CN217443587U - Optical module - Google Patents

Abstract

The application provides an optical module, including: a circuit board. An optical transceiver assembly comprising: a tube/light receiving assembly disposed on one side of the tube, comprising: the flexible printed circuit board comprises a light receiving tube seat, a light receiving pin, a first flexible circuit board and a second flexible circuit board, wherein the light receiving tube seat penetrates through the light receiving tube seat and protrudes out of the light receiving tube seat; the other end is provided with a first circuit board connecting part which is welded with the circuit board; and the first wave absorbing plate is arranged on the first flexible circuit board and covers a welding spot between the light receiving pin and the first TO connecting part or a welding spot between the first circuit board connecting part and the circuit board. The wave absorbing plate is arranged at the joint of the light receiving pin and the flexible circuit board, so that the noise influence is effectively filtered, the impedance continuity on a circuit is optimized, and the receiving sensitivity is improved.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module. In a high-speed information transceiving system, a high-density optical module is required to replace a conventional optical module, and a multi-channel optical transceiving technology is adopted, so that more transmitters and receivers can be concentrated in a smaller space.

The common optical module is composed of an optical component, an FPC, a PCBA and a structural component, wherein the joints from the optical component to the FPC and from the FPC to the PCBA are mostly connected by soldering, reflection and crosstalk with different intensities are introduced into each welding point, and impedance continuity is deteriorated, and the quality of an emitted optical signal or a received optical signal is influenced.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to improve optical module communication quality.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes: a circuit board;

an optical transceiver assembly comprising:

a pipe shell;

the light receiving component, set up in one side of the tube shell includes:

a light-receiving tube seat is arranged on the light-receiving tube seat,

a light receiving pin passing through the light receiving tube seat and protruding outside the light receiving tube seat,

one end of the first flexible circuit board is provided with a first TO connecting part, and one side of the first TO connecting part is welded with the light receiving pin; the other end is provided with a first circuit board connecting part which is welded with the circuit board;

and the first wave absorbing plate is arranged on the other side of the first TO connecting part and covers a welding point between the light receiving pin and the first TO connecting part.

The beneficial effect of this application:

the application provides an optical module, including: the circuit board is provided with a notch. An optical transceiver assembly comprising: the tube shell is arranged at the notch. The light receiving component, set up in one side of the tube shell includes: the flexible printed circuit board comprises a light receiving tube seat, a light receiving pin, a first flexible circuit board and a second flexible circuit board, wherein the light receiving tube seat penetrates through the light receiving tube seat and protrudes out of the light receiving tube seat; the other end is provided with a first circuit board connecting part which is welded with the circuit board; and the first wave absorbing plate is arranged on the other side of the first TO connecting part and covers a welding spot between the light receiving pin and the first TO connecting part or covers a welding spot between the first circuit board connecting part and the circuit board. The wave absorbing plate is arranged at the joint of the light receiving pin and the flexible circuit board, so that the noise influence is effectively filtered, the impedance continuity on a circuit is optimized, and the receiving sensitivity is improved.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings required to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to these drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is a schematic view of a connection structure between an optical transceiver module and a circuit board according to an embodiment of the present disclosure;

fig. 6 is an exploded schematic view of an optical transceiver module and a circuit board according to an embodiment of the present disclosure;

fig. 7 is a first schematic structural diagram of an optical transceiver module and a first flexible circuit board according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a first flexible circuit board according to an embodiment of the present disclosure;

fig. 9 is a second schematic structural diagram of an optical transceiver module and a first flexible circuit board according to an embodiment of the present disclosure;

fig. 10 is a third schematic structural diagram of an optical transceiver module and a first flexible circuit board according to an embodiment of the present disclosure;

fig. 11 is a second schematic view of a connection structure between an optical transceiver module and a circuit board according to an embodiment of the present disclosure;

fig. 12 is a third schematic view of a connection structure between an optical transceiver module and a circuit board according to an embodiment of the present application.

Detailed Description

The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is to be understood that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the word "comprise" and its other forms, such as "comprises" and "comprising", will be interpreted as open, inclusive meaning that the word "comprise" and "comprises" will be interpreted as meaning "including, but not limited to", in the singular. In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the information processing equipment such as a computer through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the onu 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, an optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver module.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two openings 204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two openings 204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (left end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (right end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101 so that the optical fiber 101 is connected to an optical transceiver module inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined to facilitate the installation of devices such as the circuit board 300 and the optical transceiver module into the shell, and the upper shell 201 and the lower shell 202 can form encapsulation protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking member 203 is located on the outer wall of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit member that mates with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a limiting amplifier (limiting amplifier), a Clock and Data Recovery (CDR) chip, a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also realize a bearing effect due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 300 (e.g., the upper surface shown in fig. 4), or may be disposed on both upper and lower sides of the circuit board 300, so as to adapt to the situation where the requirement of the number of pins is large. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver module 400 includes an optical transmitter module and an optical receiver module.

The digital communication symbol displayed on the oscilloscope screen is formed by overlapping a plurality of waveform parts, and the shape of the digital communication symbol is similar to an eye pattern. "eye" is large indicating that the system transmission characteristics are good; the small "eye" indicates the presence of inter-signal interference in the system. The size of the optical eye directly reflects the communication quality of light in the light emitting module or the light receiving module. The sensitivity refers to the sensitivity of the light receiving component to the received signal light in the optical module communication process.

The common optical module is composed of an optical component, an FPC, a PCBA and a structural component, wherein the optical component is connected to the FPC, and the connection between the FPC and the PCBA is mostly connected by soldering tin, and reflection and crosstalk with different intensities are introduced into each soldering point, and impedance continuity is deteriorated. And the high-speed optical module product has higher requirements on the production process, and the eye pattern and the sensitivity can be degraded by slightly adjusting the production process. If the FPC is redeveloped or the production process is readjusted after the process adjustment, the production cycle is affected, and the design needs to be changed, which is very troublesome.

The emitted light eye pattern is an important index for evaluating the emission performance of the optical module, the higher the speed is, the more sensitive the requirement on the integrity of the model is, so the impedance continuity is required to be better, the influence of noise on the performance of the module is obvious, and the problems of eye pattern deformation, more scattering points and the like can be caused if the signal has noise. The welding influence between the FPC and the transmitting or receiving TO of the flexible printed board is the most serious, a gap between the FPC and the TO can cause resonance, space radiation crosstalk can be introduced into a welding spot, the problem of impedance continuity easily occurs at the welding positions of an optical component and the FPC, a PCBA and the FPC, and the problems of noise and the like introduced at the welding positions due TO the problem of impedance continuity can influence the performance of a transmitted light eye diagram and the receiving sensitivity.

Optimization of an optical eye diagram and optimization of sensitivity of an optical module are the most significant links for optical module engineers in designing the optical module, and with the increase of speed, optimization of the eye diagram and the sensitivity is more difficult, and the requirements on the process are higher.

In order TO solve the problems, the application provides an optical module, one or more wave absorbing plates are additionally arranged at the joint of a flexible circuit board and a TO pin and the joint of the circuit board and the flexible circuit board, at least one pin of a signal line is completely covered, the generation of impedance at a welding position is reduced, and noise of a certain frequency band can be absorbed. The welding points are exposed in the air, which is equivalent to suspension, the wave absorbing plate can be equivalent to a capacitor, the wave absorbing plate is adhered to the welding points, which is equivalent to the capacitor connected in series between the welding points and the air, and the impedance is reduced. The structure is simple and practical, the accuracy is high, and the operation is easy.

In some embodiments of the present application, the light receiving module 410 and the light emitting module 420 are both packaged in a coaxial TO package, and the light receiving module 410 is connected TO the circuit board 300 through a first flexible circuit board 510, and the light emitting module 420 is connected TO the circuit board 300 through a second flexible circuit board 520.

Fig. 5 is a schematic view of a connection structure between an optical transceiver module and a circuit board according to an embodiment of the present disclosure, and fig. 6 is a schematic view of an exploded structure between an optical transceiver module and a circuit board according to an embodiment of the present disclosure. The light receiving module 410 and the light emitting module 420 are both packaged in coaxial TO packages, the light receiving module 410 is connected with the circuit board 300 through a first flexible circuit board 510, and the light emitting module 420 is connected with the circuit board 300 through a second flexible circuit board 520.

In the embodiment of the present application, the optical transceiver module is a BOSA structure, and includes a package 401, one end of which is provided with an optical fiber adapter 402 for connecting with an external optical fiber, an optical receiver module 410 disposed on the opposite side of the optical fiber adapter 402, and an optical transmitter module 420 disposed on the adjacent side of the optical receiver module 410.

A notch 301 is formed in one corner of the circuit board 300, and for installing an avoiding portion, the optical transceiver module is disposed in the installing avoiding portion, and pins of the optical receiver module 410 and the optical transmitter module 420 are disposed toward the circuit board 300.

Fig. 7 is a first structural schematic diagram of an optical transceiver module and a first flexible circuit board according to an embodiment of the present disclosure, in which the optical receiver module 410 includes an optical receiver socket 411 and a plurality of optical receiver pins, and the optical receiver pins pass through the optical receiver socket 411 and protrude outside the optical receiver socket 411. One end of the first flexible circuit board 510 is soldered to the light receiving pin.

Fig. 8 is a schematic structural diagram of a first flexible circuit board according to an embodiment of the present disclosure. The first flexible circuit board 510 has a first TO connection portion 511 at one end thereof and a first circuit board connection portion 512 at the other end thereof, and is connected TO a circuit board.

The light receiving pin includes: a signal pin 4121 and a ground pin 4122, and a first end of the first flexible circuit board 510 is provided with a first TO connection portion 511 connected TO the bottom of the light receiving stem 411. The first TO connection portion 511 is provided with a plurality of pin through holes 5111, and the inner walls of the through holes are provided with metal plating layers TO be connected TO the light receiving pins. The metal plating layer is welded with the light receiving pin. The first absorption plate 610 is disposed on the surface of the first TO connection portion 511, covering the solder joints between the light receiving pins and the metal plating layer.

Fig. 9 is a second structural diagram of an optical transceiver module and a first flexible circuit board according to an embodiment of the present disclosure. Fig. 10 is a third structural schematic diagram of an optical transceiver module and a first flexible circuit board according to an embodiment of the present application. The first absorbing plate can be located at the first TO connection 511 by covering the solder joint between the ground pin and the metallization as shown in fig. 7, by covering the solder joint between the signal pin and the metallization as shown in fig. 9, or by covering the solder joint between the signal pin, the ground pin and the metallization as shown in fig. 10.

The shape of the first wave absorbing plate can be a cuboid structure shown in the figure, and can also be a circular arc structure. The first absorbing wave plate is arranged between the first TO connecting portion 511 and the circuit board 300, and the thickness of the first absorbing wave plate does not exceed the distance between the circuit board and the first TO connecting portion 511.

In some embodiments of the present application, the first absorption plate comprises: the first sub-absorbing wave plate covers a welding point between the signal pin and the metal coating; and the second sub wave absorbing plate covers a welding point between the grounding pin and the metal coating.

In some embodiments of the present application, the first TO connection portion 511 is a circular structure, covers the light receiving socket, and is provided with a plurality of pin through holes, and the inner walls of the through holes are provided with metal plating layers TO connect with the light receiving pins. The metal plating layer is welded with the light receiving pin. The first absorption plate is disposed on the surface of the first TO connection portion 511, and covers a solder joint between the light receiving pin and the metal plating layer.

With continued reference TO fig. 6 and 8, in the present embodiment, the first flexible circuit board 510 is provided at a first end thereof with a first TO connection portion 511, and at a second end thereof with a first circuit board connection portion 512. The circuit board 300 is provided with a gold receiving finger portion 302 soldered to the first circuit board connection portion. The first circuit board connecting portion is provided with a plurality of bonding pads 514, as shown in fig. 8, the upper surface of the first circuit board connecting portion is provided with a first bonding pad, the lower surface is provided with a second bonding pad, the projection positions of the first bonding pad and the second bonding pad on the circuit board are consistent, or the projection of the first bonding pad on the circuit board 300 covers the second bonding pad. The receiving golden finger 302 corresponding to the second bonding pad is arranged below the second bonding pad. The receiving golden finger portion 302 is provided with a plurality of receiving golden fingers corresponding to the pads of the first circuit board connecting portion 512 one by one.

The first circuit board connection portion is also provided with a solder through hole 515 communicating the first land with the second land. In the embodiment of the present application, the number of the soldering through holes between the first pad and the second pad may be 1, and may be 2 or more than 2. The number of the first bonding pads arranged on the upper surface of the first circuit board connecting part is consistent with that of the light receiving pins, and the number of the second bonding pads is consistent with that of the first bonding pads.

During installation, tin is dotted on the upper surface of the first bonding pad, tin liquid flows from the first bonding pad to the second bonding pad through the welding through hole and is connected with the transmitting golden finger connected with the second bonding pad, and therefore the first flexible circuit board 510 is electrically connected with the circuit board.

For convenient welding, the first circuit board connecting portion is further provided with a positioning through hole, including a first positioning through hole 5131 and a second positioning through hole. The first positioning through hole 5131 and the second positioning through hole 5132 are located outside the traces of the first flexible circuit board 510. The circuit board 300 is provided with a limiting protrusion near the mounting avoiding portion, and the limiting protrusion comprises a first limiting protrusion 3031 and a second limiting protrusion 3032. The projection of the first positioning through hole 5131 on the circuit board covers the first limit protrusion 3031, and the projection of the second positioning through hole 5132 on the circuit board covers the second limit protrusion 3032.

For convenient installation, the first limiting protrusion 3031 and the second limiting protrusion 3032 are arranged to protrude out of the surface of the circuit board. In some embodiments of the present application, the first limiting protrusion 3031 penetrates through the first positioning through hole 5131, the second limiting protrusion 3032 penetrates through the second positioning through hole 5132, and the first limiting protrusion is matched with the first positioning through hole 5131, and the second limiting protrusion is matched with the second positioning through hole 5132, so that the first flexible circuit board 510 and the circuit board can be positioned, and the pad of the first circuit board connecting portion is conveniently connected with the receiving golden finger 302 at the corresponding position of the circuit board.

During installation, the first TO connection portion 511 is connected with the light receiving assembly, then the first limiting protrusion 3031 is matched with the first positioning through hole 5131 in position, the second limiting protrusion 3032 is matched with the second positioning through hole 5132 in position, the first circuit board connection portion 512 is matched with the receiving golden finger portion 302 in position, and then the first circuit board connection portion 512 is connected with the receiving golden finger portion 302 through soldering tin.

Fig. 11 is a second schematic view of a connection structure between an optical transceiver module and a circuit board according to an embodiment of the present disclosure. In some embodiments of the present application, a second wave-absorbing plate 620 may be further disposed on the upper surface of the first circuit board connecting portion 512, covering the solder joints between the first circuit board connecting portion and the gold finger receiving portion. The second wave absorbing plate can be in a cuboid structure or in other shapes.

The second wave absorbing plate 620 may be disposed to cover the receiving golden finger. In some embodiments of the present application, the second suction wave plate may cover one or more receiving goldfingers.

The wave absorbing plate has certain viscosity and can be directly stuck at a required position. If the wave absorbing plate has no viscosity or poor viscosity, surface layer glue with viscosity can be added on the surface of the wave absorbing material, so that the performance cannot be influenced while the viscosity is increased.

The wave absorbing plates with different wave absorbing frequencies can absorb noise within a certain frequency range around the corresponding frequency, the material of the wave absorbing plate is selected according to the frequency of the loud noise, the frequency of the loud noise is usually obtained through experiments, namely, the eye pattern or the receiving sensitivity can be seen through pasting wave absorbing materials with different frequencies, and the method is simple, practical, high in accuracy and easy to operate.

The light emitting assembly 420 includes a light emitting stem and a plurality of light emitting pins passing through the light emitting stem and protruding outside the light emitting stem. One end of the second flexible circuit board 520 is soldered to the light emitting pin.

Fig. 12 is a third schematic view of a connection structure between an optical transceiver module and a circuit board according to an embodiment of the present application. The light emitting pin includes: the first end of the second flexible circuit board is provided with a second TO connecting part which is connected with the bottom of the light emitting tube seat. The second TO connecting portion is provided with a plurality of pin through holes, and the inner walls of the through holes are provided with transmitting metal coatings and connected with the light transmitting pins. The transmitting metal plating is welded with the light receiving pin. The third wave absorbing plate is arranged on the surface of the second TO connecting part and covers a welding spot between the light receiving pin and the emission metal coating.

The third absorbing wave plate 630 may cover a solder joint between the transmitting signal pin and the transmitting metal plating layer, or cover a solder joint between the transmitting ground pin and the transmitting metal plating layer, or cover a solder joint between the transmitting signal pin, the transmitting ground pin, and the transmitting metal plating layer, in a position where the second TO connection portion is coincident with the first absorbing wave plate at the first TO connection portion 511.

The third wave absorbing plate 630 may have a rectangular parallelepiped structure, or may have a square or other shape structure. The third wave absorbing plate is arranged between the second TO connecting portion and the circuit board 300, and the thickness of the third wave absorbing plate does not exceed the distance between the circuit board and the third TO connecting portion.

In some embodiments of the present application, the third TO connection portion is a circular structure, covers the light emitting stem, and is provided with a plurality of pin through holes, and the inner walls of the through holes are provided with a light emitting metal plating layer, and are connected with the light emitting pins. The metal plating layer is welded with the light receiving pin. The third wave absorbing plate is disposed on the surface of the first TO connection portion 511, and covers a solder joint between the light emitting pin and the emission metal plating layer.

In this embodiment, the first end of the second flexible circuit board is provided with a second TO connection portion, and the second end is provided with a second circuit board connection portion. The circuit board 300 is provided with a gold finger part for transmission, which is welded to the second circuit board connection part. The second circuit board connecting portion is provided with a plurality of emission pads, as shown in the figure, the upper surface of the second circuit board connecting portion is provided with a first emission pad, the lower surface is provided with a second emission pad, the projection positions of the first emission pad and the second emission pad on the circuit board are consistent, or the projection of the first emission pad on the circuit board 300 covers the second emission pad. And a corresponding emitting golden finger is arranged below the second emitting bonding pad. The transmitting golden finger part is provided with a plurality of transmitting golden fingers which are in one-to-one correspondence with the welding discs of the connecting part of the second circuit board.

The second circuit board connecting part is also provided with an emission welding through hole which is communicated with the first emission welding disc and the second emission welding disc. In the embodiment of the present application, the number of the soldering vias between the first and second emission pads may be 1, and may be 2 or more than 2. The upper surface of the second circuit board connecting part is provided with first transmitting pads, the number of which is consistent with that of the light receiving pins, and the number of second transmitting pads is consistent with that of the second pads.

For convenient welding, the second circuit board connecting part is also provided with a transmitting positioning through hole which comprises a third positioning through hole and a fourth positioning through hole. The third positioning through hole and the fourth positioning through hole are positioned on the outer side of the wiring of the second flexible circuit board. The circuit board 300 is provided with a transmitting limit protrusion, including a first transmitting limit protrusion and a second transmitting limit protrusion, near the mounting avoiding portion. The projection of the first emission positioning through hole on the circuit board covers the first emission limiting bulge, and the projection of the second emission positioning through hole on the circuit board covers the second emission limiting bulge.

For convenient installation, the first emission limiting bulge and the second emission limiting bulge are arranged to protrude out of the surface of the circuit board. In some embodiments of the present application, the first transmitting limiting protrusion passes through the first transmitting positioning through hole, the second transmitting limiting protrusion passes through the second transmitting positioning through hole, the first transmitting limiting protrusion is matched with the first transmitting positioning through hole, and the second transmitting limiting protrusion is matched with the second transmitting positioning through hole, so that the second flexible circuit board and the circuit board can be positioned, and the pad of the second circuit board connecting portion is conveniently connected with the transmitting golden finger at the corresponding position of the circuit board.

During the installation, at first be connected second TO connecting portion and light emission component, then the spacing protruding position matching of first transmission and first transmission positioning hole, the spacing protruding position matching of second transmission and second transmission positioning hole of first transmission, second circuit board connecting portion and transmission golden finger position matching, then be connected first circuit board connecting portion and transmission golden finger portion through soldering tin.

In some embodiments of the present application, a fourth wave-absorbing plate 640 may be further disposed on the upper surface of the second circuit board connection portion, covering the solder joint between the second circuit board connection portion and the launch gold finger portion. The second wave absorbing plate can be in a cuboid structure or in other shapes.

The fourth wave absorbing plate 640 may be disposed as one or more pieces covering the emitting golden finger. In some embodiments of the present application, the second suction wave plate may cover one or more of the emitting fingers.

In the embodiment of the present application, the first wave absorbing plate, the second wave absorbing plate, the third wave absorbing plate and the fourth wave absorbing plate may be made of the same material or different materials.

The application provides an optical module, its light receiving assembly is the BOSA structure, includes: and one end of the tube shell is provided with an optical fiber adapter for being connected with external optical fibers, the light receiving component is arranged on the opposite side of the optical fiber adapter, and the light emitting component is arranged on the adjacent side of the light receiving component. The circuit board is connected with the light receiving assembly and the light emitting assembly through the flexible circuit boards. The wave absorbing plate is attached to the welding positions of the flexible circuit board and the light receiving assembly, the flexible circuit board and the light emitting assembly and the circuit board and the flexible circuit board, so that impedance continuity is optimized, noise is filtered, and the performance of an emitted light eye pattern and the performance of receiving sensitivity are improved.

Set up in the optic fibre adapter contralateral to light emission component, light receiving assembly sets up in the setting of facing the side of light emission component, and this application is applicable equally.

Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.

It is noted that, in this specification, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims (9)

1. A light module, comprising:

a circuit board;

an optical transceiver assembly comprising:

a pipe shell;

the light receiving component, set up in one side of the tube shell includes:

a light-receiving tube seat is arranged on the light-receiving tube seat,

a light receiving pin passing through the light receiving tube seat and protruding outside the light receiving tube seat,

one end of the first flexible circuit board is provided with a first TO connecting part, and one side of the first TO connecting part is welded with the light receiving pin; the other end is provided with a first circuit board connecting part which is welded with the circuit board;

and the first wave absorbing plate is arranged on the first flexible circuit board and covers a welding spot between the light receiving pin and the first TO connecting part or a welding spot between the first circuit board connecting part and the circuit board.

2. The light module of claim 1,

the first TO connecting part is provided with a pin through hole, the inner wall of the first TO connecting part is provided with a metal coating, and the light receiving pin is welded with the metal coating;

the first wave absorbing plate covers welding points between the metal plating layer and the light receiving pins.

3. The optical module of claim 2, wherein the light receiving pin comprises: a signal pin and a ground pin;

the first absorption plate comprises: the first sub wave absorbing plate covers a welding point between the signal pin and the metal coating;

the second sub wave absorbing plate covers welding spots between the grounding pin and the metal coating.

4. The optical module of claim 1, further comprising: the second wave absorbing plate is arranged on the upper surface of the first circuit board connecting part and covers a welding spot between the first circuit board connecting part and the circuit board;

the lower surface of the first circuit board connecting part is connected with the circuit board.

5. The optical module according to claim 4, wherein the first circuit board connection portion includes:

a first pad disposed on an upper surface of the first circuit board connection portion;

a second pad disposed on a lower surface of the first circuit board connection portion;

the circuit board is arranged to receive a golden finger;

the second bonding pad is arranged above the receiving golden finger, and the projection of the first bonding pad on the circuit board covers the second bonding pad;

the second wave absorbing plate is arranged on the upper surface of the first bonding pad, and the projection of the second wave absorbing plate on the circuit board covers the receiving golden finger.

6. The optical module according to claim 5, wherein the first circuit board connecting portion is provided with a solder through hole, one end of which is connected to the first pad and the other end of which is connected to the second pad; the second wave absorbing plate covers the welding through hole.

7. The optical module according to claim 4, wherein the first circuit board connecting portion is further provided with a positioning through hole, and the circuit board is provided with a limiting protrusion; the end part of the limiting bulge penetrates through the positioning through hole and protrudes out of the upper surface of the first circuit board connecting part.

8. The optical module of claim 1, wherein the optical transceiver component further comprises: the light emission subassembly set up in the opposite side of tube shell includes:

a light-emitting tube seat is arranged on the light-emitting tube seat,

a light emitting pin passing through the light emitting tube seat and protruding out of the outer side of the light emitting tube seat,

one end of the second flexible circuit board is provided with a second TO connecting part, and one side of the first TO connecting part is welded with the light emitting pin; the other end is provided with a second circuit board connecting part which is welded with the circuit board;

and the third wave absorbing plate is arranged on the other side of the second TO connecting part and covers a welding spot between the light receiving pin and the second TO connecting part.

9. The light module of claim 8, further comprising: the fourth wave absorbing plate is arranged on the upper surface of the second circuit board connecting part and covers a welding spot between the second circuit board connecting part and the circuit board;

the lower surface of the second circuit board connecting part is connected with the circuit board.

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