CN217384936U - IC removing device and TOC analysis system - Google Patents
IC removing device and TOC analysis system Download PDFInfo
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- CN217384936U CN217384936U CN202221107215.XU CN202221107215U CN217384936U CN 217384936 U CN217384936 U CN 217384936U CN 202221107215 U CN202221107215 U CN 202221107215U CN 217384936 U CN217384936 U CN 217384936U
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- 239000012528 membrane Substances 0.000 claims abstract description 54
- 239000012530 fluid Substances 0.000 claims abstract description 27
- 229910002090 carbon oxide Inorganic materials 0.000 claims abstract description 19
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 16
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 2
- 238000010926 purge Methods 0.000 claims 4
- 229910002092 carbon dioxide Inorganic materials 0.000 abstract description 4
- 239000001569 carbon dioxide Substances 0.000 abstract description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 abstract description 3
- 238000002474 experimental method Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 238000002834 transmittance Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 238000004887 air purification Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- -1 moisture Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A20/00—Water conservation; Efficient water supply; Efficient water use
- Y02A20/20—Controlling water pollution; Waste water treatment
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
An embodiment of the utility model provides an IC remove device and TOC analytic system relates to the TOC and detects technical field. The IC removing device comprises a shell and a selective permeation membrane, wherein the selective permeation membrane is of a sheet-shaped structure and is arranged on the shell, and the selective permeation membrane is used for selectively passing carbon oxides, namely carbon oxides such as carbon monoxide and carbon dioxide can move from one side of the selective permeation membrane to the other side, but other substances cannot. And simultaneously, the shell forms a first space and a second space respectively at the upper side and the lower side of the selective permeation membrane, the second space is used for containing sample fluid, and carbon oxides in the sample fluid can penetrate through the selective permeation membrane to enter the first space. Experiments prove that the selective permeation film has a lamellar structure, so that the transmittance of oxycarbide is greatly improved, and the IC removal rate is further greatly improved.
Description
Technical Field
The utility model relates to a TOC detects technical field, particularly, relates to an IC remove device and TOC analytic system.
Background
Total Organic Carbon (TOC) analyzers are used in a large number for the quantitative detection of Organic contaminants in water in the industries of municipal water supply, pharmaceuticals, food and beverage, and microelectronics. The TOC analyzer principle is to detect the Total Carbon (TC) and Inorganic Carbon (IC) contents of a sample at the same time, and calculate the TOC content of the sample according to the following formula (1): TOC-TC-IC.
As can be seen from the above equation, when the IC content in the sample is too high (usually > 10mg C L) -1 ) Cumulative error effects can affect TOC detection accuracy. Extensive research and industry experience has shown that the TOC analyzer detection error is as high as + -30% when TC/IC is < 10 in the sample. Since IC is present in the form of carbonic acid (H) at pH < 3 2 CO 3 ) Which can be dissolved from the liquid stream, it is therefore necessary to first acidify the sample stream before testing the TOC and then use a specific method to acidify the IC (in the form of H) 2 CO 3 ) And (5) removing. However, the vacuum stripping method used in the existing commercial TOC analyzer has the problem of low removal rate of IC, and the popularization and use of the method in the TOC analyzer are limited.
SUMMERY OF THE UTILITY MODEL
The object of the utility model includes, for example, provide an IC remove device, it can improve the problem that the IC clearance is low among the prior art.
The object of the utility model is also to include, provide a TOC analytic system, it can improve the problem that the IC clearance is low among the prior art.
The embodiment of the utility model discloses a can realize like this:
an embodiment of the present invention provides an IC removal device, which includes a housing and a permselective membrane; the selective permeation membrane is of a sheet-like structure and is used for the carbon oxide to pass through; the selective permeation membrane is arranged on the shell, a first space and a second space are respectively formed on the upper side and the lower side of the selective permeation membrane by the shell, the first space is used for containing carbon oxides passing through the selective permeation membrane, and the second space is used for containing a sample fluid.
Optionally, the housing includes an upper flow channel clamping plate and a lower flow channel clamping plate which are oppositely disposed, the permselective membrane is clamped between the upper flow channel clamping plate and the lower flow channel clamping plate, the upper flow channel clamping plate defines the first space, and the lower flow channel clamping plate defines the second space.
Optionally, the casing still includes an upper fixed plate and a lower fixed plate, the lower fixed plate is located runner splint downside down, an upper fixed plate is located runner splint upside, just an upper fixed plate with lower fixed plate locking is fixed, with runner splint the permselective membrane and runner splint centre gripping is fixed down.
Optionally, the upper fixing plate is provided with a first inlet and a first outlet communicated with the first space, the lower fixing plate is provided with a second inlet and a second outlet communicated with the second space, and the first inlet and the second outlet are used for allowing the sample fluid to enter and exit the second space.
Optionally, the first space is in a serpentine shape which is bent back and forth; and/or the second space is in a serpentine shape which is bent back and forth.
Optionally, a projection of the second space in the up-down direction falls within the first space, and a length of the first space is greater than that of the second space.
Optionally, the permselective membrane has a thickness of 10 μm to 200 μm.
Optionally, the IC removing device further includes a heating element disposed outside the housing, the heating element is located at a side of the second space away from the first space, and the heating element is used to make the temperature of the sample fluid in the second space within a preset temperature range.
Optionally, the IC removing apparatus further includes a vacuum pump and an air purifying column, the vacuum pump and the air purifying column are both communicated with the first space, the vacuum pump is configured to form a vacuum in the first space, and the air purifying column is configured to purify air before the air enters the first space.
The embodiment of the utility model provides a TOC analytic system is still provided. The TOC analysis system comprises the IC removal device.
The utility model discloses IC remove device and TOC analytic system's beneficial effect includes, for example:
the embodiment of the utility model provides a IC remove device, it includes casing and selective permeation membrane, and the selective permeation membrane is lamellar structure, and it sets up in the casing, and the selective permeation membrane is used for supplying carbon oxide selectivity to pass through, and carbon oxide such as carbon monoxide and carbon dioxide can move to the opposite side from one side of selective permeation membrane promptly, and other materials then can not. And simultaneously, the shell forms a first space and a second space respectively at the upper side and the lower side of the selective permeation membrane, the second space is used for containing sample fluid, and carbon oxides in the sample fluid can penetrate through the selective permeation membrane to enter the first space. As the selective permeation film is of a sheet-shaped structure, experiments prove that the selective permeation film is of a sheet-shaped structure, the transmittance of the oxycarbide is greatly improved, and the IC removal rate is further greatly improved.
The embodiment of the utility model also provides a TOC analytic system, it includes foretell IC remove device. Since the TOC analysis system includes the IC removal device, the TOC analysis system also has an advantageous effect of high IC removal rate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a block diagram of an IC removing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a part of the structure of an IC removing apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an upper runner clamp plate in the IC removing apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a lower runner clamp plate in the IC removing apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an upper fixing plate in the IC removing apparatus according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a lower fixing plate in an IC removing apparatus according to an embodiment of the present invention.
An icon: 100-IC removal means; 110-a housing; 111-upper runner clamp plate; 112-a first space; 113-lower channel clamp plate; 114-a second space; 115-upper fixing plate; 116-a first inlet; 117 — a first outlet; 118-lower fixation plate; 119-a second inlet; 121-a second outlet; 130-permselective membrane; 141-a heating element; 142-an air purification column; 143-vacuum pump.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, the description is only for convenience of description and simplification, but the indication or suggestion that the indicated device or element must have a specific position, be constructed and operated in a specific orientation, and thus, should not be interpreted as a limitation of the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are only used to distinguish one description from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Fig. 1 is a block diagram of a structure of an IC removing apparatus 100 provided in this embodiment, and fig. 2 is a schematic cross-sectional view of a part of the structure of the IC removing apparatus 100 provided in this embodiment. Referring to fig. 1 and fig. 2 in combination, the present embodiment provides an IC removing apparatus 100, and accordingly, provides a TOC analyzing system.
The TOC analysis system includes an IC removal device 100, and also includes a carbon content detection module for detecting the sample fluid after removal of the IC.
The IC removing apparatus 100 includes a housing 110 and a permselective membrane 130, wherein the permselective membrane 130 is a sheet-like structure disposed on the housing 110, and the permselective membrane 130 is used for selectively passing carbon oxides, i.e. carbon oxides such as carbon monoxide and carbon dioxide can move from one side of the permselective membrane 130 to the other side, but other substances cannot. Meanwhile, the housing 110 forms a first space 112 and a second space 114 on the upper and lower sides of the permselective membrane 130, respectively, the second space 114 is used for accommodating the sample fluid, and the carbon oxides in the sample fluid can pass through the permselective membrane 130 and enter the first space 112. Since the permselective membrane 130 has a lamellar structure, experiments have shown that the permeability of oxycarbides is greatly improved due to the lamellar structure of the permselective membrane, and thus the IC removal rate is further greatly improved.
The IC removing apparatus 100 provided in this embodiment will be further described below:
referring to fig. 1 and 2, in the present embodiment, the housing 110 includes an upper channel plate 111 and a lower channel plate 113, the upper channel plate 111 and the lower channel plate 113 are disposed on opposite sides of the permselective membrane 130, such that the sheet-like permselective membrane 130 is clamped between the upper channel plate 111 and the lower channel plate 113. The upper flow path clamping plate 111 defines a first space 112 above the permselective membrane 130, and the lower flow path clamping plate 113 defines a second space 114 below the permselective membrane 130. Alternatively, the upper flow passage clamping plate 111 and the lower flow passage clamping plate 113 have substantially the same thickness, and the upper flow passage clamping plate 111 and the lower flow passage clamping plate 113 have a thickness of 0.5mm to 5 mm.
In the description of the present embodiment, the "flaky selectively permeable membrane 130" refers to a flaky membrane having a thickness of 10 μm to 200 μm, and the carbon oxide permeation efficiency of the selectively permeable membrane 130 having such a small thickness is higher. In the present embodiment, the thickness of the permselective membrane 130 is 100 μm, and it is understood that in other embodiments, a permselective membrane 130 with a thickness of 10 μm or 200 μm may be used.
In the present embodiment, the first space 112 is a serpentine channel that is bent back and forth, so that the oxycarbide entering the first space 112 flows along the extending direction of the first space 112. Meanwhile, the second space 114 is also a serpentine channel bent back and forth, the first space 112 corresponds to the bent extending direction of the second space 114, that is, the projection of the second space 114 in the up-down direction falls into the first space 112, so that the sample fluid entering the second space 114 flows along the second space 114, and during the flowing process, the oxycarbide in the sample fluid overflows and passes through the permselective membrane 130 to enter the first space 112. It is understood that in other embodiments, the first space 112 and the second space 114 may be specifically configured according to requirements, for example, configured as a spiral channel or the like.
Fig. 3 is a schematic structural view of an upper flow path clamping plate 111 in the IC removing apparatus 100 according to the present embodiment, and fig. 4 is a schematic structural view of a lower flow path clamping plate 113 in the IC removing apparatus 100 according to the present embodiment. Referring to fig. 1 to 4, in particular, a serpentine groove is formed on a lower end surface of the upper channel plate 111, so that when the upper channel plate 111 is clamped on an upper side of the permselective membrane 130, a first space 112 is defined by the groove. Similarly, the lower flow path clamping plate 113 is provided with a serpentine groove bent back and forth on the lower end surface thereof, so that the second space 114 is defined by the groove when the lower flow path clamping plate 113 is clamped on the lower side of the permselective membrane 130.
Optionally, the length of the first space 112 is greater than that of the second space 114, that is, the length dimension of the first space 112 along the extending direction thereof is greater than that of the second space 114 along the extending direction thereof. Alternatively, the serpentine groove forming the first space 112 has a semicircular cross section, and the serpentine groove forming the second space 114 has a semicircular cross section, so that the first space 112 and the second space 114 can be spliced to form a complete circle with a radius of 0.5mm to 1.1 mm. It is understood that in other embodiments, the cross-sectional shape may be configured as required, for example, U-shaped, L-shaped, etc.
Alternatively, the upper channel clamp plate 111 and the lower channel clamp plate 113 may be made of stainless steel, PEEK, or other materials capable of manufacturing a microfluidic chip.
In this embodiment, the housing 110 further includes an upper fixing plate 115 and a lower fixing plate 118, the upper fixing plate 115 is located on the upper side of the upper flow channel clamping plate 111, i.e., the side of the upper flow channel clamping plate 111 facing away from the lower flow channel clamping plate 113; the lower fixing plate 118 is located on the lower side of the lower flow channel clamping plate 113, i.e., on the side of the lower flow channel clamping plate 113 facing away from the upper flow channel clamping plate 111. And meanwhile, the upper fixing plate 115 and the lower fixing plate 118 are locked and fixed, so that the upper flow channel clamping plate 111, the permselective membrane 130 and the lower flow channel clamping plate 113 are clamped and fixed between the upper fixing plate 115 and the lower fixing plate 118, and thus the upper flow channel clamping plate 111 and the lower flow channel clamping plate 113 are firmly fixed at two sides of the permselective membrane 130 by the clamping action of the upper fixing plate 115 and the lower fixing plate 118, which is helpful for ensuring the sealing effect of the first space 112 and the second space 114. Alternatively, the upper fixing plate 115 and the lower fixing plate 118 are fastened using bolts.
Fig. 5 is a schematic structural diagram of an upper fixing plate 115 in the IC removing apparatus 100 according to the present embodiment, and fig. 6 is a schematic structural diagram of a lower fixing plate 118 in the IC removing apparatus 100 according to the present embodiment. Referring to fig. 1 to 6, in the present embodiment, the upper fixing plate 115 is provided with a first inlet 116 and a first outlet 117 communicated with the first space 112, and the first inlet 116 and the second outlet 121 respectively correspond to two ends of the first space 112 for fluid to enter and exit the first space 112. The lower fixing plate 118 is opened with a second inlet 119 and a second outlet 121 communicated with the second space 114, and the second inlet 119 and the second outlet 121 respectively correspond to two ends of the second space 114 for fluid to enter and exit the second space 114.
In the present embodiment, the IC removing apparatus 100 further includes a vacuum pump 143 and an air purifying column 142, and the air purifying column 142 and the vacuum pump 143 are both communicated with the first space 112. The air entering the first space 112 is purified and filtered by the air purifying column 142, and a vacuum is formed in the first space 112 by the vacuum pump 143, so that the separation of carbon oxides from the sample fluid is accelerated, and the IC removal rate is improved.
Specifically, the air purifying column 142 can absorb impurities such as carbon dioxide, moisture, and dust in the air, and the air purifying column 142 communicates with the first inlet 116, and the air filtered by the air purifying column 142 enters the first space 112 from the first inlet 116. The vacuum pump 143 is in communication with the first outlet 117.
In this embodiment, the IC removing apparatus 100 further includes a heating member 141, and the heating member 141 is disposed on a side of the second space 114 away from the first space 112, so that the sample fluid in the second space 114 is maintained in a preset temperature range by the heating member 141, thereby facilitating to accelerate the separation of carbon oxides in the sample fluid. Specifically, the heater member 141 is installed at the lower side of the lower fixing plate 118. Optionally, the preset temperature range is 25 ℃ to 40 ℃. Alternatively, the heating member 141 is a semiconductor heating sheet.
According to the IC removing apparatus 100 provided in this embodiment, the operation principle of the IC removing apparatus 100 is:
in use, a vacuum environment is created in the first volume 112 by the vacuum pump 143, while the sample fluid flows from the second inlet 119 into the second volume 114 and along the second volume 114 to the second outlet 121. While the sample fluid flows through the second space 114, the temperature of the sample fluid is maintained within the predetermined temperature range by the heating element 141, and carbon oxides in the sample fluid are rapidly extracted from the sample fluid by the vacuum and the heating, and pass through the permselective membrane 130 into the first space 112 to be discharged from the first outlet 117.
The IC removing apparatus 100 provided in this embodiment has at least the following advantages:
the embodiment of the utility model provides a IC remove device 100, it sets up to lamellar structure through with permselective membrane 130, so help carbon oxide to pass permselective membrane 130 fast in order to separate with sample fluid, first space 112 and second space 114 are located the upper and lower both sides of permselective membrane 130 respectively simultaneously, so set up heating member 141 and can effectively guarantee the heating to sample fluid at second space 114 downside, and then help promoting carbon oxide's separation rate, thereby showing and improving the clearance of vacuum stripping method to IC, be favorable to the application of vacuum stripping method in IC removes.
And, at 20mg C L -1 The removal rates of the IC removal device 100 provided in this embodiment and the conventional IC removal device were compared and verified by using sodium carbonate and sodium bicarbonate as examples, and the results are shown in the following table:
the above results show that the IC removal apparatus 100 according to the present embodiment can improve the IC removal rate by about 30%.
The present embodiment also provides a TOC analysis system, which includes the IC removal apparatus 100 described above. Since the TOC analysis system includes the IC removal device 100 described above, the TOC analysis system also has all the advantageous effects of the IC removal device 100.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An IC removing device is characterized by comprising a shell and a selective permeation film; the selective permeation membrane is of a sheet-like structure and is used for the carbon oxide to pass through; the selective permeation membrane is arranged on the shell, a first space and a second space are respectively formed on the upper side and the lower side of the selective permeation membrane by the shell, the first space is used for containing carbon oxides passing through the selective permeation membrane, and the second space is used for containing a sample fluid.
2. The IC removing apparatus according to claim 1, wherein the housing includes an upper flow passage clamp plate and a lower flow passage clamp plate which are disposed opposite to each other, the permselective membrane is clamped between the upper flow passage clamp plate and the lower flow passage clamp plate, and the upper flow passage clamp plate defines the first space and the lower flow passage clamp plate defines the second space.
3. The IC removing apparatus according to claim 2, wherein the housing further comprises an upper fixing plate and a lower fixing plate, the lower fixing plate is located at a lower side of the lower flow channel clamping plate, the upper fixing plate is located at an upper side of the upper flow channel clamping plate, and the upper fixing plate is locked and fixed with the lower fixing plate to clamp and fix the upper flow channel clamping plate, the permselective membrane, and the lower flow channel clamping plate.
4. The IC removing apparatus according to claim 3, wherein the upper fixing plate defines a first inlet and a first outlet communicating with the first space, and the lower fixing plate defines a second inlet and a second outlet communicating with the second space, the first inlet and the second outlet being for allowing the sample fluid to enter and exit the second space.
5. The IC removal apparatus of claim 1, wherein the first space has a serpentine shape that is bent back and forth; and/or the second space is in a serpentine shape which is bent back and forth.
6. The IC removing apparatus according to claim 5, wherein a projection of the second space in the up-down direction falls within the first space, and a length of the first space is larger than the second space.
7. The IC removal apparatus of claim 1, wherein the permselective membrane has a thickness of 10 μ ι η to 200 μ ι η.
8. The IC removal device of claim 1, further comprising a heating element disposed outside the housing, the heating element being located on a side of the second space remote from the first space, and the heating element being configured to bring the temperature of the sample fluid within the second space within a predetermined temperature range.
9. The IC removal apparatus of any one of claims 1-8, further comprising a vacuum pump and an air purge column, the vacuum pump and the air purge column both being in communication with the first space, the vacuum pump being configured to create a vacuum in the first space, the air purge column being configured to purge air before the air enters the first space.
10. A TOC analysis system comprising the IC removal apparatus of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221107215.XU CN217384936U (en) | 2022-05-10 | 2022-05-10 | IC removing device and TOC analysis system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221107215.XU CN217384936U (en) | 2022-05-10 | 2022-05-10 | IC removing device and TOC analysis system |
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| CN217384936U true CN217384936U (en) | 2022-09-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118179095A (en) * | 2024-05-19 | 2024-06-14 | 浙江泰林分析仪器有限公司 | Method and structure for removing inorganic carbon in liquid |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118179095A (en) * | 2024-05-19 | 2024-06-14 | 浙江泰林分析仪器有限公司 | Method and structure for removing inorganic carbon in liquid |
| CN118179095B (en) * | 2024-05-19 | 2024-08-02 | 浙江泰林分析仪器有限公司 | Method and structure for removing inorganic carbon in liquid |
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