greatly improved.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. The condensed liquid drop bounce plate is characterized in that a micrometer-scale thin-wall pit microstructure is formed in the surface of the condensed liquid drop bounce plate, condensed liquid drops only grow in single pits of the thin-wall pit microstructure but not on the top surfaces of the side walls of the single pits, and a super-hydrophobic layer is arranged on the surface of the condensed liquid drop bounce plate.

2. The condensate droplet bouncing plate of claim 1, wherein a plurality of pits are formed in the thin-wall pit microstructure, and the plurality of pits are uniformly arranged on the surface of the condensate droplet bouncing plate.

3. The condensate droplet springboard of claim 1, wherein the individual dimples of the thin-walled dimple microstructure are of the same or different shape and size.

4. The condensate droplet springboard of claim 1, wherein the sidewall thickness of a single dimple of the thin-walled dimple microstructure is 0.5-2 microns.

5. The condensate droplet springboard of claim 1, wherein a cross-sectional area of a single condensate droplet is less than or equal to 150% of a cross-sectional area of a single dimple of the thin-walled dimple microstructure.

6. The condensate droplet springboard of claim 1, wherein a cross-sectional area of a single pit in the thin-walled pit microstructure is 250-600 μm ² 。

7. The condensate droplet springboard of claim 1, wherein the thin-walled dimple microstructure is a grid microstructure or an egg-crate microstructure.

8. The condensate droplet springboard of claim 7, wherein individual grid shapes in the grid microstructure are square, triangular or polygonal.

9. The condensate droplet springboard of claim 7, wherein the thickness of the sidewall of a single grid in the grid microstructure is 0.8-2 microns; the height of the grid microstructure is 8-12 micrometers; the width of the grid microstructure is 15-25 micrometers.