CN217386810U - Chip resistor easy to package - Google Patents
Chip resistor easy to package Download PDFInfo
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- CN217386810U CN217386810U CN202220398595.0U CN202220398595U CN217386810U CN 217386810 U CN217386810 U CN 217386810U CN 202220398595 U CN202220398595 U CN 202220398595U CN 217386810 U CN217386810 U CN 217386810U
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Abstract
The utility model discloses an easy paster resistance of encapsulation, including the resistance main part, the one end of resistance main part is equipped with first external electrode, and the other end of resistance main part is equipped with second external electrode, the upper surface of resistance main part is equipped with the protection film, the chucking groove has been seted up in the resistance main part, and is provided with heat radiation structure in the resistance main part, heat radiation structure includes mounting bracket, installation curb plate and heat dissipation frame, fixed connection between mounting bracket and the installation curb plate. A chip resistor of easily encapsulating belongs to the chip resistor field, through the heat radiation structure who sets up, utilizes the radiating fin in the heat dissipation frame to carry out thermal conduction, can carry out thermal conduction fast, improved the radiating efficiency of resistance, heat radiation structure adopts the mode of joint to install simultaneously, simple to operate, installation back stability is high to still convenient to detach gets off and changes operation such as, simple structure, the result of use is excellent.
Description
Technical Field
The utility model relates to a chip resistor field, in particular to chip resistor of easily encapsulating.
Background
A Chip Resistor (SMD Resistor), also known as a Chip Fixed Resistor, is one of the metal glass enamel resistors. The resistor is manufactured by mixing metal powder and glass glaze powder and printing the mixture on a substrate by a screen printing method. It is resistant to humidity and high temperature and has small temperature coefficient. The circuit space cost can be greatly saved, and the design is more refined. Compared with the common resistor, the chip resistor is simple in structure and regular in shape, and is more convenient to package. But among the chip resistor of current convenient encapsulation, install on the circuit board when the resistance uses, when resistance work produced heat, the heat passed through the air conduction, and conduction rate is low, is unfavorable for the heat dissipation, can not guarantee the normal use of resistance when the high temperature.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides an easy SMD resistor of encapsulation can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an easy paster resistance of encapsulation, includes the resistance main part, the one end of resistance main part is equipped with first external electrode, and the other end of resistance main part is equipped with second external electrode, the upper surface of resistance main part is equipped with the protection film, the chucking groove has been seted up in the resistance main part, and is provided with heat radiation structure in the resistance main part, heat radiation structure includes mounting bracket, installation curb plate and heat dissipation frame, fixed connection between mounting bracket and the installation curb plate, and the installation curb plate is connected in the resistance main part, the mounting bracket is installed in the resistance main part through the installation curb plate, heat dissipation frame is installed on the mounting bracket.
Preferably, the resistor main body is fixedly connected with the first external electrode and the second external electrode, the first external electrode and the second external electrode are symmetrically arranged on the resistor main body, and the protective film is fixedly connected with the resistor main body.
Preferably, one end of the protective film contacts the first external electrode, the other end of the protective film contacts the second external electrode, and the clamping grooves are symmetrically arranged on the resistor main body.
Preferably, heat radiation structure still includes the chucking arch, installation curb plate symmetry sets up on the mounting bracket, the protruding fixed mounting of chucking is in the inboard of installation curb plate, and between the chucking groove in the protruding and resistance main part of chucking looks joint, the installation curb plate passes through the protruding fixed mounting of chucking on the resistance main part, the through-hole has been seted up on the mounting bracket.
Preferably, the heat dissipation frame includes connection frame, radiating fin, fixed fritter and chucking post, radiating fin fixed mounting is on the connection frame, and the connection frame laminates in the mounting bracket, radiating fin's lower extreme passes the through-hole contact on the protective film, fixed fritter is fixed on the connection frame, the chucking post sets up in the lower surface of fixed fritter, and chucking post and mounting bracket looks joint, the connection frame is through fixed fritter, chucking post fixed mounting on the mounting bracket.
Compared with the prior art, the utility model discloses following beneficial effect has: this chip resistor of easily encapsulating through the heat radiation structure who sets up, utilizes the radiating fin in the heat dissipation frame to carry out thermal conduction, can carry out thermal conduction fast, has improved the radiating efficiency of resistance, and heat radiation structure adopts the mode of joint to install simultaneously, simple to operate, and installation back stability is high to still convenient to detach gets off and changes operation such as, simple structure, the result of use is excellent.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural diagram of the resistor substrate of the present invention;
fig. 3 is a schematic structural view of the heat dissipation structure of the present invention;
fig. 4 is a schematic structural view of the heat dissipation frame of the present invention.
In the figure: 1. a resistor body; 2. a first external electrode; 3. a second external electrode; 4. a protective film; 5. a clamping groove; 6. a heat dissipation structure; 601. a mounting frame; 602. installing a side plate; 603. clamping the bulge; 604. a heat dissipation frame; 6041. a connecting frame; 6042. a heat dissipating fin; 6043. fixing the small blocks; 6044. and (4) clamping the column.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-4, an easily packaged chip resistor includes a resistor main body 1, one end of the resistor main body 1 is provided with a first external electrode 2, the other end of the resistor main body 1 is provided with a second external electrode 3, the upper surface of the resistor main body 1 is provided with a protective film 4, a clamping groove 5 is formed in the resistor main body 1, a heat dissipation structure 6 is arranged on the resistor main body 1, the heat dissipation structure 6 includes a mounting frame 601, a mounting side plate 602 and a heat dissipation frame 604, the mounting frame 601 is fixedly connected with the mounting side plate 602, the mounting side plate 602 is connected to the resistor main body 1, the mounting frame 601 is mounted on the resistor main body 1 through the mounting side plate 602, and the heat dissipation frame 604 is mounted on the mounting frame 601.
Through the above embodiment, the resistor main body 1 is fixedly connected with the first external electrode 2 and the second external electrode 3, the first external electrode 2 and the second external electrode 3 are symmetrically arranged on the resistor main body 1, the protection film 4 is fixedly connected with the resistor main body 1, one end of the protection film 4 contacts the first external electrode 2, the other end of the protection film 4 contacts the second external electrode 3, and the clamping grooves 5 are symmetrically arranged on the resistor main body 1.
Through the above embodiment, the heat dissipation structure 6 further includes the clamping protrusions 603, the mounting side plates 602 are symmetrically disposed on the mounting frame 601, the clamping protrusions 603 are fixedly mounted on the inner side of the mounting side plates 602, and the clamping protrusions 603 are clamped with the clamping grooves 5 on the resistor body 1, the mounting side plates 602 are fixedly mounted on the resistor body 1 through the clamping protrusions 603, the mounting frame 601 is provided with through holes, the heat dissipation frame 604 includes the connection frame 6041, the heat dissipation fins 6042, the fixing small blocks 6043 and the clamping columns 6044, the heat dissipation fins 6042 are fixedly mounted on the connection frame 6041, the connection frame 6041 is attached to the mounting frame 601, the lower ends of the heat dissipation fins 6042 pass through the through holes to contact with the protection film 4, the fixing small blocks 6043 are fixed on the connection frame 6041, the clamping columns 6044 are disposed on the lower surface of the fixing small blocks 6043, and the clamping columns 6044 are clamped with the mounting frame 601, the connection frame 6041 is fixedly mounted on the mounting frame 601 through the fixing small blocks 6043 and the clamping columns 6044, through the heat radiation structure 6 who sets up, utilize radiating fin 6042 in the heat dissipation frame 604 to carry out thermal conduction, can carry out thermal conduction fast, improved the radiating efficiency of resistance, heat radiation structure 6 adopts the mode of joint to install simultaneously, simple to operate, installation back stability is high to still convenient to detach gets off and changes operation such as, simple structure, the result of use is excellent.
It should be noted that, the utility model relates to a chip resistor easy to package, when in use, the first external electrode 2 and the second external electrode 3 are respectively arranged at the two ends of the resistor main body 1, the protection film 4 is arranged on the upper surface of the resistor main body 1, when the chip resistor is required to be installed for use, whether to install the heat dissipation structure 6 is selected according to actual conditions, when the heat dissipation structure 6 is not required to be installed, the resistor main body 1 is directly installed, so that the chip resistor is connected to the circuit board, then the chip resistor is used, if the heat dissipation structure 6 is required to be installed, the mounting frame 601 and other structures in the heat dissipation structure 6 are firstly installed on the resistor main body 1, in the installation process, the mounting side plate 602 on the mounting frame 601 is attached to the side wall of the resistor main body 1, the clamping protrusion 603 on the mounting side plate 602 is clamped into the clamping groove 5 on the resistor main body 1, under the clamping action of the clamping protrusion 603 and the clamping groove 5, the mounting side plate 602 is stably mounted on the resistor main body 1 in cooperation with the mounting frame 601, then the mounting of the heat dissipation frame 604 is started, the connecting frame 6041 in the heat dissipation frame 604 is attached to the mounting frame 601, so that the clamping column 6044 on the lower surface of the small fixing block 6043 is inserted into the circular groove on the mounting frame 601, thereby the connecting frame 6041 is fixedly connected with the mounting frame 601, at the moment, the lower end of the heat dissipation fin 6042 passes through the through hole between the mounting frame 601 to be contacted with the protective film 4, after the mounting of the heat dissipation frame 604 is finished, the mounting work of the whole heat dissipation structure 6 is finished, the chip resistor with the heat dissipation structure 6 is mounted on the circuit board to be used, at the moment, the heat generated when the resistor is used is conducted to the heat dissipation fin 6042 in the heat dissipation frame 604, the heat dissipation fin 6042 quickly dissipates the heat into the air, and further realizes the quick heat dissipation of the chip resistor, guarantee that the inside temperature of chip resistor can not be too high, the result of use of resistance has been ensured, if when needing to carry out the change of heat dissipation frame 604 isotructure, at first dismantle curb plate 602 from resistance main part 1 with installing, make whole heat radiation structure 6 dismantle, then dismantle chucking post 6044 from mounting bracket 601 through fixed fritter 6043, take away from mounting bracket 601 joint box 6041 that will have radiating fin 6042, and then realize dismantling work, carry out corresponding change operation afterwards, install in proper order again after the change finishes and can continue to use.
The foregoing has described the principles of use, features and advantages of the present invention. The above embodiments and the description describe the basic principles and features of the present invention, and the present invention can be modified in various ways according to the principles of the present invention, and all such modifications are intended to fall within the scope of the present invention as claimed.
Claims (5)
1. The utility model provides an easy paster resistance of encapsulation, includes resistance main part (1), the one end of resistance main part (1) is equipped with first external electrode (2), and the other end of resistance main part (1) is equipped with second external electrode (3), the upper surface of resistance main part (1) is equipped with protection film (4), its characterized in that: the resistor is characterized in that a clamping groove (5) is formed in the resistor main body (1), a heat dissipation structure (6) is arranged on the resistor main body (1), the heat dissipation structure (6) comprises a mounting frame (601), an installation side plate (602) and a heat dissipation frame (604), the mounting frame (601) is fixedly connected with the installation side plate (602), the installation side plate (602) is connected to the resistor main body (1), the mounting frame (601) is installed on the resistor main body (1) through the installation side plate (602), and the heat dissipation frame (604) is installed on the mounting frame (601).
2. A chip resistor easy to package as claimed in claim 1, wherein: the resistor main body (1) is fixedly connected with the first external electrode (2) and the second external electrode (3), the first external electrode (2) and the second external electrode (3) are symmetrically arranged on the resistor main body (1), and the protective film (4) is fixedly connected with the resistor main body (1).
3. A chip resistor easy to package as claimed in claim 2, wherein: one end of the protective film (4) is in contact with the first external electrode (2), the other end of the protective film (4) is in contact with the second external electrode (3), and the clamping grooves (5) are symmetrically arranged on the resistor main body (1).
4. A chip resistor easy to package according to claim 3, wherein: heat radiation structure (6) still include the chucking arch (603), installation curb plate (602) symmetry sets up on mounting bracket (601), chucking arch (603) fixed mounting is in the inboard of installation curb plate (602), and between chucking groove (5) on chucking arch (603) and resistance main part (1) the looks joint, installation curb plate (602) are through chucking arch (603) fixed mounting on resistance main part (1), the through-hole has been seted up on mounting bracket (601).
5. A chip resistor easy to package according to claim 4, wherein: radiating frame (604) includes connecting frame (6041), radiating fin (6042), fixed fritter (6043) and chucking post (6044), radiating fin (6042) fixed mounting is on connecting frame (6041), and connecting frame (6041) laminate in mounting bracket (601), the lower extreme of radiating fin (6042) passes the through-hole contact on protective film (4), fixed fritter (6043) is fixed on connecting frame (6041), chucking post (6044) sets up in the lower surface of fixed fritter (6043), and chucking post (6044) and mounting bracket (601) looks joint, connecting frame (6041) is through fixed fritter (6043), chucking post (6044) fixed mounting on mounting bracket (601).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220398595.0U CN217386810U (en) | 2022-02-26 | 2022-02-26 | Chip resistor easy to package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220398595.0U CN217386810U (en) | 2022-02-26 | 2022-02-26 | Chip resistor easy to package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217386810U true CN217386810U (en) | 2022-09-06 |
Family
ID=83099701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220398595.0U Active CN217386810U (en) | 2022-02-26 | 2022-02-26 | Chip resistor easy to package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217386810U (en) |
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2022
- 2022-02-26 CN CN202220398595.0U patent/CN217386810U/en active Active
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