CN217424585U - Temperature sensor for power module - Google Patents
Temperature sensor for power module Download PDFInfo
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- CN217424585U CN217424585U CN202221144679.8U CN202221144679U CN217424585U CN 217424585 U CN217424585 U CN 217424585U CN 202221144679 U CN202221144679 U CN 202221144679U CN 217424585 U CN217424585 U CN 217424585U
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Abstract
The utility model is suitable for a temperature sensor technical field. The utility model discloses a temperature sensor for a power supply module, which comprises a thermistor, a metal piece, an injection molding piece, two low-voltage injection molding pieces and two plastic rings; the thermistor is provided with a pin; the metal piece is sheet-shaped and is provided with a metal round through hole; the injection molding piece is cuboid and provided with an injection molding round through hole and two small round holes; the low-pressure injection molding piece is cylindrical; the plastic ring is circular; the beneficial effects of the utility model reside in that: the structure is simple, the cost is low, the production is easy, and the production period is short; secondly, the structure is flexible, and enough space volume improvement can be provided for the power supply module; and thirdly, the PCB can be directly welded and assembled on the mainboard according to the requirements of the mainboard of a client.
Description
Technical Field
The utility model relates to a temperature sensor technical field, in particular to a temperature sensor for power module.
Background
A temperature sensor is a sensor that senses temperature and converts it into a usable output signal. Under the condition that present electronic equipment is widely used, high temperature generated by operating the electronic equipment for a long time can cause damage to the electronic equipment. How to ensure that the long-time reliable operation of the electronic equipment is not influenced by self-heating high temperature needs to install a temperature sensor on a power module in the electronic equipment for monitoring; thus, a temperature sensor of the power supply module is produced.
The temperature sensor of the existing power module has the following defects: firstly, the structure is complex, the manufacturing cost is high, the production is difficult, and the production period is long; the structure is large in size, occupies large space of a power supply module, and is not suitable for installation; and thirdly, the direct welding assembly on the mainboard can not be carried out according to the requirements of the mainboard of the client.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing a temperature sensor for a power module, which has simple structure, low cost, easy production and short production period; the structure is ingenious, and the sufficient space volume improvement can be provided for the power module.
In order to solve the above problems, the present invention provides a temperature sensor for a power module, which comprises a thermistor, a metal piece, an injection molding piece, two low-pressure injection molding pieces, and two plastic rings; the thermistor is provided with a pin; the metal piece is sheet-shaped and is provided with a metal round through hole; the injection molding piece is cuboid and provided with an injection molding round through hole and two small round holes; the size of the metal round through hole is the same as that of the injection molding round through hole; the low-pressure injection molding piece is cylindrical; the plastic ring is circular; the metal piece and the injection molding piece are subjected to injection molding through an injection molding machine, namely the metal piece is arranged in front of the injection molding piece, and the metal round through hole is superposed with the injection round through hole; the thermistor is arranged in the injection molding piece, and the thermistor head is arranged on the inner wall of the injection molding round through hole; the low-pressure injection molding part is formed in a low-pressure injection molding mode in an injection molding mode, is arranged on the bottom surface of the injection molding part, and pins penetrate through the low-pressure injection molding part; the plastic ring is mounted on the pin.
Furthermore, the metal piece is made of H65 brass and nickel plating.
Furthermore, the injection molding part and the plastic ring are made of PA66+ GF30 plastic.
Furthermore, the thermistor is an epoxy resin packaging type thermistor.
Furthermore, the material of the low-pressure injection molding part is PA6710 low-pressure injection molding material.
The beneficial effects of the utility model reside in that: the structure is simple, the cost is low, the production is easy, and the production period is short; secondly, the structure is smart, and enough space volume improvement can be provided for the power supply module; and thirdly, the PCB can be directly welded and assembled on the mainboard according to the requirements of the mainboard of a client.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional view of the present invention.
Fig. 2 is a front perspective view of the present invention.
Fig. 3 is a rear perspective view of fig. 2.
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1 to 3, the temperature sensor for the power module includes a thermistor 1, a metal part 2, an injection molding part 3, two low-voltage injection molding parts 4, and two plastic rings 5; the thermistor 1 is provided with a pin 11; the metal piece 2 is sheet-shaped, and the metal piece 2 is provided with a metal round through hole 21; the injection molding piece 3 is cuboid, and the injection molding piece 3 is provided with an injection molding round through hole 31 and two small round holes 32; the size of the metal round through hole 21 is the same as that of the injection molding round through hole 31; the low-pressure injection molding piece 4 is cylindrical; the plastic ring 5 is circular; the metal piece 2 and the injection molding piece 3 are subjected to injection molding by an injection molding machine, namely the metal piece 2 is arranged in front of the injection molding piece 3, and the metal round through hole 21 is superposed with the injection round through hole 31; the thermistor 1 is arranged in the injection molding part 3, and the thermistor 1 is arranged on the inner wall of the injection molding round through hole 31; the low-pressure injection molding part 4 is formed in a low-pressure injection molding mode and arranged on the bottom surface of the injection molding part 3, and the pins 11 penetrate through the low-pressure injection molding part 4; the plastic ring 5 is mounted on the pin 11.
As shown in fig. 1 and 3, the metal piece 2 is made of H65 brass plus nickel plating; specifically, the material H65 brass and the nickel plating are H65 brass, namely, a layer of nickel is plated on the material H65 brass by an electrolytic or chemical method; the material of the H65 brass has the performance between H68 and H62, has good mechanical properties, higher strength and plasticity, can well bear cold and hot pressure processing, and has corrosion and cracking tendency.
As shown in fig. 1 to 3, the injection-molded part 3 and the plastic ring 5 are made of PA66+ GF30 plastic; specifically, the PA66+ GF30 plastic is a general name of the PA66 plastic raw material added with 30% of glass fiber, and the PA66 plastic is polyhexamethylene adipamide.
As shown in fig. 1, the thermistor 1 is an epoxy resin-encapsulated thermistor.
As shown in fig. 1 to 3, the material of the low-pressure injection molding part 4 is PA6710 low-pressure injection molding material; specifically, the PA6710 low-pressure injection molding material is a low-pressure injection molding hot melt adhesive, the low-pressure injection molding hot melt adhesive is a PA polyamide hot melt adhesive, and PA polyamide is commonly known as nylon and is a general name of a polymer containing an amido group in a macromolecular chain structural unit.
The working process of the embodiment is as follows: the product is directly welded and assembled on the mainboard through the metal piece 2 according to the requirement of the mainboard of a client; the product can also be arranged on a power module of the electronic equipment, and the pin 11 is electrically connected with an electronic control unit of the electronic equipment; the temperature generated by the power module is sensed by the thermistor 1, converted into an electric signal and input into an electronic control unit of the electronic equipment; the effects performed on the power supply module are: monitoring the temperature to ensure that the temperature of the power supply module is controlled within a certain range in real time in the process of heat dissipation treatment of the power supply module so as to ensure the normal operation of the electronic equipment; the working state of the power supply module is controlled through temperature data fed back by the thermistor 1, and information alarm is carried out on the electronic equipment in different temperature states; the reliability of the power module can be guaranteed to the greatest extent.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.
Claims (5)
1. A temperature sensor for a power supply module is characterized by comprising a thermistor (1), a metal piece (2), an injection molding piece (3), two low-voltage injection molding pieces (4) and two plastic rings (5); the thermistor (1) is provided with a pin (11); the metal piece (2) is sheet-shaped, and the metal piece (2) is provided with a metal round through hole (21); the injection molding piece (3) is cuboid, and the injection molding piece (3) is provided with an injection molding round through hole (31) and two small round holes (32); the metal round through hole (21) and the injection molding round through hole (31) have the same size; the low-pressure injection molding piece (4) is cylindrical; the plastic ring (5) is annular; the metal piece (2) and the injection molding piece (3) are subjected to injection molding by an injection molding machine, namely the metal piece (2) is arranged in front of the injection molding piece (3), and the metal round through hole (21) is superposed with the injection molding round through hole (31); the thermistor (1) is arranged in the injection molding part (3), and the head of the thermistor (1) is arranged on the inner wall of the injection molding round through hole (31); the low-pressure injection molding part (4) is formed in an injection molding mode in a low-pressure injection molding mode, is arranged on the bottom surface of the injection molding part (3), and the pins (11) penetrate through the low-pressure injection molding part (4); the plastic ring (5) is arranged on the pin (11).
2. Temperature sensor for a power supply module according to claim 1, characterized in that the metal piece (2) is of H65 brass + nickel plated.
3. The temperature sensor for power supply module according to claim 1, wherein the injection-molded part (3) and the plastic ring (5) are made of PA66+ GF30 plastic.
4. A temperature sensor for a power supply module according to claim 1, characterized in that the thermistor (1) is an epoxy resin encapsulated thermistor.
5. Temperature sensor for a power supply module according to claim 1, characterized in that the material of the low-pressure injection-molded part (4) is PA6710 low-pressure injection-molded plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221144679.8U CN217424585U (en) | 2022-05-13 | 2022-05-13 | Temperature sensor for power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221144679.8U CN217424585U (en) | 2022-05-13 | 2022-05-13 | Temperature sensor for power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217424585U true CN217424585U (en) | 2022-09-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221144679.8U Active CN217424585U (en) | 2022-05-13 | 2022-05-13 | Temperature sensor for power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217424585U (en) |
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2022
- 2022-05-13 CN CN202221144679.8U patent/CN217424585U/en active Active
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