CN217426167U

CN217426167U - Integrated 3D module

Info

Publication number: CN217426167U
Application number: CN202220696577.0U
Authority: CN
Inventors: 刘勤
Original assignee: Orbbec Inc
Current assignee: Orbbec Inc
Priority date: 2022-03-28
Filing date: 2022-03-28
Publication date: 2022-09-13
Anticipated expiration: 2032-03-28

Abstract

The utility model provides an integrated 3D module, which comprises a shell, a 3D imaging component, a printed circuit board, a depth calculation chip and an application chip, wherein the depth calculation chip and the application chip are respectively integrated on the printed circuit board, and the depth calculation chip can respectively carry out data communication with the 3D imaging component and the application chip; the shell is provided with an accommodating cavity and an opening communicated with the accommodating cavity, the opening is arranged on one side of the shell, the printed circuit board, the 3D imaging component, the depth calculation chip and the application chip are arranged in the accommodating cavity, and the 3D imaging component is partially positioned in the opening; the utility model discloses a with degree of depth calculation chip, application chip, 3D formation of image subassembly all integrated on printed circuit board and in place the casing in, the structure is more compact, the size is littleer, the lock space that occupies still less, moreover because degree of depth calculation chip, application chip all integrate on printed circuit board and lie in the casing, simple to operate to need not a plurality of materials of management and control, the cost is reduced.

Description

Integrated 3D module

Technical Field

The utility model belongs to the technical field of the lock technique and specifically relates to indicate an integrated 3D module.

Background

The existing door lock face brushing module is arranged in a customer door lock in a structural mode that a 3D module is connected with an external face algorithm board through an FPC (flexible printed circuit) flat cable; to the customer, the installation of door lock brush face module is inconvenient, and still need a plurality of materials of management and control, occupies more spaces of customer's door lock and the cost is higher.

Disclosure of Invention

The utility model aims to solve not enough among the prior art to a certain extent at least, provide an integrated 3D module.

In order to solve the technical problem, the embodiment of the utility model provides an adopt technical scheme is:

the embodiment of the utility model provides an integrated 3D module, including casing, 3D imaging component, printed circuit board and integrated respectively in depth calculation chip, application chip on the printed circuit board, the depth calculation chip can carry out data communication with 3D imaging component, application chip respectively; the casing has the holding chamber and with the trompil of holding chamber intercommunication, the trompil set up in one side of casing, printed circuit board with 3D imaging component, the degree of depth calculation chip, application chip set up in the holding intracavity, just 3D imaging component part is located in the trompil.

Further, the casing includes photoelectric support and back lid, photoelectric support with the back lid encloses to close and forms the holding chamber, seted up on the photoelectric support the trompil, 3D formation of image subassembly part sets up in the trompil.

Further, the rear cover is provided with a mounting groove, and the mounting groove is matched with the printed circuit board.

Further, the openings comprise a first opening and a second opening which are arranged on the photoelectric support at intervals;

the 3D imaging assembly comprises a projection module and an imaging module, the projection module and the imaging module are arranged at intervals, the projection module and the first opening are correspondingly arranged, the imaging module and the second opening are correspondingly arranged, and the imaging module is in communication connection with the depth calculation chip.

Further, the opening further comprises a third opening disposed between the first opening and the second opening;

the 3D imaging assembly further comprises a light supplementing lamp assembly, the light supplementing lamp assembly is arranged between the projection module and the imaging module, and the light supplementing lamp assembly corresponds to the third opening.

The testing device further comprises a testing interface and a 4Pin serial port terminal, wherein the testing interface and the 4Pin serial port terminal are integrated on the printed circuit board, and the rear cover is provided with a mounting hole matched with the testing interface and the 4Pin serial port terminal.

Further, the surface of the photoelectric support is provided with a protective optical layer.

Further, the protection optical layer comprises a PET black film and waterproof foam cotton rubber which are sequentially overlapped from the surface of the photoelectric support to the outside.

Furthermore, a compressing foam is arranged between the printed circuit board and the mounting groove.

Further, the back lid has the installation department, the installation department set up relatively in the both sides of back lid.

The embodiment of the utility model provides a beneficial effect lies in: through all integrating degree of depth calculation chip, application chip in place the casing in on printed circuit board and in, compare in the current mode of only integrating degree of depth calculation chip on printed circuit board, the utility model discloses all integrate degree of depth calculation chip, the two kinds of algorithm chips of application chip on printed circuit board for the structure is more compact, and the size is littleer, and the lock space that occupies still less, moreover because degree of depth calculation chip, application chip and 3D imaging component all integrate on printed circuit board and lie in the casing, simple to operate to need not a plurality of materials of management and control, the cost is reduced.

Drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is an explosion diagram of an integrated 3D module according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and are intended to be used for explaining the present invention, but should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1, an embodiment of the present invention provides an integrated 3D module, which includes a housing 1, a printed circuit board 2, a 3D imaging component 3, and a depth calculation chip and an application chip integrated on the printed circuit board 2, wherein the depth calculation chip can perform data communication with the 3D imaging component 3 and the application chip respectively; the shell 1 is provided with an accommodating cavity and a hole 11 communicated with the accommodating cavity, the hole 11 is formed in one side of the shell 1, the printed circuit board 2, the 3D imaging assembly 3, the depth calculation chip and the application chip are arranged in the accommodating cavity, and the 3D imaging assembly 3 is partially located in the hole 11.

The depth calculating chip is used for receiving the structured light image collected by the 3D imaging component 3, and then depth calculation is carried out by using the structured light image, and the application chip can be a face algorithm chip and is used for receiving the depth image output by the depth calculating chip and carrying out face recognition. By integrating the depth calculation chip and the application chip on the printed circuit board 2 and internally arranged in the shell 1, compared with the existing mode of integrating the depth calculation chip on the printed circuit board 2, the depth calculation chip and the application chip are integrated on the printed circuit board 2, so that the depth calculation chip and the application chip are more compact in structure, smaller in size and less in occupied door lock space; and because degree of depth calculation chip, application chip and 3D formation of image subassembly 3 all integrate on printed circuit board 2 and lie in casing 1, simple to operate to need not a plurality of materials of management and control, the cost is reduced.

Further, the casing 1 includes the photoelectric support 12 and the back lid 13, and the photoelectric support 12 encloses with the back lid 13 and closes and form the holding chamber, has seted up trompil 11 on the photoelectric support 12, and 3D imaging component 3 part sets up in the trompil 11.

In this embodiment, the optoelectronic support 12 includes a top plate 121 and an upper sidewall 122 extending from the top plate 121 toward the rear cover 13, the top plate 121 and the upper sidewall 122 enclose to form an upper housing cavity, the opening 11 is opened in the top plate 121, the rear cover 13 includes a bottom plate 131 and a lower sidewall 132 extending from the bottom plate 131 toward the optoelectronic support 12, and the bottom plate 131 and the lower sidewall 132 enclose to form a lower housing cavity; the rear cover 13 is made of stainless steel, when the photoelectric support 12 is connected with the rear cover 13, the upper side wall 131 is connected with the lower side wall 132, an accommodating cavity for accommodating the 3D imaging component 3 is formed between the upper shell cavity and the lower shell cavity, and the photoelectric support 12 is provided with an opening 11 for accommodating the 3D imaging component 3; in order to facilitate maintenance of the 3D imaging assembly 3 in the accommodating cavity, the photoelectric support 12 is detachably connected with the rear cover 13, wherein the photoelectric support 12 can be connected with the rear cover 13 in a threaded fastening manner, the rear cover 13 is provided with a threaded hole, a threaded through hole is also formed in a position of the photoelectric support 12 corresponding to the threaded hole of the rear cover 13, and a screw 01 penetrates through the threaded hole of the rear cover 13 to be in threaded connection with the threaded hole of the photoelectric support 12, so that the photoelectric support 12 and the rear cover 13 are locked and fixed; of course, in other embodiments, the threaded hole of the optoelectronic mount 12 may be a threaded blind hole; or connecting pieces such as bolts or screws are adopted for connection; or the locking connection is realized by adopting a buckling connection mode.

It should be noted that the optoelectronic support 12 is generally made of a material with good rigidity, such as steel, aluminum alloy, zinc alloy, stainless steel alloy, etc. and is manufactured by powder metallurgy, sheet metal, die casting, stamping, liquid metal forming, etc. in some embodiments, the optoelectronic support 12 may also be made of a material with good heat dissipation, such as ceramic, etc. to provide heat dissipation of the device.

Further, a mounting groove is provided on the rear cover 13, and the mounting groove is matched with the printed circuit board 2.

In this embodiment, in order to facilitate the installation of the printed circuit board 2 and reduce the space occupied by the installation of the printed circuit board 2, an installation groove is formed on the rear cover 13, and when the rear cover 13 is covered on the assembled optoelectronic bracket 12, the printed circuit board 2 is located in the installation groove; a threaded hole is formed in the printed circuit board 2, and a screw 02 penetrates through the rear cover 13 to be in threaded connection with the threaded hole in the printed circuit board 2, so that the printed circuit board 2 can be stably fixed in the mounting groove, falling off is avoided, and meanwhile, the integrated 3D module is smaller in size and more compact in structure; of course, in other embodiments, a bolt or screw may be used to connect the components.

Further, the test device also comprises a test interface and a 4Pin serial port terminal, wherein the test interface and the 4Pin serial port terminal are integrated on the printed circuit board 2, and the rear cover 13 is provided with a mounting hole matched with the test interface and the 4Pin serial port terminal.

The Printed Circuit Board 2 of this embodiment adopts PCBA (Printed Circuit Board Assembly), has seted up the mounting hole in back lid 13 one side, and a mounting hole is provided with test interface for the performance of test integrated 3D module, a mounting hole department is provided with 4Pin serial ports terminal, and the main control Board for connecting the lock supplies power to integrated 3D module.

Further, the opening 11 includes a first opening 111 and a second opening 112 spaced apart from each other on the optoelectronic mount 12; 3D imaging component 3 includes projection module 31 and formation of image module 32, and projection module 31 and formation of image module 32 interval set up, and projection module 31 corresponds the setting with first trompil 111, and formation of image module 32 corresponds the setting with second trompil 112, and formation of image module 32 and degree of depth calculation chip communication are connected.

In this embodiment, the imaging module 32 is used to collect images or video information, the projection module 31 is used to provide a light source, the auxiliary imaging module 32 is used to collect images or video information, the depth calculation chip is used to receive structured light images collected by the imaging module 32, then the structured light images are used to perform depth calculation, and the application chip can be a face algorithm chip and is used to receive depth images output by the depth calculation chip for face recognition; the first opening 111 and the second opening 112 are sequentially formed along the length direction of the optoelectronic bracket 12 at intervals for accommodating the projection module 31 and the imaging module 32, so that the occupied space can be reduced, the structure is more compact, and light can pass through when the light source emits and receives light; the first opening 111 and the second opening 112 are arranged on the same side, so that space occupation on two sides can be avoided, and the structure concentrated on one side is more compact; the imaging module 32 may be an infrared camera or an RGB camera.

Further, the opening 11 further includes a third opening 113, and the third opening 113 is disposed between the first opening 111 and the second opening 112; the 3D imaging assembly 3 further includes a light supplement lamp assembly 33 disposed between the projection module 31 and the imaging module 32, and the light supplement lamp assembly 33 is disposed corresponding to the third opening 113.

In this embodiment, be provided with light filling banks spare 33 between projection module 31 and the imaging module 32, light filling banks spare 33 can infrared light filling lamp, and infrared light filling lamp all is used for throwing initiative light beam to the target with projection module 31, when imaging module 32 is used for imaging to the two, generally independently opens infrared light filling lamp and projection module 31 to the needs of difference, for example opens infrared light filling lamp when infrared floodlight image is gathered to needs, opens projection module 31 when the degree of depth image is gathered to needs. In some embodiments, the floodlight and the projection module 31 can be turned on synchronously. In other embodiments, the fill-in lamp assembly 33 may be provided in a plurality, and may be arranged in a ring array around the imaging module 32 or in a matrix array on one side of the imaging module 32.

Further, the surface of the optoelectronic mount 12 is provided with a protective optical layer 14.

In this embodiment, the surface of the optoelectronic support 12 is adhered with the protective transparent optical layer, which can prevent the optoelectronic support 12 from being touched by mistake to cause stain or abrasion in the using process, and has the dustproof and waterproof effects, so that the optoelectronic support 12 can be effectively protected, and the protective optical layer 14 is provided with the through hole 141 corresponding to the first opening 111, the second opening 112 and the third opening 113.

Further, the protective optical layer 14 includes a PET black film and a waterproof foam cotton sequentially stacked from the surface of the optoelectronic support 12 to the outside.

In the embodiment, the PET black film has good black uniformity and no risk of decolorization and delamination, and can well protect the surface of the internal photoelectric support 12 from corrosion; set up waterproof bubble celloidin between photoelectric support 12 and the black membrane of PET, avoid external object direct and photoelectric support 12 surface contact wearing and tearing to appear, simultaneously because waterproof bubble celloidin has certain elastic PE obturator bubble cotton for it has good shockproof impact resistance, waterproof dirt proofness is in order to guarantee the waterproof dustproof effect on photoelectric support 12 surface.

Further, a compression foam 4 is arranged between the printed circuit board 2 and the mounting groove.

In this embodiment, set up between printed circuit board 2 and the mounting groove and compress tightly the bubble cotton 4, can realize the flexonics between printed circuit board 2 and the mounting groove, can avoid direct hard coupling between printed circuit board 2 and the mounting groove wearing and tearing not hard up to appear, help improving printed circuit board 2's installation stability and can protect the mounting groove not receive wearing and tearing.

Further, the rear cover 13 has mounting portions 133, and the mounting portions 133 are oppositely disposed on both sides of the rear cover 13.

In this embodiment, the two opposite sides of the rear cover 13 are provided with mounting portions 133, wherein the two ends of one side of the rear cover 13 are both provided with the mounting portions 133, and the middle of the opposite side is provided with the mounting portions 133, so that the three mounting portions 133 on the two sides form a triangular structure, thereby ensuring that the connection is more stable during mounting; the mounting portion 133 of this embodiment gradually extends from the bottom end to the top end of the rear cover 13 from inside to outside, and the extending direction of the mounting portion 133 forms an included angle with the rear cover 13, which can be applied to a scene with a higher mounting position, preferably, the included angle of this embodiment is 12.5 degrees; in order to adapt to the use in a scene with a lower installation position, the installation portion 133 also gradually extends from the bottom end to the top end of the rear cover 13 from inside to outside; in other embodiments, the included angle may be modified according to actual requirements, and the integrated 3D module in this embodiment has a small size and a compact structure.

Further, the projection module 31 includes a single vertical cavity surface laser emitter; or projection module 31 includes a plurality of arrayed vertical cavity surface laser emitters.

In this embodiment, in order to provide a good illumination light source, a single vertical cavity surface laser emitter may be used; or include a plurality of arrayed vertical cavity surface laser emitters.

To sum up, the utility model provides an integrated 3D module, through with the degree of depth calculation chip, the application chip all integrates on printed circuit board and place in place the casing in, compare in the current mode of only integrating the degree of depth calculation chip on printed circuit board, with the degree of depth calculation chip, the two kinds of algorithm chips of application chip are all integrated on printed circuit board, make the structure more compact, the size is littleer, the lock space who occupies still less, and because the degree of depth calculation chip, the application chip all integrates on printed circuit board and be located the casing, high durability and convenient installation, and need not a plurality of materials of management and control, the cost is reduced.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An integrated 3D module is characterized by comprising a shell, a 3D imaging component, a printed circuit board, a depth calculation chip and an application chip, wherein the depth calculation chip and the application chip are respectively integrated on the printed circuit board, and the depth calculation chip can respectively carry out data communication with the 3D imaging component and the application chip; the casing has the holding chamber and with the trompil of holding chamber intercommunication, the trompil set up in one side of casing, printed circuit board with 3D imaging component, the degree of depth calculation chip, application chip set up in the holding intracavity, just 3D imaging component part is located in the trompil.

2. The integrated 3D module of claim 1, wherein the housing comprises a photoelectric support and a back cover, the photoelectric support and the back cover enclose the receiving cavity, the photoelectric support has the opening, and the 3D imaging assembly is partially disposed in the opening.

3. The integrated 3D module of claim 2, wherein a mounting slot is provided on the back cover, the mounting slot mating with the printed circuit board.

4. The integrated 3D module of claim 2, wherein the opening comprises a first opening and a second opening spaced apart on the optoelectronic mount;

the 3D imaging assembly comprises a projection module and an imaging module, the projection module and the imaging module are arranged at intervals, the projection module and the first opening are correspondingly arranged, the imaging module and the second opening are correspondingly arranged, and the imaging module and the depth calculation chip are in communication connection.

5. The integrated 3D module of claim 4, wherein the opening further comprises a third opening disposed between the first opening and the second opening;

6. The integrated 3D module according to claim 2, further comprising a test interface and a 4Pin serial port terminal, wherein the test interface and the 4Pin serial port terminal are integrated on the printed circuit board, and the rear cover is provided with a mounting hole matching with the test interface and the 4Pin serial port terminal.

7. The integrated 3D module of claim 2, wherein the optoelectronic mount surface is provided with a protective optical layer.

8. The integrated 3D module of claim 7, wherein the protective optical layer comprises a PET black film and a waterproof foam cotton laminated in sequence from the surface of the optoelectronic mount to the outside.

9. The integrated 3D module of claim 3, wherein a compression foam is disposed between the printed circuit board and the mounting slot.

10. The integrated 3D module of claim 2, wherein the back cover has mounting portions disposed opposite to both sides of the back cover.