CN217388513U

CN217388513U - Power management chip that compressive capacity is strong

Info

Publication number: CN217388513U
Application number: CN202123229831.0U
Authority: CN
Inventors: 任留涛
Original assignee: Nantong Gerp Microelectronics Co ltd
Current assignee: Nantong Gerp Microelectronics Co ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-09-06
Anticipated expiration: 2031-12-21

Abstract

The utility model relates to the technical field of chips, in particular to a power management chip with strong pressure resistance, which comprises a device main body, a chip body and a chip module, wherein the chip main body is provided with a plurality of chip modules; the compression-resistant mechanism comprises a fixed frame, the inner side of the fixed frame is fixedly connected with the outer side of the chip body, and a compression spring is fixedly mounted at the top end of the fixed frame. The utility model discloses a be provided with the chip body, fixed frame, the resistance to compression board, compression spring, horizontal bar and rubber strip, in using, electronic component operation vibrations oppression resistance to compression board, make resistance to compression board be close to the chip body, make compression spring also pressurized thereupon downwards, the bottom of until resistance to compression board is closely laminated with the top of rubber strip, pressurized compression spring kick-backs makes resistance to compression board also to the direction activity of keeping away from the chip body, just here reciprocating cycle, can avoid the power management chip to receive the oppression and damage, and then influence the holistic use of device, the service life of device has been improved.

Description

Power management chip that compressive capacity is strong

Technical Field

The utility model relates to a chip technical field specifically is a power management chip that compressive capacity is strong.

Background

The power management chip IS mainly responsible for identifying the power supply amplitude of the CPU, generating corresponding short moment waves and pushing a rear-stage circuit to output power, and commonly used power management chips comprise HIP6301, IS6537, RT9237, ADP3168, KA7500, TL494 and the like. The power management chip is indispensable to the electronic system, and the quality of the performance of the power management chip has a direct influence on the performance of the whole electronic system. All electronic devices have power supplies, but different systems have different requirements for power supplies. In order to achieve the best performance of the electronic system, the most suitable power management method needs to be selected. The application range of the power management chip is very wide, the development of the power management chip has important significance for improving the performance of the whole machine, the selection of the power management chip is directly related to the requirement of a system, the development of the digital power management chip is difficult to cross the cost, and the life of people is that electronic equipment cannot be opened for a moment in the world at present.

After the existing power management chip is installed on a circuit board, different electronic systems are formed by installing different electronic elements, the electronic elements easily press the chip above the power management chip, the service life of the power management chip is influenced, the use of the whole device is further influenced, and therefore the power management chip with strong pressure resistance is required to be designed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power management chip that compressive capacity is strong to after solving the current power management chip that provides in the above-mentioned background art and installing on the circuit board, still can install some different electronic system of electronic component constitution, these electronic component easily cause the oppression to the chip in the top of power management chip, have influenced the life of power management chip, and then have influenced the problem of installing holistic use.

In order to achieve the above purpose, the utility model provides a following technical scheme: a power management chip with strong pressure resistance capability comprises:

a device main body including a chip body;

resistance to compression mechanism, including fixed frame, fixed frame's the inboard outside fixed connection with the chip body, fixed frame's top fixed mounting has compression spring, compression spring keeps away from fixed frame's one end fixed mounting and has the resistance to compression board, fixed frame's top fixed mounting has the horizontal bar, the quantity of horizontal bar is two, the top of horizontal bar is fixed mounting all has the rubber strip.

Preferably, the number of the compression springs is four, and the compression springs are uniformly arranged between the pressure resisting plate and the fixed frame.

Preferably, a first fixing column is fixedly mounted at the top end of the fixing frame, a second empty slot is formed in one end, away from the fixing frame, of the first fixing column, a second fixing column is fixedly mounted at the bottom end of the pressure resisting plate, and one end, away from the pressure resisting plate, of the second fixing column extends into the second empty slot.

Preferably, a plurality of ventilation grooves are uniformly formed in the top end of the pressure resistant plate.

Preferably, the top end of the pressure-resistant plate is provided with a through hole, a cylindrical connecting column is movably installed inside the through hole in a penetrating mode, a first circular plate is fixedly installed at the top end of the cylindrical connecting column, small rectangular blocks are fixedly installed on the outer side of the first circular plate, and the number of the small rectangular blocks is four.

Preferably, one end of the cylindrical connecting column, which is far away from the pressure resisting plate, extends to the outer side of the bottom end of the pressure resisting plate, and a second circular plate is fixedly mounted at one end of the cylindrical connecting column, which is far away from the pressure resisting plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through being provided with the chip body, fixed frame, the resistance to compression board, compression spring, horizontal bar and rubber strip, during the use, electronic component operation vibrations oppression resistance to compression board, make resistance to compression board be close to the chip body, make compression spring also pressurized downwards thereupon, the bottom and the top of rubber strip of resistance to compression board closely laminate, pressurized compression spring kick-backs and makes resistance to compression board also to the direction activity of keeping away from the chip body, just this reciprocating cycle, can avoid the power management chip to receive the oppression and damage, and then influence the holistic use of device, the service life of device has been improved.

2. Through being provided with the through-hole, little rectangular piece, first circular slab, cylindric spliced pole and second circular slab, during the use, drive cylindric spliced pole and bounce when the resistance to compression board activity, will fall when cylindric spliced pole bullet to the second circular slab contact resistance to compression board bottom of bottom, the little rectangular piece striking that drives the first circular slab outside is on the ventilation groove top for the ventilation groove produces slight shake, can clean the ventilation groove, avoids piling up too much dust and influences the radiating effect.

Drawings

FIG. 1 is a schematic front view of the structure of the present invention;

FIG. 2 is a schematic sectional view of the front view of the structure of the present invention;

FIG. 3 is a schematic top view of the structure of the present invention;

fig. 4 is a schematic side view of the structure of the present invention.

In the figure: 1. a device main body; 110. a chip body; 111. a fixed frame; 112. a pressure resistant plate; 113. a horizontal bar; 114. a rubber strip; 115. a compression spring; 116. a small rectangular block; 117. a first circular plate; 118. a cylindrical connecting column; 119. a second circular plate; 120. a ventilation slot; 121. a through hole; 122. a first fixed column; 123. a second empty slot; 124. and a second fixing column.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment of:

a power management chip with strong pressure resistance capability comprises:

a device main body 1 including a chip body 110;

the compression-resisting mechanism comprises a fixed frame 111, a first fixed column 122 is fixedly installed at the top end of the fixed frame 111, a second empty groove 123 is formed in one end, away from the fixed frame 111, of the first fixed column 122, a second fixed column 124 is fixedly installed at the bottom end of the compression-resisting plate 112, one end, away from the compression-resisting plate 112, of the second fixed column 124 extends into the second empty groove 123, the position between the compression-resisting plate 112 and the fixed frame 111 can be fixed, the situation that the compression-resisting plate 112 is stressed and deviated due to connection of only compression springs 115 is avoided, the inner side of the fixed frame 111 is fixedly connected with the outer side of a chip body 110, the compression springs 115 are fixedly installed at the top end of the fixed frame 111, the number of the compression springs 115 is four, the compression springs 115 are uniformly installed between the compression-resisting plate 112 and the fixed frame 111, the compression springs 115 can uniformly bear the stress of the compression-resisting plate 112, and the compression-resisting plate 112 is more stable and balanced, compression spring 115 keeps away from the one end fixed mounting of fixed frame 111 and has resist clamp 112, and the top fixed mounting of fixed frame 111 has horizontal bar 113, and the quantity of horizontal bar 113 is two, and the equal fixed mounting in top of horizontal bar 113 has rubber strip 114, can avoid the power management chip to receive the oppression and damage, and then influences the holistic use of device, has improved the life of device, has reduced the economic loss of company.

The top end of the pressure-resistant plate 112 is uniformly provided with a plurality of ventilation grooves 120 which can radiate the chip body 110, thereby avoiding the situation that the periphery of the power management chip is difficult to dissipate due to heat accumulation, effectively reducing the working temperature of the periphery of the power management chip, the top end of the pressure-resistant plate 112 is provided with a through hole 121, the inside of the through hole 121 is movably provided with a cylindrical connecting column 118 in a penetrating way, the top end of the cylindrical connecting column 118 is fixedly provided with a first circular plate 117, the outer side of the first circular plate 117 is fixedly provided with small rectangular blocks 116, the number of the small rectangular blocks 116 is four, the four small rectangular blocks 116 can impact the ventilation grooves 120 when the device main body 1 runs, dust accumulated at the inner side of the ventilation grooves 120 can be knocked down, the heat radiation effect of the ventilation grooves 120 is prevented from being influenced by too much dust, further the running of the chip body 110 is influenced by the cylindrical connecting column 118, one end, far away from the pressure-resistant plate 112, extends to the outer side of the bottom end of the pressure-resistant plate 112, one end of the cylindrical connecting column 118, which is far away from the pressure resisting plate 112, is fixedly provided with a second circular plate 119, so that the cylindrical connecting column 118 is prevented from completely separating from the through hole 121 during the operation of the device main body 1 and dissociating inside an electronic system to cause system failure.

The working principle is as follows: when the device is used, a worker holds the chip body 110 to approach the chip groove on the circuit board until the pins of the chip body 110 are inserted into the grooves, so that the chip body 110 is fixedly installed, and then other electronic elements are continuously installed, the device can be put into use after the installation of a whole electronic system is completed, the worker operates the electronic system to operate, so that the electronic elements in the electronic system also operate, the electronic elements vibrate when operating, so that the pressure-resistant plate 112 at the top end of the chip body 110 is pressed to approach the chip body 110, and simultaneously the second fixing column 124 at the bottom end of the pressure-resistant plate 112 is driven to move towards the second empty groove 123, so that the compression spring 115 at the bottom end of the pressure-resistant plate 112 is pressed downwards until the bottom end of the pressure-resistant plate 112 is tightly attached to the top end of the rubber strip 114, and the compressed compression spring 115 starts to rebound, and the rebound force of the compression spring 115 drives the second fixing column 124 to be far away from the inside of the second empty groove 123, and then the pressure resisting plate 112 also moves in the direction away from the chip body 110, and the reciprocating circulation is carried out, the cylindrical connecting column 118 movably installed in the through hole 121 is suspended when the pressure resisting plate 112 moves downwards, when the pressure resisting plate 112 rebounds, the cylindrical connecting column 118 is driven to bounce, and due to the blocking of the second circular plate 119 installed at the bottom of the cylindrical connecting column 118, the second circular plate 119 rebounded to the bottom end of the cylindrical connecting column 118 contacts the bottom end of the pressure resisting plate 112 and falls down, so that the small rectangular blocks 116 outside the first circular plate 117 are driven to impact the top end of the ventilation groove 120, the ventilation groove 120 generates slight shaking, when the electronic system stops working, the internal electronic elements stop running, and the device main body 1 slowly stops.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a power management chip that compressive capacity is strong, its characterized in that includes:

a device main body (1) including a chip body (110);

resistance to compression mechanism, including fixed frame (111), the inboard outside fixed connection with chip body (110) of fixed frame (111), the top fixed mounting of fixed frame (111) has compression spring (115), the one end fixed mounting that fixed frame (111) were kept away from in compression spring (115) has resistance to compression plate (112), the top fixed mounting of fixed frame (111) has horizontal bar (113), the quantity of horizontal bar (113) is two, the top of horizontal bar (113) is fixed mounting all has rubber strip (114).

2. The power management chip with high pressure resistance of claim 1, wherein: the number of the compression springs (115) is four, and the compression springs (115) are uniformly arranged between the pressure resisting plate (112) and the fixed frame (111).

3. The power management chip with high pressure resistance of claim 1, wherein: the top end of the fixed frame (111) is fixedly provided with a first fixed column (122), one end, far away from the fixed frame (111), of the first fixed column (122) is provided with a second empty groove (123), the bottom end of the pressure resisting plate (112) is fixedly provided with a second fixed column (124), and one end, far away from the pressure resisting plate (112), of the second fixed column (124) extends to the inside of the second empty groove (123).

4. The power management chip with high pressure resistance of claim 1, wherein: a plurality of ventilation grooves (120) are uniformly formed in the top end of the pressure resistant plate (112).

5. The power management chip with high pressure resistance of claim 1, wherein: through-hole (121) have been seted up on the top of resistance to compression board (112), the inside activity of through-hole (121) is run through and is installed cylindric spliced pole (118), the top fixed mounting of cylindric spliced pole (118) has first circular slab (117), the outside fixed mounting of first circular slab (117) has little rectangular block (116), and the quantity of little rectangular block (116) is four.

6. The power management chip with high pressure resistance of claim 5, wherein: one end, far away from the pressure resisting plate (112), of the cylindrical connecting column (118) extends to the outer side of the bottom end of the pressure resisting plate (112), and a second circular plate (119) is fixedly mounted at one end, far away from the pressure resisting plate (112), of the cylindrical connecting column (118).