CN217425935U

CN217425935U - Processing box and chip bracket installed on same

Info

Publication number: CN217425935U
Application number: CN202220645758.0U
Authority: CN
Inventors: 曾丽坤; 武新宇; 王常彪
Original assignee: Ninestar Corp
Current assignee: Ninestar Corp
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-09-13
Anticipated expiration: 2032-03-23

Abstract

The utility model discloses a handle box and install the chip support on handling the box, wherein, handle box detachably and install in imaging device, include: a frame having a first wall surface; a photosensitive member rotatably supported by the frame; an electrical contact part mounted to the frame and electrically connected to the image forming apparatus; a storage portion electrically connected to the electrical contact portion and configured to store information related to the process cartridge; the storage part is positioned on one side of the electric contact part facing the processing box; a projection size of the storage portion is smaller than a projection size of the electrical contact portion as viewed in a normal direction of the first wall surface; and/or, in the axial direction of the photosensitive member, the projection of the storage portion is located between the projection ranges of the electrical contact portions. The utility model discloses a processing box can protect storage portion well, can avoid leading to the condition that storage portion damaged because of the collision between external component and the storage portion.

Description

Processing box and chip bracket installed on same

Technical Field

The utility model relates to an imaging device technical field especially relates to a handle box and install chip support on handling the box.

Background

In an image forming apparatus of an electrophotographic type, a configuration is known in which a photosensitive member and a process member actable on the photosensitive member are integrally assembled into a unit as a process cartridge, and the process cartridge is mountable in and dismountable from the image forming apparatus. With this configuration, the maintenance operation can be performed by the user himself in the case where the toner runs out or in the case where the handling member is damaged, and therefore the maintenance performance can be significantly improved.

Further, in recent years, a configuration has also been realized in which a storage portion for storing information (various information such as service information and process information) related to the process cartridge is mounted on the process cartridge. In this configuration, electrical connection is formed between an electrical contact portion provided on the apparatus main assembly side of the image forming apparatus and an electrical contact portion provided on the process cartridge side and electrically connected to the storage portion. Subsequently, electrical communication is performed between the apparatus main assembly of the image forming apparatus and the storage portion of the process cartridge, and information stored in the storage portion is used, so that image quality and maintenance performance can be further improved.

Further, in the process cartridge disclosed in japanese laid-open application (JP- ｃA)2004-37876, the electrical contact portion and the storage portion are flush with each other, and ｃA protrusion protruding in the mounting direction of the process cartridge is provided. With this configuration, during drop of the process cartridge or the like, the contact member contacts the external member before the storage portion, and thus breakage of the storage portion due to collision between the external member and the storage portion is avoided. However, in the configuration disclosed in JP-a 2004-.

SUMMERY OF THE UTILITY MODEL

According to an aspect of the present invention, there is provided a process cartridge detachably mountable to an image forming apparatus, comprising: a frame having a first wall surface; a photosensitive member rotatably supported by the frame; an electrical contact mounted to the frame and for electrical connection with the imaging device; a storage portion electrically connected to the electrical contact portion and configured to store information related to the process cartridge; the storage part is positioned on one side of the electric contact part facing the processing box; a projected size of the storage portion is smaller than a projected size of the electrical contact portion as viewed in a normal direction of the first wall surface; and/or, in the axial direction of the photosensitive member, the projection of the storage part is located between the projection ranges of the electric contact parts.

In some embodiments, a projection range of the electrical contact portion in an axial direction of the photosensitive member as viewed in a normal direction of the first wall surface is 3.5mm to 5.5 mm.

In some embodiments, the frame comprises a development frame and a photosensitive frame; the electric contact portion and the storage portion are provided together on the developing frame or the photosensitive frame.

In some embodiments, the storage part is located outside a range of a gap between the photosensitive frame and the developing frame.

In some embodiments, the electrical contact is located outside the first wall surface in a direction normal to the first wall surface.

In some embodiments, the electrical contact is parallel to the first wall surface.

In some embodiments, the electrical contact and the storage portion are electrically connected by a flexible conductive medium.

In some embodiments, the developer frame or the photoreceptor frame includes an end cap to which the electrical contacts and the storage portion are mounted.

According to another aspect of the present invention, there is provided a chip holder mounted on a process cartridge, the chip holder being configured to mount and fix the electrical contact portion and the storage portion on the process cartridge, the process cartridge being as described in any one of the above.

In some embodiments, the chip holder may be provided separately from the frame or may be integrally formed.

The utility model has the advantages that: the utility model discloses a processing box can protect storage portion well, can avoid leading to the condition that storage portion damaged because of the collision between external member and the storage portion.

Drawings

Fig. 1 is an overall structure diagram of a processing box according to a first embodiment of the present invention;

fig. 2 is a sectional view of a process cartridge according to a first embodiment of the present invention;

fig. 3 is an overall structural view of another angle of the process cartridge according to the first embodiment of the present invention;

FIG. 4 is an enlarged view of the point A in FIG. 3;

fig. 5 is a schematic structural view of a chip of a processing cartridge according to a first embodiment of the present invention;

fig. 6 is a schematic view of the process cartridge according to the first embodiment of the present invention, as viewed from the Z direction;

FIG. 7 is an enlarged view of the point B in FIG. 6;

fig. 8 is a schematic view of a chip of a process cartridge according to a first embodiment of the present invention viewed from a Z direction;

fig. 9 is a structural view of a chip holder of a process cartridge according to a first embodiment of the present invention;

fig. 10 is a schematic view illustrating the installation of a chip and a chip holder of a processing cartridge according to a first embodiment of the present invention;

fig. 11 is a partially exploded view of a process cartridge according to a first embodiment of the present invention;

fig. 12 is a sectional view showing a chip position of a process cartridge according to a first embodiment of the present invention;

fig. 13 is an overall structural view of a process cartridge according to a second embodiment of the present invention;

FIG. 14 is an enlarged view of FIG. 11 at C;

fig. 15 is a schematic structural view of a chip of a process cartridge according to a second embodiment of the present invention;

fig. 16 is a partial view of a process cartridge according to a second embodiment of the present invention viewed from the Z direction;

FIG. 17 is an enlarged view of FIG. 16 at D;

fig. 18 is a schematic view of a chip of a process cartridge according to a second embodiment of the present invention, as viewed from the Z direction;

fig. 19 is a schematic view of a chip holder of a processing cartridge according to a second embodiment of the present invention;

fig. 20 is a schematic view of a chip holder of a processing cartridge according to a second embodiment of the present invention at another angle;

FIG. 21 is a schematic view showing the mounting of a chip and a chip holder of a second process cartridge according to an embodiment of the present invention;

fig. 22 is a partially exploded view of a process cartridge according to a second embodiment of the present invention;

fig. 23 is a schematic view of an overall structure of a processing box according to a third embodiment of the present invention;

fig. 24 is a schematic view of the overall structure of a processing cartridge according to a third embodiment of the present invention from another angle;

FIG. 25 is an enlarged view at E in FIG. 24;

fig. 26 is a schematic structural view of a chip of a process cartridge according to a third embodiment of the present invention;

fig. 27 is a partial schematic view of a process cartridge according to a third embodiment of the present invention, viewed from the Z direction;

FIG. 28 is an enlarged view at F of FIG. 27;

fig. 29 is a schematic structural view of a chip holder of a process cartridge according to a third embodiment of the present invention;

fig. 30 is a partially exploded view of a process cartridge according to a third embodiment of the present invention;

fig. 31 is a schematic view of the overall structure of a process cartridge according to a fourth embodiment of the present invention;

fig. 32 is a partial schematic view of a process cartridge according to a fourth embodiment of the present invention, viewed from the Z direction;

FIG. 33 is an enlarged view at G of FIG. 32;

fig. 34 is a schematic structural view of a chip of a process cartridge according to a fourth embodiment of the present invention;

fig. 35 is a schematic view of a chip of a process cartridge according to a fourth embodiment of the present invention, as viewed from the Z direction;

fig. 36 is a schematic view illustrating the installation of the end cap and the chip of the processing cartridge according to the fourth embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some of the described embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description above, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Example one

An electrophotographic image forming apparatus forms an image on a recording material using, for example, an electrophotographic image forming process. The electrophotographic image forming apparatus includes, for example, an electrophotographic copying machine, an electrophotographic printer (LED printer, laser printer, etc.), a facsimile machine of an electrophotographic printer type, and the like. And a process cartridge detachably mountable to the electronic image forming apparatus, the process cartridge including a photosensitive member, a developing member for developing an electrostatic latent image formed on the photosensitive member, and the like. The electronic image forming apparatus includes a driving head for transmitting a driving force of the electronic image forming apparatus to the process cartridge to operate the process cartridge.

As shown in fig. 1 and 2, the present embodiment provides a process cartridge including a frame, a powder hopper assembly, a waste powder hopper assembly, a driving unit 30, a chip 40, and a chip holder 50.

As shown in fig. 1 and 2, the frame includes a developing frame 10 and a photosensitive frame 20. The powder bin assembly comprises a powder bin 11 for storing carbon powder, a developing roller 12, a powder outlet knife 13 and an agitating frame 14 installed in the powder bin 11. The waste powder bin assembly includes a waste powder bin 21 for collecting waste powder, a photosensitive drum 22, a charging roller 23, and a cleaning blade 24.

As shown in fig. 2, the developing frame 10 encloses a powder hopper 11 for storing toner, the developing frame 10 is substantially in the shape of a long box, and the developing frame 10 has end faces at both ends in the longitudinal direction. The developing frame 10 may be provided with a powder feeding port through which the powder bin 11 is replenished with carbon powder, and the powder feeding port may be provided on one of end surfaces of the developing frame 10. The stirring frame 14 and the developing roller 12 are rotatably supported at both ends of the developing frame 10 in the longitudinal direction, the stirring frame 14 and the developing roller 12 are rotatable by the driving unit 30, and the axial directions of the stirring frame 14 and the developing roller 12 are both along the longitudinal direction of the developing frame 10. The carbon powder in the powder bin 11 is stirred by the stirring frame 14, so that the carbon powder in the powder bin 11 is prevented from caking, and meanwhile, the carbon powder can be conveyed towards the developing roller 12 and adsorbed by the charged developing roller 12.

As shown in fig. 1 and 2, the photosensitive frame 20 encloses a waste toner bin 21 for collecting waste toner, the photosensitive frame 20 also has a length direction, the length direction of the photosensitive frame 20 is consistent with the length direction of the developing frame 10, the photosensitive drums 22 are rotatably supported at two ends of the photosensitive frame 20 in the length direction, and the axial direction of the photosensitive drums 22 is consistent with the length direction of the photosensitive frame 20.

To better explain the process cartridge, a coordinate system is established as in fig. 3, in which the axial direction of the photosensitive drum 22 is the X-axis direction, the direction perpendicular to the axial direction X of the photosensitive drum 22 is the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis directions is the Z-axis direction. The plane formed by the X axis and the Y axis is an XY plane, the plane formed by the Y axis and the Z axis is a YZ plane, and the plane formed by the X axis and the Z axis is an XZ plane.

As shown in fig. 3 and 4, the photosensitive frame 20 has a first wall surface 20a thereon, the first wall surface 20a lying on the XY plane, the first wall surface 20a having a mounting position 20a1 thereon to be coupled with the chip holder 50, a normal direction of the first wall surface 20a being along the Z-axis direction.

The waste toner hopper 21 is provided along the length direction of the photosensitive frame 20, and the waste toner hopper 21 is located on one side of the photosensitive drum 22. The carbon powder adsorbed by the developing roller 12 is transferred to the photosensitive drum 22 through the potential difference between the carbon powder and the photosensitive drum 22, after the transfer printing, the cleaning scraper 24 is in linear contact with the photosensitive drum 22, the carbon powder which is not completely transferred on the surface of the photosensitive drum 22 is cleaned, namely waste powder, and the cleaned waste powder is stored in the waste powder bin 21. The charging roller 23 is used to charge the surface of the photosensitive drum 22 with uniform electric charges, so that the photosensitive drum 22 can adsorb carbon powder.

Gaps 60 are present between portions of the photosensitive frame 20 and portions of the developing frame 10, and do not completely fit, and as shown in fig. 3, gaps 60 are present between the photosensitive frame 20 and the developing frame 10 in the Y direction.

As shown in fig. 1, the driving unit 30 is located outside the end surface of the frame in the longitudinal direction, specifically, may be located outside one or both end surfaces of the developing frame 10 in the longitudinal direction, or may be located outside one or both end surfaces of the photosensitive frame 20 in the longitudinal direction. The driving unit 30 is for receiving and transmitting a driving force of an image forming apparatus such as a laser printer to operate the process cartridge. The driving unit 30 may include a power receiving member and a gear train so as to receive and transmit the driving force of the image forming apparatus, and rotate the photosensitive drum 22, the developing roller 12, the agitating frame 14, and the like.

Further, the photosensitive frame 20 may further include an end cover, the end cover is covered on the outer side of the end face of the photosensitive frame 20 in the length direction, a part or all of the gears of the driving unit 30 are covered in the end cover to play a role in protection, the end cover may be integrally disposed with the photosensitive frame 20, may be in a split structure, and is fixedly mounted on the photosensitive frame 20 by welding, adhering, fastening, inserting or other manners.

The developing frame 10 may include an end cap covering an end surface of the developing frame 10 in the longitudinal direction.

As shown in fig. 5, the chip 40 includes a memory portion 41 and an electrical contact portion 42, the memory portion 41 being electrically connected to the electrical contact portion 42 through a flexible conductive medium 43, the memory portion 41 being configured to store information related to the process cartridge.

When the process cartridge is mounted to the image forming apparatus, the electrical contacts 42 are electrically connected to the image forming apparatus, thereby establishing communication of the chip 40 with the image forming apparatus.

The flexible conductive medium 43 may be a conductive ribbon or a conductive foil. The storage part 41 is connected to the electrical contact part 42 via a flexible conductive medium 43, so that the location of the storage part 41 can be set more flexibly.

The storage part 41 includes a first substrate 411, and a wafer 412 and a cell 413 disposed on the first substrate 411.

The electric contacts 42 are provided on one surface of the second substrate 421, the number of the electric contacts 42 is two, and the electric contacts 42 are provided facing away from the process cartridge, that is, on the surface of the second substrate 421 away from the process cartridge.

As shown in fig. 7 and 8, the chip holder 50 is used to mount and fix the chip 40, and the chip holder 50 is detachably attached to the photosensitive frame 20. The photosensitive frame 20 has a first wall surface 20a, the first wall surface 20a has a mounting position 20a1 coupled with the chip holder 50, specifically, the mounting position 20a1 is a hole or a groove formed on the first wall surface 20a, a part of the chip holder 50 is inserted into the photosensitive frame 20 from the hole or the groove and fixed on the photosensitive frame 20, so that the chip 40 is mounted on the photosensitive frame 20, that is, the storage portion 41 and the electrical contact portion 42 of the chip 40 are both located on the photosensitive frame 20.

As shown in fig. 3 and 4, after the chip 40 is mounted to the photosensitive frame 20, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, i.e., in the normal direction Z along the first wall surface 20a, the electrical contact portion 42 is located on the outer side of the first wall surface 20a, and the electrical contact portion 42 is completely exposed on the outer side of the first wall surface 20 a. The electrical contact 42 is substantially parallel to the first wall surface 20 a. A part of the storage portion 41 may be inserted into a hole or a groove in the first wall surface 20a, and a part may be exposed to the first wall surface 20a, or the storage portion 41 may be entirely inserted into a hole or a groove in the first wall surface 20 a.

The storage portion 41 is located inside the electric contact portion 42 in the normal direction Z of the first wall surface 20a, and does not protrude from the electric contact portion 42, whereby the electric contact portion 42 can shield the storage portion 41 from an external member colliding against the storage portion 41.

As shown in fig. 6 and 7, further, as viewed in the normal direction Z of the first wall surface 20a, the projected dimension S1 of the storage part 41 is smaller than the projected dimension S2 of the electrical contact part 42. Specifically, the area of the portion where the storage section 41 can be observed as viewed in the normal direction Z of the first wall surface is its projected dimension S1, the area of the portion where the electrical contact 42 can be observed is its projected dimension S2, and the projected dimension S1 (area) of the storage section 41 is smaller than the projected dimension S2 (area) of the electrical contact 42.

As shown in fig. 8, further, the projection of the storage portion 41 is located between the projection ranges of the electrical contact portions 42 in the axial direction X of the photosensitive drum as viewed in the normal direction Z of the first wall surface 20 a. The projections of the memory part 41 and the electrical contact part 42 are located on the XY plane, and the projection D1 of the memory part 41 falls completely within the projection D2 of the electrical contact part 42 in the X-axis direction.

As shown in fig. 8, it is preferable that the projection range of the electric contact part 42 in the X-axis direction is 3.5mm to 5.5mm, and the projection D1 of the storage part 41 in the X-axis direction is smaller than the projection D2 of the electric contact part 42 in the X-axis direction and falls completely within the projection range of the electric contact part 42.

By the above-mentioned positional relationship between the storage portion 41 and the electric contact portion 42, the electric contact portion 42 can effectively shield the storage portion 41, and damage to the storage portion 41 due to collision of an external member with the storage portion 41 can be avoided.

As shown in fig. 9 and 10, in the present embodiment, the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51, a second mounting portion 52, a first clamping portion 53 and a second clamping portion 54.

The first mounting portion 51 is used for mounting the electrical contact portion 42 of the chip 40, the second mounting portion 52 is used for mounting the storage portion 41, and the first clamping portion 53 and the second clamping portion 54 are used for clamping with the photosensitive frame 20, so as to mount the chip holder 50 on the photosensitive frame 20.

As shown in fig. 9 and 10, the first mounting portion 51 is located on a side of the main body away from the process cartridge, and the second mounting portion 52 is located inside the first mounting portion 51 in the Z direction. The first clamping portion 53 and the second clamping portion 54 are located at two ends of the main body in the Y direction, one of the first clamping portions 53 is a protrusion, the other is an elastic arm, and a clamping protrusion is also arranged on the elastic arm.

As shown in fig. 10 to 12, the memory portion 41 of the chip 40 may be mounted in the second mounting portion 52, the electrical contact portion 42 of the chip 40 may be mounted in the first mounting portion 51, that is, the chip 40 is mounted on the chip holder 50, and then the chip holder 50 is mounted on the photosensitive frame 20 together with the chip 40. The requirement for convenient mounting or dismounting of the whole chip 40 is easily satisfied.

As shown in fig. 3 and 12, in the present embodiment, the chip 40 and the chip holder 50 are mounted on the photosensitive frame 20, the storage portion 41 is surrounded by the photosensitive frame 20, the chip 40 is entirely located outside the range of the gap 60 between the photosensitive frame 20 and the developing frame 10, and is not exposed in the gap 60 between the photosensitive frame 20 and the developing frame 10, and some external members can be prevented from colliding with the storage portion 41 from the gap 60.

In some other embodiments, the chip holder 50 may be integrally provided with the photosensitive frame 20.

Example two

The present embodiment provides another process cartridge, and unlike the first embodiment, the chip 40 and the chip holder 50 of the present embodiment are mounted on the developing frame 10.

As shown in fig. 13 and 14, in the present embodiment, the developing frame 10 has the first wall surface 10a thereon, the first wall surface 10a is located on the XY plane, the first wall surface 10a has the mounting position 10a1 to be combined with the chip holder 50 thereon, and the normal direction of the first wall surface 10a is along the Z-axis direction.

As shown in fig. 13 and 14, after the chip 40 is mounted to the developing frame 10, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 10a, the electrical contact portion 42 is located on the outer side of the first wall surface 10a, and the electrical contact portion 42 is completely exposed on the outer side of the first wall surface 10 a. The electrical contact 42 is substantially parallel to the first wall surface 10 a. A part of the storage part 41 may be inserted into the mounting position 10a1 on the first wall surface 10a, and partially exposed from the first wall surface 10a, or the storage part 41 may be entirely inserted into the mounting position 10a1 on the first wall surface 10 a. The storage portion 41 is located inside the electric contact portion 42 in the normal direction Z of the first wall surface 10a, and does not protrude from the electric contact portion 42, whereby the electric contact portion 42 can shield the storage portion 41 from an external member colliding against the storage portion 41.

As shown in fig. 15 to 17, further, as viewed in the normal direction Z of the first wall surface 10a, the projected dimension S1 of the storage part 41 is smaller than the projected dimension S2 of the electrical contact part 42. Specifically, the area of the portion where the storage section 41 can be observed as viewed in the normal direction Z of the first wall surface is its projected dimension S1, the area of the portion where the electrical contact 42 can be observed is its projected dimension S2, and the projected dimension S1 (area) of the storage section 41 is smaller than the projected dimension S2 (area) of the electrical contact 42.

As shown in fig. 15 and 18, further, the projection of the storage portion 41 is located between the projection ranges of the electrical contact portions 42 in the axial direction X of the photosensitive drum as viewed in the normal direction Z of the first wall surface 10 a. The projections of the memory part 41 and the electrical contact part 42 are located on the XY plane, and the projection D1 of the memory part 41 falls completely within the projection D2 of the electrical contact part 42 in the X-axis direction.

As shown in fig. 15 and 18, it is preferable that the projection range of the electric contact 42 in the X-axis direction is 3.5mm to 5.5mm, and the projection D1 of the storage part 41 in the X-axis direction is smaller than the projection D2 of the electric contact 42 in the X-axis direction and falls completely within the projection range of the electric contact 42.

Another difference from the first embodiment is that the chip holder 50 of the present embodiment has a different structure. As shown in fig. 19 and 20, in the present embodiment, the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51, a second mounting portion 52, a first clamping portion 53, and a second clamping portion 54. The first mounting portion 51 is used for mounting the electrical contact portion 42 of the chip 40, the second mounting portion 52 is used for mounting the storage portion 41, and the first clamping portion 53 and the second clamping portion 54 are used for clamping with the developing frame 10, so that the chip holder 50 is mounted on the developing frame 10.

As shown in fig. 19 and 20, the first mounting portion 51 is located on the side of the main body away from the process cartridge, and the second mounting portion 52 is located inside the first mounting portion 51 in the Z direction. In the X direction, the second mounting portion 52 is located on one side of the main body, and the first and second catching

portions

53 and 54 are located on the other side of the main body. The first and second catching

portions

53 and 54 face both sides of the main body in the Y direction, respectively. One of the first engaging portions 53 is a protrusion, and the other is an elastic arm, on which a locking protrusion is also disposed.

As shown in fig. 21 and 22, the memory portion 41 of the chip 40 may be mounted in the second mounting portion 52 and the electrical contact portion 42 of the chip 40 may be mounted in the first mounting portion 51, that is, the chip 40 may be mounted on the chip holder 50, and then the chip holder 50 may be mounted on the developing frame 10 together with the chip 40. The requirement for convenient mounting or dismounting of the whole chip 40 is easily satisfied.

As shown in fig. 22, in the present embodiment, the chip 40 and the chip holder 50 are mounted on the developing frame 10, and the chip 40 is entirely located outside the range of the gap 60 between the developing frame 10 and the photosensitive frame 20 and is not exposed in the gap 60 between the developing frame 10 and the photosensitive frame 20, so that some external members can be prevented from colliding with the storage portion 41 from the gap 60.

In some other embodiments, the chip holder 50 may be integrally provided with the developing frame 10.

Other structures of the processing box of the embodiment are the same as those of the first embodiment, and are not described again.

EXAMPLE III

The present embodiment provides a process cartridge, which is different from the first and second embodiments in the structure of the chip 40 and the structure of the chip holder 50.

As shown in fig. 23 and 24, in the present embodiment, the photosensitive frame 20 may further include an end cap 70, the chip 40 and the chip holder 50 are mounted on the end cap 70, the end cap 70 has a first wall surface 70a, the first wall surface 70a is located on the XY plane, the first wall surface 70a has a mounting position to be combined with the chip holder 50, and a normal direction of the first wall surface 70a is along the Z-axis direction.

As shown in fig. 24 to 26, after the chip 40 is mounted to the end cap 70, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 70a, the electrical contact portion 42 is located outside the first wall surface 70a, and the electrical contact portion 42 is completely exposed outside the first wall surface 70 a. The electrical contact 42 is substantially parallel to the first wall surface 70 a. A part of the storage portion 41 may be inserted into the mounting position on the first wall surface 70a, and a part thereof may be exposed from the first wall surface 70a, or the storage portion 41 may be entirely inserted into the mounting position on the first wall surface 70 a. The storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 70a, and does not protrude from the electrical contact portion 42, whereby the electrical contact portion 42 can shield the storage portion 41 from an external member colliding against the storage portion 41. The electric contact portion 42 is located on one side of the storage portion 41 in the Y-axis direction.

As shown in fig. 27 and 28, further, as viewed in the normal direction Z of the first wall surface 70a, the projected dimension S1 of the storage part 41 is smaller than the projected dimension S2 of the electrical contact part 42. Specifically, the area of the portion where the storing portion 41 can be observed is the projected size S1 thereof, the area of the portion where the electric contact portion 42 can be observed is the projected size S2 thereof, the storing portion 41 (the dotted line portion in fig. 28) is substantially blocked by the first shutter 55, the area where the storing portion 41 can be observed is substantially zero, that is, the projected size S1 of the storing portion 41 is substantially zero, and the projected size S1 (area) of the storing portion 41 is smaller than the projected size S2 (area) of the electric contact portion 42, as viewed in the normal direction Z of the first wall surface.

Another difference from the first embodiment is that the chip holder 50 of the present embodiment has a different structure. As shown in fig. 24, in the present embodiment, the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51, a first blocking plate 55, a first clamping portion 53, and a second clamping portion 54. The first mounting portion 51 is used for mounting the electrical contact portion 42 of the chip 40, and the first clamping portion 53 and the second clamping portion 54 are used for clamping with the end cap 70, so as to mount the chip holder 50 on the end cap 70.

As shown in fig. 29, the first mounting portion 51 is located on a side of the main body away from the process cartridge in the Z direction. The first catching portion 53 and the second catching portion 54 face both sides of the main body in the Y direction, respectively. The first and second engaging

portions

53 and 54 are each a retaining projection. The first shutter 55 is located on the side of the first mounting portion 51 in the Y-axis direction and on the side of the main body away from the process cartridge in the Z-axis direction, and the first shutter 55 is used to shield the storage portion 41 of the chip 40 in the Z-axis direction.

As shown in fig. 30, further, a second shutter 72 is provided on the end cap 70, the second shutter 72 extending along the YZ plane, the second shutter 72 having a space 71 with the inside of the end face of the end cap 70 in the X axis direction, and when the chip 40 and the chip holder 50 are mounted to the mounting position of the end cap 70, the memory part 41 is inserted into the space 71 between the second shutter 72 and the inside of the end cap 70 so that the second shutter 72 can shutter the memory part 41 in the X axis direction. The second baffle 72 is integrally formed with the end cap 70.

As shown in fig. 29, during mounting, the storage portion 41 of the chip 40 may be mounted on the main body by means of adhering or welding, the electrical contact portion 42 of the chip 40 may be mounted on the first mounting portion 51, that is, the chip 40 may be mounted on the chip holder 50, and then the chip holder 50 may be mounted on the end cap 70 together with the chip 40. The requirement for convenient mounting or dismounting of the whole chip 40 is easily satisfied.

As shown in fig. 25 and 30, in the present embodiment, the chip 40 and the chip holder 50 are mounted on the end cap 70, and the first shutter 55 and the second shutter 72 shield the storage portion 41 of the chip 40 so that the storage portion 41 is not exposed to the gap 60 between the photosensitive frame 20 and the developing frame 10, and some external members can be prevented from colliding with the storage portion 41 from the gap 60.

In some other embodiments, the developer frame 10 may also include an end cap on which the chip and chip holder are mounted.

Other structures of the processing box of the embodiment are the same as those of the first embodiment, and are not described herein again.

Example four

The present embodiment provides another processing box, which is different from the third embodiment in that the structure of the chip 40 of the present embodiment is different, and the chip holder 50 and the end cap 70 are an integral structure.

As shown in fig. 31 to 36, in the present embodiment, the first mounting portion 51 for mounting the electrical contact 42 of the chip 40 is formed on the first wall surface 70a of the end cap 70, the first wall surface 70a is located on the XY plane, and the first mounting portion 51 is disposed to protrude from the first wall surface 70a in the Z-axis direction.

As shown in fig. 31 and 32, the end cap 70 is further provided with a second shutter 72, the second shutter 72 extends along the YZ plane, the second shutter 72 has a space 71 from the inside of the end face of the end cap 70 in the X-axis direction, and when the chip 40 is mounted to the mounting position of the end cap 70, the storage portion 41 is inserted into the space 71 between the second shutter 72 and the inside of the end cap 70, so that the second shutter 72 can shutter the storage portion 41 in the X-axis direction.

As shown in fig. 31 to 36, after the chip 40 is mounted to the end cap 70, the storage part 41 is located on the side of the electrical contact part 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 70a, the electrical contact part 42 is located outside the first wall surface 70a, and the electrical contact part 42 is completely exposed outside the first wall surface 70 a. The electrical contact 42 is substantially parallel to the first wall surface 70 a. The storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 70a, and does not protrude from the electrical contact portion 42, whereby the electrical contact portion 42 can shield the storage portion 41 from an external member colliding against the storage portion 41.

As shown in fig. 32 to 34, further, as viewed in the normal direction Z of the first wall surface 70a, the projected dimension S1 of the storage part 41 is smaller than the projected dimension S2 of the electrical contact part 42. The area of the portion where the storage section 41 can be observed is its projected size S1, the area of the portion where the electrical contact 42 can be observed is its projected size S2, the storage section 41 is substantially blocked by the electrical contact 42 and the chip holder 50, the area where the storage section 41 can be observed is substantially zero, that is, the projected size S1 of the storage section 41 is substantially zero, and the projected size S1 (area) of the storage section 41 is smaller than the projected size S2 (area) of the electrical contact 42.

As shown in fig. 35, further, the projection of the storage portion 41 is located between the projection ranges of the electric contact portions 42 in the axial direction X of the photosensitive drum as viewed in the normal direction Z of the first wall surface 70 a. The projections of the memory part 41 and the electrical contact part 42 are located on the XY plane, and the projection D1 of the memory part 41 falls completely within the projection D2 of the electrical contact part 42 in the X-axis direction.

As shown in fig. 35, it is preferable that the size of the projection range of the electric contact 42 in the X-axis direction is 3.5mm to 5.5mm, and the projection D1 of the storage section 41 in the X-axis direction is smaller than the projection D2 of the electric contact 42 in the X-axis direction and falls completely within the projection range of the electric contact 42.

As shown in fig. 36, in the present embodiment, the chip 40 is mounted on the end cap 70, and the electric contact portion 42 and the second shutter 72 shield the storage portion 41 of the chip 40 so that the storage portion 41 is not exposed to the gap 60 between the photosensitive frame 20 and the developing frame 10, and some external members can be prevented from colliding with the storage portion 41 from the gap 60.

The structure of the processing box of this embodiment is the same as that of the first embodiment, and will not be described herein.

What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which all fall within the scope of the invention.

Claims

1. A process cartridge detachably mountable to an image forming apparatus, comprising:

a frame having a first wall surface;

a photosensitive member rotatably supported by the frame;

an electrical contact mounted to the frame and for electrical connection with the imaging device;

a storage portion electrically connected to the electrical contact portion and configured to store information related to the process cartridge;

the storage part is positioned on one side of the electric contact part facing the processing box;

a projected size of the storage portion is smaller than a projected size of the electrical contact portion as viewed in a normal direction of the first wall surface; and/or, in the axial direction of the photosensitive member, the projection of the storage portion is located between the projection ranges of the electric contact portions.

2. A process cartridge according to claim 1, wherein a projection range of said electric contact portion in an axial direction of said photosensitive member as viewed in a normal direction of said first wall surface is 3.5mm to 5.5 mm.

3. A process cartridge according to claim 1, wherein said frame includes a developing frame and a photosensitive frame;

the electric contact portion and the storage portion are provided together on the developing frame or the photosensitive frame.

4. A process cartridge according to claim 3, wherein said storing portion is located outside a range of a gap between said photosensitive frame and developing frame.

5. A process cartridge according to any one of claims 1-4, wherein said electric contact portion is located outside said first wall surface in a normal direction along said first wall surface.

6. A process cartridge according to claim 5, wherein said electric contact is parallel to said first wall surface.

7. A process cartridge according to claim 5, wherein said electric contact portion and said storage portion are electrically connected through a flexible conductive medium.

8. A process cartridge according to claim 3, wherein said developing frame or photosensitive frame includes an end cap, and said electric contact portion and storage portion are mounted to said end cap.

9. A chip holder to be mounted on a process cartridge for mounting and fixing an electric contact part and a memory part on the process cartridge according to any one of claims 1 to 8.

10. The chip holder according to claim 9, wherein the chip holder is provided separately from or integrally formed with the frame.