CN217450623U

CN217450623U - Rotary coating device for diode

Info

Publication number: CN217450623U
Application number: CN202122138494.8U
Authority: CN
Inventors: 初亚东
Original assignee: Tewoo Gold Best Microelectronics Co ltd
Current assignee: Tewoo Gold Best Microelectronics Co ltd
Priority date: 2021-09-06
Filing date: 2021-09-06
Publication date: 2022-09-20
Anticipated expiration: 2031-09-06

Abstract

The utility model relates to the technical field of diodes, in particular to a rotary coating device for diodes, which comprises a workbench, wherein two ends of the upper surface of the workbench are fixedly provided with supporting plates, one of the supporting plates is fixedly provided with a motor platform on the outer surface, the upper surface of the motor platform is provided with a rotary mechanism, the other supporting plate is provided with a threaded hole through which a screw rod is arranged, the inside of the threaded hole is rotatably connected with the screw rod, the top end of the screw rod is rotatably connected with a first clamp through a bearing, the upper ends of the two supporting plates are connected with two coating mechanisms, the two coating mechanisms are identical in assembly and are provided with a storage box, two different materials can be separately distributed, after the coating on the upper surface of a silicon wafer is finished by starting one coating mechanism, the rotary mechanism drives the silicon wafer to rotate, the lower surface rotates upwards, and the other coating mechanism is started to spray the lower surface of the silicon wafer with another material, thereby greatly improving the working efficiency of the equipment.

Description

Rotary coating device for diode

Technical Field

The utility model relates to a diode technical field particularly, relates to a rotatory coating device for diode.

Background

With the development of the application market of discrete components, the requirements on the bulk technology and the process cost of the discrete semiconductor components are higher and higher, the most important diffusion as the production link of the discrete components also faces higher and higher cost pressure, a simple and easy operation is developed, the diffusion process with the characteristics of good productivity and low cost is an urgent requirement, the diode is an electronic device made of semiconductor materials and has unidirectional conductivity, when the diode is produced, a liquid boron source is coated on one side of the silicon wafer on the two sides of the silicon wafer in a rotating mode and is baked, then rotationally coating a liquid phosphorus source, baking, laminating and other steps to prepare the product, the traditional equipment, when the upper surface and the lower surface of a silicon wafer are coated, the coating can not be completed in the same step, so that the spraying efficiency of the device is low, and therefore, a rotary coating device for the diode is provided.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a spin coating device for diodes, which can effectively solve the problems of the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a rotatory coating device for diode, includes the workstation, the equal fixed mounting in workstation upper surface both ends has the backup pad, one of them backup pad outside fixed surface installs the motor platform, motor platform upper surface is provided with rotary mechanism, another be used to wear to be provided with the screw hole in the backup pad, the inside swivelling joint of screw hole has the screw rod, the top of screw rod is rotated through the bearing and is connected with first anchor clamps, the fixed slot has been seted up on the first anchor clamps, two the backup pad upper end is connected with two spraying mechanism, workstation upper surface one side fixed mounting has the roaster.

Preferably, the spraying mechanism comprises a fixed plate, a limiting rod, a spray head, a storage box, a water pump, a connecting pipe, a telescopic pipe, a spraying hole and a hydraulic cylinder, and two ends of the fixed plate are respectively and fixedly installed on two supporting plates.

Preferably, the fixed plate is connected with two limiting rods in a penetrating and sliding mode, the lower end of each limiting rod is fixedly connected to the upper surface of the spray head, a hydraulic cylinder is fixedly mounted on the lower surface of the fixed plate, and the output end of the hydraulic cylinder is fixedly connected to the upper surface of the spray head.

Preferably, the lower surface of the spray head is fixedly connected with a plurality of spray holes, the upper surface of the fixing plate is fixedly provided with a storage box in the middle of the two limiting rods, and the surface of the interior of the storage box is fixedly provided with a water pump.

Preferably, the output end of the water pump is fixedly connected with a connecting pipe, the lower end of the connecting pipe is communicated with the upper end of a telescopic pipe, and the lower end of the telescopic pipe is fixedly connected with the upper surface of the spray head.

Preferably, the rotating mechanism comprises a motor, a transmission shaft and a second clamp, and the motor is fixedly installed on the upper surface of the motor table.

Preferably, the output end of the motor is fixedly connected with one end of the transmission shaft, the transmission shaft is connected to the supporting plate through a bearing in a transmission mode, a second clamp is fixedly mounted at the other end of the transmission shaft, and a fixing groove is formed in the second clamp.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) the components of the two spraying mechanisms are the same, the storage box is installed, two different materials can be separately packaged, after spraying of the upper surface of the silicon wafer is completed by starting one spraying mechanism, the silicon wafer is driven to rotate through the rotating mechanism, the lower surface is rotated upwards, another spraying mechanism is started to spray the lower surface of the silicon wafer with another material, and therefore the working efficiency of the equipment is greatly improved.

(2) Through setting up shower nozzle, flexible pipe and the pneumatic cylinder in spraying mechanism, make equipment can pass through the height of pneumatic cylinder adjustment shower nozzle, make the shower nozzle closely carry out the spraying to the silicon chip to make the spraying of silicon chip more even.

Drawings

Fig. 1 is a schematic view of the overall structure of a spin coating apparatus for diodes according to the present invention;

fig. 2 is a schematic side view of a spin coating apparatus for diodes according to the present invention;

fig. 3 is a schematic structural view of a rotating mechanism of a rotary coating device for diodes according to the present invention;

fig. 4 is a schematic structural view of a spraying mechanism of a rotary coating device for diodes according to the present invention;

fig. 5 is a schematic structural view of a storage box of a rotary coating device for diodes according to the present invention;

fig. 6 is a circuit diagram of a spin coating apparatus for diodes according to the present invention.

In the figure: 1. a work table; 2. a support plate; 3. a threaded hole; 4. a screw; 5. a spraying mechanism; 6. a first clamp; 7. a baking machine; 8. a motor table; 9. a rotation mechanism; 501. a fixing plate; 502. a limiting rod; 503. a spray head; 504. a storage box; 505. a water pump; 506. a connecting pipe; 507. a telescopic pipe; 508. a spray orifice; 509. a hydraulic cylinder; 901. a motor; 902. a drive shaft; 903. and a second clamp.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Examples

As shown in fig. 1-6, a rotatory coating device for diode, comprises a workbench 1, backup pads 2 are fixedly mounted at both ends of the upper surface of the workbench 1, a motor platform 8 is fixedly mounted on the outer surface of one backup pad 2, a rotating mechanism 9 is arranged on the upper surface of the motor platform 8, a threaded hole 3 is penetratingly arranged on the other backup pad 2, a screw rod 4 is rotatably connected inside the threaded hole 3, the top end of the screw rod 4 is rotatably connected with a first clamp 6 through a bearing, a fixing groove is formed in the first clamp 6, two spraying mechanisms 5 are connected to the upper ends of the two backup pads 2, and a baking machine 7 is fixedly mounted on one side of the upper surface of the workbench 1.

Through the technical scheme, firstly, a silicon wafer is placed between a fixing groove arranged on a first clamp 6 and a fixing groove arranged on a second clamp 903, the silicon wafer is rotatably connected in a threaded hole 3 through a screw rod 4, when the screw rod 4 is rotated by external force, the screw rod 4 drives the first clamp 6 to synchronously move, so that the first clamp 6 and the second clamp 903 clamp and fix the silicon wafer through the two fixing grooves, then a water pump 505 arranged in a storage box 504 arranged on the upper surface of a fixing plate 501 is used for starting the water pump 505 to convey materials in the storage box 504 to a spray head 503 through a connecting pipe 506 and a telescopic pipe 507, the materials are sprayed on the upper surface of the silicon wafer through a plurality of spray holes 508 arranged on the spray head 503, then a motor 901 is started to drive a transmission shaft 902 to rotate, the first clamp 6 is rotatably connected at one end of the screw rod 4 through a second clamp 903 arranged at the top end of the transmission shaft 902 and the first clamp 6, therefore, when the transmission shaft 902 rotates, the silicon wafer fixed by the second clamp 903 and the first clamp 6 is driven to rotate synchronously, the lower surface of the silicon wafer is overturned upwards for spraying, and after the spraying is finished, the material sprayed on the surface of the silicon wafer is dried through the baking machine 7 arranged on the upper surface of the workbench 1.

In this embodiment, the spraying mechanism 5 includes a fixing plate 501, a limiting rod 502, a nozzle 503, a storage tank 504, a water pump 505, a connecting pipe 506, an extension pipe 507, spraying holes 508 and a hydraulic cylinder 509, two ends of the fixing plate 501 are respectively and fixedly installed on the two supporting plates 2, two limiting rods 502 are connected to the fixing plate 501 in a penetrating and sliding manner, the lower end of each limiting rod 502 is fixedly connected to the upper surface of the nozzle 503, the hydraulic cylinder 509 is fixedly installed on the lower surface of the fixing plate 501, the output end of the hydraulic cylinder 509 is fixedly connected to the upper surface of the nozzle 503, a plurality of spraying holes 508 are fixedly connected to the lower surface of the nozzle 503, the storage tank 504 is fixedly installed on the upper surface of the fixing plate 501 in the middle of the two limiting rods 502, the water pump 505 is fixedly installed on the inner surface of the storage tank 504, the output end of the water pump 505 is fixedly connected to the connecting pipe 506, the lower end of the connecting pipe 506 is communicated with the upper end of the extension pipe 507, the lower end of the extension pipe 507 is fixedly connected to the upper surface of the nozzle 503, the components of the two spraying mechanisms 5 are the same, the storage box 504 is installed, two different materials can be separately packaged, after the spraying of the upper surface of the silicon wafer is completed by starting one spraying mechanism 5, the silicon wafer is driven to rotate through the rotating mechanism 9, the lower surface of the silicon wafer rotates upwards, and the other spraying mechanism 5 is started to spray the lower surface of the silicon wafer with another material.

When specifically setting up, rotary mechanism 9 includes motor 901, transmission shaft 902 and second anchor clamps 903, motor 901 fixed mounting is at the upper surface of motor platform 8, the output of motor 901 and the one end fixed connection of transmission shaft 902, transmission shaft 902 passes through the bearing transmission and connects in backup pad 2, the other end fixed mounting of transmission shaft 902 has second anchor clamps 903, the fixed slot has been seted up on second anchor clamps 903, through starter motor 901, it is rotatory to drive transmission shaft 902, second anchor clamps 903 and first anchor clamps 6 through the installation of transmission shaft 902 top, first anchor clamps 6 rotate the one end of connecting at screw rod 4 through the bearing, thereby drive second anchor clamps 903 when making transmission shaft 902 rotate, the silicon chip synchronous revolution that first anchor clamps 6 have fixed, thereby reach the mesh of rotatory silicon chip.

The working principle of the spin coating device for the diode is as follows:

when in use, firstly, a silicon wafer is placed between a fixed groove arranged on a first clamp 6 and a fixed groove arranged on a second clamp 903 and is connected in a threaded hole 3 through a screw rod 4 in a rotating way, when the screw rod 4 is rotated by external force, the screw rod 4 drives the first clamp 6 to move synchronously, so that the first clamp 6 and the second clamp 903 clamp and fix the silicon wafer through the two fixed grooves, then a water pump 505 arranged in a storage box 504 arranged on the upper surface of a fixed plate 501 is used for starting the water pump 505 to enable the water pump 505 to convey materials in the storage box 504 to a spray head 503 through a connecting pipe 506 and a telescopic pipe 507, the materials are sprayed on the upper surface of the silicon wafer through a plurality of spray holes 508 arranged on the spray head 503, then a motor 901 is started to drive a transmission shaft 902 to rotate, the first clamp 6 is rotatably connected at one end of the screw rod 4 through a bearing through the second clamp 903 and the first clamp 6 arranged at the top end of the transmission shaft 902, therefore, when the transmission shaft 902 rotates, the silicon wafer fixed by the second clamp 903 and the first clamp 6 is driven to rotate synchronously, the lower surface of the silicon wafer is overturned upwards for spraying, after the spraying is finished, the material sprayed on the surface of the silicon wafer is dried through the baking machine 7 arranged on the upper surface of the workbench 1, and then the next operation is carried out.

It should be noted that the specific model of the motor 901 is V5-040130FC2A, the specific model of the roaster 7 is DC-001, the specific model of the water pump 505 is ISG/IHG, and the specific model of the hydraulic cylinder 509 is DYTZ.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A spin coating device for diodes, comprising a worktable (1), characterized in that: workstation (1) upper surface both ends equal fixed mounting has backup pad (2), one of them backup pad (2) outside fixed surface installs motor platform (8), motor platform (8) upper surface is provided with rotary mechanism (9), another be used to wear to be provided with screw hole (3) in backup pad (2), screw hole (3) inside swivelling joint has screw rod (4), the top of screw rod (4) is rotated through the bearing and is connected with first anchor clamps (6), the fixed slot has been seted up on first anchor clamps (6), two backup pad (2) upper end is connected with two spraying mechanism (5), workstation (1) upper surface one side fixed mounting has roaster (7).

2. A spin coating apparatus for diodes according to claim 1, wherein: the spraying mechanism (5) comprises a fixing plate (501), a limiting rod (502), a spray head (503), a storage box (504), a water pump (505), a connecting pipe (506), an extension pipe (507), a spraying hole (508) and a hydraulic cylinder (509), wherein two ends of the fixing plate (501) are fixedly installed on two supporting plates (2) respectively.

3. A spin coating apparatus for diodes according to claim 2, wherein: run through sliding connection on fixed plate (501) and have two gag lever posts (502), every the equal fixed connection of lower extreme of gag lever post (502) is at the upper surface of shower nozzle (503), the lower fixed surface of fixed plate (501) installs pneumatic cylinder (509), the output fixed connection of pneumatic cylinder (509) is at the upper surface of shower nozzle (503).

4. A spin coating apparatus for diodes according to claim 3, wherein: the lower surface of the spray head (503) is fixedly connected with a plurality of spray holes (508), the middle of the upper surface of the fixing plate (501) positioned on the two limiting rods (502) is fixedly provided with a storage box (504), and the inner surface of the storage box (504) is fixedly provided with a water pump (505).

5. A spin coating apparatus for diodes according to claim 4, wherein: the output end of the water pump (505) is fixedly connected with a connecting pipe (506), the lower end of the connecting pipe (506) is communicated with the upper end of a telescopic pipe (507), and the lower end of the telescopic pipe (507) is fixedly connected with the upper surface of the spray head (503).

6. A spin coating apparatus for diodes according to claim 1, wherein: the rotating mechanism (9) comprises a motor (901), a transmission shaft (902) and a second clamp (903), wherein the motor (901) is fixedly installed on the upper surface of the motor table (8).

7. A spin coating apparatus for diodes according to claim 6, wherein: the output end of the motor (901) is fixedly connected with one end of a transmission shaft (902), the transmission shaft (902) is connected onto the supporting plate (2) through a bearing in a transmission mode, a second clamp (903) is fixedly mounted at the other end of the transmission shaft (902), and a fixing groove is formed in the second clamp (903).