CN217445596U - Flexible circuit board chip mounter - Google Patents
Flexible circuit board chip mounter Download PDFInfo
- Publication number
- CN217445596U CN217445596U CN202221430258.1U CN202221430258U CN217445596U CN 217445596 U CN217445596 U CN 217445596U CN 202221430258 U CN202221430258 U CN 202221430258U CN 217445596 U CN217445596 U CN 217445596U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- belt mechanism
- conveyor belt
- flattening
- chip mounter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model discloses a flexible line way board chip mounter relates to circuit board flattening field, including conveying mechanism and chip mounter body, conveying mechanism includes first conveyor belt mechanism and second conveyor belt mechanism, a plurality of through-holes have been seted up on second conveyor belt mechanism's conveyer belt surface, second conveyor belt mechanism's internally mounted has the vacuum cavity. The utility model discloses carry out the preliminary treatment to the flexible line way board earlier, carry out flattening work before getting into the chip mounter, the circuit board is carried to the flattening roller by first conveyer belt mechanism, carry out the flattening to the circuit board by the flattening roller, the flattening finishes the back, the circuit board gets into second conveyer belt mechanism, negative pressure work is taken out to the vacuum cavity, it is fixed to carry out the negative pressure to the circuit board that is located the through-hole top and adsorb, the circuit board is at the in-process that advances, carry out the flattening to the circuit board both sides by the compression roller, twice flattening makes circuit board surface warpage obtain handling, precision when carrying out the paster is higher.
Description
Technical Field
The utility model relates to a circuit board flattening field specifically is a flexible line way board chip mounter.
Background
Chip mounter: the flexible circuit board is also called a mounting machine and a surface mounting system, and is configured behind a dispensing machine or a screen printing machine in a production line, a device for accurately placing surface mounted components on a PCB (printed circuit board) pad through a movable mounting head is divided into a manual device and a full-automatic device, the full-automatic device can be automatically mounted at high speed and high precision, the device is the most critical and complex device in the whole SMT production, and the flexible circuit board needs to use the mounting machine during production to mount materials to be mounted on the surface of the circuit board.
Chinese patent with publication number CN216357557U discloses a PCB circuit board chip mounter, which comprises a body, the fixed surface of organism has the controller, the bottom position department of organism is provided with three backup pads of group, and has placed the paster between the adjacent backup pad and has rolled up, has not only improved the degree of convenience when the chip mounter uses, has improved the practicality when the chip mounter uses, has avoided the fuzzy phenomenon of controller surface observation to take place when the chip mounter uses moreover.
The technology discloses a chip mounting mechanism of a PCB circuit board, but when the chip mounting mechanism carries out chip mounting work on the flexible circuit board, the flexible circuit board can be bent and wound, so when the circuit board enters a chip mounting machine, the precision of the chip mounting is possibly reduced due to surface warping, the edge of the circuit board is positioned by using a pressing roller, the middle of the circuit board is still likely to warp, the positioning effect is poor, and the production quality of the circuit board is reduced.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model aims at providing a flexible line way board chip mounter to solve general chip mounter to the not good technical problem of paster effect of the curve way board that sticks up.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a flexible line way board chip mounter, includes conveying mechanism and chip mounter body, conveying mechanism includes first conveyor belt mechanism and second conveyor belt mechanism, a plurality of through-holes have been seted up on second conveyor belt mechanism's conveyer belt surface, second conveyor belt mechanism's internally mounted has the vacuum cavity, second conveyor belt mechanism's top is provided with a plurality of compression rollers, one side of second conveyor belt mechanism is provided with a set of flattening roller, top one side of flattening roller is provided with the connecting block, the top of connecting block is provided with the spring, the top of spring is provided with the movable block.
By adopting the technical scheme, the warping of the surface of the circuit board is processed by twice leveling, the precision is higher when the circuit board is pasted, the distance between the leveling rollers is adjustable, and the leveling device is matched with the circuit boards with different thicknesses to perform leveling work, so that the application range is wider.
The utility model discloses further set up to, first conveyor belt mechanism and second conveyor belt mechanism all set up in the top of mounting bracket.
Through adopting above-mentioned technical scheme, the mounting bracket provides the support for first conveyer belt mechanism and second conveyer belt mechanism and installs.
The utility model discloses further set up to, the top of mounting bracket is provided with the fixing base, the inside of fixing base is provided with the locating rack, the top the leveling roller is located the inside of locating rack.
Through adopting above-mentioned technical scheme, when the screw rod rotated, the locating rack can reciprocate.
The utility model discloses further set up to, movable block, spring and connecting block all are located the recess of fixing base one side, the movable groove has been seted up to the inner wall of recess, and the movable block moves along the movable groove.
Through adopting above-mentioned technical scheme, the activity groove provides spacing direction for the motion of movable block and connecting block.
The utility model discloses further set up as, one side of vacuum cavity is provided with the connecting pipe, and the connecting pipe takes place the mechanism with outside vacuum and is connected.
By adopting the technical scheme, the vacuum generating mechanism vacuumizes the vacuum cavity, so that the circuit board is adsorbed on the surface of the conveyor belt.
The utility model discloses further set up to, first conveyor belt mechanism, second conveyor belt mechanism and bottom the flattening roller is connected with outside actuating mechanism respectively.
Through adopting above-mentioned technical scheme, actuating mechanism drives first conveyer belt mechanism, second conveyer belt mechanism and bottom leveling roller and rotates, carries the circuit board.
The utility model discloses further set up to, the top of movable block is provided with the screw rod.
By adopting the technical scheme, the screw rod enables the movable block to move up and down more easily.
To sum up, the utility model discloses mainly have following beneficial effect:
1. the utility model discloses carry out the preliminary treatment to the flexible line way board earlier, carry out flattening work before getting into the chip mounter, the circuit board is carried to the flattening roller by first conveyer belt mechanism, carry out the flattening to the circuit board by the flattening roller, the flattening finishes the back, the circuit board gets into second conveyer belt mechanism, negative pressure work is taken out to the vacuum cavity, it is fixed to carry out the negative pressure to the circuit board that is located the through-hole top and adsorb, the circuit board is at the in-process that advances, carry out the flattening to the circuit board both sides by the compression roller, twice flattening makes circuit board surface warpage obtain handling, precision when carrying out the paster is higher.
2. The utility model discloses interval between the leveling roller is adjustable, and movable block extrusion spring makes the stroke of spring shorten, and the connecting block drives the locating rack decline and makes the leveling roller descend thereupon this moment, and the circuit board of the different thickness of cooperation carries out flattening work, and application range is more extensive.
Drawings
FIG. 1 is a schematic view of the structural connection of the present invention;
FIG. 2 is a schematic view of the structural connection of the second conveyor belt mechanism of the present invention;
fig. 3 is a schematic view of the structural connection of the leveling mechanism of the present invention.
In the figure: 1. a mounting frame; 2. a chip mounter body; 3. a first conveyor belt mechanism; 4. a second conveyor belt mechanism; 5. a through hole; 6. a vacuum chamber; 7. a connecting pipe; 8. a compression roller; 9. a fixed seat; 10. a positioning frame; 11. a leveling roller; 12. a screw; 13. a movable block; 14. a spring; 15. connecting blocks; 16. a movable groove.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
The following describes an embodiment of the present invention according to its overall structure.
A chip mounter for a flexible circuit board comprises a conveying mechanism and a chip mounter body 2, wherein the conveying mechanism comprises a first conveying belt mechanism 3 and a second conveying belt mechanism 4, a plurality of through holes 5 are formed in the surface of a conveying belt of the second conveying belt mechanism 4, a vacuum cavity 6 is installed inside the second conveying belt mechanism 4, a plurality of press rollers 8 are arranged above the second conveying belt mechanism 4, one side of the second conveying belt mechanism 4 is provided with a group of leveling rollers 11, the leveling rollers 11 are vertically and symmetrically installed, the flexible circuit board is pretreated firstly and leveled before entering the chip mounter, the circuit board is conveyed to the leveling rollers 11 by the first conveying belt mechanism 3 and leveled by the leveling rollers 11, after leveling, the circuit board enters the second conveying belt mechanism 4, the vacuum cavity 6 is vacuumized, and the circuit board positioned at the top of the through holes 5 is subjected to negative pressure adsorption and fixation, in the advancing process of the circuit board, the two sides of the circuit board are leveled by the compression roller 8;
one side of top flattening roller 11 is provided with connecting block 15, the top of connecting block 15 is provided with spring 14, the top of spring 14 is provided with movable block 13, the top of movable block 13 is provided with screw rod 12, interval between flattening roller 11 is adjustable, clockwise rotation screw rod 12, make movable block 13 remove downwards, movable block 13 extrusion spring 14 this moment, the stroke that makes spring 14 shortens, connecting block 15 drives locating rack 10 and descends and make flattening roller 11 descend thereupon this moment, anticlockwise rotation screw rod 12, make movable block 13 rebound, spring 14 is tensile this moment, connecting block 15 drives locating rack 10 and rises and make flattening roller 11 rise thereupon, the circuit board of cooperation different thickness carries out flattening work, application range is more extensive.
Referring to fig. 1, the first belt conveying mechanism 3 and the second belt conveying mechanism 4 are both disposed on the top of the mounting rack 1, and the mounting rack 1 provides a support for the first belt conveying mechanism 3 and the second belt conveying mechanism 4 to mount.
Referring to fig. 1 and 3, a fixing seat 9 is disposed at the top of the mounting frame 1, a positioning frame 10 is disposed inside the fixing seat 9, a top leveling roller 11 is disposed inside the positioning frame 10, the positioning frame 10 and the leveling roller 11 are mounted in the fixing seat 9, and when the screw 12 rotates, the positioning frame 10 can move up and down.
Referring to fig. 3, the movable block 13, the spring 14 and the connecting block 15 are all located in a groove on one side of the fixing base 9, a movable groove 16 is formed in an inner wall of the groove, the movable block 13 moves along the movable groove 16, and the movable groove 16 provides a limiting guide for the movement of the movable block 13 and the connecting block 15.
Referring to fig. 2, a connecting pipe 7 is disposed at one side of the vacuum chamber 6, and the connecting pipe 7 is connected to an external vacuum generating mechanism, which vacuumizes the vacuum chamber 6 to make the circuit board adhere to the surface of the conveyor belt.
Referring to fig. 1, the first conveyor belt mechanism 3, the second conveyor belt mechanism 4 and the bottom leveling roller are respectively connected to an external driving mechanism, and the driving mechanism drives the first conveyor belt mechanism 3, the second conveyor belt mechanism 4 and the bottom leveling roller to rotate so as to convey the circuit board.
The utility model discloses a theory of operation does: the flexible circuit board is pretreated firstly, leveling work is carried out before the flexible circuit board enters a chip mounter, the circuit board is conveyed to a leveling roller 11 through a first conveying belt mechanism 3, the circuit board is leveled through the leveling roller 11, after leveling is finished, the circuit board enters a second conveying belt mechanism 4, negative pressure is pumped out through a vacuum cavity 6, the circuit board positioned at the top of a through hole 5 is subjected to negative pressure adsorption and fixation, in the advancing process of the circuit board, two sides of the circuit board are leveled through a compression roller 8, and after leveling is finished, the flexible circuit board enters a chip mounter body 2 to be subjected to a chip mounting process;
interval between the flattening roller 11 is adjustable, clockwise rotation screw rod 12, make movable block 13 remove downwards, movable block 13 extrusion spring 14 this moment, make the stroke of spring 14 shorten, connecting block 15 drives the locating rack 10 and descends and make flattening roller 11 descend thereupon this moment, anticlockwise rotation screw rod 12, make movable block 13 rebound, spring 14 is tensile this moment, connecting block 15 drives the locating rack 10 and rises and make flattening roller 11 rise thereupon, the circuit board of cooperation different thickness carries out the flattening work, application range is more extensive.
Although embodiments of the present invention have been shown and described, it is intended that the present embodiments be illustrative only and not limiting to the invention, and that the particular features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples, and that modifications, substitutions, variations, and the like, which are not inventive in light of the above teachings, may be made to the embodiments by those skilled in the art without departing from the principles and spirit of the present invention, but are to be construed as broadly as the following claims.
Claims (7)
1. The utility model provides a flexible line way board chip mounter, includes conveying mechanism and chip mounter body (2), its characterized in that: conveying mechanism includes first conveyor belt mechanism (3) and second conveyor belt mechanism (4), a plurality of through-holes (5) have been seted up on the conveyer belt surface of second conveyor belt mechanism (4), the internally mounted of second conveyor belt mechanism (4) has vacuum chamber (6), the top of second conveyor belt mechanism (4) is provided with a plurality of compression rollers (8), one side of second conveyor belt mechanism (4) is provided with a set of flattening roller (11), the top one side of flattening roller (11) is provided with connecting block (15), the top of connecting block (15) is provided with spring (14), the top of spring (14) is provided with movable block (13).
2. The flexible circuit board placement machine according to claim 1, wherein: the first conveyor belt mechanism (3) and the second conveyor belt mechanism (4) are arranged at the top of the mounting rack (1).
3. The flexible circuit board placement machine according to claim 2, wherein: the top of mounting bracket (1) is provided with fixing base (9), the inside of fixing base (9) is provided with locating rack (10), the top leveling roller (11) are located the inside of locating rack (10).
4. The flexible circuit board placement machine according to claim 1, wherein: the movable block (13), the spring (14) and the connecting block (15) are all located in a groove in one side of the fixing seat (9), a movable groove (16) is formed in the inner wall of the groove, and the movable block (13) moves along the movable groove (16).
5. The flexible circuit board placement machine according to claim 1, wherein: one side of the vacuum cavity (6) is provided with a connecting pipe (7), and the connecting pipe (7) is connected with an external vacuum generating mechanism.
6. The flexible circuit board placement machine according to claim 1, wherein: the first conveyor belt mechanism (3), the second conveyor belt mechanism (4) and the bottom leveling roller are respectively connected with an external driving mechanism.
7. The flexible circuit board placement machine according to claim 1, wherein: the top of the movable block (13) is provided with a screw (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221430258.1U CN217445596U (en) | 2022-06-08 | 2022-06-08 | Flexible circuit board chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221430258.1U CN217445596U (en) | 2022-06-08 | 2022-06-08 | Flexible circuit board chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217445596U true CN217445596U (en) | 2022-09-16 |
Family
ID=83224314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221430258.1U Active CN217445596U (en) | 2022-06-08 | 2022-06-08 | Flexible circuit board chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217445596U (en) |
-
2022
- 2022-06-08 CN CN202221430258.1U patent/CN217445596U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108323014B (en) | Laminating machine | |
| EP1161129A2 (en) | Electronic-component mounting apparatus | |
| KR100290733B1 (en) | Apparatus for Compensating Flatness of Printed Circuit Board for Surface Mounter | |
| CN217445596U (en) | Flexible circuit board chip mounter | |
| CN111356300B (en) | Forming and manufacturing process of printed integrated circuit board | |
| CN210353454U (en) | Be applied to bilateral sole bat printing machine of single | |
| CN114055907A (en) | Flexible plate laminating device | |
| CN218868452U (en) | Conveying type welding machine for circuit board paster of precise electronic product | |
| CN114750239A (en) | Stamping die positioning method applied to FPC (flexible printed circuit) processing | |
| CN115610078A (en) | Vision positioning shuttle type screen process press | |
| CN114347639A (en) | Curved glass screen printing method | |
| JP4774605B2 (en) | Screen printing device | |
| CN208369978U (en) | A kind of full-automatic SMT paster apparatus | |
| CN113479690A (en) | Feeding system for laser cutting of flexible plate | |
| CN106564191A (en) | 3D printer capable of automatically taking and permeating wax and automatic taking and wax permeating method | |
| CN118102697B (en) | SMT chip mounter capable of accurately and automatically attaching | |
| CN113510474A (en) | Novel high-precision electronic paper combined equipment | |
| CN218707081U (en) | Adsorption type plate sucking machine | |
| CN215500335U (en) | Automatic LED chip mounter of material loading | |
| CN216635391U (en) | Rotary disc type film sticking machine | |
| CN112319003B (en) | Heating laminating processing equipment of foam board | |
| CN215818816U (en) | Conveying mechanism for multilayer circuit board laminating equipment | |
| CN220883740U (en) | Automatic transfer printing production line of binary channels | |
| CN218765373U (en) | Automatic positioning detection assembly and automatic rubberizing detection equipment | |
| CN217037838U (en) | Feeding mechanism of SMT chip mounter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |