CN217402996U

CN217402996U - Novel drying-machine of silicon chip

Info

Publication number: CN217402996U
Application number: CN202221090234.6U
Authority: CN
Inventors: 信广志
Original assignee: Tianjin Chuangyuda Photovoltaic Technology Co ltd
Current assignee: Tianjin Chuangyuda Photovoltaic Technology Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-09-09
Anticipated expiration: 2032-05-09

Abstract

The utility model discloses a novel silicon wafer dryer, which comprises a drying box; an automatic box cover mechanism is arranged at the top of the drying box; the bottom in the drying box is provided with an air return pool; electric heating pipes are uniformly distributed on two sides of the drying box above the air return pool; a material frame bracket is arranged above the air return pool in the drying box; an air inlet cover is fixedly arranged on the outer wall of the drying box; a through groove communicated with the air inlet cover is formed in one side of the electric heating pipe on the side wall of the drying box; a fan is arranged below the air inlet cover, an air inlet of the fan is communicated with the air return pool, and an air outlet of the fan is communicated with the air inlet cover. The utility model discloses a drying-machine forms circulating hot air in the enclosure space, has improved drying efficiency, has reduced the energy consumption.

Description

Novel drying-machine of silicon chip

Technical Field

The utility model relates to a silicon chip production technical field especially relates to a novel drying-machine of silicon chip.

Background

In the production process of the silicon wafer, a silicon material is bonded on a material seat, then the silicon wafer is cut into the silicon wafer by cutting equipment, then the silicon wafer and the material seat are placed into a material frame together, heating and degumming treatment are carried out, the silicon wafer is taken off from the material seat, and the silicon wafer after degumming falls into the material frame. The silicon chip can be conveniently transferred among various working procedures through the material frame. After the silicon wafer is degummed, the silicon wafer needs to be washed, and silicon mud, silicon powder and the like on the silicon wafer are washed clean. After the rinsing is completed, the silicon wafer needs to be dried. The existing drying equipment only dries through the heat radiation of the electric heating pipe, and is long in drying time, low in efficiency and high in energy consumption.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a novel silicon wafer dryer with high drying efficiency and low energy consumption, which forms circulating hot air in a closed space.

The utility model provides a novel silicon wafer dryer, which comprises a drying box; an automatic box cover mechanism is arranged at the top of the drying box; an air return pool is arranged at the bottom in the drying box; electric heating pipes are uniformly distributed on two sides of the drying box above the air return pool; a material frame bracket is arranged above the air return pool in the drying box; an air inlet cover is fixedly arranged on the outer wall of the drying box; a through groove communicated with the air inlet hood is formed in one side, located on the electric heating pipe, of the side wall of the drying box; and a fan is arranged below the air inlet cover, the air inlet of the fan is communicated with the air return pool, and the air outlet of the fan is communicated with the air inlet cover.

Furthermore, two sides in the drying box are respectively provided with a separation cover for covering the electric heating pipe and the through groove, and first air holes are uniformly distributed on the separation cover.

Furthermore, a partition plate is fixedly arranged between the air return pool and the material frame support in the drying box, a mounting groove is formed in the partition plate, a ventilation basket is mounted in the mounting groove, and second air holes are uniformly distributed in the ventilation basket.

Further, automatic case lid mechanism include two parallel set up in the slide rail of stoving roof portion both sides, two be located between the slide rail one side of stoving case is provided with opens the station, two be provided with the case lid between the slide rail, the both sides of case lid respectively through the rail wheel with slide rail sliding connection, open the fixed portal frame that is provided with in top of station, be provided with the drive between portal frame and the case lid the gliding actuating cylinder that drives of slide rail is followed to the case lid.

Furthermore, the periphery of the material frame support is fixedly provided with a guide plate.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a drying-machine is provided with stoving case, automatic case lid mechanism, electric heating pipe, inlet hood and fan. The top of the drying box can be automatically opened and closed through the automatic box cover mechanism, the material frame containing the silicon wafers can be automatically conveyed into the drying box by matching with hoisting equipment, and the material frame after the silicon wafers are dried can be automatically moved out of the drying box, so that the automatic drying treatment of the silicon wafers is realized, and the automation degree is good;

after the silicon wafers are placed into the drying box together with the material frame, the automatic box cover mechanism is closed, then the fan is started, air blown out by the fan enters the air inlet cover, is blown to the electric heating pipe through the through groove, enters the drying box after being heated by the electric heating pipe, and enters the air return pool at the bottom of the drying box after the silicon wafers in the material frame are dried. The fan extracts the hot air with the slightly reduced temperature in the return air tank, and the hot air is sent into the drying box again, and the hot air is slightly heated by the electric heating pipe to reach a higher temperature, so that the energy consumption of the electric heating pipe is greatly reduced. The air inlet cover, the drying box, the air return pool and the fan form a closed circulation loop, the drying effect is good, the drying treatment time is effectively shortened, and the drying efficiency is improved.

It should be understood that what is described in this summary section is not intended to limit key or critical features of embodiments of the invention, nor is it intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:

FIG. 1 is a schematic structural diagram of a novel silicon wafer dryer;

FIG. 2 is a schematic structural view of a drying box;

fig. 3 is a schematic structural view of components in the drying box.

Reference numbers in the figures: 1. a drying box; 2. an automatic lid closing mechanism; 3. an electric heating tube; 4. a material frame support; 5. an air intake hood; 6. a fan;

11. a gas return pool; 12. a through groove; 13. a separation cover; 14. a first air hole; 15. a partition plate; 16. a vent basket; 17. a second air hole.

21. A slide rail; 22. a box cover; 23. a rail wheel; 24. a gantry; 25. a driving cylinder;

41. a guide plate.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1 to 3, an embodiment of the present invention provides a novel silicon wafer dryer, including a drying box 1; the top of the drying box 1 is provided with an automatic box cover mechanism 2; the bottom in the drying box 1 is provided with an air return pool 11; electric heating pipes 3 are uniformly distributed on two sides of the drying box 1 above the air return pool 11; a material frame bracket 4 is arranged above the air return pool 11 in the drying box 1; an air inlet hood 5 is fixedly arranged on the outer wall of the drying box 1; a through groove 12 communicated with the air inlet hood 5 is arranged on one side of the electric heating pipe 3 on the side wall of the drying box 1; a fan 6 is arranged below the air inlet hood 5, an air inlet of the fan 6 is communicated with the air return pool 11, and an air outlet of the fan 6 is communicated with the air inlet hood 5.

In this embodiment, when the silicon wafer is dried, the automatic box cover mechanism 2 is first controlled to be opened, and then the material frames containing the silicon wafers are conveyed into the drying box 1 through the hoisting device and fall on the material frame support 4, and a plurality of material frames can be simultaneously placed on the material frame support 4 side by side. After the material frame is placed, the automatic box cover mechanism 2 is controlled to be closed. Then the electric heating tube 3 is powered and the fan 6 is started. The drying machine forms a closed circulation loop between the air inlet cover, the drying box, the air return pool and the fan, is good in drying effect, effectively shortens the time length of silicon wafer drying treatment, and improves the drying efficiency.

In a preferred embodiment, as shown in fig. 2 and 3, two sides in the drying box 1 are respectively provided with a separating cover 13 for covering the electric heating pipe 3 and the through slot 12, and the separating cover 13 is uniformly provided with first air holes 14.

In this embodiment, the partition cover 13 is arranged to enable the air blown by the fan 6 to be fully contacted with the electric heating tube 3 and then blown out through the first air hole 14, so as to improve the heating effect of the electric heating tube 3.

In a preferred embodiment, as shown in fig. 3, a partition plate 15 is fixedly disposed in the drying box 1 between the air return pool 11 and the material frame support 4, an installation groove is formed in the partition plate 15, an aeration basket 16 is installed in the installation groove, and second air holes 17 are uniformly distributed in the aeration basket 16.

In this embodiment, the silicon wafer placed on the material frame support 4 is separated from the air return tank 11 by the partition plate 15, so that the drying hot air enters the air return tank 11 after passing through the second air hole 17 on the vent basket 16, the retention time of the drying hot air in the drying box 1 is increased, and the drying effect is improved.

In a preferred embodiment, as shown in fig. 1, the automatic box cover mechanism 2 includes two parallel slide rails 21 disposed at two sides of the top of the drying box 1, an opening station is disposed between the two slide rails 21 and at one side of the drying box 1, a box cover 22 is disposed between the two slide rails 21, two sides of the box cover 22 are slidably connected to the slide rails 21 through rail wheels 23, a portal frame 24 is fixedly disposed above the opening station, and a driving cylinder 25 for driving the box cover 22 to slide along the slide rails 21 is disposed between the portal frame 24 and the box cover 22.

In the present embodiment, the driving cylinder 25 is rotatably connected to the gantry 24, and the piston rod of the driving cylinder 25 is rotatably connected to the box cover 22, so as to compensate the sliding position of the box cover 22. When the box cover 22 is driven to move to the top of the drying box 1 by the telescopic driving of the piston rod of the driving cylinder 25, the sealing of the drying box 1 is automatically completed, so that a closed drying environment is formed in the drying box 1; when the box cover 22 moves to the opening station, the drying box 1 is automatically opened, and a material frame loaded with silicon wafers is taken and placed.

In a preferred embodiment, as shown in fig. 3, a guide plate 41 is fixedly arranged on the periphery of the frame support 4 to ensure that the frame loaded with silicon wafers accurately falls on the top surface of the frame support 4.

In the description of the present specification, the terms "connect", "mount", "fix", and the like are to be understood in a broad sense, for example, "connect" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, the description of the terms "one embodiment," "some embodiments," etc. means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A novel silicon wafer dryer is characterized by comprising a drying box; an automatic box cover mechanism is arranged at the top of the drying box; an air return pool is arranged at the bottom in the drying box; electric heating pipes are uniformly distributed on two sides of the drying box above the air return pool; a material frame bracket is arranged above the air return pool in the drying box; an air inlet cover is fixedly arranged on the outer wall of the drying box; a through groove communicated with the air inlet cover is formed in one side, located on the electric heating pipe, of the side wall of the drying box; and a fan is arranged below the air inlet cover, the air inlet of the fan is communicated with the air return pool, and the air outlet of the fan is communicated with the air inlet cover.

2. The novel silicon wafer dryer as claimed in claim 1, wherein two sides of the drying box are respectively provided with a separating cover for covering the electric heating pipe and the through groove, and the separating cover is uniformly provided with first air holes.

3. The novel silicon wafer dryer as claimed in claim 2, wherein a partition plate is fixedly arranged in the drying box between the air return pool and the material frame support, a mounting groove is formed in the partition plate, a vent basket is mounted in the mounting groove, and second air holes are uniformly distributed in the vent basket.

4. The novel silicon wafer drying machine according to claim 1, wherein the automatic box cover mechanism comprises two parallel slide rails arranged on two sides of the top of the drying box, an opening station is arranged between the two slide rails on one side of the drying box, a box cover is arranged between the two slide rails, two sides of the box cover are respectively connected with the slide rails in a sliding manner through rail wheels, a portal frame is fixedly arranged above the opening station, and a driving cylinder for driving the box cover to slide along the slide rails is arranged between the portal frame and the box cover.

5. The novel silicon wafer dryer as claimed in claim 1, wherein a guide plate is fixedly arranged on the periphery of the material frame support.