CN217386307U

CN217386307U - Cold and hot conduction device

Info

Publication number: CN217386307U
Application number: CN202221233138.2U
Authority: CN
Inventors: 李�诚; 彭吕
Original assignee: Shenzhen Dianzhicheng Product Development Co ltd
Current assignee: Shenzhen Dianzhicheng Product Development Co ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-09-06
Anticipated expiration: 2032-05-23

Abstract

The utility model discloses a cold and hot conduction device, which comprises a bottom shell, a heat exchanger and a heat exchanger, wherein the bottom shell is a hollow cavity; the upper shell is movably arranged on the bottom shell and can be inclined relative to the bottom shell; the heat dissipation device is fixedly arranged in the bottom shell; the semiconductor refrigeration piece is arranged above the heat dissipation device, one end of the semiconductor refrigeration piece is in contact connection with the middle position of the temperature guide plate of the upper shell, and the other end of the semiconductor refrigeration piece is in contact connection with the heat dissipation device; the two ends of the elastic pieces are respectively connected with the bottom shell and the upper shell, and the elastic pieces respectively provide supporting force for the inclined upper shell. The utility model discloses the function of cold and hot conduction has been realized effectively.

Description

Cold and hot conduction device

Technical Field

The utility model relates to a cold and hot conduction device.

Background

In daily life, heating or cooling is often needed, generally, heating and cooling functions are realized by different products, for example, a notebook computer generates a large amount of heat under the condition of extremely fast running, if the heat is not led out in time, the CPU and the GPU can be possibly damaged by the large amount of heat, so that the computer cannot work, and therefore, the cooling and the heat dissipation of the notebook computer are important; such as cold weather, a heated product is needed to warm the hands. In the prior art, the heat dissipation function and the refrigeration function are difficult to realize in one product at the same time. Therefore, in view of the defects of the above solutions in actual manufacturing and implementation, the present invention provides a cold and heat conduction device to solve the above problems, which is based on the spirit and concept, with the assistance of professional knowledge and experience, and after many times of ingenuity and experiments, the present invention is created.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a heat conduction device to solve the above-mentioned problems.

The utility model relates to a cold and hot conduction device can realize through following technical scheme:

the utility model relates to a cold and heat conduction device, which comprises a bottom shell, a heat conduction pipe and a heat conduction pipe, wherein the bottom shell is a hollow cavity; the upper shell is movably arranged on the bottom shell and can be inclined relative to the bottom shell; the heat dissipation device is fixedly arranged in the bottom shell; the semiconductor refrigeration piece is arranged above the heat dissipation device, one end of the semiconductor refrigeration piece is in contact connection with the middle position of the temperature guide plate of the upper shell, and the other end of the semiconductor refrigeration piece is in contact connection with the heat dissipation device; the two ends of the elastic pieces are respectively connected with the bottom shell and the upper shell, and the elastic pieces respectively provide supporting force for the inclined upper shell.

In one embodiment, the upper shell comprises a connecting plate and a temperature guide plate, the temperature guide plate is arranged on the connecting plate, and the middle position of the temperature guide plate and the two ends form a gradient.

In one embodiment, the heat conducting plate is made of an aluminum plate.

In one embodiment, the side and bottom surfaces of the bottom case are provided with heat dissipation holes.

In one embodiment, a plurality of accommodating cavities are formed in the bottom surface of the bottom shell, and a plurality of supporting legs are movably arranged in the corresponding accommodating cavities.

In one embodiment, the heat dissipation device includes a heat dissipation block having a cavity disposed therein and a fan disposed in the cavity.

In one embodiment, the elastic member is a spring or a torsion spring.

In one embodiment, the four springs are symmetrically arranged, the upper end of each spring is connected with the upper shell, and the lower end of each spring is connected with the bottom shell.

In one embodiment, the power interface comprises an adapter plate and an interface; the adapter plate is fixedly arranged in the bottom shell, the interface is arranged on the adapter plate and penetrates through the bottom shell, and the adapter plate is electrically connected with the heat dissipation device and the semiconductor refrigerating sheet respectively.

In one embodiment, the interface is a Micro USB interface, a USB Type C interface, or a Lightning interface.

Compared with the prior art, the utility model relates to a cold and hot conduction device's beneficial effect does:

the utility model relates to a cold and hot conduction device, which transfers low temperature to a heat conducting plate through the cold end of a semiconductor refrigeration piece, and the heat conducting plate adopts the gradient design of thick middle part and thin two sides, so that the temperature of the heat conducting plate is uniform, and the conduction of cold and hot temperature is convenient; when refrigeration is needed, the heat dissipation device dissipates heat generated by the hot end of the semiconductor refrigeration sheet out of the heat dissipation holes, so that heat dissipation inside the shell is effectively realized; through the supporting arrangement of the elastic pieces, products arranged on the temperature guide plate are in full contact with the temperature guide plate, and the heat emitted by the products arranged on the temperature guide plate by the pen is taken away at an accelerated speed; meanwhile, the inclination angle of the heat dissipation device can be adjusted through the supporting legs, so that a customer can incline as required, and the customer experience is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic perspective view of a heat and cold conduction device according to the present invention;

fig. 2 is a schematic perspective view of another side of the heat and cold conducting device of the present invention shown in fig. 1;

fig. 3 is an exploded view of a heat and cold conducting device of the present invention shown in fig. 1;

fig. 4 is an exploded view of another angle of the heat and cold conducting device of the present invention shown in fig. 3;

fig. 5 is a schematic cross-sectional view of a cold and heat conducting device of the present invention shown in fig. 1;

fig. 6 is a schematic structural view of a heat conducting plate in a cold and heat conducting device of the present invention shown in fig. 3.

The following are marked in the figure: 11, a bottom shell; 111, heat dissipation holes; 112, a housing cavity; 12, an upper shell; 121, a connecting plate; 122, a temperature conducting plate; 13, a heat sink; 131, a heat dissipation block; 132, a fan; 14, semiconductor refrigerating sheets; 15, an elastic member; 16, supporting the feet; 17, a power interface; 171, an interposer; 172, an interface.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper" and "lower" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the indicated device or element must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention.

Further, in the present disclosure, unless otherwise expressly stated or limited, the first feature may comprise both the first and second features directly contacting each other, and also may comprise the first and second features not being directly contacting each other but being in contact with each other by means of further features between them. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature being below, beneath or beneath a second feature includes the first feature being directly below and obliquely below the second feature or simply indicating that the first feature is at a lesser level than the second feature.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, a heat and cold conducting device of the present invention, which can be applied to heat dissipation of a notebook computer, includes a bottom case 11, an upper case 12, a heat dissipation device 13, a semiconductor cooling plate 14, a plurality of elastic members 15, a plurality of supporting legs 16 and a power interface 17; the bottom shell 11 is a hollow cavity, and a plurality of heat dissipation holes 111 are formed in the hollow cavity; the upper shell 12 is movably arranged on the bottom shell 11 and can be inclined relative to the bottom shell 11; the heat dissipation device 13 is fixedly arranged in the bottom shell 11 and is used for dissipating heat at the hot end of the semiconductor refrigeration piece 14; the semiconductor refrigeration piece 14 is arranged above the heat dissipation device 13, the hot end and the cold end of the semiconductor refrigeration piece 14 can be switched with each other, when refrigeration is needed, the cold end of the semiconductor refrigeration piece 14 is in contact connection with the temperature guide plate 122 of the upper shell 12, the hot end of the semiconductor refrigeration piece 14 is in contact connection with the heat dissipation device 13, when heating is needed, the hot end of the semiconductor refrigeration piece 14 is in contact connection with the temperature guide plate 122 of the upper shell 12, and the cold end of the semiconductor refrigeration piece 14 is in contact connection with the heat dissipation device 13; a plurality of elastic members 15 having lower ends respectively connected to the bottom case 11 and upper ends respectively connected to the upper case 12, the elastic members 15 serving to provide a supporting force to the inclined upper case 12; the supporting legs 16 are movably arranged at the lower end of the bottom shell 11, and the angle inclination of the bottom shell 11 is realized by adjusting the angles between the supporting legs 16 and the bottom shell 11; the power interface 17 is arranged in the bottom case 11 and penetrates through the bottom case 11, the power interface is electrically connected with the heat dissipation device 13 and the semiconductor refrigeration piece 14 respectively, and an external power supply supplies electric energy to the heat dissipation device 13 and the semiconductor refrigeration piece 14 through the power interface 17.

Referring to fig. 1-4, in the present embodiment, the bottom case 11 is made of aluminum alloy, and the heat dissipation holes 111 are disposed on both sides and bottom of the bottom case, so that heat at the hot end of the semiconductor chilling plate 14 is dissipated through the heat dissipation holes 111. In this embodiment, the bottom surface of the bottom case 11 is provided with a plurality of accommodating cavities 112, a plurality of supporting legs 16 are movably disposed in the corresponding accommodating cavities 112, and when the supporting legs 16 are disposed in the accommodating cavities 112, the supporting legs 16 are flush with or lower than the lower surface of the bottom case 11, so that when the bottom case 11 is horizontally placed, the entire bottom surface is flat.

Referring to fig. 1 to 6, in the present embodiment, the upper housing 12 includes a connecting plate 121 and a temperature guide plate 122, the temperature guide plate 122 is disposed on the connecting plate 121, a gradient is formed between the middle position and two ends of the temperature guide plate 122, specifically, the temperature guide plate 122 adopts a gradient design in which the middle is thick and the two sides are thin, and the semiconductor cooling plate is in contact connection with the middle portion of the temperature guide plate 122, so that the temperature is diffused from the middle to the two sides, and thus the temperature at each position on the surface of the temperature guide plate 122 is uniform during the temperature guide process. In this embodiment, the heat conducting plate 122 is made of an aluminum plate.

Referring to fig. 3 and 4, in the present embodiment, the heat dissipation device 13 includes a heat dissipation block 131 and a fan 132, a cavity is disposed in the heat dissipation block 131, the fan 132 is disposed in the cavity, such design is convenient for reducing the volume of the heat dissipation device, and a heat dissipation hole 111 is disposed right below the fan 132.

Referring to fig. 3-5, the elastic members 15 are springs or torsion springs, in this embodiment, the elastic members 15 are springs, four springs are symmetrically disposed, an upper end of each spring is connected to the upper housing 12, a lower end of each spring is connected to the bottom housing 11, the four springs are used to support the upper housing 12 to be inclined, in other embodiments, the number of the elastic members 15 may be two, three, or a plurality thereof, and the number of the elastic members 15 may be set according to actual conditions. In this embodiment, the two supporting legs 16 are symmetrically and movably disposed at the lower end of the bottom shell 11; in other embodiments, the number of the supporting legs 16 may be three, four or other numbers, and the number of the supporting legs 16 may be set according to actual situations.

Referring to fig. 1 and 4, in the present embodiment, the power interface 17 includes an adapter plate 171 and an interface 172; the adapter plate 171 is fixedly arranged in the bottom case 11, the interface 172 is arranged on the adapter plate 171 and penetrates through the bottom case 11, and the adapter plate 171 is electrically connected with the heat dissipation device 13 and the semiconductor chilling plate 14 respectively. The Type of the interface 172 may be a Micro USB interface, a USB Type C interface, or a Lightning interface, and in this embodiment, the interface 172 adopts a USB Type C interface. In other embodiments, a rechargeable battery may also be disposed in the bottom case 11, specifically, the rechargeable battery is a polymer lithium ion battery, and the battery is charged through the power interface 17.

It should be noted that, the utility model relates to a cold and hot conduction device passes through power supply 17 switches on, heat abstractor 13 with semiconductor refrigeration piece 14 begins work, and when needs refrigerate, the cold junction of semiconductor refrigeration piece 14 transmits low temperature to lead warm plate 122, lead warm plate 122 and the product contact who sets up on leading warm plate 122 are connected to take away the heat of product that sets up on leading warm plate 122, simultaneously heat abstractor 13 distributes the heat that the hot junction of semiconductor refrigeration piece 14 produced from louvre 111; through the supporting effect of the elastic elements 15, the product arranged on the temperature guide plate 122 is in full contact with the temperature guide plate 122, and the heat of the product arranged on the temperature guide plate 122 is accelerated to be taken away; meanwhile, the inclination angle of the heat sink can be adjusted by the supporting legs 16.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A cold and heat conduction device is characterized by comprising a bottom shell which is a hollow cavity; the upper shell is movably arranged on the bottom shell and can be inclined relative to the bottom shell; the heat dissipation device is fixedly arranged in the bottom shell; the semiconductor refrigeration piece is arranged above the heat dissipation device, one end of the semiconductor refrigeration piece is in contact connection with the middle position of the temperature guide plate of the upper shell, and the other end of the semiconductor refrigeration piece is in contact connection with the heat dissipation device; the two ends of the elastic pieces are respectively connected with the bottom shell and the upper shell, and the elastic pieces respectively provide supporting force for the inclined upper shell.

2. The cold and heat transfer device of claim 1, wherein the upper housing comprises a connecting plate and a temperature guiding plate, the temperature guiding plate is disposed on the connecting plate, and the middle position of the temperature guiding plate is graded with the two ends.

3. A cold and heat conducting apparatus according to claim 2, wherein the heat conducting plate is made of an aluminum plate.

4. The cold and heat transfer device of claim 1, wherein the bottom and the side surfaces of the bottom case are provided with heat dissipation holes.

5. The cold and heat transfer device of claim 1, wherein the bottom surface of the bottom shell is provided with a plurality of accommodating cavities, and a plurality of supporting legs are movably arranged in the corresponding accommodating cavities.

6. A cold-heat transfer device according to claim 1, wherein the heat sink comprises a heat dissipation block and a fan, the heat dissipation block having a cavity therein, and the fan being disposed in the cavity.

7. The cold and heat transfer device of claim 1, wherein the elastic member is a spring or a torsion spring.

8. The cold and heat transfer device of claim 7, wherein four springs are symmetrically disposed, and each of the springs has an upper end connected to the upper housing and a lower end connected to the bottom housing.

9. A cold heat transfer device according to claim 1, wherein the power interface comprises an adapter plate and an interface; the adapter plate is fixedly arranged in the bottom shell, the interface is arranged on the adapter plate and penetrates through the bottom shell, and the adapter plate is electrically connected with the heat dissipation device and the semiconductor refrigerating sheet respectively.

10. The cold and heat conduction device according to claim 9, wherein the interface is a Micro USB interface, a USB Type C interface or a Lightning interface.