CN217413635U

CN217413635U - Jig suitable for abrasive operation of semiconductor module product

Info

Publication number: CN217413635U
Application number: CN202221512543.8U
Authority: CN
Inventors: 仲兆文; 陈李广
Original assignee: Shanghai Simat Microelectronics Technology Co ltd
Current assignee: Shanghai Simat Microelectronics Technology Co ltd
Priority date: 2022-06-16
Filing date: 2022-06-16
Publication date: 2022-09-13
Anticipated expiration: 2032-06-16

Abstract

The utility model belongs to the technical field of the grinding apparatus, concretely relates to tool suitable for operation of semiconductor module product abrasive material, include tool base, product spacing storehouse, get material breach and pilot pin, product spacing storehouse is seted up in on the tool base, be equipped with a plurality ofly on the product spacing storehouse the pilot pin, it is a plurality of the pilot pin all with product spacing storehouse fixed connection, still seted up a plurality ofly on the tool base get the material breach, it is located to get the material breach the both sides in product spacing storehouse, the degree of depth of getting the material breach is greater than the degree of depth in product spacing storehouse, the utility model discloses need not the manual work and press the product, can avoid with mesa friction fish tail product plastic body, can reduce the emergence of compounding condition, reduced processing step and working strength, improved production quality and work efficiency.

Description

Jig suitable for abrasive operation of semiconductor module product

Technical Field

The utility model belongs to the technical field of the grinding apparatus, concretely relates to tool suitable for semiconductor module product abrasive material operation.

Background

In the production of semiconductor QFN and other module products, a main raw material frame needs to be pasted with a film in the production process, a large amount of glue is arranged on the film, packaging production and processing can be carried out after the pasting, the film on the frame needs to be torn off from the frame after plastic packaging, and therefore a large amount of glue is left on the frame and an electroplating process cannot be directly carried out.

However, the conventional module product abrasive work of the semiconductor QFN and the like has the following defects: according to the conventional operation method, when workers press the product by hands, the product is not pressed well frequently, so that a plastic package body of the product is abraded with a table top, the plastic package body of the product is scratched, the product is poor, printing in a later process is poor, and the quality of the product is seriously affected; in the conventional abrasive work, both hands of the staff need to continuously move, and large force is needed to press the product, so that the working strength of the staff is high. Resulting in a higher personnel loss rate in the process. Frequent loss of personnel causes more work of new personnel, and the product quality is more unstable; the conventional grinding operation has the disadvantages of more operation processes, complex operation and longer production period of products.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned weak point that exists among the prior art, the utility model provides a tool suitable for semiconductor module product abrasive material operation for solve above-mentioned current problem.

In order to solve the technical problem, the utility model adopts the following technical scheme:

the utility model provides a tool suitable for semiconductor module product abrasive material operation, includes tool base, product spacing storehouse, gets material breach and pilot pin, product spacing storehouse set up in on the tool base, be equipped with a plurality ofly on the product spacing storehouse the pilot pin, it is a plurality of the pilot pin all with product spacing storehouse fixed connection, still seted up a plurality ofly on the tool base get the material breach, it is located to get the material breach the both sides in product spacing storehouse, the degree of depth of getting the material breach is greater than the degree of depth in product spacing storehouse.

Furthermore, the product limiting bin is in a square groove shape, and four corners of the product limiting bin are provided with slotted holes.

Further, get the material breach and be circular recess form and have two, two get the material breach and be located the both sides and the symmetric distribution in product spacing storehouse.

Furthermore, the pilot pin is conical and has four, four pilot pins all with the upper and lower side interval certain distance and the equidistance in product spacing storehouse, four pilot pins are close to side and two bisymmetry distributions about the product spacing storehouse.

Compared with the prior art, the utility model, following beneficial effect has:

1. the utility model can solve the problem that the product can not be pressed due to improper manual operation, and avoid the occurrence of product plastic body scratching caused by the friction between the product and the table top;

2. the utility model does not need to manually press the product in the grinding operation, reduces the processing steps of the product, reduces the working intensity of the working personnel and improves the productivity of the product;

3. the utility model discloses can keep the processing scene to go on in order at the abrasive material operation in-process, can effectively reduce the emergence of compounding phenomenon.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of a jig for abrasive work of a semiconductor module product according to the present invention;

FIG. 2 is a top view of an embodiment of the present invention of a jig for abrasive work of semiconductor module products;

reference numerals in the drawings of the specification include:

tool base 1, product spacing storehouse 2, get material breach 3, pilot pin 4.

Detailed Description

In order to make the present invention better understood by those skilled in the art, the technical solutions of the present invention are further described below with reference to the accompanying drawings and examples.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better explanation of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numbers in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.

In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be connected through any combination of two or more members or structures. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in fig. 1-2, the utility model discloses a jig suitable for semiconductor module product abrasive material operation, including jig base 1, product spacing storehouse 2, get material breach 3 and pilot pin 4, product spacing storehouse 2 sets up on jig base 1, is equipped with a plurality of pilot pins 4 on product spacing storehouse 2, and a plurality of pilot pins 4 all are connected with product spacing storehouse 2 is fixed, still sets up a plurality of and gets material breach 3 on jig base 1, gets material breach 3 and is located the both sides of product spacing storehouse 2, and the degree of depth of getting material breach 3 is greater than the degree of depth of product spacing storehouse 2; the product limiting bin 2 is in a square groove shape, and four corners of the product limiting bin 2 are provided with slotted holes; the two material taking notches 3 are circular groove-shaped and are symmetrically distributed, and the two material taking notches 3 are positioned at two sides of the product limiting bin 2; the positioning needles 4 are conical and four, the four positioning needles 4 are spaced from the upper side surface and the lower side surface of the product limiting bin 2 at a certain distance and are equidistantly arranged, and the four positioning needles 4 are close to the left side surface and the right side surface of the product limiting bin 2 and are symmetrically distributed in pairs.

The specific working principle and effect are as follows: (1) putting the product into a grinding material jig; (2) polishing the whole surface of the product by using abrasive paper; (3) and taking out the jig to finish the grinding work. Tool base 1: the main material engineering plastics are used for supporting products and operation platforms; product limiting bin 2: products needing to be ground are placed into the limiting bin, the surface of the products needing to be ground is upward, the products are fixed in the limiting bin and cannot move, and the products are prevented from being scratched in the grinding operation; the positioning needle 4: when the product is placed in the limiting bin, the positioning needle 4 performs a guiding and positioning function; get material breach 3: after the product is polished in the product limiting bin 2, the product is taken out from the material taking notch 3 by hand.

The above are merely embodiments of the present invention, and the common general knowledge of the known specific structures and characteristics in the schemes is not described herein too much, so that those skilled in the art can know all the common technical knowledge in the technical field of the present invention before the application date or the priority date, can know all the prior art in the field, and have the capability of applying the conventional experimental means before the date. It should be pointed out that, for the person skilled in the art, without departing from the structure of the invention, several variants and modifications can be made, which should also be regarded as the scope of protection of the invention, which will not affect the effectiveness of the implementation of the invention and the utility of the patent.

Claims

1. The utility model provides a tool suitable for semiconductor module product abrasive material operation which characterized in that: the jig comprises a jig base, a product limiting bin, material taking notches and positioning needles, wherein the product limiting bin is arranged on the jig base, the positioning needles are arranged on the product limiting bin in a plurality of numbers and are fixedly connected with the product limiting bin, the material taking notches are further formed in the jig base and are located on two sides of the product limiting bin, and the depth of each material taking notch is larger than that of the product limiting bin.

2. The jig of claim 1, wherein the jig is adapted for abrasive work on semiconductor module products, and comprises: the product limiting bin is in a square groove shape, and the four corners of the product limiting bin are provided with slotted holes.

3. The jig of claim 1 adapted for abrasive work on semiconductor module products, wherein: get the material breach and be circular recess form and have two, two are got the material breach and are located the both sides and the symmetric distribution in product spacing storehouse.

4. The jig of claim 1, wherein the jig is adapted for abrasive work on semiconductor module products, and comprises: the pilot pin is conical and has four, four pilot pins all with the upper and lower side interval certain distance and the equidistance in product spacing storehouse, four pilot pins are close to side and two bisymmetry distributions about the product spacing storehouse.