CN217434870U - Distributed sewage module mould - Google Patents
Distributed sewage module mould Download PDFInfo
- Publication number
- CN217434870U CN217434870U CN202122394780.0U CN202122394780U CN217434870U CN 217434870 U CN217434870 U CN 217434870U CN 202122394780 U CN202122394780 U CN 202122394780U CN 217434870 U CN217434870 U CN 217434870U
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- CN
- China
- Prior art keywords
- thimble
- die
- groove
- ejector pin
- ejector
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- 239000010865 sewage Substances 0.000 title claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 35
- 238000002347 injection Methods 0.000 claims abstract description 32
- 239000007924 injection Substances 0.000 claims abstract description 32
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The application discloses a distributed sewage module die which comprises an upper die and a lower die; the upper die comprises an upper die cover plate and an upper die plate, and the upper die cover plate is provided with an injection gate; the lower die comprises a base, a lower die plate, an ejection device and a pair of supporting plates, the supporting plates are symmetrically arranged on the base, the lower die plate is arranged on the supporting plates, the ejection device is arranged between the supporting plates, a die cavity is formed between the upper die and the lower die, the injection gate is communicated with the die cavity, and the ejection device ejects an object in the die cavity. From this, form the mould chamber through between cope match-plate pattern and the lower bolster, carry out the injecting glue and form module assembly, then ejecting module assembly from the mould intracavity through ejecting device, mould overall structure is simple, low in production cost.
Description
Technical Field
The utility model relates to a mould field especially relates to distributed sewage module mould.
Background
Present distributed sewage module is formed by a plurality of module component subassemblies, and module component need be made through mould processing, and current mould structure is complicated, and production efficiency is lower, and current mould when the injecting glue is made, can connect the part of connecting between the module product of making and annotate the connecting strip that forms in the gluey groove promptly, and the later stage still need be dismantled the module even together, and because the connecting strip is thicker for dismantle inefficiency.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a distributed sewage module mould solves one or more among the above-mentioned prior art problem.
According to one aspect of the present invention, a distributed sewage module mold is provided, comprising an upper mold and a lower mold; the upper die comprises an upper die cover plate and an upper die plate, and the upper die cover plate is provided with an injection gate; the lower die comprises a base, a lower die plate, an ejection device and a pair of supporting plates, the supporting plates are symmetrically arranged on the base, the lower die plate is arranged on the supporting plates, the ejection device is arranged between the supporting plates, a die cavity is formed between the upper die and the lower die, the injection gate is communicated with the die cavity, and the ejection device ejects an object in the die cavity.
From this, form the mould chamber through between cope match-plate pattern and the lower bolster, carry out the injecting glue and form module assembly, then ejecting module assembly from the mould intracavity through ejecting device, mould overall structure is simple, low in production cost.
In some embodiments: the surface of the lower die is provided with a die groove, a glue injection main groove and a glue injection branch groove, the glue injection main groove is communicated with the die groove through the glue injection branch groove, and a glue injection gate is communicated with the glue injection main groove.
In some embodiments: a plurality of first ejection holes and second ejection holes are formed in the die groove, the first ejection holes are uniformly distributed at the edge of the die groove, and the second ejection holes are uniformly distributed along the axis of the die groove; the glue injection main groove is uniformly provided with third ejection holes, the glue injection branch groove is provided with a fourth ejection hole close to the joint with the mould groove, the ejection device comprises a first ejector pin, a second ejector pin, a third ejector pin and a fourth ejector pin, and the first ejector pin, the second ejector pin, the third ejector pin and the fourth ejector pin are respectively arranged corresponding to the first ejection hole, the second ejection hole, the third ejection hole and the fourth ejection hole.
In some embodiments: the ejector device further comprises an ejector plate and an ejector base plate, the ejector base plate is arranged on the base, a power input hole is formed in the center of the base, the first ejector pin, the second ejector pin, the third ejector pin and the fourth ejector pin are arranged on the ejector base plate, and the ejector plate is sleeved on the first ejector pin, the second ejector pin, the third ejector pin and the fourth ejector pin and is fixedly arranged on the upper side face of the ejector base plate.
In some embodiments: the bottom of the fourth ejector pin is provided with an elastic pad, the top of the fourth ejector pin is an arc surface, when the elastic pad is in a normal state, the top of the fourth ejector pin extends out of the fourth ejection hole, a gap is reserved between the top of the fourth ejector pin and the upper die plate, and when the elastic pad is in a compression state after receiving pressure, the top of the fourth ejector pin is located in the fourth ejection hole. From this, when the injecting glue, the mould intracavity has pressure, presses fourth thimble top in the fourth ejecting hole, when the injecting glue finishes, stops the injecting glue, and mould intracavity pressure reduces to a certain extent, and fourth thimble top stretches out fourth ejecting hole, reduces the aperture of injecting glue tributary trough and mould groove junction for be connected between connecting strip and the module assembly more easily by the rupture, improve later stage module assembly's dismantlement efficiency.
In some embodiments: the supporting plate is provided with a positioning guide rod which penetrates through the lower template, and the upper template is provided with a guide hole matched with the guide rod. The positioning and guiding functions are realized for the upper template.
Drawings
Fig. 1 is a schematic structural view of the distributed sewage module mold of the present invention;
FIG. 2 is a schematic structural view of a lower mold of the distributed sewage module mold of the present invention;
FIG. 3 is a schematic structural view of the lower template of the distributed sewage module mold of the present invention;
fig. 4 is a schematic structural view of a fourth thimble of the distributed sewage module mold of the present invention;
Detailed Description
The present invention will be described in further detail with reference to the following description of the drawings.
As shown in fig. 1-4, the decentralized sewage module mold comprises an upper mold 1 and a lower mold 2; the upper die 1 comprises an upper die cover plate 11 and an upper die plate 12, wherein the upper die cover plate 11 is provided with an injection gate 13; the lower die 2 comprises a base 21, a lower die plate 22, an ejection device 3 and a pair of supporting plates 23, the supporting plates 23 are symmetrically arranged on the base 21, the supporting plates 23 are fixed with the base 21 through bolts, the lower die plate 22 is arranged on the supporting plates 23, the ejection device 3 is arranged between the supporting plates 23, a die cavity is formed between the upper die 1 and the lower die 2, the injection gate 13 is communicated with the die cavity, and the ejection device 3 ejects an object in the die cavity.
The surface of the lower die 2 is integrally formed with a die groove 24, a glue injection main groove 25 and a glue injection branch groove 26, the glue injection main groove 25 is communicated with the die groove 24 through the glue injection branch groove 26, and the glue injection gate 13 is communicated with the glue injection main groove 25.
A plurality of first ejection holes 241 and second ejection holes 242 are formed in the die groove, the first ejection holes 241 are uniformly distributed at the edge of the die groove, and the second ejection holes 242 are uniformly distributed along the axis of the die groove; third ejection holes 243 are uniformly distributed in the main glue injection groove 25, a fourth ejection hole 244 is arranged at a position, close to a connection position with the mold groove, of the main glue injection groove 26, the ejection device 3 comprises a first ejector pin 31, a second ejector pin 32, a third ejector pin 33 and a fourth ejector pin 34, and the first ejector pin 31, the second ejector pin 32, the third ejector pin 33 and the fourth ejector pin 34 are respectively arranged corresponding to the first ejection hole 241, the second ejection hole 242, the third ejection hole 243 and the fourth ejection hole 244.
The ejector device 3 further comprises an ejector plate 35 and an ejector base plate 36, the ejector base plate 36 is arranged on the base 21, a power input hole is formed in the center of the base 21, the first ejector pin 31, the second ejector pin 32, the third ejector pin 33 and the fourth ejector pin 34 are arranged on the ejector base plate 36, and the ejector plate 35 is sleeved on the first ejector pin 31, the second ejector pin 32, the third ejector pin 33 and the fourth ejector pin 34 and is fixedly arranged on the upper side face of the ejector base plate 36.
An elastic pad 37 is disposed at the bottom of the fourth thimble 34, the top of the fourth thimble 34 is a circular arc surface, when the elastic pad 37 is in a normal state, the top of the fourth thimble 34 extends out of the fourth ejection hole 244, and a gap is reserved between the top of the fourth thimble 34 and the upper die plate 12, and when the elastic pad 37 is compressed under pressure, the top of the fourth thimble 34 is located in the fourth ejection hole 244. That is, the fourth thimble 34 is movable up and down in the thimble plate 35.
The supporting plate 23 is fixedly provided with a positioning guide rod 27, the positioning guide rod 27 penetrates through the lower template 22, and the upper template 12 is provided with a guide hole matched with the guide rod 27.
In conclusion, a mold cavity is formed between the upper template and the lower template, glue is injected to form a module assembly, and then the module assembly is ejected out of the mold cavity through the ejection device, so that the mold is simple in integral structure and low in production cost; and when injecting glue, pressure has in the mould cavity, presses fourth thimble top to in the fourth ejecting hole, when the injecting glue was ended, stops the injecting glue, and mould intracavity pressure reduces to a certain extent, and fourth thimble top stretches out fourth ejecting hole, reduces the aperture of injecting glue branch groove and mould groove junction for be connected between connecting strip and the module assembly more easily by the rupture, improve later stage module assembly's dismantlement efficiency.
The above description is only one embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of similar modifications and improvements can be made without departing from the inventive concept, and these should also be considered as within the protection scope of the present invention.
Claims (4)
1. Distributed sewage module mould, its characterized in that: comprises an upper die (1) and a lower die (2); the upper die (1) comprises an upper die cover plate (11) and an upper die plate (12), wherein the upper die cover plate (11) is provided with an injection gate (13); the lower die (2) comprises a base (21), a lower die plate (22), an ejection device (3) and a pair of supporting plates (23), the pair of supporting plates (23) are symmetrically arranged on the base (21), the lower die plate (22) is arranged on the supporting plates (23), the ejection device (3) is arranged between the supporting plates (23), a die cavity is formed between the upper die (1) and the lower die (2), the injection gate (13) is communicated with the die cavity, and an object in the die cavity is ejected out by the ejection device (3); the surface of the lower mold (2) is provided with a mold groove, a main glue injection groove (25) and a branch glue injection groove (26), the main glue injection groove (25) is communicated with the mold groove through the branch glue injection groove (26), and the injection gate (13) is communicated with the main glue injection groove (25); a plurality of first ejection holes (241) and second ejection holes (242) are formed in the die groove, the first ejection holes (241) are uniformly distributed at the edge of the die groove, and the second ejection holes (242) are uniformly distributed along the axis of the die groove; third ejector holes (243) are uniformly distributed in the glue injection main groove (25), the glue injection branch groove (26) is close to the joint of the mold groove and is provided with a fourth ejector hole (244), the ejection device (3) comprises a first ejector pin (31), a second ejector pin (32), a third ejector pin (33) and a fourth ejector pin (34), and the first ejector pin (31), the second ejector pin (32), the third ejector pin (33) and the fourth ejector pin (34) are respectively arranged corresponding to the first ejector hole (241), the second ejector hole (242), the third ejector hole (243) and the fourth ejector hole (244).
2. The decentralized sewage module mould according to claim 1, wherein: ejecting device (3) still include thimble board (35) and thimble board (36), thimble board (36) set up in on base (21), base (21) center is equipped with the power input hole, first thimble (31), second thimble (32), third thimble (33) and fourth thimble (34) set up in on thimble board (36), thimble board (35) cover is located first thimble (31), second thimble (32), third thimble (33) and fourth thimble (34), and fixed set up in the side on thimble board (36).
3. The decentralized sewage module mould of claim 1, characterized in that: fourth thimble (34) bottom is equipped with cushion (37), fourth thimble (34) top is the arc surface, works as when cushion (37) are in normal condition, fourth thimble (34) top stretch out in fourth ejector pin hole (244), and with keep having the gap between cope match-plate pattern (12), work as when cushion (37) received pressure and is in compression state, fourth thimble (34) top is located in fourth ejector pin hole (244).
4. The decentralized sewage module mould of claim 1, characterized in that: the die is characterized in that a positioning guide rod (27) is arranged on the support plate (23), the positioning guide rod (27) penetrates through the lower die plate (22), and a guide hole matched with the guide rod (27) is formed in the upper die plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122394780.0U CN217434870U (en) | 2021-09-30 | 2021-09-30 | Distributed sewage module mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122394780.0U CN217434870U (en) | 2021-09-30 | 2021-09-30 | Distributed sewage module mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217434870U true CN217434870U (en) | 2022-09-16 |
Family
ID=83210472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122394780.0U Active CN217434870U (en) | 2021-09-30 | 2021-09-30 | Distributed sewage module mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217434870U (en) |
-
2021
- 2021-09-30 CN CN202122394780.0U patent/CN217434870U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240118 Address after: 226400 8 Yang Kou Road, Yang Kou Town, Rudong County, Nantong, Jiangsu. Patentee after: Jiangsu Baihai New Materials Co.,Ltd. Address before: 226000 No.8, Yangkou Avenue, Yangkou Town, Rudong County, Nantong City, Jiangsu Province Patentee before: Jiangsu Baihai Environmental Protection Technology Group Co.,Ltd. |