CN217403636U - 一种集成温度传感器、片上系统soc芯片和电子设备 - Google Patents
一种集成温度传感器、片上系统soc芯片和电子设备 Download PDFInfo
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- CN217403636U CN217403636U CN202220469807.XU CN202220469807U CN217403636U CN 217403636 U CN217403636 U CN 217403636U CN 202220469807 U CN202220469807 U CN 202220469807U CN 217403636 U CN217403636 U CN 217403636U
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- 230000010355 oscillation Effects 0.000 claims abstract description 17
- 239000003990 capacitor Substances 0.000 claims description 27
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000011161 development Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 101150110971 CIN7 gene Proteins 0.000 description 2
- 101150110298 INV1 gene Proteins 0.000 description 2
- 101100397044 Xenopus laevis invs-a gene Proteins 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 101000845170 Homo sapiens Thymic stromal lymphopoietin Proteins 0.000 description 1
- 102100031294 Thymic stromal lymphopoietin Human genes 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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CN202220469807.XU CN217403636U (zh) | 2022-03-03 | 2022-03-03 | 一种集成温度传感器、片上系统soc芯片和电子设备 |
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CN202220469807.XU CN217403636U (zh) | 2022-03-03 | 2022-03-03 | 一种集成温度传感器、片上系统soc芯片和电子设备 |
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CN217403636U true CN217403636U (zh) | 2022-09-09 |
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Effective date of registration: 20240614 Address after: 106A, Floor 1, B-1, Zhongguancun Dongsheng Science Park, 66 Xixiaokou Road, Haidian District, Beijing, 100096 Patentee after: ZIGUANG TONGXIN MICROELECTRONICS CO.,LTD. Country or region after: China Address before: No. 1511-06, 15 / F, block D, Tsinghua Tongfang science and technology building, No. 1 courtyard, Wangzhuang Road, Haidian District, Beijing 100083 Patentee before: Beijing Ziguang Xinneng Technology Co.,Ltd. Country or region before: China |
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