CN217418798U - Evaporation plating system - Google Patents

Abstract

The utility model provides an evaporation system, which comprises an evaporation cavity; the evaporation module, the substrate bearing assembly and the conductive plate assembly are arranged in the evaporation cavity; the power supply control module is electrically connected with the evaporation module; the evaporation module comprises a plurality of evaporation source units provided with evaporation material charged parts; the substrate bearing assembly comprises a substrate fixing part and a substrate rotating part, wherein the substrate fixing part is used for bearing a substrate to be evaporated; the conductive plate assembly comprises a plurality of conductive plates and a first charge providing part electrically connected with the conductive plates, and controls each conductive plate to have the same charge as the evaporation material belt. The power supply control module can apply current to the evaporation source unit in the evaporation module, evaporation materials in the evaporation source unit evaporate a large amount of evaporation particles due to heating, and the evaporation particles move upwards in a relatively ordered manner until being deposited on the substrate in a rotating state under the repulsion action of the same charges, so that the evaporation particles are favorably and uniformly deposited on the substrate to improve the evaporation quality.

Description

Evaporation plating system

Technical Field

The utility model relates to an evaporation equipment technical field especially relates to an evaporation system.

Background

The multi-evaporation source thermal resistance type evaporation equipment is film forming equipment in the industries of semiconductor light emitting diodes and organic light emitting semiconductor panels. The current is applied to the evaporation source, the evaporation material in the evaporation source is heated to melt and evaporate, and evaporated evaporation material particles float to the surface of the wafer above in a disordered state to form a film layer. Meanwhile, in the multi-evaporation-source thermal resistance type evaporation equipment, the positions of all evaporation sources are not aligned with the central position of the substrate, so that the film layer obtained by the existing scheme is rough and has poor quality.

Therefore, how to improve the evaporation quality is an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned related art not enough, the utility model aims at providing an evaporation plating system aims at solving the relatively poor problem of evaporation plating quality through current evaporation plating equipment.

In order to solve the technical problem, the utility model provides an evaporation system, include: evaporating a cavity; the evaporation module, the substrate bearing assembly and the conductive plate assembly are arranged in the evaporation cavity; the power supply control module is electrically connected with the evaporation module; wherein the content of the first and second substances,

the evaporation module comprises a plurality of evaporation source units distributed in an array manner, wherein an evaporation material charging part is arranged in each evaporation source unit and is used for controlling first charges of an evaporation material belt in the evaporation source unit;

the substrate bearing assembly comprises a substrate fixing part and a substrate rotating part which are connected with each other, and one side of the substrate fixing part facing the evaporation module bears a substrate to be evaporated;

the conducting plate assembly comprises a plurality of conducting plates arranged on two opposite sides of the evaporation module and a first charge providing part electrically connected with the conducting plates, and the first charge providing part is used for controlling the first charges of the conducting plates.

According to the evaporation system, the plurality of conductive plates are arranged on the two opposite sides of the evaporation module comprising the plurality of evaporation source units, the evaporation source units are internally provided with evaporation material charging parts, and the conductive plates and the evaporation material charging parts are controlled to have the same charge. In the evaporation process, the base plate that treats the coating by vaporization that the base plate carrier assembly bore rotates in evaporation module top, exert the electric current through power control module to the evaporation source unit in the evaporation module, the coating by vaporization material who arranges in the evaporation source unit evaporates a large amount of coating by vaporization particles because of being heated, the coating by vaporization particle is under the repulsion that receives self and conducting plate between the same kind of electric charge, the motion path of adjustable coating by vaporization particle, a large amount of relatively orderly upward movements of coating by vaporization particle this moment are until the deposit is on the base plate that is in the rotation state, help the even deposit of coating by vaporization particle on the base plate, thereby promote the coating by vaporization quality.

Drawings

Fig. 1 is a first schematic structural diagram of an evaporation system provided in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an evaporation chamber in an evaporation system according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an evaporation chamber in an evaporation system according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a second evaporation system provided in an embodiment of the present invention;

fig. 5 is a third schematic structural diagram of an evaporation system provided in an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a vapor deposition system according to an embodiment of the present invention;

description of reference numerals:

1-evaporation plating cavity; 11-an evaporation module; 12-a substrate carrier assembly; 13-a conductive plate assembly; 14-a power supply control module; 111-an evaporation source unit; 112-vapor deposition material charging part; 113-an evaporation material; 114-a heating section; 121-a substrate fixing part; 122-substrate rotating part; 123-a substrate; 124-a second charge providing section; 131-a conductive plate; 132-a first charge providing section; 141-a control submodule; 142-a power supply sub-module; 143-a gating submodule; 1421 — a power supply unit; 1431-switch; 1432-a switch control unit; 15-evaporation speed control module; 151-film thickness analysis submodule; 152-a data acquisition sub-module; 1521-a collection unit; 16-an evaporation angle control module; 161-grid sub-module; 162-opening adjustment submodule; 1611-grid cell.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

The multi-evaporation source thermal resistance type evaporation equipment is film forming equipment in the industries of semiconductor light emitting diodes and organic light emitting semiconductor panels. The current is applied to the evaporation source, the evaporation material in the evaporation source is heated to melt and evaporate, and evaporated evaporation material particles float to the surface of the wafer above in a disordered manner to form a film layer. Meanwhile, in the multi-evaporation-source thermal resistance type evaporation equipment, the positions of all evaporation sources are not aligned with the central position of the substrate, so that the film layer obtained by the existing scheme is rough and has poor quality.

Based on this, the present invention is intended to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.

The embodiment of the utility model provides a:

the present embodiment provides a vapor deposition system, as shown in fig. 1 to 6, the vapor deposition system at least includes: evaporating a cavity 1; the evaporation module 11, the substrate bearing assembly 12 and the conductive plate assembly 13 are arranged in the evaporation cavity 1; and a power control module 14 electrically connected to the evaporation module 11; wherein the content of the first and second substances,

the evaporation module 11 comprises a plurality of evaporation source units 111 distributed in an array, wherein an evaporation material charging part 112 is arranged in each evaporation source unit 111, and the evaporation material charging part 112 is used for controlling an evaporation material 113 in the evaporation source unit 111 to be charged with a first charge;

the substrate carrier assembly 12 includes a substrate fixing portion 121 and a substrate rotating portion 122 connected to each other, wherein one side of the substrate fixing portion 121 facing the evaporation module 11 carries a substrate 123 to be evaporated;

the conductive plate assembly 13 includes a plurality of conductive plates 131 disposed at opposite sides of the evaporation module 11, and a first charge providing part 132 electrically connected to the plurality of conductive plates 131, the first charge providing part 132 being configured to control the plurality of conductive plates 131 to carry a first charge.

It is understood that in the present embodiment, the evaporation chamber 1 is configured with a gas pumping system, which includes, but is not limited to, vacuum pumps, pipes, valves, etc. Before coating, the space in the evaporation cavity 1 can be decompressed into a vacuum state in advance through an air exhaust system so as to meet the requirement of preparing a film layer in vacuum.

In this embodiment, as shown in fig. 3, an evaporation module 11 is disposed at the bottom of the evaporation chamber 1, the evaporation module 11 includes a plurality of evaporation source units 111, a heating unit 114 is disposed in each evaporation source unit 111, an evaporation material 113 disposed above the heating unit 114, and an evaporation material charging unit 112 disposed below the heating unit 114. The heating portion 114 may be made of a refractory metal such as tungsten or molybdenum, and may be made of a boat foil or a wire. The evaporation material 113 includes, but is not limited to, a metal material such as silver, aluminum, copper, gold, or nickel. Generally, one evaporation source unit 111 is provided with one evaporation material 113, and different evaporation source units 111 may be provided with the same or different kinds of evaporation materials 113. The evaporation material charging unit 112 can be used to charge the evaporation material 113 in the corresponding evaporation source unit 111, and the evaporation material charging unit 112 includes, but is not limited to, an ion source, such as a high frequency ion source or a plasma ion source. In practical applications, when performing evaporation, the evaporation material charging section 112 can generate ions with certain charges and deposit the ions at the evaporation material 113 in the corresponding evaporation source unit 111 to charge the evaporation material 113; at the same time, a current is applied to the heating section 114, and the vapor deposition material 113 is melted by the heat to generate a large amount of vapor deposition particles, which also have electric charges. It can also be understood that the specific number and arrangement of the evaporation source units 111 in the evaporation module 11 can be flexibly set. By way of example, the evaporation module 11 may include, but is not limited to, 2, 4, 8, or 9 evaporation source units 111. The evaporation source units 111 in the evaporation module 11 are distributed annularly, or sequentially arranged along a certain length direction, or distributed in an array.

In this embodiment, as shown in fig. 2, a substrate supporting assembly 12 is disposed on the top of the evaporation chamber 1, the substrate supporting assembly 12 includes a substrate fixing portion 121 and a substrate rotating portion 122, the substrate rotating portion 122 can be a rotating mechanism with a rotating shaft, and the substrate fixing portion 121 is fixed on the rotating shaft of the substrate rotating portion 122. Meanwhile, one side of the substrate fixing portion 121 facing the evaporation module 11 (i.e., the bottom of the evaporation chamber 1) can be used for carrying a substrate 123 to be evaporated, and a plurality of wafers can be disposed on the substrate 123. In practical applications, when vapor deposition is performed, the substrate rotating portion 122 is driven to drive the substrate fixing portion 121 and the substrate 123 to be vapor deposited to rotate in a horizontal direction, so as to facilitate uniform deposition of vapor deposition particles on the surface of the substrate or the plurality of wafers.

In this embodiment, as shown in fig. 2, a conductive plate assembly 13 is further disposed in the evaporation cavity 1, the conductive plate assembly 13 includes a plurality of conductive plates 131, and each conductive plate 131 is located on one side of the evaporation module 11. It will be appreciated that the specific number and size of the conductive plates 131 in the conductive plate assembly 13 can be flexibly set, and can also be appropriately set according to the specific size of the evaporation module 11. For example, in practical applications, the evaporation module 11 includes a plurality of evaporation source units 111 arranged in a 4 × 4 array, one conductive plate 131 may be disposed on each of the front and rear sides or the left and right sides (i.e., one set of opposing side surfaces) of the evaporation module 11, or one conductive plate 131 may be disposed on each of the front and rear sides or the left and right sides (i.e., two sets of opposing side surfaces) of the evaporation module 11. Meanwhile, the conductive plate assembly 13 further includes a first charge providing portion 132, and the first charge providing portion 132 is used for controlling the plurality of conductive plates 131 to have a first charge, so that the conductive plates 131 and the vapor deposition particles have the same charge, such as a positive charge or a negative charge. Then, during the evaporation process, the evaporation particles evaporated from the evaporation source unit 111 can be subjected to the repulsive force of the same kind of charges between themselves and other evaporation particles or the conductive plate 131, so that the movement path of the evaporation particles is more biased to the vertical line. In view of the whole, a large amount of vapor deposition particles move upwards relatively orderly until the vapor deposition particles are deposited on the substrate in a rotating state, which is beneficial to improving the thickness uniformity of the film layer so as to form the film layer with higher quality. Meanwhile, more evaporation particles can be deposited on the substrate, and the material utilization rate is improved. It is also understood that the first charge providing part 132 may be separately provided for each of the plurality of conductive plates 131 so that each of the conductive plates 131 is independently controlled, or the plurality of conductive plates 131 may be electrically connected to the same first charge providing part 132 so that the conductive plates 131 are collectively controlled.

In this embodiment, as shown in fig. 3, the substrate carrier assembly 12 further includes a second charge providing portion 124, and the second charge providing portion 124 is electrically connected to the substrate 123 for controlling the substrate 123 to carry a second charge. That is, the substrate 123 and the vapor deposition particles can be controlled to carry different charges, and when the vapor deposition particles move to be close to the substrate 123, the vapor deposition particles can be driven to deposit on the substrate 123 by the attraction of the different charges between the vapor deposition particles and the substrate 123, thereby further improving the material utilization rate.

It is understood that, in the present embodiment, the first electric charge is opposite to the second electric charge. For example, if the first charge is a positive charge, the second charge is a negative charge; conversely, if the first charge is negative, the second charge is positive. When it is necessary to control the conductive plate 131 to have the first charge and the substrate 123 to have the second charge, the first charge supply part 132 corresponding to the conductive plate 131 and the first charge supply part 124 corresponding to the substrate 123 may be disposed on the same power source. In practical application, the conductive plate 131 and the substrate 123 can be directly and electrically connected with the positive end and the negative end of the same power supply respectively, so that the purpose that the conductive plate 131 and the substrate 123 carry different charges is achieved, the structure is simple, and the cost is low.

In the present embodiment, as shown in fig. 4, the power control module 14 includes a control sub-module 141, a power sub-module 142, and a gating sub-module 143; the control submodule 141 is electrically connected with the power supply submodule 142 and the gating submodule 143 respectively; the power supply sub-module 142 includes a plurality of power supply units 1421 electrically connected to the plurality of evaporation source units 111 in a one-to-one correspondence; the gating sub-module 143 includes a plurality of switches 1431 electrically connected to the plurality of evaporation source units 111 in a one-to-one correspondence, and a switch control unit 1432 electrically connected to the plurality of switches 1431, and the plurality of switches 1431 are disposed between the plurality of evaporation source units 111 and the plurality of power supply units 1421. It is understood that the control sub-module 141 may send a gating instruction to the gating sub-module 143 to instruct the switch control unit 1432 in the gating sub-module 143 to control the target switch to be closed or opened. The control submodule 141 may also send a heating instruction to the power supply submodule 142 to instruct a target power supply unit in the power supply submodule 142 to apply current to the corresponding evaporation source unit 111 at a specified power. In practical applications, any one or more target evaporation sources in the evaporation module 11 can be selected to be turned on by the power control module 14 to generate evaporation particles, and the power control module 14 can also control the target power units corresponding to the target evaporation sources to output specified currents, so as to meet the evaporation requirements of various evaporation materials. By way of example, in one example, the evaporation module 11 includes at least one row of 4 evaporation source units 111 arranged sequentially from left to right, and the evaporation materials in the 4 evaporation source units 111 are the same. The gating instruction can be sent to the switch control unit 1432 by the control sub-module 141, and the switch control unit 1432 controls the leftmost switch 1431 and the rightmost switch 1431 to be closed according to the gating instruction, that is, the leftmost evaporation source unit 111 and the rightmost evaporation source unit 111 are designated to be turned on to generate evaporation particles. The control sub-module 141 further sends the same heating command to the power supply unit 1421 corresponding to the leftmost evaporation source unit 111 and the power supply unit 1421 corresponding to the leftmost evaporation source unit 111, respectively, and each power supply unit 1421 applies the same current to the corresponding evaporation source unit 111 according to the heating command, so as to enable the two evaporation sources to evaporate the film layer of the single evaporation material. Meanwhile, the uniformity of the film thickness can be further improved by controlling the simultaneous evaporation of the two evaporation sources which are bilaterally symmetrical. In another example, the evaporation module 11 includes at least one row of 5 evaporation source units 111 arranged sequentially from left to right, and the evaporation materials in different evaporation source units 111 are different for the 5 evaporation source units 111. The gating instruction can be sent to the switch control unit 1432 by the control sub-module 141, and the switch control unit 1432 controls the leftmost switch 1431 and the rightmost switch 1431 to be closed according to the gating instruction, that is, the leftmost evaporation source unit 111 and the rightmost evaporation source unit 111 are designated to be turned on to generate evaporation particles. The control sub-module 141 further sends different heating instructions to the power supply unit 1421 corresponding to the leftmost evaporation source unit 111 and the power supply unit 1421 corresponding to the leftmost evaporation source unit 111, respectively, and each power supply unit 1421 applies a corresponding current to the corresponding evaporation source unit 111 according to the corresponding heating instruction, so as to achieve evaporation of the two evaporation sources to form the film layer doped with two evaporation materials. Therefore, the evaporation system provided by the embodiment can be applied to the application scenes of evaporation of a single evaporation material and doping evaporation of multiple evaporation materials.

In this embodiment, as shown in fig. 5 and 6, in order to further improve the evaporation quality, an evaporation system may further include an evaporation speed control module 15; the evaporation speed control module 15 comprises a film thickness analysis submodule 151 and a data acquisition submodule 152; the film thickness analysis submodule 151 is electrically connected with the data acquisition submodule 152 and the power control module 14 respectively; the data collecting submodule 152 is configured to collect the evaporation rate and the evaporation thickness of the evaporation material 113 in the evaporation source unit 111 and send the evaporation rate and the evaporation thickness to the film thickness analyzing submodule 151. It is understood that the data acquisition submodule 152 includes a number of acquisition units 1521, and each acquisition unit 1521 is not limited to being a crystal probe. The data acquisition submodule 152 is disposed inside the evaporation chamber 1 and located on a movement path of the evaporation particles for monitoring the evaporation rate and the evaporation thickness of the evaporation material in the evaporation source unit 111. The film thickness analysis submodule 151 is not limited to a film thickness meter, and the film thickness analysis submodule 151 may be disposed outside the evaporation chamber 1, and configured to receive data information, such as evaporation rate and evaporation thickness, acquired by the data acquisition submodule 152, and send a current adjustment instruction to the power control module 14 according to the data information, so as to adjust the evaporation rate of the evaporation material in the evaporation source unit 111, thereby implementing control of the thickness of the film on the substrate. It will also be appreciated that the particular number and location of the acquisition units 1521 within the data acquisition submodule 152 may be flexibly arranged. In practical applications, the data acquisition sub-module 152 includes a plurality of acquisition units 1521 disposed on opposite sides of the evaporation module 11. The plurality of collecting units 1521 may be respectively disposed between the substrate supporting assembly 12 and the conductive plate assembly 13, and of course, the plurality of collecting units 1521 may be disposed at other lower positions, which may be satisfied with the positions where the vapor deposition particles evaporated from the vapor deposition material in a certain evaporation source or some evaporation sources can reach. For example, in an example, the evaporation module 11 includes a row of 4 evaporation source units 111 sequentially arranged from left to right, a conductive plate 131 is respectively disposed on the left and right sides of the evaporation module 11, and a collection unit 1521 may be respectively disposed on the left and right sides of the evaporation module 11, where each collection unit 1521 is located above the conductive plate 131 and below the substrate 123. In other examples, a plurality of collecting units 1521 may be respectively disposed around the evaporation module 11, and the fixing position of each collecting unit 1521 is lower than the height of each conductive plate 131. By providing a greater number of acquisition units 1521, the monitoring accuracy is facilitated to be improved.

In this embodiment, as shown in fig. 5 and 6, in order to further improve the evaporation quality, an evaporation system may further include an evaporation angle control module 16; the evaporation angle control module 16 includes a grill sub-module 161 and an opening adjustment sub-module 162; the grid submodule 161 includes a plurality of grid units 1611 corresponding to the plurality of evaporation source units 111 one by one; the opening adjustment submodule 162 is electrically connected to the grid submodule 161 and the film thickness analysis submodule 151, respectively. It can be understood that the grid sub-module 161 includes a plurality of grid units 1611, one evaporation source unit 111 is disposed in each grid unit 1611, and an opening is disposed on a surface of each grid unit 1611 above the evaporation source unit 111, so that the evaporation particles evaporated from the evaporation material in the evaporation source unit 111 are scattered into the evaporation cavity through the corresponding opening. The opening size of each grid unit 1611 can be adjusted by the opening adjustment sub-module 162 to control the evaporation angle of each evaporation source unit 111, and thus the covering position of the vapor deposition particles on the substrate. It can be understood that when the opening of the grid unit is adjusted by the opening adjustment submodule 162 and the opening is reduced to the closed state, the vapor deposition particles of the evaporation source unit 111 are prevented from being evaporated onto the substrate. For example, the evaporation module 11 includes at least one row of 4 evaporation source units 111 arranged in sequence, the 4 evaporation source units 111 are arranged in the 4 grid units 1611 in a one-to-one correspondence manner, and the opening size of each grid unit is adjusted by the opening adjusting sub-module 162, so that the vapor deposition particles of each evaporation source unit 111 can cover the whole substrate or only a half of the area on the substrate through the opening. Meanwhile, the opening adjusting submodule 162 is electrically connected to the grid submodule 161 and the film thickness analyzing submodule 151, respectively, that is, the opening adjusting submodule 162 may receive a control command from the film thickness analyzing submodule 151 and adjust the size of the opening of the grid unit 1611 according to the control command to control the thickness of the film layer to be formed on the substrate and the mixture concentration ratio when the plurality of evaporation materials are evaporated together.

The evaporation system provided by the embodiment of the utility model at least comprises an evaporation cavity, an evaporation module, a substrate bearing assembly and a current conducting plate assembly, wherein the evaporation module, the substrate bearing assembly and the current conducting plate assembly are arranged in the evaporation cavity; and the power supply control module is electrically connected with the evaporation module. In the evaporation process, the base plate that treats the coating by vaporization that the base plate carrier assembly bore rotates in evaporation module top, exert the electric current through power control module to the evaporation source unit in the evaporation module, the coating by vaporization material who arranges in the evaporation source unit evaporates a large amount of coating by vaporization particles because of being heated, the coating by vaporization particle is under the repulsion that receives self and conducting plate between the same kind of electric charge, the motion path of adjustable coating by vaporization particle, a large amount of relatively orderly upward movements of coating by vaporization particle this moment are until the deposit is on the base plate that is in the rotation state, help the even deposit of coating by vaporization particle on the base plate, thereby promote the coating by vaporization quality. In addition, the evaporation system can also comprise an evaporation speed control module and an evaporation angle control module so as to further expand the application requirements and better improve the evaporation quality.

It should be understood that the application of the present invention is not limited to the above examples, and that modifications or changes can be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims (10)

1. An evaporation system, comprising: evaporating a cavity; the evaporation module, the substrate bearing assembly and the conductive plate assembly are arranged in the evaporation cavity; the power supply control module is electrically connected with the evaporation module; wherein the content of the first and second substances,

the evaporation module comprises a plurality of evaporation source units distributed in an array manner, wherein an evaporation material charging part is arranged in each evaporation source unit and is used for controlling a first charge of an evaporation material belt in the evaporation source unit;

the substrate bearing assembly comprises a substrate fixing part and a substrate rotating part which are connected with each other, and one side of the substrate fixing part facing the evaporation module bears a substrate to be evaporated;

the conducting plate assembly comprises a plurality of conducting plates arranged on two opposite sides of the evaporation module and a first charge providing part electrically connected with the conducting plates, and the first charge providing part is used for controlling the first charges of the conducting plates.

2. The evaporation system according to claim 1, wherein the substrate carrier assembly further comprises a second charge provider electrically connected to the substrate, the second charge provider being configured to control the substrate to be charged with a second charge; wherein the second charge is opposite to the first charge.

3. The evaporation system according to claim 2, wherein the first charge supply unit and the second charge supply unit are provided on the same power supply.

4. The evaporation system according to claim 1, wherein the evaporation material charging section is an ion source.

5. The evaporation system according to claim 1, wherein different ones of said plurality of evaporation source units are provided with different kinds of evaporation materials.

6. The evaporation system according to any one of claims 1 to 5, wherein the power control module comprises a control sub-module, a power sub-module and a gating sub-module; the control submodule is electrically connected with the power supply submodule and the gating submodule respectively;

the power supply submodule comprises a plurality of power supply units which are electrically connected with the plurality of evaporation source units in a one-to-one correspondence manner;

the gating sub-module comprises a plurality of switches which are electrically connected with the plurality of evaporation source units in a one-to-one correspondence manner, and a switch control unit which is electrically connected with the plurality of switches; and the switches are arranged between the evaporation source units and the power supply units.

7. The evaporation system according to any one of claims 1 to 5, further comprising an evaporation rate control module; the evaporation speed control module comprises a film thickness analysis submodule and a data acquisition submodule; the film thickness analysis submodule is electrically connected with the data acquisition submodule and the power supply control module respectively; the data acquisition submodule is used for acquiring the evaporation rate and the evaporation thickness of evaporation materials in the evaporation source unit and sending the evaporation rate and the evaporation thickness to the film thickness analysis submodule.

8. The evaporation system of claim 7, wherein said data acquisition submodule comprises a plurality of acquisition units disposed on opposite sides of said evaporation module.

9. The evaporation system according to claim 8, wherein each of the collection units is disposed between the substrate carrier assembly and the conductive plate assembly.

10. The evaporation system according to claim 7, further comprising an evaporation angle control module; the evaporation angle control module comprises a grid submodule and an opening adjusting submodule; the grid submodule comprises a plurality of grid units which correspond to the plurality of evaporation source units one by one; the opening adjusting submodule is electrically connected with the grid submodule and the film thickness analyzing submodule respectively.

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