CN217397076U - Transportable container, transport system and arrangement, and transportable container management system - Google Patents

Abstract

The utility model provides a transportable container, transportation system, transportation arrangement and transportable container management system. The transportable container for carrying a component carrier transport device, the transportable container comprising: i) a plurality of sidewalls defining a chamber therebetween such that the chamber is isolated from an environment external to the transportable container; ii) wherein at least one of the plurality of side walls comprises a) an outer wall arranged at an external environment and b) an inner wall arranged at the chamber, wherein the outer wall and the inner wall are arranged such that a hollow channel is formed between the inner wall and the outer wall; and iii) an air control unit coupled to the hollow passage and configured to control and/or regulate air flow through the hollow passage.

Description

Transportable container, transport system and arrangement, and transportable container management system

Technical Field

The utility model relates to a transportable container for carrying part carrier conveyer. The invention also relates to a transport system comprising a transportable container and a component carrier transport device configured to transport a component carrier and/or a component carrier preform. The invention also relates to a transport arrangement (arrangement) comprising a transport system loaded with a plurality of component carriers (preforms). The present invention also relates to a transportable container management (organization) system comprising a transportable container and a control device having a wireless communication unit.

Background

Against the background of increasing product functionality of component carriers equipped with one or more electronic components and increasing miniaturization of such electronic components and increasing number of electronic components to be mounted on component carriers, such as printed circuit boards, increasingly larger array-like components or packages having a plurality of electronic components are being employed, which have a plurality of contact portions or connection portions, wherein the spacing between these contact portions is increasingly smaller. The removal of heat generated by these electronic components and the component carriers themselves during operation is an increasing problem. At the same time, the component carrier should be mechanically robust and electrically and magnetically reliable in order to be operable even under severe conditions.

In particular, during the manufacturing, the component carriers and component carrier preforms, such as panels, have to be stored and transported in an efficient and safe manner in the manufacturing scenario (Facility) of the component carriers. For example, there may be long transport distances between different processes of a manufacturing scenario. The component carrier (preform) is a technically delicate device and may be sensitive to light and foreign matter from the external environment.

For this purpose, a trolley device is usually applied to transport the component carrier (preform) through the manufacturing scenario. However, such a trolley device still does not protect the panel from the external environment in an effective and stable manner, in particular from airborne particles (foreign bodies).

SUMMERY OF THE UTILITY MODEL

It may be desirable to transport the component carrier and/or the component carrier preform within the manufacturing scenario in an efficient and safe manner.

In order to achieve the object defined above, a transportable container, a transport system, a transport arrangement and a transportable container management system according to exemplary embodiments are provided. Further exemplary embodiments describe advantageous embodiments.

According to an aspect of the invention, a transportable container for carrying at least one component carrier transport device (such as a cart), which component carrier transport device may be configured to transport a component carrier (e.g. a printed circuit board) and/or a component carrier preform (e.g. a panel comprising a plurality of semi-finished component carriers), is described, wherein the transportable container comprises:

i) a plurality of side walls defining a chamber (compartment, space) therebetween such that the chamber is isolated from an environment external to the transportable container,

at least one of the plurality of sidewalls includes:

ia) an outer wall arranged at an external environment, and

ib) an inner wall arranged at the chamber,

ic) wherein the outer wall and the inner wall are arranged such that a hollow channel is formed between the inner wall and the outer wall (in other words, at least one side wall is hollow); and

ii) an air control unit (coupled to the hollow channel) configured to control and/or regulate the air flow through the hollow channel.

According to another aspect of the present invention, a transportation system is described, the transportation system comprising:

i) a transportable container as described above, and

ii) a component carrier transport device as described above, which is configured to transport a component carrier (e.g. a printed circuit board) and/or a component carrier pre-form (e.g. a panel comprising a plurality of semi-finished component carriers),

wherein the component carrier transport device is arranged in the chamber.

According to another aspect of the present invention, a transportation arrangement is described, the transportation arrangement comprising:

i) a transport system as described above, and

ii) a plurality of component carriers (preforms) arranged in a component carrier transport device.

According to another aspect of the present invention, a transportable container management system for a component carrier manufacturing scenario is described, the transportable container management system comprising:

i) a transportable container (and/or transport system and/or transport arrangement) as described above (but with a wireless communication unit),

ii) at least one further transportable container (comparable to the transportable container and/or the transport system and/or the transport arrangement), and

iii) a control device with a (further) wireless communication unit, which control device is configured to wirelessly communicate with the transportable container and the further transportable container (in particular to wirelessly transmit information relating to the transportable container).

In the context of this document, the term "transportable container" may denote any device configured to store and transport a transportable container device system configured for carrying component carriers and/or component carrier preforms (in a chamber). The transportable container may be configured such that the component carrier and/or the component carrier preform is/are isolated from the external environment, so that the influence of the external environment on the component carrier (preform) may be effectively suppressed. In particular, the component carrier within the chamber of the transportable container may be hermetically sealed with respect to the external environment.

In the context of this document, the term "external environment" may refer to the environment (surrounding space) outside of the transportable container. In particular, at least one of electromagnetic radiation, in particular visible light, chemical particles, in particular foreign bodies, etc. may be present in the external environment. In an example, the external environment may comprise a component carrier manufacturing scenario (a space around the transportable device). The component carrier manufacturing scenario may include a plurality of such transportable containers each storing the same component carrier or a different component carrier at a different production stage.

In the context of this document, the term "air control unit" may denote any device configured to control and/or regulate the air flow through the hollow passage (relative to the chamber). Such control/adjustment may be based on a measured parameter, e.g. a parameter measured by a sensor unit associated with the transportable device. In one embodiment, the air control unit may be configured as a fan filter unit. In another embodiment, the air filter unit may be arranged at an interface between the external environment and the hollow channel. In another embodiment, the air filter unit may be arranged within the hollow channel and/or at the interface between the hollow channel and the chamber.

In the context of the present document, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical carrier and/or as an electronic carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different types of component carriers of the above-described types of component carriers.

In an embodiment, the component carrier comprises a (layer) stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure and electrically conductive layer structure, in particular a laminate formed by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier which is able to provide a large mounting surface for other components and which is still very thin and compact. The term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

In the context of this document, the term "component carrier preform" may particularly denote a panel comprising a plurality of semi-finished component carrier products (as described above). For example, the panel can subsequently be separated (singulated) into a plurality of (finished) component carriers. In another example, the component carrier preform may be a single semi-finished component carrier.

According to an exemplary embodiment, the invention may be based on the following concept: when the component carrier and/or the component carrier preform is stored in a specific transportable container as described above, the component carrier and/or the component carrier preform can be transported within the manufacturing scenario in an efficient and safe manner. The transportable container comprises a hollow channel in the (at least one) side wall surrounding a cavity in which the component carriers and/or component carrier preforms are stored (preferably within a component carrier transport device, such as a cart). The hollow channel is coupled to an air control unit so that the air flow relative to the chamber (from the external environment) can be controlled/regulated. The hollow channel between the outer wall and the inner wall may provide the following advantages: improved temperature preservation within a transportable container may be established while the weight of the container may be reduced.

Often, foreign objects from the manufacturing scene (external environment) may damage the component carriers stored in the cart. Thereby, the quality of the final component carrier product may be significantly reduced.

The inventors have surprisingly found that these disadvantages can be overcome when establishing an effective and robust air flow control within a transportable container configured to simply lift the cart (loaded with the component carrier). In this way, existing manufacturing practices need not be changed. The cart can still be applied, however, the described transportable container can be used as an additional protection for the component carrier (preform), in particular with respect to foreign objects. Thus, the new container can be easily implemented into existing production lines and made more efficient and reliable.

In the context of this document, the term "chamber" may particularly denote any type of compartment or space located between a plurality of side walls. The chamber may be part of the transportable container and may be isolated from the environment outside the transportable container.

Exemplary embodiments

According to an exemplary embodiment, the air control unit is arranged at one side wall, in particular at a top side wall covering the chamber. This arrangement of the air control unit may provide the following advantages: the air flow through the hollow passage is effectively regulated and/or controlled relative to the chamber and ensures a well ventilated environment within the transportable container. This effect can be achieved by removing from the circulating air chemical substances and/or other particles (e.g. dust) that are harmful to the component carrier (preform).

According to a further exemplary embodiment, the air control unit can be configured as an air filter unit, in particular as a fan filter unit or as an exhaust air filter. Such a unit may comprise at least one of a pre-filter, a HEPA-filter (high efficiency particulate air) and an ULPA-filter (ultra low particulate air). The unit may be motorized and ensure a continuous supply of (clean/fresh) air in the transportable device. Thus, by means of the fan filter unit, the local air (in the chamber) can be effectively cleaned of external environmental particles that may be harmful to the component carrier (preform).

According to another exemplary embodiment, the transportable container further comprises a sensor unit coupled (connected) with the air control unit, wherein the sensor unit is configured to measure a parameter of the air flow.

In the context of this document, the term "sensor unit" may denote any device suitable for measuring (sensing, acquiring and processing) an environmental parameter of an air flow, such as humidity, pressure, temperature, flow rate, etc. The measured parameters may provide information indicative of a cleanliness class (cleanliness class may indicate air quality/air cleanliness and/or concentration of foreign matter) in the transportable container, in particular information of dust or other harmful particles harmful to the component carrier (preform). The sensor unit may be arranged in the air control unit or may be arranged separately from the air control unit, in particular within the hollow channel. Further, the sensor unit may be configured to communicate with a data center.

According to another exemplary embodiment, the measured parameter comprises at least one of humidity, pressure, temperature. These characteristics may be particularly suitable when analyzing the condition or state of a transportable container. Based on these measured characteristics and the resulting conditions, further control/regulation operations may be adjusted.

According to a further exemplary embodiment, the measured parameter provides information indicative of the cleanliness level (foreign bodies) in the transportable container, in particular information of dust particles. Based on this information (e.g. amount of foreign matter in the air, type of particles, size of particles), a suitable air control filter can be installed. The measured information can be transmitted permanently or at specific intervals from the sensor unit to the air control unit and/or to a further control device, in particular when the transportable container is loaded with component carriers (preforms).

According to another exemplary embodiment, the measured parameter provides information indicative of the movement of the transportable container. By using the information about the movement, the position of the transportable container can be controlled. Thus, the manufacturing process can be managed such that the transportable container is located in an easily accessible place.

According to another exemplary embodiment, the measured parameter provides information indicative of lighting conditions with respect to the transportable container. In particular, in this example, a sensor (e.g., a light sensor) is provided that indicates a lighting condition within the transportable container.

In an embodiment, it may be crucial to protect the component carrier (preform) from electromagnetic radiation, in particular visible light. Thus, the lighting conditions may be controlled and adjusted as frequently as desired.

According to another exemplary embodiment, the air control unit is configured to control and/or regulate the air flow based on the measured parameter. The control and/or regulation of the air flow can be performed both during operation time and during downtime of the transportable container loaded with component carriers (preforms).

According to another exemplary embodiment, one of the plurality of side walls of the transportable container may comprise a door. The door may facilitate loading and unloading of the component carrier transport in a safe manner, either manually or automatically. The side wall comprising the door may be the opposite side wall, in particular the front side wall, to the side wall comprising the handling unit.

According to another exemplary embodiment, the container is configured to prevent electromagnetic radiation, in particular visible light, from the external environment from entering the chamber. This measure can protect the component carrier (preform) sensitive to electromagnetic radiation and uv light from damage.

According to another exemplary embodiment, the transportable container is configured such that the chamber is hermetically sealed. This may provide the following advantages: the component carrier (preform) can be effectively protected from the external environment, in particular from foreign particles.

According to another exemplary embodiment, the side wall of the transportable container comprises metal (in particular steel). In this way, the sensitive contents of the transportable container, i.e. the component carriers (preforms) loaded in the component carrier transport device, can be protected from the external environment in a particularly robust and reliable manner. Also, the sidewalls may comprise (metallic) different materials. Even the inner and outer walls of the side wall may comprise different materials.

According to another exemplary embodiment, the at least one side wall comprises an opening towards the chamber to enable an air flow to enter and/or exit the chamber. In this way, the air of the hollow channel is in communication with the air of the chamber. This ensures that: the air flow in the hollow passage is controlled and/or regulated with respect to the chamber. Thereby, the environment within the transportable container can be effectively controlled and/or regulated.

According to another exemplary embodiment, the transportable container comprises a wireless communication device configured to transmit information related to the transportable container to the external transportable container.

According to a further exemplary embodiment, the "transportable container-related information" comprises information about the positioning of the transportable container, in particular in a component carrier manufacturing scenario. This may provide the following advantages: the location of a particular transportable container (and its contents) can be easily found, particularly by retrieving this information from a wireless communication network.

According to a further exemplary embodiment, the information relating to the transportable container comprises information about the component carrier and/or the component carrier preform stored in the storage volume. This may provide the following advantages: the location of the specific component carrier (preform) at the specific processing step (or scene level) can be easily found, in particular by retrieving this information from the wireless communication network. Furthermore, it is possible to identify which transportable container comprises which component carrier (preform) without opening the transportable container (opening the transportable container would create an unnecessary risk of light or chemical substances and/or other particles harmful to the component carrier and its preform entering into the transportable container). Thus, the following known drawbacks can be overcome: certain component carriers are lost in complex component carrier manufacturing scenarios and the transportable container must be opened to verify the contents of the transportable container.

In the context of this document, the term "wireless communication device" may denote any device adapted to communicate wirelessly (with another wireless communication device). For example, data (information) between the wireless communication apparatus and another wireless communication apparatus may be transferred via 4G, 5G, Wifi (802.11p), Radio Frequency (RF), RFID, NFC, or DSRC (dedicated short range communication). The wireless communication device may be configured as a receiver, transmitter, or transceiver. The wireless communication device may also be configured to communicate with wireless communication devices (external devices) of other transportable containers. Further, the wireless communication device may be configured to communicate with a control device (external device) of the transportable container management system. Additionally or alternatively, the wireless communication device may be integrated in a wireless communication network and/or an IoT (internet of things) system.

In the context of this document, the term "wireless communication network" may denote a computer network using wireless data connections between network nodes, e.g. wireless communication devices. In an example, the network may be configured as a Wireless Local Area Network (WLAN) that links two or more transportable containers over a short distance using a wireless distribution method (e.g., by providing connectivity via an access point for internet access). In one example, the IEEE 802.11WLAN standard (Wi-Fi) may be used. In the network, information indicative of transportable containers may be stored and retrieved again. For example, the static test (device) may be connected to a network and the (personal identity related) test results of different operators may be stored in the network or in a network related memory. In addition, transportable containers can upload their current locations and/or their current loads to a network or network-related storage. Such data may be stored, for example, in a memory (of the control device). By combining information in the network, it may be possible to efficiently manage transportable containers.

The wireless communication device and/or the further wireless communication device comprise 4G and/or 5G functionality. In the context of this document, the term "4G and/or 5G functionality" may refer to known wireless system standards. 4G (or LTE) is an established standard, while 5G is an upcoming standardized technology and will be fully established in the near future. The wireless communication device may also be adapted for future developments, such as 6G.

The wireless communication device may also comply with WiFi standards such as 2.4GHz, 5GHz, and 60 GHz. The electronic device may for example comprise a so-called wireless combo (integrated WiFi, bluetooth, GPS), Radio Frequency Front End (RFFE) or Low Power Wide Area (LPWA) network module.

The wireless communication device and/or the further wireless communication device may comprise an antenna. In the context of this document, the term "antenna" may particularly denote an element connected to a receiver or a transmitter, for example by a transmission line. Thus, an antenna may be represented as an electrical component that converts electrical power to radio waves and/or converts radio waves to electrical power. The antenna may be used with a controller (e.g., a control chip) such as a radio transmitter and/or a radio receiver. In transmission, a radio transmitter may supply an electric current oscillating at radio frequency (i.e., a high-frequency alternating current) to an antenna, and the antenna may radiate energy from the electric current as an electromagnetic wave (particularly, a radio wave). In a receive mode, the antenna may intercept some of the power of the electromagnetic wave to provide a small voltage that may be applied to a receiver, for example, to be amplified. In an embodiment, the antenna may be configured as a receiver antenna, a transmitter antenna, or a transceiver (i.e., transmitter and receiver) antenna. In one example, the antenna may be configured as a single antenna. In another example, the antenna may be configured as an (adhesive, embedded) antenna array.

The wireless communication device and/or the further wireless communication device may comprise a radar. In the context of this document, the term "radar" may refer to object detection that uses electromagnetic waves to determine the range, angle, or velocity of one or more objects. The radar arrangement may comprise a transmitter that transmits electromagnetic waves (e.g. in the radio range or microwave range). The electromagnetic waves from the transmitter are reflected by the object and returned to the receiver. Thus, one antenna structure can be used for both transmission and reception. Further, a processor, such as an electronic component, may be used to determine properties of the object, such as position and velocity, based on the received electromagnetic waves. According to a further embodiment, the described component carrier can be used in the case of radar applications, in particular radar applications relating to industry. Radar applications may preferably be performed in a frequency range from 28GHz to 120 GHz. Radar applications may be performed in particular in the millimeter wave range for industrial applications (e.g. level indicators). In these examples, the antenna structure and electronic components (e.g., HF components for radar applications) may be advantageously arranged in spatial proximity without undesirable parasitic effects.

According to a further exemplary embodiment, the transportable container has a holder device which is arranged at the door to fix the component carrier transport device within the cavity. The holder device may comprise a material different from the door, e.g. a softer material, to protect the component carrier transport device. Furthermore, the transportable container may comprise a plurality of holder devices arranged at least one side wall other than the door.

According to another exemplary embodiment, the side wall of the container comprises a guiding structure for smoothly guiding and facilitating a linear movement of the component carrier transport device within the cavity. The transportable container may comprise a plurality of guiding structures arranged on the wall to ensure safe loading of the component carrier transport device within the chamber. In an example, the guiding structure may be embodied as rollers (wheels) to guide the component carrier transport device in an easy, protective and reliable manner.

According to another exemplary embodiment, the transportable container further comprises a (self-) localization device configured to self-localize the transport means and to store the localization result as transport means related information. In this way, the transportation device can self-locate and communicate the information to the network so that management/coordination can be done efficiently.

The (self-) locating means may comprise, for example, one of the following: distance sensors, speed sensors, positioning sensors, cameras, radar, ultrasound functions, GPS (global positioning system), differential GNSS, SLAM (synchronous positioning and mapping) functions, GPR (ground penetrating radar). In principle, the positioning device may be any kind of sensor device that enables self-positioning of the transportable container within the component carrier manufacturing scenario (in particular with respect to different levels of the scenario).

According to another exemplary embodiment, the transportable container further comprises: an output element which is coupled to the storage volume and which is configured to automatically output at least one component carrier and/or component carrier preform from the storage volume. This may provide the following advantages: since the operator does not have to manually remove the component carrier (preform) from the storage volume, the component carrier (preform) is more safely protected.

According to a further exemplary embodiment, the storage volume of the component carrier transport device comprises a plurality of grooves for storing a plurality of component carriers and/or component carrier preforms. Thereby, the content of the component carrier transport device can be well managed and the desired object can be taken out in an easy and safe manner.

According to another exemplary embodiment, the transportable container further comprises a display configured to provide information related to the transportable container to an operator. The transport-device-related information for example indicates the component carriers (preforms) to be stored in the storage volume. This may provide the following advantages: the operator can easily find the location of a specific component carrier (preform) at a specific processing step without opening the transportable container (opening the transportable container creates the risk that harmful particles come into contact with the component carrier or/and the component carrier preform). Thus, the following known drawbacks can be overcome: certain component carriers are lost in complex component carrier manufacturing scenarios and transportable containers must be opened to verify their contents.

According to an exemplary embodiment, a control system is arranged in the transportable container for controlling the operation of the transportable container. The control system may be arranged on/in the transportable container.

According to another exemplary embodiment, the transportable container further comprises a door locking element arranged at, for example, a door. The door locking element provides the advantage of additional security, i.e. the door locking element ensures that the component carrier transport device is safely positioned in the transportable container during transport.

According to a further exemplary embodiment, the transportable container comprises at least one handling unit, in particular a handling wheel, for moving the transportable container within the component carrier manufacturing scenario either manually or automatically. Furthermore, the transportable container can comprise a pneumatic pump unit for height adjustment of the transportable container and/or a joystick for manipulation of the transportable container (in particular a joystick with a gripping handle).

According to another exemplary embodiment, the control device comprises a memory for storing information related to at least one of the following transportable containers: the location of a plurality of transportable containers, the identity of authorized and/or unauthorized operators, the direction of transport of the component carrier (preform) in the component carrier manufacturing scenario.

According to another exemplary embodiment, the control device is configured to coordinate a plurality of transportable containers. In particular, the coordinating includes at least one of: coordination of positioning, coordination of authorized and unauthorized operators, coordination of the direction of transport of the component carrier and/or the component carrier preform in the component carrier manufacturing scenario.

This may provide the following advantages: multiple (large) transportable containers can be managed and coordinated, even in large component carrier manufacturing scenarios. The control device may be any processor or processors configured to receive, store, and control information received from the transportable container and/or the wireless network. The control means may be operated by a human operator or may be operated automatically. The control device may also include AI functions (e.g., neural networks) that may be trained based on human decisions. The control device may be coupled to the wireless communication network and/or the IoT application.

According to another exemplary embodiment, the transport system is coupled to an internet of things app, i.e. an IoT app, in particular wherein the IoT app comprises an artificial intelligence algorithm, i.e. an AI algorithm (see above description).

According to another exemplary embodiment, the handling unit comprises a locking function. For example, the wheels may be automatically locked. This may provide the following advantages: increased safety, for example during loading or unloading of the transport container.

According to another exemplary embodiment, the transportable container includes an energy storage element (e.g., a battery and/or an accumulator) and an automatic charging function. For example, the container is configured to: when the power state of the energy storage element is low (e.g. below 10%), the energy storage element is automatically charged (and automatically driven to a charging station). This may provide the following advantages: the power supply to the container is robust and, therefore, the device operates in a very safe manner.

In an embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier nevertheless provides a large base for the mounting components on the component carrier. In addition, in particular, a bare chip (die), which is an example of an embedded electronic component, may be conveniently embedded in a thin plate, such as a printed circuit board, due to its small thickness.

In an embodiment, the component carrier is configured to comprise one of: printed circuit boards, substrates (particularly IC substrates) and interposers.

In the context of the present application, the term "Printed Circuit Board (PCB)" may particularly denote a plate-like component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg, or FR4 material. The individual electrically conductive layer structures can be connected to each other in a desired manner by forming through holes through the laminate, for example by laser drilling or mechanical drilling, and by filling these holes with an electrically conductive material, in particular copper, so as to form vias as through hole connections. In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured for housing one or more components on one surface or both opposing surfaces of a plate-like printed circuit board. The one or more components may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may include a resin with reinforcing fibers (e.g., glass fibers).

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB on which one or more components may be mounted and which may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the components (in particular, electronic components) to be mounted on the substrate (for example, in the case of Chip Scale Package (CSP)). More specifically, a substrate can be understood as a carrier: carriers for electrical connections or grids and component carriers comparable to Printed Circuit Boards (PCBs) but with a relatively high density of laterally and/or vertically arranged connections. The transverse connections are, for example, conducting channels, while the vertical connections can be, for example, bores. These lateral and/or vertical connections are arranged within the base plate and can be used to provide electrical, thermal and/or mechanical connection of accommodated or not accommodated components (such as bare wafers), in particular IC chips, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric portion of the substrate may include a resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

The substrate or interposer may comprise or consist of a layer of at least one of: glass; silicon (Si); a photosensitive or dry-etchable organic material such as an epoxy-based stacked material (e.g., an epoxy-based stacked film); or a polymer compound such as polyimide, polybenzoxazole or benzocyclobutene-functional polymer.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of: resins (e.g. reinforced or non-reinforced resins, such as epoxy or bismaleimide-triazine resins), cyanate ester resins, polyphenylene derivatives, glass (especially glass fibre, multiple glass, glass-like materials), prepregs (e.g. FR-4 or FR-5), polyimides, polyamides, Liquid Crystal Polymers (LCP), epoxy-based laminates, polytetrafluoroethylene (PTFE, Teflon)

Ceramics and metal oxides. Reinforcing structures, such as meshes, fibers or spheres, for example made of glass (multiple layers of glass) may also be used. Although prepreg, in particular FR4, is generally preferred for rigid PCBs, other materials, in particular epoxy-based stacked films or photosensitive dielectric materials, may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins, low temperature co-fired ceramics (LTCC) or other low, very low or ultra low DK materials can be implemented in the component carrier as an electrically insulating layer structure.

In an embodiment, the at least one electronically conductive layer structure comprises at least one of: copper, aluminum, nickel, silver, gold, palladium, magnesium, titanium, and tungsten. Although copper is generally preferred, the at least one (electronic) component, of which other materials or coated variants thereof, in particular coated with superconducting materials such as graphene, are also possible, may be selected from at least one of the following: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light directing element (e.g., a light waveguide or light conductor connector), an optical element (e.g., a lens), an electronic component, or a combination thereof. For example, the component may be an active electronic component, a passive electronic component, an electronic chip, a storage device (e.g., DRAM or other data storage), a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a light emitting diode, an optocoupler, a voltage converter (e.g., a DC/DC converter or an AC/DC converter), a cryptography component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a micro-electro-mechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components may also be embedded in the component carrier. For example, a magnetic element may be used as the component. Such a magnetic element may be a permanent magnetic element (e.g. a ferromagnetic element, an antiferromagnetic element, a multiferroic element or a ferrimagnetic element, e.g. a ferrite core) or may be a paramagnetic element. However, the component may also be a substrate, an interposer, or other component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded in the interior of the component carrier. Furthermore, other components, in particular components which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment, can also be used as components.

In an embodiment, the component carrier is a laminate type component carrier. In such an embodiment, the component carrier is a composite of a multilayer structure that is stacked and joined together by the application of pressure and/or heat.

After the processing of the inner layer structure of the component carrier, one main surface or the two opposite main surfaces of the processed layer structure may be covered symmetrically or asymmetrically (in particular by lamination) with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, stacking may continue until a desired number of layers is obtained.

After the formation of the stack with the electrically insulating layer structure and the electrically conductive layer structure is completed, the resulting layer structure or component carrier may be subjected to a surface treatment.

In particular, in terms of surface treatment, an electrically insulating solder resist may be applied to one main surface or both opposite main surfaces of the layer stack or the component carrier. For example, a layer such as solder resist may be formed over the entire major surface and subsequently patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to the electronic periphery. The surface portion of the component carrier which remains covered with solder resist, in particular the surface portion which comprises copper, can be effectively protected against oxidation or corrosion.

In terms of surface treatment, it is also possible to selectively apply a surface treatment to exposed electrically conductive surface portions of the component carrier. Such a surface treatment may be an electrically conductive covering material on exposed electrically conductive layer structures (such as pads, conductive traces, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (in particular copper) will be oxidized, resulting in a lower reliability of the component carrier. Further, the surface treatment portion may be formed as, for example, an engaging portion between the surface mounting component and the component carrier. The surface treatment has the function of protecting the exposed electrically conductive layer structure, in particular the copper circuit, and the surface treatment can effect a joining process with one or more components, for example by soldering. Examples of suitable materials for the surface treatment are Organic Solderability Preservative (OSP), Electroless Nickel Immersion Gold (ENIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, ENIPIG (electroless nickel immersion palladium immersion gold), and the like.

Drawings

The above-defined and other aspects of the present invention will become apparent from and elucidated with reference to the examples of embodiment(s) to be described hereinafter.

Fig. 1 illustrates a front elevation view of a transport arrangement according to an exemplary embodiment of the present invention, comprising a transportable container for carrying component carriers or component carrier preforms loaded with a component carrier transport device, which carries the component carriers or component carrier preforms placed therein.

Fig. 2 illustrates a front side view of a transport arrangement according to another exemplary embodiment of the present invention, comprising a transportable container with a component carrier transport device placed therein.

Fig. 3 illustrates an isometric view of a transport system including a transportable container with a component carrier transport device placed therein according to another exemplary embodiment of the present invention.

Fig. 4 illustrates an isometric view of a closed transportable container according to another exemplary embodiment of the present invention.

Fig. 5 illustrates an isometric front view of a transportable container with a component carrier transport device placed therein in accordance with another exemplary embodiment of the present invention.

Fig. 6 illustrates an enlarged view of a guide structure of a transportable container according to another exemplary embodiment of the present invention.

Fig. 7 illustrates a side view of a transportable container according to another exemplary embodiment of the present invention.

Fig. 8 illustrates a transportable container management system according to an exemplary embodiment of the present invention.

The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference numerals.

Detailed Description

Fig. 1 shows a transport arrangement 600 with a loaded transport system 200 with a transportable container 100 and a component carrier transport device 210 and component carrier 250 or/and component carrier preforms according to an exemplary embodiment of the present invention.

The transportable container 100 includes a plurality of side walls 110 defining a chamber (compartment, space) 120 therebetween such that the chamber 120 is isolated from the environment outside the transportable container 100. Each side wall 110 comprises an outer wall 110a and an inner wall 110b, wherein the outer wall 110a is arranged at the external environment and the inner wall 110b is arranged at the chamber 120 such that a hollow channel 121 is formed between the outer wall 110a and the inner wall 110 b.

The transportable container 100 further comprises an air control unit 130, which air control unit 130 is configured to control and/or regulate the air flow through the hollow channel 121. In this example, the air control unit 130 is disposed on the top sidewall 111 covering the chamber 120. The air control unit 130 includes an air inlet opening and an air outlet opening. Air from the chamber 120 communicates with the air in the hollow passage 121 through the opening 160 in the inner wall 110 b.

In particular, there is an air flow shown by arrows through said hollow channel 121. The air flow may be directed from the air control unit 130 directly into the chamber 120. Further, the air flow may be directed along the hollow channel 121 between the inner wall 110b and the outer wall 110 a. At the bottom of the transportable container 100, the air flow may exit the chamber 120 through the opening 160 and rush into the hollow channel 121.

The transportable container 100 further comprises one or more sensor units 140, the one or more sensor units 140 being configured to measure a parameter associated with the air flow. The measured parameters provide information indicating the cleanliness level (foreign matter) in the transportable container, in particular information of dust particles. The air control unit 130 is configured to adjust the air flow based on the measured parameter.

In this example, the air control unit 130 is configured as a fan filter unit. Further, in this example, one sensor unit 140 is implemented with the air control unit 130. Another sensor unit 140 is disposed within the hollow passage 121 and is separate from the air control unit 130.

The component carrier transportation device 210 is configured as a cart, and a plurality of component carrier preforms are placed within the storage volume of said component carrier transportation device 210. Each of the component carrier preforms comprises a layer stack having a plurality of electrically insulating layer structures and a plurality of electrically conductive layer structures. The component carrier preform will be manufactured in a further processing step into a component carrier product, such as a printed circuit board or an IC substrate.

Fig. 2 shows a loaded transport system 200 according to an exemplary embodiment in a side view, wherein the transportable container 100 is loaded with a component carrier transport device 210. The transport system 200 is in principle identical to the transport system described for fig. 1, however, in this view, a handling unit 400 can be seen. The steering unit 400 comprises a pneumatic pump unit 403, a steering wheel 401 provided with braking features, and a steering lever 402 with a gripping handle 404. The lifting activity of the pneumatic pump unit 403 can be controlled by a limit sensor (not shown). It can be seen that the storage volume of the component carrier transport device 210 extends a large distance in the horizontal direction, so that a large storage volume can be provided and a plurality of component carrier preforms can be held in place. In an example, a storage device (magazine) may be placed in the storage volume of the component carrier transport device 210. In this case, the plurality of component carrier preforms may be placed directly into the storage device.

Fig. 3 shows an isometric view of a loaded transport system 200 according to an exemplary embodiment, the loaded transport system 200 having a transportable container 100 and a component carrier transport device 210. The transportable container 100 comprises a plurality of side walls 110, wherein one of the side walls 110 comprises a door 150 having a door handle 171. Optionally, door 150 includes two layers (an inner layer and an outer layer) with a hollow space between the two layers. In this example, the door 150 is in an open position. Two retainer devices 220 are arranged at the inner side of the door 150 with respect to the chamber 120. Thus, the component carrier transport device 210 may be fixed in the chamber 120 in a stable manner using the holder device 220, and the component carrier transport device 210 may be protected from the external environment in the chamber 120.

Fig. 4 shows an isometric view of the transportable container 100 according to an exemplary embodiment. The transportable container 100 comprises one, two or more load bearing (caster) rollers 260 to ensure stable positioning of the transportable container 100, wherein the plurality of load bearing rollers 260 are arranged at the bottom side wall 114 of the transportable container 100. In this particular example, each of the load bearing rollers 260 has a maximum load capacity of 210 kg.

Fig. 5 shows a front view of a transport system 200 with a transportable container 100 and a component carrier transport device 210 according to an exemplary embodiment. The transportable container 100 comprises a plurality of side walls 110, wherein some of the side walls 110 comprise guiding structures 170 for guiding the component carrier transport devices 210 within the compartment 120. The transportable container 100 comprises a stopping device 180 for stopping the component carrier transport device within the compartment 120. The detent is disposed on the bottom sidewall 114.

Fig. 6 shows an enlarged view of the guide structure 170 of fig. 5, which includes a plurality of rolling elements. A guide structure 170 extending along at least one of the plurality of side walls 110 secures the component carrier transport device 210 in the compartment 120. In addition, when the guide structure 170 contacts the component carrier transport device 210, the inner wall 110b may be protected.

Fig. 7 shows a side view of a transportable container 100 according to another exemplary embodiment. Here, the load bearing rollers 260 can be seen in a preferred position.

Fig. 8 illustrates a transportable container management system 300 in a component carrier manufacturing scenario 500, according to an exemplary embodiment. The transportable container management system 300 includes a plurality of additional transportable containers 100a, 100b (as described above) that form the transportable container management system 300. The transportable container management system 300 further comprises a control device 310 (external device), the control device 310 comprising a further wireless communication device 330, the further wireless communication device 330 being configured to communicate with a plurality of wireless communication devices 320 attached to the further transportable containers 100a, 100b, respectively. The control device 310 comprises a memory for storing information about the transportable container 100, such as the positioning of further transportable containers 100a, 100b, the transport direction of the component carrier 250 and/or the component carrier preform in the component carrier manufacturing scenario 500.

Thereby, the control device 310 is configured to coordinate the plurality of further transportable containers 100a, 100b, such as the positioning of the component carrier 250 and/or the component carrier preform, the authorized and unauthorized operators, the direction of transport, based on the information relating to the transportable container 100. The component carrier manufacturing scenario 500 comprises a plurality of levels, so that further transportable containers 100a, 100b can be (self-) located not based on GPS only, for example additional ultrasound functionality can be used. The devices of the transportable container management system 300 and the control device 310 are coupled via a wireless communication network 550 (e.g., WiFi).

Preferably, the transportable container management system 300 is also coupled (integrated) to an internet of things (IoT) application that includes Artificial Intelligence (AI) algorithms (not shown).

Reference numerals

100 transportable container

100a, 100b further transportable containers

110 side walls

110a outer wall

110b inner wall

111 Top side wall, cover

112 left side wall

113 right side wall

114 bottom side wall, base

115 front side wall

116 rear side wall

120 chamber, space

121 hollow channel

130 air control unit

140 sensor unit

150 door

160 opening

170 guide structure

171 door handle

180 braking device

200 transport system

210 parts carrier transport device

220 holder device

250 parts carrier

260 caster roll

300 transportable container management system

310 control device

320 radio communication device

330 further radio communication device

400 operating unit

401 steering wheel

402 operating rod

403 pneumatic pump unit

404 grip handle

500 parts carrier manufacturing scenario

550 wireless communication network

600 transportation arrangement

Claims (36)

1. A transportable container (100), the transportable container (100) for carrying a component carrier transport device (210), the transportable container (100) comprising:

a plurality of side walls (110), the plurality of side walls (110) defining a chamber (120) therebetween such that the chamber (120) is isolated from an environment external to the transportable container (100),

characterized in that at least one of said plurality of side walls (110) comprises:

an outer wall (110a), the outer wall (110a) being arranged at the external environment, an

An inner wall (110b), the inner wall (110b) being arranged at the chamber,

wherein the outer wall (110a) and the inner wall (110b) are arranged such that a hollow channel (121) is formed between the outer wall (110a) and the inner wall (110 b); and

an air control unit (130), the air control unit (130) being coupled to the hollow channel (121) and configured to control and/or regulate an air flow through the hollow channel (121).

2. The transportable container (100) of claim 1, characterized in that said air control unit (130) is arranged at least one side wall of said plurality of side walls (110).

3. The transportable container (100) of claim 1, characterized in that said air control unit (130) is configured as an air filter unit.

4. The transportable container (100) of claim 1, said transportable container (100) further comprising:

a sensor unit (140), the sensor unit (140) being coupled with the air control unit (130), wherein the sensor unit (140) is configured to measure a parameter of the air flow.

5. The transportable container (100) of claim 4, characterized in that the measured parameter comprises at least one of humidity, pressure, temperature, flow rate.

6. The transportable container (100) of claim 4, characterized in that the measured parameter provides information indicative of a cleanliness condition in the transportable container (100).

7. The transportable container (100) of claim 4, characterized in that the measured parameter provides information indicative of a movement of the transportable container (100).

8. The transportable container (100) according to claim 4, characterized in that the air control unit (130) is configured to control and/or regulate the air flow based on the measured parameter.

9. The transportable container (100) of claim 1, wherein one sidewall (115) of the plurality of sidewalls (110) comprises a door (150).

10. The transportable container (100) of claim 1, characterized in that said transportable container (100) is configured to prevent electromagnetic radiation from said external environment from entering said chamber (120).

11. The transportable container (100) of claim 1, characterized in that the transportable container (100) is configured such that the chamber (120) is hermetically sealed.

12. The transportable container (100) of claim 1, wherein at least one of said plurality of side walls (110) comprises metal.

13. The transportable container (100) of claim 1, characterized in that at least one of said plurality of side walls (110) comprises at least one opening (160) towards said chamber (120) such that said air flow can enter said chamber (120) and/or exit said chamber (120).

14. The transportable container (100) of claim 1, said transportable container (100) further comprising:

a wireless communication device (320), the wireless communication device (320) being configured to transmit information relating to the transportable container (100) to a control device (310) and/or a further transportable container (100a, 100 b).

15. A transportation system (200), characterized in that the transportation system (200) comprises:

the transportable container (100) of claim 1; and

a component carrier transport device (210), the component carrier transport device (210) being configured to transport a component carrier (250) and/or a component carrier preform, wherein the component carrier transport device (210) is at least partially arranged in the cavity (120).

16. The transport system (200) of claim 15, wherein the transportable container (100) has at least one holder device (220), the at least one holder device (220) being arranged at a door to secure the component carrier transport device (210) within the cavity (120).

17. The transport system (200) of claim 15, wherein at least one of the plurality of side walls (110) comprises a guiding structure (170) for guiding the component carrier transport device (210) within the cavity (120).

18. A transport arrangement (600), characterized in that the transport arrangement (600) comprises:

a transportation system according to claim 15; and

a plurality of component carriers (250) and/or component carrier pre-forms, the component carriers (250) and/or the component carrier pre-forms being arranged in the component carrier transport device (210).

19. The transport arrangement (600) according to claim 18, wherein the component carrier (250) and/or the component carrier preform comprises at least one of the following features:

at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and at least one of the following features:

at least one electronic component which is surface-mounted on and/or embedded in the component carrier (250) and/or the component carrier pre-form;

at least one of the electrically conductive layer structures of the component carrier (250) and/or the component carrier preform comprises one of copper, aluminum, nickel, silver, gold, palladium, magnesium and tungsten, any of which is coated with a superconducting material;

the electrically insulating layer structure comprises one of: epoxy resins or bismaleimide-triazine resins; FR-4; FR-5; cyanate ester resin; a polyphenylene derivative; glass; pre-impregnated material; a polyimide; a polyamide; a liquid crystalline polymer; an epoxy-based stacked film; polytetrafluoroethylene; a ceramic; and a metal oxide;

the component carrier (250) and/or the component carrier preform is configured to be one of: a printed circuit board, an IC substrate, and an organic interposer;

the component carrier (250) and/or the component carrier pre-form is configured as a laminate-type component carrier.

20. The transportation arrangement (600) of claim 19, wherein the at least one electronic component is a non-conductive inlay and/or a conductive inlay.

21. The transport arrangement (600) of claim 19, wherein the at least one electronic component is an active electronic component or a passive electronic component.

22. The transport arrangement (600) of claim 19, wherein the at least one electronic component is an energy harvesting unit, a signal processing component or an electromechanical transducer.

23. The transportation arrangement (600) of claim 19, wherein the at least one electronic component is a storage device, a power management component, a cryptographic component, or a magnetic element.

24. The transport arrangement (600) according to claim 19, wherein the at least one electronic component is a filter, an optical-electrical interface element, a voltage converter, an actuator, a capacitor, a resistor, an inductance, an energy accumulator, a switch, a camera or an antenna.

25. The transportation arrangement (600) of claim 19, wherein the at least one electronic component is an integrated circuit.

26. The transport arrangement (600) of claim 19, wherein the at least one electronic component is an electronic chip.

27. The transportation arrangement (600) of claim 19, wherein the at least one electronic component is a logic chip.

28. The transportation arrangement (600) of claim 19, wherein the at least one electronic component is a micro-electromechanical system.

29. The transport arrangement (600) of claim 19, wherein the at least one electronic component is a microprocessor.

30. The transport arrangement (600) according to claim 19, wherein the at least one electronic component is a heat transfer unit, a light guiding element, a transmitter and/or a receiver, or a further component carrier and/or a component carrier pre-form.

31. The transportation arrangement (600) of claim 19, wherein the at least one electronic component is an optical element.

32. The transport arrangement (600) of claim 19, wherein the at least one electronic component is a bridge.

33. The transport arrangement (600) according to claim 19, wherein the superconducting material is graphene.

34. The transport arrangement (600) according to claim 18, wherein the component carrier (250) and/or the component carrier pre-form is shaped as a plate.

35. A transport arrangement (600) according to claim 18, wherein the component carrier preform is configured as a panel comprising a plurality of semi-finished component carriers (250).

36. A transportable container management system (300), the transportable container management system (300) for a component carrier manufacturing scenario (500), the transportable container management system (300) comprising:

the transportable container (100) of claim 14;

at least one further transportable container (100a, 100 b); and

a control device (310) having a wireless communication unit, the control device (310) being configured to wirelessly communicate with the transportable container (100) and the further transportable container (100a, 100 b).

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