CN217442752U

CN217442752U - Pressure sensor

Info

Publication number: CN217442752U
Application number: CN202221387344.9U
Authority: CN
Inventors: 孙飞; 吴东辉; 肖滨; 李刚
Original assignee: Kunshan Lingke Sensing Technology Co ltd
Current assignee: Kunshan Lingke Sensing Technology Co ltd
Priority date: 2022-06-01
Filing date: 2022-06-01
Publication date: 2022-09-16
Anticipated expiration: 2032-06-01

Abstract

The utility model relates to the technical field of sensors, a pressure sensor is disclosed. The pressure sensor includes a first substrate, a second substrate, a connection member, and a pressure sensor chip. The two ends of the first substrate are provided with connecting parts, and the connecting parts are used for connecting the first substrate and the second substrate to form an accommodating cavity. The connecting component comprises a connecting body and pins, the connecting body extends along the vertical direction, one ends of the pins are arranged in the containing cavity, the other ends of the pins penetrate through the connecting body to be connected with the outside, and the pressure sensor chip is arranged in the containing cavity and attached to one side of the two pins. The pressure sensor chip in the arrangement is not contacted with the substrate, so that adverse effects of external stress on the working performance of the pressure sensor chip in the packaging process are avoided.

Description

Pressure sensor

Technical Field

The utility model relates to a sensor technical field especially relates to a pressure sensor.

Background

The conventional pressure sensor is packaged by attaching the pressure sensor chip to the substrate through glue. In the packaging process, because the pressure sensor chip is connected with the substrate, the working performance of the pressure sensor chip is easily affected by external stress. The influence of external stress on the pressure sensor chip is often weakened by increasing the thickness of the adhesive layer between the pressure sensor chip and the substrate, but the method has high requirement on the packaging precision of the pressure sensor so as to prevent the thickness of the adhesive layer between the pressure sensor chip and the substrate from meeting the requirement of weakening the external stress.

Therefore, a pressure sensor is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pressure sensor can solve pressure sensor in the packaging process, because the external stress causes pressure sensor's the problem that working property is low.

As the conception, the utility model adopts the technical proposal that:

a pressure sensor, comprising:

a first substrate;

a second substrate;

the connecting parts are arranged at two ends of the first substrate and are used for connecting the first substrate and the second substrate to form an accommodating cavity; the connecting part comprises a connecting body and pins, the connecting body extends along the vertical direction, one ends of the pins are arranged in the accommodating cavities, and the other ends of the pins penetrate through the connecting body to be connected with the outside;

and the pressure sensor chips are arranged in the accommodating cavities and are attached to one sides of the two pins.

As an alternative mode of the above pressure sensor, the first substrate is connected to a bottom end of one of the connection members and spaced apart from a bottom end of the other connection member to form a first through hole; the two pins are arranged at intervals to form a second through hole, and external gas can sequentially pass through the first through hole and the second through hole and then is in contact with the back face of the pressure sensor chip.

As an optional manner of the pressure sensor, the second substrate is connected to top ends of the two connecting members, and the second substrate is provided with a third through hole along a thickness direction thereof, and a piezoresistive sensing film is disposed at a top end of the pressure sensor chip, and external air can contact the piezoresistive sensing film through the third through hole.

As an optional mode of above-mentioned pressure sensor, one of them the mounting groove has all been seted up at the both ends of connecting body, another the top of connecting body is seted up the mounting groove, another the bottom of connecting body is followed the degree of depth of mounting groove is cut completely to form the cutting plane, the groove of stepping down has all been seted up at the both ends of first base plate, the one end of first base plate can with the connecting body bottom the cell wall of mounting groove links to each other, the first base plate other end step down the groove tank bottom with there is the clearance between the cutting plane, in order to form first through-hole.

As an optional manner of the above pressure sensor, the first substrate is connected to top ends of the two connecting components, the second substrate is connected to bottom ends of the two connecting components, and the second substrate is provided with a first through hole along a thickness direction thereof; the two pins are arranged at intervals to form a second through hole, and external gas can sequentially pass through the first through hole and the second through hole and then is in contact with the back face of the pressure sensor chip.

As an optional manner of the above pressure sensor, the pressure sensor further includes a connecting wire, and the pressure sensor chip is connected to one of the pins through the connecting wire.

As an optional mode of the pressure sensor, the two pins and the pressure sensor chip separate the accommodating cavity into a first accommodating cavity and a second accommodating cavity, a protective layer is arranged in the first accommodating cavity and covers one side of the pressure sensor chip, the protective layer is also arranged in the second accommodating cavity, and the protective layer covers the other side of the pressure sensor chip.

As an optional mode of the pressure sensor, the two pins are disposed at one end of the accommodating cavity and abutted against each other.

As an optional mode of the pressure sensor, the pressure sensor further includes a conditioning chip, and the conditioning chip and the pressure sensor chip are arranged on the pin in a reverse manner.

As an optional mode of the pressure sensor, the pin includes an auxiliary component and a pin body, one end of the pin body, which is located in the accommodating cavity, is provided with the auxiliary component, one side of the auxiliary component, which is away from the pressure sensor chip, is convexly provided with a protrusion, the conditioning chip is attached to the protrusion, a fourth through hole is formed between an attachment surface of the conditioning chip and the other auxiliary component, and the first through hole, the fourth through hole and the second through hole form a flow channel, so that external air flows to the back surface of the pressure sensor chip.

The utility model has the advantages that:

the utility model provides a pressure sensor includes first base plate, second base plate, adapting unit and pressure sensor chip. The two ends of the first substrate are provided with connecting parts, and the connecting parts are used for connecting the first substrate and the second substrate to form an accommodating cavity. The connecting component comprises a connecting body and pins, the connecting body extends along the vertical direction, one ends of the pins are arranged in the containing cavity, the other ends of the pins penetrate through the connecting body to be connected with the outside, and the pressure sensor chip is arranged in the containing cavity and attached to one side of the two pins. The pressure sensor chip in the arrangement is not contacted with the substrate, so that adverse effects of external stress on the working performance of the pressure sensor chip in the packaging process are avoided.

Drawings

Fig. 1 is a schematic structural diagram of a pressure sensor according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a pressure sensor according to a second embodiment of the present invention;

fig. 3 is a schematic structural diagram of a pressure sensor provided in the third embodiment of the present invention;

fig. 4 is a schematic structural diagram of a pressure sensor according to a fourth embodiment of the present invention.

In the figure:

1. a first substrate; 2. a second substrate; 3. a connecting member; 4. a pressure sensor chip; 5. conditioning the chip; 6. a connecting wire; 7. a protective layer; 8. a first glue layer;

11. a yielding groove; 111. a first through hole;

21. a third through hole;

31. a connecting body; 311. mounting grooves; 32. a pin; 321. a pin body; 322. an auxiliary member; 3221. a protrusion; 3222. a fourth via hole; 323. a second through hole;

41. piezoresistive sensing membranes.

Detailed Description

In order to make the technical problems, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further explained below by means of specific embodiments in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected", "connected" and "fixed" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to be limiting.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Example one

As shown in fig. 1, the present embodiment provides a pressure sensor including a first substrate 1, a second substrate 2, a connection member 3, and a pressure sensor chip 4. Both ends of the first substrate 1 are provided with connecting parts 3, and the connecting parts 3 are used for connecting the first substrate 1 and the second substrate 2 to form an accommodating cavity. Connecting part 3 is including connecting body 31 and pin 32, and connecting body 31 extends along vertical direction, and the intracavity is located to the one end of pin 32, and the other end of pin 32 passes connecting body 31 and links to each other with the external world, and pressure sensor chip 4 is located and is held the intracavity to paste and locate one side of two pins 32. The pressure sensor chip 4 in the above arrangement is not in contact with the substrate, so that adverse effects of external stress on the working performance of the pressure sensor chip 4 in the packaging process are avoided. Further optionally, the connecting body 31 and the pins 32 are of an integral structure, so that the processing difficulty is reduced, and the connecting body 31 can be formed through integral injection molding or ceramic process. Further, the connecting body 31 and the pins 32 are locked, so that the connection stability of the connecting body 31 and the pins 32 is improved, and the packaging quality of the pressure sensor is improved. Further optionally, an end of the pin 32 remote from the receiving cavity is bent to facilitate electrical connection with an external component.

Further optionally, a first glue layer 8 is disposed between the pressure sensor chip 4 and the pins 32 to connect the pressure sensor chip 4 and the pins 32. Further, the first adhesive layer 8 is epoxy resin glue or high-hardness high-shear glue. And need utilize solid brilliant equipment to paste pressure sensor chip 4 and locate on first glue film 8, after the subsides are established, still need pass through the solidification condition to improve the steadiness that pressure sensor chip 4 and pin 32 are connected. Wherein, the curing condition is that the pressure sensor chip 4 is required to be in the environment of 150 ℃ for 30min-60 min.

Further optionally, the pressure sensor further includes a connection line 6, the pressure sensor chip 4 is connected to one of the pins 32 through the connection line 6, so as to electrically connect the pressure sensor chip 4 to one of the pins 32, and when a product failure analysis is required, the pressure sensor chip 4 can be directly connected to the pressure sensor through the exposed pin 32, so as to implement an electrical analysis of the pressure sensor chip 4. In order to ensure the conductive effect of the connection line 6, the connection line 6 may be a gold wire, an aluminum wire, a copper wire, an alloy wire, or the like, which is not limited in this embodiment.

Further optionally, two pins 32 and pressure sensor chip 4 will hold the chamber and separate into first chamber and the second chamber that holds, and first intracavity that holds is equipped with protective layer 7, and protective layer 7 covers one side of pressure sensor chip 4, and the second holds the intracavity and also is equipped with protective layer 7, and protective layer 7 covers the opposite side of pressure sensor chip 4, and the all-round parcel pressure sensor chip 4 of two-layer protective layer 7 has improved pressure sensor's reliability. The protective layer 7 protects the pressure sensor chip 4 from being damaged by the external environment, and the service life of the pressure sensor is prolonged. Specifically, the protective layer 7 is formed of a fluorine-containing silicone gel. The fluorine-containing silicone gel has good corrosion resistance, thereby preventing the pressure sensor chip 4 from being damaged by corrosive gas. And the wrapping process of the protective layer 7 is realized by glue spraying or glue dispensing equipment.

Further optionally, an adhesive is disposed between the connecting member 3 and the first substrate 1 and the second substrate 2 to improve the stability of the connection between the first substrate 1 and the second substrate 2 and the connecting member 3. Further, the adhesive member may be a product having an adhesive function, such as glue or solder paste, and is not limited herein.

Alternatively, the first substrate 1 is connected to a bottom end of one of the connection members 3 and spaced apart from a bottom end of the other connection member 3 to form the first through hole 111. The two pins 32 are spaced apart to form a second through hole 323. The external air can contact with the back surface of the pressure sensor chip 4 after sequentially passing through the first through hole 111 and the second through hole 323, so as to realize back air intake of the pressure sensor. Specifically, mounting groove 311 has all been seted up at one of them both ends of connecting body 31, mounting groove 311 is seted up on the top of another connecting body 31, the degree of depth of mounting groove 311 is cut completely along the bottom of another connecting body 31, in order to form the cutting plane, the groove of stepping down 11 has all been seted up at the both ends of first base plate 1, the one end of first base plate 1 can link to each other with the cell wall of mounting groove 311 of connecting body 31 bottom, there is the clearance between the groove of stepping down 11 bottoms of the first base plate 1 other end and the cutting plane, in order to form first through-hole 111, thereby be convenient for outside gas to get into and hold the intracavity. Further, the adhesive member is disposed at the notch of the mounting groove 311 at the bottom end of the connection member 3 such that the first substrate 1 is spaced apart from one of the connection members 3 after being connected to the other connection member 3.

Further alternatively, the second substrate 2 is connected to the top ends of the two connection members 3, and the second substrate 2 is opened with a third through hole 21 along the thickness direction thereof, the top end of the pressure sensor chip 4 is provided with a piezoresistive sensing film 41, and external air can contact the piezoresistive sensing film 41 through the third through hole 21 to realize positive air intake of the pressure sensor. Further, an adhesive member is provided at the groove bottom of the mounting groove 311 at the top end of the connection member 3 to achieve the connection of the second substrate 2 with the two connection members 3.

Or alternatively, the first substrate 1 is connected to the top ends of the two connection parts 3, the second substrate 2 is connected to the bottom ends of the two connection parts 3, and the second substrate 2 is provided with a first through hole 111 along the thickness direction thereof. The two pins 32 are spaced apart to form a second through hole 323. The external air can contact with the back surface of the pressure sensor chip 4 after sequentially passing through the first through hole 111 and the second through hole 323, so as to realize back air intake of the pressure sensor. Specifically, the adhesive member is provided at the notch of the mounting groove 311 at the top end of the connection member 3 to achieve the connection of the first substrate 1 with the two connection members 3. The adhesive member is further provided at the groove bottom of the mounting groove 311 at the bottom end of the connection member 3 to couple the second substrate 2 with the two connection members 3.

The pressure sensor in the first embodiment can reduce the influence of external stress on the working performance, and can select different air inlet directions of the pressure sensor through the change of the installation positions of the first substrate 1 and the second substrate 2, wherein the air inlet directions can be back air inlet or front air inlet, and how to select the actual working environment needs to be combined.

Example two

As shown in fig. 2, the structure of the pressure sensor in this embodiment is similar to that of the pressure sensor in the first embodiment, except for the arrangement of two pins 32 in this embodiment.

Optionally, the two pins 32 are disposed at one end of the accommodating cavity to abut against each other, and at this time, the second through hole 323 is closed, so that the external air can only contact with the piezoresistive sensing film 41 on the pressure sensor chip 4 through the third through hole 21, that is, the pressure sensor can only be used as an absolute pressure sensor. At this time, the first substrate 1 is used for connecting the bottom ends of the two connecting components 3, the second substrate 2 is used for connecting the top ends of the two connecting components 3, and the second substrate 2 is provided with a third through hole 21 so that the external air can contact the piezoresistive sensing film 41 after entering the first accommodating cavity. Since the external air can enter the first accommodating cavity only through the third through hole 21, the protective layer 7 is no longer arranged in the second accommodating cavity.

The pressure sensor of the second embodiment can reduce the influence of external stress on the working performance.

EXAMPLE III

As shown in fig. 3, the structure of the pressure sensor in this embodiment is similar to that of the pressure sensors in the first and second embodiments, except that the pressure sensor in this embodiment includes a conditioning chip 5.

Optionally, the conditioning chip 5 and the pressure sensor chip 4 are disposed on the leads 32 opposite to each other, so that the pressure sensor in this embodiment becomes a dual-chip differential pressure sensor. A second glue layer is arranged between the pins 32 and the conditioning chip 5, so that the conditioning chip 5 is connected with the pins 32.

Further optionally, the pin 32 includes an auxiliary component 322 and a pin body 321, one end of the pin body 321, which is located in the accommodating cavity, is provided with the auxiliary component 322, one side of one of the auxiliary components 322, which is away from the pressure sensor chip 4, is convexly provided with a protrusion 3221, the conditioning chip 5 is attached to the protrusion 3221, so that a fourth through hole 3222 is formed between the attachment surface of the conditioning chip 5 and the other auxiliary component 322, and the first through hole 111, the fourth through hole 3222, and the second through hole 323 form a flow channel, thereby facilitating the flow of the external air to the back surface of the pressure sensor chip 4. Further optionally, the pin body 321 is detachably connected to the auxiliary element 322, so that the auxiliary element 322 can be replaced, on one hand, the auxiliary element 322 can be repaired, and on the other hand, the auxiliary elements 322 with different thicknesses can be replaced, thereby changing the width of the flow channel. Generally, there are various detachable connection methods, and in this embodiment, a clip is selected as the connection method between the pin body 321 and the auxiliary element 322.

Further optionally, the connecting wires 6 are also used for connecting the conditioning chip 5 with the two pins 32. Further optionally, the protective layer 7 disposed in the second accommodating cavity also wraps the conditioning chip 5.

The pressure sensor in the third embodiment can reduce the influence of external stress on the working performance, and can select different air inlet directions of the pressure sensor through the change of the installation positions of the first substrate 1 and the second substrate 2, wherein the air inlet directions can be back air inlet or front air inlet, and the actual working environment is combined with the selection requirement specifically. Moreover, the pressure sensor in the third embodiment compresses the packaging volume through the back stacking of the two chips, and the pressure sensor chip 4 or the conditioning chip 5 is separately tested and judged when the pressure sensor fails through the connection relationship of the common pins.

Example four

As shown in fig. 4, the structure of the pressure sensor in the present embodiment is similar to that of the pressure sensor in the third embodiment, except for the provision of the auxiliary 322.

Optionally, the pin 32 includes an auxiliary component 322 and a pin body 321, the auxiliary component 322 is disposed at one end of the pin body 321 in the accommodating cavity, the thickness of the auxiliary component 322 is equal to that of the pin body 321, and the pressure sensor chip 4 and the conditioning chip 5 are disposed at two sides of the auxiliary component 322, that is, the auxiliary component 322 is disposed without pulling a distance between the conditioning chip 5 and another auxiliary component 322, and a through hole for allowing external air to contact with the back surface of the pressure sensor chip 4 cannot be formed. Therefore, the pressure sensor in the fourth embodiment is a two-chip absolute pressure sensor. At this time, the first substrate 1 is used to connect the bottom ends of the two connecting parts 3, the second substrate 2 is used to connect the top ends of the two connecting parts 3, and the second substrate 2 is provided with a third through hole 21, so that the external air can contact the piezoresistive sensing film 41 after entering the first accommodating cavity. Since the external air can enter the first accommodating cavity only through the third through hole 21, the protective layer 7 is no longer arranged in the second accommodating cavity.

The pressure sensor in the fourth embodiment can reduce the influence of external stress on the working performance, the packaging volume can be compressed through the back stacking of the two chips, and the pressure sensor chip 4 or the conditioning chip 5 can be tested and judged separately through the connection relation of the common pins when the pressure sensor fails.

The above embodiments have been described only the basic principles and features of the present invention, and the present invention is not limited by the above embodiments, and is not departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A pressure sensor, comprising:

a first substrate (1);

a second substrate (2);

the connecting parts (3) are arranged at two ends of the first substrate (1), and the connecting parts (3) are used for connecting the first substrate (1) and the second substrate (2) to form an accommodating cavity; the connecting part (3) comprises a connecting body (31) and pins (32), the connecting body (31) extends in the vertical direction, one ends of the pins (32) are arranged in the accommodating cavities, and the other ends of the pins (32) penetrate through the connecting body (31) to be connected with the outside;

the pressure sensor chip (4) is arranged in the accommodating cavity, and the pressure sensor chip (4) is attached to one side of the two pins (32).

2. The pressure sensor according to claim 1, wherein the first substrate (1) is connected to a bottom end of one of the connection members (3) and spaced apart from a bottom end of the other connection member (3) to form a first through hole (111); the two pins (32) are arranged at intervals to form a second through hole (323), and external air can sequentially pass through the first through hole (111) and the second through hole (323) and then contact with the back surface of the pressure sensor chip (4).

3. The pressure sensor according to claim 2, wherein the second substrate (2) is connected to top ends of the two connection members (3), and the second substrate (2) is formed with a third through hole (21) along a thickness direction thereof, and a piezoresistive sensing film (41) is formed on a top end of the pressure sensor chip (4), and external air can be in contact with the piezoresistive sensing film (41) through the third through hole (21).

4. The pressure sensor according to claim 2, wherein both ends of one of the connecting bodies (31) are provided with a mounting groove (311), the top end of the other connecting body (31) is provided with the mounting groove (311), the bottom end of the other connecting body (31) is completely cut along the depth of the mounting groove (311) to form a cutting surface, both ends of the first substrate (1) are provided with an abdicating groove (11), one end of the first substrate (1) can be connected with the groove wall of the mounting groove (311) at the bottom end of the connecting body (31), and a gap exists between the bottom of the abdicating groove (11) at the other end of the first substrate (1) and the cutting surface to form the first through hole (111).

5. The pressure sensor according to claim 1, wherein the first substrate (1) is connected to top ends of the two connecting members (3), the second substrate (2) is connected to bottom ends of the two connecting members (3), and the second substrate (2) is provided with a first through hole (111) along a thickness direction thereof; the two pins (32) are arranged at intervals to form a second through hole (323), and external air can sequentially pass through the first through hole (111) and the second through hole (323) and then contact with the back surface of the pressure sensor chip (4).

6. A pressure sensor according to any of claims 2-5, characterized in that the pressure sensor further comprises a connection line (6), and the pressure sensor chip (4) is connected to one of the pins (32) via the connection line (6).

7. The pressure sensor according to claim 6, wherein the two pins (32) and the pressure sensor chip (4) divide the accommodating cavity into a first accommodating cavity and a second accommodating cavity, a protective layer (7) is arranged in the first accommodating cavity, the protective layer (7) covers one side of the pressure sensor chip (4), the protective layer (7) is also arranged in the second accommodating cavity, and the protective layer (7) covers the other side of the pressure sensor chip (4).

8. A pressure sensor according to claim 3, wherein the two pins (32) are arranged in abutment at one end in the receiving chamber.

9. The pressure sensor according to claim 2, further comprising a conditioning chip (5), the conditioning chip (5) being arranged on the pins (32) opposite the pressure sensor chip (4).

10. The pressure sensor according to claim 9, wherein the pin (32) comprises an auxiliary member (322) and a pin body (321), the auxiliary member (322) is disposed at one end of the pin body (321) disposed in the accommodating cavity, a protrusion (3221) is convexly disposed on one side of one of the auxiliary members (322) away from the pressure sensor chip (4), the conditioning chip (5) is attached to the protrusion (3221), a fourth through hole (3222) is formed between an attachment surface of the conditioning chip (5) and the other auxiliary member (322), and the first through hole (111) and the fourth through hole (3222) and the second through hole (323) form a flow channel, so that external air flows to a back side of the pressure sensor chip (4).