CN220567667U - Section type transverse-cutting air silicon wafer drying groove - Google Patents
Section type transverse-cutting air silicon wafer drying groove Download PDFInfo
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- CN220567667U CN220567667U CN202321863528.2U CN202321863528U CN220567667U CN 220567667 U CN220567667 U CN 220567667U CN 202321863528 U CN202321863528 U CN 202321863528U CN 220567667 U CN220567667 U CN 220567667U
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- silicon wafer
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 238000001035 drying Methods 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 54
- 239000010703 silicon Substances 0.000 title claims abstract description 54
- 238000005520 cutting process Methods 0.000 title description 3
- 238000005192 partition Methods 0.000 claims abstract description 8
- 239000003921 oil Substances 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 7
- 238000009825 accumulation Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 39
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000012634 fragment Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 241000886569 Cyprogenia stegaria Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Drying Of Solid Materials (AREA)
Abstract
The utility model relates to a cross-section type cross-cut air silicon wafer drying groove which comprises a drying oven, wherein a box cover is arranged above the drying oven, and the drying oven is divided into a circulating drying working area and an air circulating driving area by a partition plate. Two sides of the circulating drying working area are communicated with the air circulating area through circulating convection holes, and a basket positioning mechanism is arranged in the working area; the wind circulation driving area is respectively provided with a left cavity, a right cavity and a bottom wind circulation area. The left circulation area and the right cavity are symmetrically distributed on the left side and the right side of the silicon wafer in the direction, one side is provided with air outlet, and the other side is provided with air suction; the centrifugal fan is used for enabling the cavities on two sides to generate pressure difference, hot air in the air circulation area is caused to generate convection through the holes arranged in the side plates in an array mode, cross-section transverse air uniformly passes through gaps between the silicon wafers, even if the silicon wafers are uniformly heated, moisture and humidity on the surfaces of the silicon wafers are absorbed, drying is uniform, the influence of wind power on the silicon wafers is avoided, and the silicon wafers are effectively protected.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer production equipment, and relates to a cross-section type transverse air-cutting silicon wafer drying groove.
Background
The oven used after cleaning the silicon wafer in the market at present adopts a direct electric heating and blowing mode. In order to enable the silicon wafer to be dried quickly in a short time, only high heating power and high wind power mode can be adopted to directly blow the silicon wafer through a blower, and the wind field of a working area is turbulent, so that uneven heating and fragments of the silicon wafer can be caused; the oven is required to continuously work in the production line, so that the oven cannot be cleaned in time, and broken silicon wafers are blown in the oven to become powder, so that the powder in the oven is continuously increased in a circulating way to pollute the cleaned silicon wafers, and the yield of the silicon wafers is reduced. And in addition, the large power wastes energy. According to the state, a cross-section type cross-cut air silicon wafer oven is developed for drying the cleaned silicon wafer.
Disclosure of Invention
The utility model aims to provide a cross-section type cross-cut wind silicon wafer drying groove which can solve the problems, shorten the drying time and reduce the heating power.
According to the technical scheme provided by the utility model: a cross-section type cross-cut air silicon wafer drying groove comprises an oven, wherein a box cover is arranged above the oven, the oven is divided into a circulating drying working area and an air circulating driving area by a partition plate, two sides of the circulating drying working area are communicated with the air circulating driving area through circulating convection holes, a basket positioning mechanism is arranged in the circulating drying working area, and a heater and a directional blowing mechanism are arranged in the air circulating driving area; the wind circulation driving area is divided into a bottom circulation area, two sides of the bottom circulation area are connected with a left circulation area and a right circulation area, the inner side of the left circulation area is a left side plate, the inner side of the right circulation area is a right side plate, and circulation convection holes are uniformly distributed on the left side plate and the right side plate; the directional blowing mechanism comprises a fan and a wind guiding device, a fan shell is arranged at the bottom of the oven, the output end of the fan stretches into a bottom circulation area and is provided with an impeller, the periphery of the impeller is sleeved with the wind guiding device, the air outlet of the wind guiding device faces to a left circulation area, and the air inlet of the wind guiding device faces to a right circulation area.
As a further improvement of the utility model, the cover is driven by the cylinder.
As a further improvement of the utility model, the top of the oven is provided with the box cover sliding frame, the box cover slides in the box cover sliding frame, the cylinder body of the oil cylinder is connected with the box cover sliding frame, and the piston end of the oil cylinder is fixedly connected with the box cover.
As a further improvement of the utility model, the flower basket positioning mechanism comprises a flower basket positioning column and a flower basket positioning frame, wherein the flower basket positioning column is positioned at the lower part of the circulating drying working area, the flower basket positioning frame is placed on the flower basket positioning column, the bottom of the flower basket positioning frame is contacted with the flower basket positioning column, and two sides of the flower basket positioning frame are contacted with the partition plate.
As a further improvement of the utility model, the lower part of the flower basket positioning frame is provided with a chip accumulation tray; the debris accumulation tray is positioned below the circulation convection hole.
As a further improvement of the utility model, the fan is an axial flow fan; the left side plate and the right side plate are provided with circulating convection holes in an array arrangement.
As a further improvement of the utility model, the air guiding device is a volute.
As a further improvement of the present utility model, heaters are installed in the left circulation area and the right circulation area, respectively, and the heaters are fin type heaters.
As a further improvement of the utility model, a temperature sensor is arranged on the oven, and a test end of the temperature sensor extends into the circulating drying working area.
As a further improvement of the utility model, a fresh air inlet and an air outlet are arranged on the oven, the inner ends of the fresh air inlet and the air outlet respectively extend into the left circulation area and the right circulation area, and the outer end of the air outlet is connected with an exhaust fan.
The positive progress effect of this application lies in:
1. the left circulation area and the right cavity are symmetrically distributed on the left side and the right side of the silicon wafer in the direction, one side is provided with air outlet, and the other side is provided with air suction; the centrifugal fan is used for enabling the cavities at two sides to generate pressure difference, hot air in the air circulation area is caused to generate convection through the holes arranged in the side plates in an array mode, cross-section transverse air uniformly passes through gaps between the silicon wafers, even if the silicon wafers are uniformly heated, moisture and humidity on the surfaces of the silicon wafers are absorbed, the drying is uniform, the influence of wind force on the silicon wafers is avoided, the silicon wafers, particularly ultrathin silicon wafers, can be effectively protected, and the generation of fragments of the silicon wafers in the drying process can be greatly reduced.
2. The crushed silicon chips brought into the oven only fall on the chip tray, and the circulating convection holes at the two sides are positioned above the chip tray, so that the chips are not repeatedly brought into the air circulating driving area to blow to the circulating drying working area to pollute the silicon chips, and the yield of the silicon chips is improved.
3. According to the utility model, the time of cleaning and cleaning liquid replacement is utilized, and the exhaust fan (14) is used for cleaning the oven in a fresh air replacement mode with an exhaust capacity of 50-100 vertical/hour.
4. The utility model adopts the cross-section type transverse wind, the convection direction of the hot wind is parallel to the silicon wafers, each silicon wafer can be heated uniformly, the drying time is shortened, and the heating power is reduced.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a cross-sectional view of the present utility model.
Fig. 3 is a top view of the present utility model.
In fig. 1-3, the circulating drying device comprises a left circulating area 2, a right circulating area 3, a circulating drying working area 4, a fan 6, an air guiding device 7, a left side plate 8, a right side plate 9, an air outlet 12, a fresh air inlet 13, a basket positioning column 17, a basket positioning frame 18, a debris accumulation tray 18-1, a temperature sensor 19 and the like.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the utility model herein. Furthermore, the terms "include" and "have," and the like, mean that other content not already listed may be "included" and "provided" in addition to those already listed in "include" and "provided; for example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements not expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Due to the drawing angle problem, some parts may not be drawn, but the positions and connection relations of the parts may be understood according to the text expression part.
As shown in fig. 1-2, the utility model relates to a cross-section type cross-cut wind silicon wafer drying groove, which comprises a drying oven, wherein a box cover 11 is arranged above the drying oven, the drying oven is divided into a circulating drying working area 4 and a wind circulating driving area by a partition plate, two sides of the circulating drying working area 4 are communicated with the wind circulating driving area through circulating convection holes, a basket positioning mechanism is arranged in the working area, and a heater 10 and a directional blowing mechanism are arranged in the wind circulating driving area.
The oven cover 11 is driven by the oil cylinder 15 to realize the closing and opening of the oven.
The top of the oven is provided with a box cover sliding frame 16, the box cover 11 slides in the box cover sliding frame 16, a cylinder body of the oil cylinder 15 is connected with the box cover sliding frame 16, and a piston end of the oil cylinder 15 is fixedly connected with the box cover 11 through a folded plate.
The wind circulation driving area is divided into a bottom circulation area 1, two sides of the bottom circulation area 1 are connected with a left circulation area 2 and a right circulation area 3, the inner side of the left circulation area 2 is a left side plate 8, the inner side of the right circulation area 3 is a right side plate 9, and circulation convection holes are uniformly distributed on the left side plate 8 and the right side plate 9.
The flower basket positioning mechanism comprises a flower basket positioning column 17 and a flower basket positioning frame 18, wherein the flower basket positioning column 17 is positioned at the lower part of the circulating drying working area 4 and is fixedly connected with the partition plate. The flower basket positioning frame 18 is placed on the flower basket positioning rail 17, the bottom of the flower basket positioning frame 18 is contacted with the flower basket positioning rail 17, and two sides of the flower basket positioning frame 18 are contacted with the partition plates.
The lower part of the basket positioning frame 18 is provided with a chip tray 18-1, and the fallen silicon chip can be cleaned quickly by opening the oven cover. The chip accumulation tray 18-1 is positioned below the circulation convection hole, and can not bring the chips repeatedly into the air circulation driving area to blow to the circulation drying working area to pollute the silicon chip, thereby improving the yield of the silicon chip
The directional blowing mechanism comprises a fan 6 and an air guide device 7, a shell of the fan 6 is arranged at the bottom of the oven, the output end of the fan 6 stretches into the bottom circulation area 1 and is provided with an impeller, the periphery of the impeller is sleeved with the air guide device 7, an air outlet of the air guide device 7 faces to the left circulation area 2, and an air inlet of the air guide device 7 faces to the right circulation area 3.
The fan 6 is an axial flow fan, and the air guiding device 7 is a volute.
Heaters 10 are respectively arranged in the left circulation area 2 and the right circulation area 3, so that the requirements of the oven that the door cover 11 is frequently opened and the temperature can be quickly raised can be met, and the direct heating mode has high heat efficiency and low energy consumption; the heater 10 is a fin heater.
In order to monitor the temperature of the circulating drying working area 4 in real time, a temperature sensor 19 is arranged on the oven, and the test end of the temperature sensor 19 extends into the circulating drying working area 4.
As shown in fig. 3, a fresh air inlet 13 and an air outlet 12 are arranged on the oven, the inner ends of the fresh air inlet 13 and the air outlet 12 respectively extend into the left circulation area 2 and the right circulation area 3, and the outer end of the air outlet 12 is connected with an exhaust fan.
The working process of the utility model is as follows:
the control oil cylinder 15 drives the box cover 11 to enable the oven to be opened, the silicon chip is installed in the flower basket, the flower basket is placed on the flower basket positioning frame 18, the fan 6 pushes air to the left circulation area 2 through the air guide device to form certain pressure, air enters the circulation drying working area 4 of the oven through the circulation convection hole on the left side plate 8 and returns to the bottom circulation area 1 through the circulation convection hole on the right side plate 9, and the air circulates in this way (the temperature uniformity of the working area can reach plus or minus 2 degrees when the structure is empty).
The circulating air uniformly flows out through the circulating convection holes, so that the cross section of the circulating drying working area is transverse to the wind field, hot air passes through each silicon wafer, the silicon wafers can be uniformly heated, and the silicon wafers can be dried quickly, meanwhile, the uniform air effectively protects the silicon wafers, particularly ultrathin silicon wafers, prevents the ultrathin silicon wafers from shaking, and can greatly reduce the generation of fragments of the silicon wafers in the drying process.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present utility model, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the utility model, and are also considered to be within the scope of the utility model.
Claims (10)
1. The section type cross-cut air-flow silicon wafer drying groove comprises a drying oven, and is characterized in that a box cover (11) is arranged above the drying oven, the drying oven is divided into a circulating drying working area (4) and an air circulating driving area by a partition plate, two sides of the circulating drying working area (4) are communicated with the air circulating driving area through circulating convection holes, a basket positioning mechanism is arranged in the circulating drying working area (4), and a heater (10) and a directional blowing mechanism are arranged in the air circulating driving area; the wind circulation driving area is divided into a bottom circulation area (1), two sides of the bottom circulation area (1) are connected with a left circulation area (2) and a right circulation area (3), the inner side of the left circulation area (2) is a left side plate (8), the inner side of the right circulation area (3) is a right side plate (9), and circulation convection holes are uniformly distributed on the left side plate (8) and the right side plate (9); the directional blowing mechanism comprises a fan (6) and an air guide device (7), wherein a fan (6) shell is arranged at the bottom of the oven, the output end of the fan (6) stretches into the bottom circulation area (1) and is provided with an impeller, the periphery of the impeller is sleeved with the air guide device (7), the air outlet of the air guide device (7) faces the left circulation area (2), and the air inlet of the air guide device (7) faces the right circulation area (3).
2. A cross-section type cross-cut wind silicon wafer drying tank as claimed in claim 1, wherein the tank cover (11) is driven by an oil cylinder (15).
3. The cross-section type cross-cut air silicon wafer drying groove according to claim 2, wherein a box cover sliding frame (16) is arranged at the top of the oven, the box cover (11) slides in the box cover sliding frame (16), a cylinder body of the oil cylinder (15) is connected with the box cover sliding frame (16), and a piston end of the oil cylinder (15) is fixedly connected with the box cover (11).
4. The cross-section type crosscut air silicon wafer drying groove according to claim 1, wherein the flower basket positioning mechanism comprises a flower basket positioning column (17) and a flower basket positioning frame (18), the flower basket positioning column (17) is positioned at the lower part of the circulating drying working area (4), the flower basket positioning frame (18) is placed on the flower basket positioning column (17), the bottom of the flower basket positioning frame (18) is contacted with the flower basket positioning column (17), and two sides of the flower basket positioning frame (18) are contacted with the partition plate.
5. The cross-section cross-cut wind silicon wafer drying groove according to claim 4, wherein a chip accumulation tray (18-1) is arranged at the lower part of the basket positioning frame (18); a debris accumulation tray (18-1) is positioned below the circulation convection aperture.
6. A cross-section crosswind silicon wafer drying tank as claimed in claim 1, characterized in that the fan (6) is an axial flow fan; the left side plate (8) and the right side plate (9) are provided with circulating convection holes in an array arrangement.
7. A cross-section type cross-cut air silicon wafer drying groove as claimed in claim 1, wherein the air guiding device (7) is a volute.
8. The cross-section type cross-cut air silicon wafer drying groove according to claim 1, wherein heaters (10) are respectively arranged in the left circulation area (2) and the right circulation area (3), and the heaters (10) are fin type heaters.
9. A cross-section crosswind silicon wafer drying tank as claimed in claim 1, characterized in that a temperature sensor (19) is mounted on the oven, the test end of the temperature sensor (19) extending into the circulation drying working area (4).
10. The cross-section type cross-cut air silicon wafer drying groove according to claim 1, wherein a fresh air inlet (13) and an air outlet (12) are arranged on the oven, the inner ends of the fresh air inlet (13) and the air outlet (12) respectively extend into a left circulation area (2) and a right circulation area (3), and the outer end of the air outlet (12) is connected with an exhaust fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321863528.2U CN220567667U (en) | 2023-07-14 | 2023-07-14 | Section type transverse-cutting air silicon wafer drying groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321863528.2U CN220567667U (en) | 2023-07-14 | 2023-07-14 | Section type transverse-cutting air silicon wafer drying groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220567667U true CN220567667U (en) | 2024-03-08 |
Family
ID=90087804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321863528.2U Active CN220567667U (en) | 2023-07-14 | 2023-07-14 | Section type transverse-cutting air silicon wafer drying groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220567667U (en) |
-
2023
- 2023-07-14 CN CN202321863528.2U patent/CN220567667U/en active Active
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