CN217383519U - Low-temperature cooling device for adhesive processing - Google Patents
Low-temperature cooling device for adhesive processing Download PDFInfo
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- CN217383519U CN217383519U CN202220959589.8U CN202220959589U CN217383519U CN 217383519 U CN217383519 U CN 217383519U CN 202220959589 U CN202220959589 U CN 202220959589U CN 217383519 U CN217383519 U CN 217383519U
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Abstract
The utility model relates to the technical field of auxiliary equipment for processing adhesives, in particular to a low-temperature cooling device for processing adhesives, which comprises a processing box body, a feeding connecting hopper, a cooling liquid circulating pipe, a refrigerator, a water pump and an adhesive cooling pipe, wherein the adhesive cooling pipe is provided with a reinforced heat radiation component, the reinforced heat radiation component comprises a connecting sleeve block fixedly sleeved on the adhesive cooling pipe and a cooling plate fixed with the side wall at one side of the connecting sleeve block, the connecting sleeve block and the cooling plate are both arranged inside the processing box body, the utility model can lead the connecting sleeve block to be sleeved on the outer wall of the adhesive cooling pipe through the arrangement of the connecting sleeve block and the cooling plate, the heat in the adhesive cooling pipe is transmitted to the cooling plate through the pipe wall of the adhesive cooling pipe and the connecting sleeve block, the surface area of the cooling plate is 1.5-3 times of the surface area of the adhesive cooling pipe, thereby improving the cooled area of the adhesive cooling pipe, the cooling efficiency of the adhesive cooling pipe is improved.
Description
Technical Field
The utility model relates to an adhesive processing auxiliary assembly technical field specifically is an adhesive processing is with low temperature cooling device.
Background
The adhesive is also called adhesive, abbreviated as glue, and is a non-metal medium material for tightly connecting an object with another object into a whole. The adhesive between two adhered surfaces only occupies a very thin layer of volume, but after the adhesive is used for completing the adhesive bonding construction, the obtained adhesive bonding piece can meet various requirements of actual requirements in the aspects of mechanical properties and physical and chemical properties. Can be effectual with the material bonding together, in the adhesive production process, can produce a large amount of heats, for the convenience of the follow-up processing of adhesive, need use low temperature cooling device, cool down the adhesive.
Through retrieval, the utility model with the Chinese patent application number of CN202023217986.8 discloses a low-temperature cooling device for processing an adhesive, which comprises supporting legs, a discharging mechanism, a water cooling mechanism and an air cooling mechanism; the number of the supports is two; the discharging mechanism is arranged at the tops of the two supporting legs and comprises a fixed box, a vertical pipe and a bending pipe, the fixed box is fixedly connected to the tops of the two supporting legs, the vertical pipe is communicated and fixedly connected to a top plate of the fixed box, the bottom end of the vertical pipe extends to the inside of the fixed box, and the bending pipe is fixedly connected to the bottom of the vertical pipe; the water cooling mechanism is arranged between the supporting legs and the fixed box. Based on above retrieval, combine prior art discovery, the area of contact between the outside reality of the crooked pipe among the prior art and the coolant liquid is less, and the coolant liquid that needs to use in the fixed incasement is more, has the coolant liquid surplus and the problem that the cooling effect does not promote.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an adhesive processing is with low temperature cooling device to solve the problem that proposes among the above-mentioned background art.
The technical scheme of the utility model is that: a low-temperature cooling device for processing an adhesive comprises a processing box body, a feeding connecting hopper, a cooling liquid circulating pipe, a refrigerator, a water pump and an adhesive cooling pipe, wherein one end of the feeding connecting hopper penetrates through the top of the processing box body and is fixed with the processing box body, the other end of the feeding connecting hopper penetrates through the side wall of the processing box body and is fixed with the processing box body, the upper end of the cooling liquid circulating pipe penetrates through the top of the processing box body and is fixed with the processing box body, the lower end of the cooling liquid circulating pipe penetrates through the side wall of the processing box body and is fixed with the processing box body, the water pump is arranged at the lower end of the cooling liquid circulating pipe, the refrigerator is arranged in the middle of the cooling liquid circulating pipe and is fixed with the outer wall of one side of the processing box body, a reinforced heat dissipation assembly is arranged on the adhesive cooling pipe and comprises a connecting sleeve block fixedly sleeved on the adhesive cooling pipe and a cooling plate fixed with the side wall of one side of the connecting sleeve block, the connecting sleeve block and the cooling plate are arranged inside the processing box body.
Preferably, the connecting sleeve blocks are arranged in a plurality and are uniformly distributed along the outer wall of the adhesive cooling pipe, circulation holes are formed in the cooling plate and are formed in a plurality, and the circulation holes are uniformly distributed along the side wall of the cooling plate at equal intervals.
Preferably, the upper surface of the cooling plate is provided with a vertical cavity penetrating through the cooling plate, the side wall of the cooling plate is provided with a transverse cavity penetrating through the cooling plate, and the transverse cavity is communicated with the vertical cavity.
Preferably, the reinforced heat dissipation assembly further comprises a surface expanding connecting plate, two ends of the surface expanding connecting plate are respectively fixed with the side wall of one side, close to each other, of the two adjacent connecting sleeve blocks, and the side wall of one side of the surface expanding connecting plate is attached to and abutted against the outer wall of the adhesive cooling pipe.
Preferably, the side wall of the face-expanding connecting plate, which is close to one side of the adhesive cooling pipe, forms an arc-shaped surface, and the arc-shaped surface is attached to and abutted against the outer wall of the adhesive cooling pipe.
Preferably, the upper end of the adhesive cooling pipe is fixed and communicated with the feeding connecting hopper, and a discharge electromagnetic valve for controlling the on-off of the adhesive cooling pipe is fixed at one end of the adhesive cooling pipe, which is far away from the feeding connecting hopper.
Preferably, a cooling liquid replacing pipe is integrally formed at the bottom of the cooling liquid circulating pipe, and one end of the cooling liquid replacing pipe, which is far away from the cooling liquid circulating pipe, is fixed and communicated with a cooling liquid replacing electromagnetic valve for controlling the cooling liquid replacing pipe to be switched on and off.
The utility model discloses an improve and provide a low temperature cooling device for adhesive processing here, compare with prior art, have following improvement and advantage:
one is as follows: the utility model has the advantages that through the arrangement of the connecting sleeve block and the cooling plate, the connecting sleeve block is sleeved on the outer wall of the adhesive cooling pipe, the heat in the adhesive cooling pipe is transmitted to the cooling plate through the pipe wall of the adhesive cooling pipe and the connecting sleeve block, and the surface area of the cooling plate is 1.5-3 times of that of the adhesive cooling pipe, so that the cooled area of the adhesive cooling pipe is increased, and the cooling efficiency of the adhesive cooling pipe is improved;
and the second step is as follows: the utility model discloses a setting of vertical cavity and horizontal cavity, coolant liquid flow in horizontal cavity and vertical cavity, and the inner wall and the coolant liquid contact of horizontal cavity and vertical cavity have further enlarged the area of contact of coolant liquid with the cooling plate to the cooling efficiency to the adhesive in the adhesive cooling tube has been improved.
Drawings
The invention is further explained below with reference to the drawings and examples:
fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is an exploded view of the enhanced heat sink assembly and the adhesive cooling tube of the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2;
fig. 4 is a schematic perspective view of the enlarged connecting plate of the present invention.
Description of reference numerals:
1. a treatment box body; 2. a feeding connecting hopper; 3. a cooling liquid circulation pipe; 4. a refrigerator; 5. a water pump; 6. an adhesive cooling tube; 61. a discharge electromagnetic valve; 7. a reinforced heat dissipation assembly; 71. connecting the sleeve blocks; 72. a cooling plate; 721. a flow-through hole; 722. a vertical cavity; 723. a transverse cavity; 73. a surface expanding connecting plate; 731. an arcuate surface; 8. a coolant replacement tube; 81. cold liquid changing electromagnetic valve.
Detailed Description
The present invention will be described in detail below, and it is apparent that the technical solutions in the embodiments of the present invention are described clearly and completely. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model discloses an improvement provides a low temperature cooling device for adhesive processing here, the technical scheme of the utility model is that:
as shown in figures 1-4, a low-temperature cooling device for processing an adhesive comprises a processing box body 1, a feeding connecting hopper 2, a cooling liquid circulating pipe 3, a refrigerator 4, a water pump 5 and an adhesive cooling pipe 6, wherein one end of the feeding connecting hopper 2 penetrates through the top of the processing box body 1 and is fixed with the processing box body 1, the other end of the feeding connecting hopper 2 penetrates through the side wall of the processing box body 1 and is fixed with the processing box body 1, the upper end of the cooling liquid circulating pipe 3 penetrates through the top of the processing box body 1 and is fixed with the processing box body 1, the lower end of the cooling liquid circulating pipe 3 penetrates through the side wall of the processing box body 1 and is fixed with the processing box body 1, the water pump 5 is arranged at the lower end of the cooling liquid circulating pipe 3, the refrigerator 4 is arranged in the middle of the cooling liquid circulating pipe 3 and is fixed with the outer wall of one side of the processing box body 1, a reinforced heat dissipation assembly 7 is arranged on the adhesive cooling pipe 6, the reinforced heat dissipation assembly 7 comprises a connecting sleeve block 71 fixedly arranged on the adhesive cooling pipe 6 and a cooling pipe 71 and a cooling block 71 fixed with the side wall of the connecting sleeve 71 The plate 72, the connection block 71 and the cooling plate 72 are provided inside the process tank 1.
Through the arrangement of the connecting sleeve block 71 and the cooling plate 72, the connecting sleeve block 71 is sleeved on the outer wall of the adhesive cooling pipe 6, heat in the adhesive cooling pipe 6 is transmitted to the cooling plate 72 through the pipe wall of the adhesive cooling pipe 6 and the connecting sleeve block 71, and the surface area of the cooling plate 72 is 1.5-3 times of that of the adhesive cooling pipe 6, so that the cooled area of the adhesive cooling pipe 6 is increased, and the cooling efficiency of the adhesive cooling pipe 6 is improved.
Further, a plurality of connecting blocks 71 are arranged, the plurality of connecting blocks 71 are uniformly distributed along the outer wall of the adhesive cooling pipe 6, the cooling plate 72 is provided with a plurality of circulation holes 721, and the plurality of circulation holes 721 are equidistantly and uniformly distributed along the side wall of the cooling plate 72.
Through the arrangement of the circulation holes 721, the contact area between the cooling liquid and the cooling plate 72 is further enlarged, and the cooling liquid flows transversely in the circulation holes 721, so that the cooling effect of the cooling liquid on the adhesive cooling pipe 6 is enhanced, and the cooling efficiency of the adhesive cooling pipe 6 at the same time is improved.
Further, the upper surface of the cooling plate 72 is provided with a vertical cavity 722 penetrating through the cooling plate 72, the side wall of the cooling plate 72 is provided with a transverse cavity 723 penetrating through the cooling plate 72, and the transverse cavity 723 is communicated with the vertical cavity 722.
Through the arrangement of the vertical cavity 722 and the transverse cavity 723, the cooling liquid flows in the transverse cavity 723 and the vertical cavity 722, the inner walls of the transverse cavity 723 and the vertical cavity 722 are in contact with the cooling liquid, the contact area between the cooling liquid and the cooling plate 72 is further enlarged, and therefore the cooling efficiency of the adhesive in the adhesive cooling pipe 6 is improved.
Further, the reinforced heat dissipation assembly 7 further comprises a surface expanding connecting plate 73, two ends of the surface expanding connecting plate 73 are respectively fixed with the side wall of one side, close to each other, of the two adjacent connecting sleeve blocks 71, and the side wall of one side of the surface expanding connecting plate 73 is attached to and abutted against the outer wall of the adhesive cooling pipe 6.
Through the setting of the face-expanding connecting plate 73, the peripheral wall of one side of the adhesive cooling pipe 6 is fully connected with the side wall of one side of the cooling plate 72, so that the adhesive cooling pipe 6 is convenient to transmit heat to the cooling plate 72, the transmission area of the adhesive cooling pipe 6 is enlarged, the transmission efficiency of heat is improved, and quick heat dissipation is convenient.
Further, the side wall of the enlarged-surface connecting plate 73 close to the side of the adhesive cooling pipe 6 forms an arc-shaped surface 731, and the arc-shaped surface 731 is attached to and abuts against the outer wall of the adhesive cooling pipe 6.
Through the setting of arc surface 731 for expand face connecting plate 73 and the outer wall of adhesive cooling tube 6 are laminated more, and arc surface 731's area of contact is bigger than conventional vertical surface area of contact simultaneously, thereby is favorable to thermal transmission more.
Further, the upper end of the adhesive cooling pipe 6 is fixed and communicated with the feeding connecting hopper 2, and one end, far away from the feeding connecting hopper 2, of the adhesive cooling pipe 6 is fixed with a discharge electromagnetic valve 61 for controlling the on-off of the adhesive cooling pipe 6.
Through the setting of ejection of compact solenoid valve 61, after the adhesive in adhesive cooling tube 6 fully cooled down, the staff only need open ejection of compact solenoid valve 61 for the adhesive in the adhesive cooling tube 6 is discharged, and is convenient for discharge the adhesive after the cooling in this.
Furthermore, a cooling liquid replacing pipe 8 is integrally formed at the bottom of the cooling liquid circulating pipe 3, and one end of the cooling liquid replacing pipe 8, which is far away from the cooling liquid circulating pipe 3, is fixed and communicated with a cooling liquid replacing electromagnetic valve 81 for controlling the on-off of the cooling liquid replacing pipe 8.
Through the setting of coolant liquid change pipe 8, when the coolant liquid needs to be changed, the staff only need open and trade cold liquid solenoid valve 81 for the coolant liquid in handling box 1 changes pipe 8 through the coolant liquid and discharges, and further changes pipe 8 through the coolant liquid and annotates new coolant liquid in handling box 1, so that the staff of being convenient for changes the coolant liquid.
The working principle is as follows: in the daily work process, a worker needs to fill the adhesive to be cooled in the adhesive cooling pipe 6 through the feeding connecting hopper 2, then the water pump 5 is started, so that cooling liquid circularly flows in the treatment box body 1 and the cooling liquid circulating pipe 3, the cooling liquid entering the treatment box body 1 is kept at a lower temperature through the refrigerator 4, the refrigerator 4 can adopt a refrigeration structure of any type, such as TCE1-12706, at the moment, the heat in the adhesive cooling pipe 6 is transmitted to the cooling plate 72 through the pipe wall of the adhesive cooling pipe 6 and the connecting sleeve block 71, and the surface area of the cooling plate 72 is 1.5-3 times of the surface area of the adhesive cooling pipe 6, so that the cooled area of the adhesive cooling pipe 6 is increased, and the cooling efficiency of the adhesive cooling pipe 6 is improved; meanwhile, through the arrangement of the vertical cavity 722 and the transverse cavity 723, the cooling liquid flows in the transverse cavity 723 and the vertical cavity 722, the inner walls of the transverse cavity 723 and the vertical cavity 722 are in contact with the cooling liquid, the contact area between the cooling liquid and the cooling plate 72 is further enlarged, and therefore the cooling efficiency of the adhesive in the adhesive cooling pipe 6 is improved.
Claims (7)
1. The utility model provides an adhesive processing is with low cooling device which characterized in that: comprises a processing box body (1), a feeding connecting hopper (2), a cooling liquid circulating pipe (3), a refrigerator (4), a water pump (5) and an adhesive cooling pipe (6), wherein one end of the feeding connecting hopper (2) penetrates through the top of the processing box body (1) and is fixed with the processing box body (1), the other end of the feeding connecting hopper (2) penetrates through the side wall of the processing box body (1) and is fixed with the processing box body (1), the upper end of the cooling liquid circulating pipe (3) penetrates through the top of the processing box body (1) and is fixed with the processing box body (1), the lower end of the cooling liquid circulating pipe (3) penetrates through the side wall of the processing box body (1) and is fixed with the processing box body (1), the water pump (5) is arranged at the lower end of the cooling liquid circulating pipe (3), the refrigerator (4) is arranged in the middle of the cooling liquid circulating pipe (3) and is fixed with the outer wall of one side of the processing box body (1), and a reinforcing and heat dissipation assembly (7) is arranged on the adhesive cooling pipe (6), strengthen radiator unit (7) including fixed cover locate connection cover piece (71) on adhesive cooling tube (6) and with connecting fixed cooling plate (72) of lateral wall of cover piece (71) one side, it all sets up inside processing box (1) to connect cover piece (71) and cooling plate (72).
2. The low-temperature cooling device for adhesive processing according to claim 1, wherein: the adhesive cooling pipe is characterized in that the connecting sleeve blocks (71) are arranged in a plurality, the connecting sleeve blocks (71) are uniformly distributed along the outer wall of the adhesive cooling pipe (6), circulation holes (721) are formed in the cooling plate (72), the circulation holes (721) are formed in a plurality, and the circulation holes (721) are uniformly distributed along the side wall of the cooling plate (72) in an equal distance.
3. The low-temperature cooling device for adhesive processing according to claim 2, wherein: the upper surface of the cooling plate (72) is provided with a vertical cavity (722) penetrating through the cooling plate (72), the side wall of the cooling plate (72) is provided with a transverse cavity (723) penetrating through the cooling plate (72), and the transverse cavity (723) is communicated with the vertical cavity (722).
4. The low-temperature cooling device for adhesive processing according to claim 1, wherein: the reinforced heat dissipation assembly (7) further comprises a surface expanding connecting plate (73), two ends of the surface expanding connecting plate (73) are respectively fixed with the side wall of one side, close to each other, of the two adjacent connecting sleeve blocks (71), and the side wall of one side of the surface expanding connecting plate (73) is attached to and abutted against the outer wall of the adhesive cooling pipe (6).
5. The low-temperature cooling device for adhesive processing according to claim 4, wherein: the side wall of the side, close to the adhesive cooling pipe (6), of the face expanding connecting plate (73) forms an arc-shaped surface (731), and the arc-shaped surface (731) is attached to and abutted against the outer wall of the adhesive cooling pipe (6).
6. The low-temperature cooling device for adhesive processing according to claim 1, wherein: the upper end of the adhesive cooling pipe (6) is fixed and communicated with the feeding connecting hopper (2), and a discharging electromagnetic valve (61) for controlling the on-off of the adhesive cooling pipe (6) is fixed at one end, far away from the feeding connecting hopper (2), of the adhesive cooling pipe (6).
7. The low-temperature cooling device for adhesive processing according to claim 1, wherein: the cooling liquid circulating pipe (3) bottom integrated into one piece has coolant liquid to change pipe (8), the one end that coolant liquid circulating pipe (3) was kept away from in coolant liquid change pipe (8) is fixed and is led to and has the cold liquid solenoid valve (81) that trades of control coolant liquid change pipe (8) break-make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220959589.8U CN217383519U (en) | 2022-04-24 | 2022-04-24 | Low-temperature cooling device for adhesive processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220959589.8U CN217383519U (en) | 2022-04-24 | 2022-04-24 | Low-temperature cooling device for adhesive processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217383519U true CN217383519U (en) | 2022-09-06 |
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ID=83109776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220959589.8U Active CN217383519U (en) | 2022-04-24 | 2022-04-24 | Low-temperature cooling device for adhesive processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217383519U (en) |
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2022
- 2022-04-24 CN CN202220959589.8U patent/CN217383519U/en active Active
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