CN217428527U - Packaging structure of wireless communication module - Google Patents

Packaging structure of wireless communication module Download PDF

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Publication number
CN217428527U
CN217428527U CN202221398880.9U CN202221398880U CN217428527U CN 217428527 U CN217428527 U CN 217428527U CN 202221398880 U CN202221398880 U CN 202221398880U CN 217428527 U CN217428527 U CN 217428527U
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wireless communication
fixedly connected
platform
communication module
installation
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CN202221398880.9U
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Chinese (zh)
Inventor
刘全智
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Taiyuan Hanrui Jiahe Electronic Technology Co ltd
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Taiyuan Hanrui Jiahe Electronic Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

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Abstract

The utility model discloses a wireless communication module's packaging structure, including wireless communication integrated circuit board and packaging shell, fixedly connected with multiunit elastic base platform on the bottom surface in the mounting shell of packaging shell, communication integrated circuit board sliding connection is in the mounting shell, and the bottom surface and the elastic base platform contact of communication integrated circuit board, and the bottom of encapsulation apron corresponds every group elastic base platform equal fixedly connected with elasticity and presses the platform, and encapsulation apron fixed connection is when the mounting shell top, and the bottom of platform and the top contact of communication integrated circuit board are pressed to elasticity, are provided with the multiunit louvre on the mounting shell. The utility model relates to a wireless communication module technical field, it has the shock attenuation effect, and the radiating effect is excellent, mainly used radio signal's transmission.

Description

Packaging structure of wireless communication module
Technical Field
The utility model relates to a wireless communication module technical field, specific wireless communication module's packaging structure that says so.
Background
The wireless communication module is a device widely used in the internet of things industry, and the principle of the wireless communication module is to transmit or receive and convert electromagnetic wave signals into information which can be understood by people. The wireless communication module is widely applied to the fields of vehicle monitoring, remote control, remote measurement, small wireless network, wireless meter reading, access control system, cell paging, industrial data acquisition system, wireless tag, identity identification, non-contact RF smart card, small wireless data terminal, safety fire protection system, wireless remote control system, biological signal acquisition, hydrological weather monitoring, robot control, wireless 232 data communication, wireless 485/422 data communication, digital audio, digital image transmission and the like.
At present, in order to reduce the damage to the wireless communication module from the outside and ensure the service life of the wireless communication module, the wireless communication module generally needs to be packaged. But the encapsulation among the prior art is mostly all simple fixedly installs the wireless communication integrated circuit board in the packaging shell, makes like this when the wireless communication integrated circuit board receives external impact, unable effectual buffering to greatly probably cause the damage, and the wireless communication integrated circuit board installation back among the prior art, the space at its bottom, top is less, makes the heat cause easily to pile up like this, and the radiating effect is poor.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned weak point that exists among the prior art, the utility model aims at providing a wireless communication module packaging structure that has shock attenuation effect, radiating effect are excellent.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is: the utility model provides a wireless communication module's packaging structure, includes wireless communication integrated circuit board and packaging shell, be provided with wireless communication interface piece and antenna takeover on the wireless communication integrated circuit board, the packaging shell is including installation shell and encapsulation apron, the installation shell top is open structure, fixedly connected with multiunit elasticity sill table on the bottom surface of installation shell, communication integrated circuit board sliding connection be in the installation shell, just the bottom surface of communication integrated circuit board with the contact of elasticity sill table, the bottom of encapsulation apron corresponds every group the platform is pressed to the equal fixedly connected with elasticity of elasticity sill table, encapsulation apron fixed connection be in during the installation shell top, the bottom of elasticity press the platform with the top contact of communication integrated circuit board, be provided with the multiunit louvre on the installation shell.
The elastic bottom table comprises an installation bottom table, a collision bottom table and a first elastic element, the installation bottom table is fixedly connected to the bottom surface of the installation shell, a bottom sliding groove is formed in the installation bottom table, the collision bottom table is slidably connected in the bottom sliding groove, and the first elastic element is fixedly connected between the bottom surface of the bottom sliding groove and the bottom surface of the collision bottom table; elastic pressure platform presses platform and second elastic element including installation top platform, top, installation top platform fixed connection be in the bottom surface of encapsulation apron, installation top platform be provided with the top sliding tray, the top is pressed a sliding connection and is in the top sliding tray, the top surface of top sliding tray with fixedly connected with between the top surface of top pressure platform second elastic element, first elastic element adopts the elastic steel piece, second elastic element adopts the spring.
Correspond on the installation shell wireless communication interface piece is provided with the wireless communication opening, the wireless communication interface piece is worn out the wireless communication opening, correspond on the installation shell the antenna is taken over and is provided with the takeover opening, the antenna is taken over and is worn out the takeover opening, wireless communication open-ended bottom fixedly connected with first rubber pad, correspond on the bottom surface of encapsulation apron first rubber pad fixedly connected with second rubber pad, takeover open-ended bottom fixedly connected with third rubber pad, correspond on the bottom surface of encapsulation apron third rubber pad fixedly connected with fourth rubber pad.
Fixedly connected with multiunit slip sand grip on the inner wall of installation shell, correspond every group on the wireless communication integrated circuit board slip sand grip all is provided with the slip recess, the gomphosis of slip sand grip one-to-one is in the slip recess, the top of slip sand grip is provided with the screw, correspond every group on the encapsulation apron the screw all is provided with the mounting hole to be provided with the fixed screw and pass the mounting hole threaded connection is in the screw.
The utility model has the advantages that: install the wireless communication integrated circuit board back in the installation shell, the accessible encapsulation apron seals the installation shell, thereby realize the encapsulation to the wireless communication integrated circuit board, avoid the external world to cause the damage to the wireless communication integrated circuit board, and press the platform to carry out the centre gripping to the wireless communication integrated circuit board through elasticity sill and elasticity, so can make the wireless communication integrated circuit board have certain buffering effect, avoid strong impact to cause the damage to the wireless communication integrated circuit board, and this kind of packaging method, make the upper portion and the lower part of wireless communication integrated circuit board all have great space, thereby make the radiating effect more excellent.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic structural view of the present invention from another angle when disassembled;
FIG. 4 is a schematic view of the structure of the middle elastic base of the present invention;
fig. 5 is a schematic view of the structure of the middle elastic pressing table of the present invention.
In the figure: 1 wireless communication board card, 2 wireless communication interface block, 3 antenna connecting pipes, 4 mounting cases, 5 packaging cover plates, 6 elastic bottom tables, 7 elastic pressing tables, 8 heat dissipation holes, 9 wireless communication openings, 10 connecting pipe openings, 11 first rubber pads, 12 second rubber pads, 13 third rubber pads, 14 fourth rubber pads, 15 sliding convex strips, 16 sliding grooves, 17 screw holes, 18 mounting holes, 19 screws, 20 mounting bottom tables, 21 abutting bottom tables, 22 first elastic elements, 23 bottom sliding grooves, 24 mounting top tables, 25 top pressing tables, 26 second elastic elements and 27 top sliding grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, a package structure of a wireless communication module includes a wireless communication board 1 and a package casing, the wireless communication board 1 is provided with a wireless communication interface block 2 for connecting a signal transmission cable and an antenna connection tube 3 for connecting a transmission antenna, the package casing includes a mounting casing 4 and a package cover plate 5, the top of the mounting casing 4 is an open structure, so that the wireless communication board 1 can be mounted in the mounting casing 4, a plurality of sets of elastic bottom platforms 6 capable of providing elastic force upwards are fixedly connected to the bottom surface of the mounting casing 4, the communication board is slidably connected in the mounting casing 4, and the bottom surface of the communication board is in contact with the elastic bottom platforms 6, the bottom of the package cover plate 5 corresponding to each set of elastic bottom platforms 6 is fixedly connected with an elastic pressing platform 7 capable of providing elastic force downwards, when the package cover plate 5 is fixedly connected to the top of the mounting casing 4, the bottom of platform 7 and the top contact of communication integrated circuit board are pressed to above-mentioned elasticity, still be provided with multiunit louvre 8 on installing shell 4, press platform 7 through elasticity sill 6 and elasticity like this and can carry out the centre gripping to wireless communication integrated circuit board 1, make wireless communication integrated circuit board 1 have certain buffering effect, can avoid strong impact to cause the damage to wireless communication integrated circuit board 1, and this kind of packaging method, make the upper portion and the lower part of wireless communication integrated circuit board 1 all have great space, thereby make the radiating effect more excellent.
The utility model discloses specific theory, it is provided with wireless communication opening 9 to correspond wireless communication interface piece 2 on installation shell 4, wireless communication opening 9 is worn out to wireless communication interface piece 2, make can be with the naked hourglass of wireless communication interface piece 2 in the external world, thereby be convenient for the connection of cable, it then is provided with takeover opening 10 to correspond antenna takeover 3 on installation shell 4, antenna takeover 3 wears out takeover opening 10, be convenient for like this to transmit the connection of antenna and antenna takeover 3, at the first rubber pad 11 of the bottom fixedly connected with of wireless communication opening 9, correspond first rubber pad 11 fixedly connected with second rubber pad 12 on the bottom surface of encapsulation apron 5, the bottom fixedly connected with third rubber pad 13 of takeover opening 10, correspond third rubber pad 13 fixedly connected with fourth rubber pad 14 on the bottom surface of encapsulation apron 5, make when encapsulation apron 5 seals installation shell 4, first rubber pad 11, rubber pad 12, Second rubber pad 12 seals wireless communication opening 9, and third rubber pad 13, fourth rubber pad 14 will take over opening 10 and seal to guarantee the leakproofness of encapsulation, and all have elasticity because of first rubber pad 11, second rubber pad 12, third rubber pad 13, fourth rubber pad 14 self, thereby can avoid forming fixedly wireless communication integrated circuit board 1, make and to realize the buffering to it.
The utility model discloses specific theory, fixedly connected with multiunit slip sand grip 15 on the inner wall of installation shell 4, it all is provided with slip recess 16 to correspond every group slip sand grip 15 on the wireless communication integrated circuit board 1, the gomphosis of 15 one-to-ones of slip sand grip is in slip recess 16, with this sliding installation of realization wireless communication integrated circuit board 1 in installation shell 4, and be provided with screw 17 at the top of slip sand grip 15, it all is provided with mounting hole 18 to correspond every group screw 17 on the encapsulation apron 5, it passes 18 threaded connection of mounting hole in screw 17 to be provided with fixed screw 19, with this carry out fixed connection with encapsulation apron 5 and installation shell 4, accomplish the encapsulation.
As a preferable mode, the present embodiment further provides an elastic bottom table 6 and an elastic top table structure:
the elastic bottom table 6 comprises an installation bottom table 20, an abutting bottom table 21 and a first elastic element 22, the installation bottom table 20 is fixedly connected to the bottom surface of the installation shell 4, a bottom sliding groove 23 is formed in the installation bottom table 20, the abutting bottom table 21 is slidably connected in the bottom sliding groove 23, the first elastic element 22 is fixedly connected between the bottom surface of the bottom sliding groove 23 and the bottom surface of the abutting bottom table 21, upward elastic force is provided for the abutting bottom table 21 through the first elastic element 22, and when the abutting bottom table 21 is subjected to downward pressure, the abutting bottom table 21 can move downward in the bottom sliding groove 23;
the elastic pressing table 7 comprises an installation top table 24, a top pressing table 25 and a second elastic element 26, the installation top table 24 is fixedly connected to the bottom surface of the encapsulation cover plate 5, the installation top table 24 is provided with a top sliding groove 27, the top pressing table 25 is slidably connected to the top sliding groove 27, and the second elastic element 26 is fixedly connected between the top surface of the top sliding groove 27 and the top surface of the top pressing table 25, so that the second elastic element 26 provides downward elastic force for the top pressing table 25, and when the top pressing table 25 is subjected to upward pressure, the top pressing table 25 can move upwards in the top sliding groove 27;
after adopting the elasticity base 6, the elasticity top platform of above-mentioned structure, install wireless communication integrated circuit board 1 in installation shell 4 to fix back with encapsulation apron 5 and installation shell 4, can make conflict base 21, top press the platform 25 to carry out the centre gripping to wireless communication integrated circuit board 1, realize the buffering through the elasticity of first elastic element 22, second elastic element 26, further say, first elastic element 22 adopts the elastic steel piece, and second elastic element 26 adopts the spring.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (9)

1. The utility model provides a wireless communication module's packaging structure, includes wireless communication integrated circuit board (1) and packaging shell, be provided with wireless communication interface block (2) and aerial takeover (3) on wireless communication integrated circuit board (1), its characterized in that: the packaging shell comprises an installation shell (4) and an encapsulation cover plate (5), the top of the installation shell (4) is of an open structure, a plurality of groups of elastic base platforms (6) are fixedly connected to the bottom surface of the installation shell (4), the communication board cards are slidably connected into the installation shell (4), the bottom surface of each communication board card is in contact with the elastic base platforms (6), each group is corresponding to the bottom of the encapsulation cover plate (5), elastic base platforms (6) are fixedly connected and elastically pressed to form a platform (7), the encapsulation cover plate (5) is fixedly connected to the top of the installation shell (4), and the bottom of each elastic pressing platform (7) is in contact with the top of each communication board card.
2. The package structure of the wireless communication module according to claim 1, wherein: elastic base (6) are including installation base (20), conflict base (21) and first elastic element (22), installation base (20) fixed connection be in on installation shell (4) bottom surface, be provided with bottom sliding tray (23) on installation base (20), conflict base (21) sliding connection be in bottom sliding tray (23), the bottom surface of bottom sliding tray (23) with fixedly connected with between the bottom surface of conflict base (21) first elastic element (22).
3. The package structure of the wireless communication module according to claim 2, wherein: elastic pressure platform (7) presses platform (25) and second elastic element (26) including installation top platform (24), top, installation top platform (24) fixed connection be in the bottom surface of encapsulation apron (5), installation top platform (24) be provided with top sliding tray (27), platform (25) sliding connection is pressed at the top be sliding tray (27), the top surface of top sliding tray (27) with fixedly connected with between the top surface of platform (25) is pressed at the top second elastic element (26).
4. The package structure of the wireless communication module according to claim 1, wherein: correspond on installation shell (4) wireless communication interface piece (2) are provided with wireless communication opening (9), wireless communication interface piece (2) are worn out wireless communication opening (9), correspond on installation shell (4) antenna takeover (3) are provided with takeover opening (10), antenna takeover (3) are worn out takeover opening (10).
5. The package structure of the wireless communication module according to claim 4, wherein: the bottom fixedly connected with first rubber pad (11) of wireless communication opening (9), correspond on the bottom surface of encapsulation apron (5) first rubber pad (11) fixedly connected with second rubber pad (12), the bottom fixedly connected with third rubber pad (13) of takeover opening (10), correspond on the bottom surface of encapsulation apron (5) third rubber pad (13) fixedly connected with fourth rubber pad (14).
6. The package structure of the wireless communication module according to claim 1, wherein: fixedly connected with multiunit slip sand grip (15) on the inner wall of installation shell (4), correspond every group on wireless communication integrated circuit board (1) slip sand grip (15) all are provided with slip recess (16), the gomphosis of slip sand grip (15) one-to-one is in slip recess (16).
7. The package structure of the wireless communication module according to claim 6, wherein: the top of slip sand grip (15) is provided with screw (17), correspond every group on encapsulation apron (5) screw (17) all are provided with mounting hole (18) to be provided with set screw (19) and pass mounting hole (18) threaded connection be in screw (17).
8. The package structure of the wireless communication module according to claim 1, wherein: and a plurality of groups of heat dissipation holes (8) are formed in the mounting shell (4).
9. The package structure of the wireless communication module according to claim 3, wherein: the first elastic element (22) is made of an elastic steel sheet, and the second elastic element (26) is made of a spring.
CN202221398880.9U 2022-06-06 2022-06-06 Packaging structure of wireless communication module Active CN217428527U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221398880.9U CN217428527U (en) 2022-06-06 2022-06-06 Packaging structure of wireless communication module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221398880.9U CN217428527U (en) 2022-06-06 2022-06-06 Packaging structure of wireless communication module

Publications (1)

Publication Number Publication Date
CN217428527U true CN217428527U (en) 2022-09-13

Family

ID=83171887

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221398880.9U Active CN217428527U (en) 2022-06-06 2022-06-06 Packaging structure of wireless communication module

Country Status (1)

Country Link
CN (1) CN217428527U (en)

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