CN217363652U

CN217363652U - Heat radiator of vehicle body sensor and vehicle body

Info

Publication number: CN217363652U
Application number: CN202221107927.1U
Authority: CN
Inventors: 张远亮; 王新雨; 王恒宇; 刘世权; 宫健超; 王健宇
Original assignee: CRRC Qingdao Sifang Co Ltd
Current assignee: CRRC Qingdao Sifang Co Ltd
Priority date: 2022-05-10
Filing date: 2022-05-10
Publication date: 2022-09-02
Anticipated expiration: 2032-05-10

Abstract

The utility model provides a heat abstractor and automobile body of automobile body sensor. The heat dissipation device of the vehicle body sensor comprises a semiconductor refrigeration piece, and the cold end surface of the semiconductor refrigeration piece is abutted with the other end surface of the vehicle body sensor; the mounting shell is connected with the semiconductor refrigerating sheet and provided with an accommodating channel, and the vehicle body sensor is accommodated in the accommodating channel; the heat insulation piece is arranged on the mounting shell and extends along the circumferential direction of the accommodating channel so as to wrap the vehicle body sensor; the water circulation cooling device at least comprises a water supply assembly and a cooling assembly, the cooling assembly is abutted to the hot end face of the semiconductor refrigeration sheet, the cooling assembly comprises a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated with the water supply assembly to realize water circulation. The utility model provides a heat abstractor and automobile body of automobile body sensor can solve among the prior art has the poor problem of radiating effect.

Description

Heat radiator of vehicle body sensor and vehicle body

Technical Field

The utility model relates to a relevant technical field of automobile body check out test set particularly, relates to a heat abstractor and automobile body of automobile body sensor.

Background

The vehicle has an important role in life and work of people as a vehicle, wherein the sensing equipment in the vehicle body is used as an important component of the vehicle body, and the safety of the vehicle is evaluated through data fed back by the sensing equipment, so that the sensing equipment plays an important role in the safety and convenience of the use of the vehicle body.

However, when the sensing equipment is overheated, the phenomenon of untimely feedback or inaccurate feedback data can occur, the traditional solution is a way of cooling by spraying a refrigerant on a surface, the traditional way is taken away heat by depending on vaporization heat absorption of the refrigerant to achieve the purpose of cooling, the way is low in efficiency, is greatly influenced by the external temperature, and wastes a large amount of refrigerant to cause cost rise.

As can be seen from the above, the conventional heat dissipation device has a problem of poor heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a heat dissipation device and a vehicle body for a vehicle body sensor, which can solve the problem of poor heat dissipation effect of the heat dissipation device in the prior art.

In order to achieve the above object, according to an aspect of the present invention, there is provided a heat dissipating device of a vehicle body sensor. One end face of the vehicle body sensor is arranged on the vehicle body, the heat dissipation device of the vehicle body sensor comprises a semiconductor refrigeration piece, and the cold end face of the semiconductor refrigeration piece is abutted against the other end face of the vehicle body sensor; the mounting shell is connected with the semiconductor refrigerating sheet and provided with an accommodating channel, and the vehicle body sensor is accommodated in the accommodating channel; the heat insulation piece is arranged on the mounting shell and extends along the circumferential direction of the accommodating channel so as to wrap the vehicle body sensor; the water circulation cooling device at least comprises a water supply assembly and a cooling assembly, the cooling assembly is abutted to the hot end face of the semiconductor refrigerating sheet, the cooling assembly comprises a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated with the water supply assembly to realize water circulation.

Further, the water supply assembly includes a mounting seat; the water tank is arranged on the mounting seat and is provided with a water supply port, a water return port, a water filling port and a water outlet; the water inlet of the cooling assembly and the water outlet of the cooling assembly are respectively communicated with the water supply port and the water return port through the telescopic water pipes; the water pump, the water pump is provided with one at least, and the water pump setting is on water tank or flexible water pipe to regulation and control circulation flow rate.

Further, the bottom of water tank is provided with one of installation arch and mounting groove, is provided with another kind of two on the mount pad, and the inside of mounting groove is stretched into to the protruding at least part of installation to the location water tank.

Further, the heat insulation piece is connected with the inner wall surface of the accommodating channel, and the heat insulation piece is arranged between the outer peripheral surface of the vehicle body sensor and the inner wall surface of the accommodating channel; or the mounting shell is provided with a plurality of enclosing plates which are connected in sequence, at least one enclosing plate is of a hollow structure, and the heat insulation piece is accommodated in the hollow structure.

Furthermore, the cooling assembly comprises a water cooling head, and the water cooling head is provided with an accommodating cavity, and a water inlet and a water outlet which are communicated with the accommodating cavity; a plurality of baffles, a plurality of baffles interval set up in the inside in holding chamber, form between two adjacent baffles and overflow the passageway, a plurality of passageways that overflow communicate end to end in order.

Furthermore, the water cooling head is provided with a contact surface which is abutted against the hot end surface of the semiconductor refrigeration sheet, and the area of the contact surface is not smaller than that of the hot end surface.

Furthermore, the water inlet and the water outlet of the water cooling head are provided with connecting joints made of stainless steel.

Furthermore, the heat dissipation device of the vehicle body sensor further comprises a direct-current power supply, and the direct-current power supply is electrically connected with a water pump and a semiconductor refrigeration piece of the water supply assembly.

Furthermore, the semiconductor refrigerating piece is a double-layer semiconductor refrigerating piece.

According to another aspect of the utility model, a automobile body is provided, and the automobile body includes foretell automobile body sensor's heat abstractor.

Use the technical scheme of the utility model, the heat abstractor of automobile body sensor includes the semiconductor refrigeration piece, the installation casing, cooling piece and water circulative cooling device, the cold terminal surface of semiconductor refrigeration piece and another terminal surface butt of automobile body sensor, the installation casing is connected with the semiconductor refrigeration piece, the installation casing has the holding passageway, the automobile body sensor holding is in the inside of holding passageway, separate the temperature piece and install on the installation casing, separate the temperature piece and extend in order to wrap up automobile body sensor along the circumference of holding passageway, water circulative cooling device is at least including the water supply subassembly, cooling module, the hot terminal surface butt of cooling module and semiconductor refrigeration piece, cooling module is including having water inlet and delivery port, water inlet and delivery port communicate with the water supply subassembly respectively in order to realize the hydrologic cycle.

By last knowing, semiconductor refrigeration piece cooperation water circulative cooling device's form is in order to realize carrying out the cooling treatment to the automobile body sensor, wherein the cold junction and the automobile body sensor butt of semiconductor refrigeration piece to realize cooling automobile body sensor, water circulative cooling device adopts the heat of circulating flow water in order to take away the hot junction of semiconductor refrigeration piece, improves the refrigeration effect of semiconductor refrigeration piece, adopts the mode and the sustainable use of physics cooling, has improved cooling efficiency, has reduced use cost. Simultaneously, this application has the installation casing that separates the temperature piece through the setting and fixes a position the installation to vehicle body sensor, not only realizes fixing a position vehicle body sensor and makes things convenient for the semiconductor refrigeration piece to carry out the effect of cooling to vehicle body sensor, also keeps apart the heat in the external environment moreover to avoid vehicle body sensor to receive ambient temperature's influence to lead to the problem that measurement of efficiency is low to the temperature rise.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic view showing an installation structure of a heat sink of a vehicle body sensor according to the present invention;

fig. 2 shows a schematic perspective view of the water tank of the present invention;

fig. 3 shows a schematic structural view of the cooling assembly of the present invention.

Wherein the figures include the following reference numerals:

10. a mounting seat; 20. a direct current power supply; 30. a water tank; 31. a water supply port; 32. a water return port; 33. a water injection port; 40. a water pump; 50. a telescopic water pipe; 60. a cooling assembly; 610. a water cooling head; 611. a water inlet; 612. a water outlet; 620. a partition plate; 70. a semiconductor refrigerating sheet; 80. installing a shell; 90. a thermal insulation member.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

In the present application, where the contrary is not intended, the use of directional words such as "upper, lower, top and bottom" is generally with respect to the orientation shown in the drawings, or with respect to the component itself in the vertical, perpendicular or gravitational direction; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.

Example one

The diagonal detection device aims at solving the problem that a diagonal detection device in the prior art is low in detection precision. The utility model provides a heat abstractor of automobile body sensor, heat abstractor of automobile body sensor are applicable to multiple different grade type automobile body sensor, and a terminal surface of automobile body sensor is installed on the automobile body.

As shown in fig. 1 to 3, the heat dissipation device of the vehicle body sensor includes a semiconductor refrigeration sheet 70, a mounting housing 80, a cooling member and a water circulation cooling device, a cold end face of the semiconductor refrigeration sheet 70 abuts against another end face of the vehicle body sensor, the mounting housing 80 is connected with the semiconductor refrigeration sheet 70, the mounting housing 80 has an accommodating channel, the vehicle body sensor is accommodated inside the accommodating channel, a temperature insulation member 90 is mounted on the mounting housing 80, the temperature insulation member 90 extends along the circumferential direction of the accommodating channel to wrap the vehicle body sensor, the water circulation cooling device at least includes a water supply assembly and a cooling assembly 60, the cooling assembly 60 abuts against a hot end face of the semiconductor refrigeration sheet 70, the cooling assembly 60 includes a water inlet 611 and a water outlet 612, and the water inlet 611 and the water outlet 612 are respectively communicated with the water supply assembly to realize water circulation.

Specifically, semiconductor refrigeration piece 70 cooperates water circulative cooling device's form in order to realize carrying out the cooling treatment to the automobile body sensor, wherein semiconductor refrigeration piece 70's cold junction and automobile body sensor butt to realize cooling automobile body sensor, water circulative cooling device adopts the heat of circulating flowing water in order to take away semiconductor refrigeration piece 70's hot junction, improves semiconductor refrigeration piece 70's refrigeration effect, adopts the mode and the sustainable use of physics cooling, has improved cooling efficiency, has reduced use cost. Simultaneously, this application has the installation casing 80 that separates temperature piece 90 through the setting and fixes a position the installation to vehicle body sensor, not only realizes fixing a position vehicle body sensor and makes things convenient for semiconductor refrigeration piece 70 to carry out the effect of cooling to vehicle body sensor, but also keeps apart the heat in the external environment to avoid vehicle body sensor to receive ambient temperature's influence to lead to the problem that measurement of efficiency is low to the temperature rise to appear.

Further, the thermal insulation member 90 may be made of a material having a thermal insulation effect, such as sponge.

It should be noted that, the accuracy that the automobile body sensor need work in order to guarantee to detect under lower temperature, therefore the temperature of external environment influences the automobile body sensor easily, the temperature of external environment is too high especially when summer, the automobile body sensor receives ambient temperature's influence can lead to the temperature of automobile body sensor to rise, this application has isolated the temperature of external environment through the installation casing 80 that sets up and has thermal-insulated piece 90, the influence of external environment temperature to the automobile body sensor has been avoided, help improving the use precision of automobile body sensor.

In the present embodiment, the semiconductor chilling plate 70 is a double-layer semiconductor chilling plate 70.

As shown in fig. 1 to 3, the water supply assembly includes a mounting base 10, a water tank 30, a plurality of telescopic water pipes 50, and a water pump 40, the water tank 30 is mounted on the mounting base 10, the water tank 30 has a water supply port 31, a water return port 32, a water injection port 33, and a water discharge port, a water inlet 611 of the cooling assembly 60 and a water outlet 612 of the cooling assembly 60 are respectively communicated with the water supply port 31 and the water return port 32 through the telescopic water pipes 50, at least one water pump 40 is provided, and the water pump 40 is provided on the water tank 30 or the telescopic water pipes 50 to regulate a circulation flow rate.

Specifically, the water tank 30 is mounted on the mounting base 10 and connected to the cooling module 60 through a plurality of telescopic water pipes 50 to realize water circulation, the water circulating inside the cooling module 60 contributes to a cooling process of the vehicle body sensor, a water discharge port and a water filling port 33 are provided on the water tank 30 to realize the water discharge from the water tank 30 after the temperature rise, new water is injected into the inside of the water tank 30 through the water filling port 33, and the flowing water is maintained to have a reduced temperature. By adopting the telescopic water pipe 50, the length of the telescopic water pipe 50 can be controlled according to the position of the vehicle body sensor, so that the vehicle body sensors at different positions can be cooled by adjusting the length of the telescopic water pipe 50 under the condition that the mounting seat 10 does not need to be moved.

The water can be water mixed with condensing agent, can also be water subjected to cooling treatment, can be tap water, and can be used for adaptively controlling the temperature of the water according to actual needs.

Further, the water pump 40 is used for providing power, one water pump 40 may be provided to keep the water moving in a single direction during the water circulation, and of course, a plurality of water pumps 40 may be provided, and the plurality of water pumps 40 provide power to enhance the flowing effect of the water at the same time.

In the present embodiment, the bottom of the water tank 30 is provided with one of a mounting protrusion and a mounting groove, and the other of the mounting protrusion and the mounting groove is provided on the mounting seat 10, and at least a portion of the mounting protrusion extends into the mounting groove to position the water tank 30.

Specifically, the water tank 30 is positioned on the mount 10 to improve stability of installation of the water tank 30.

It should be noted that the connection between the water tank 30 and the mounting seat 10 is not limited to the connection between the mounting protrusion and the mounting groove, and may also be performed by using a fastener, specifically, the water tank 30 and the mounting seat 10 can be stably connected.

In this embodiment, the mounting seat 10 is a housing, the water tank 30 and the water pump 40 are both mounted inside the housing, one end of the telescopic water pipe 50 is located inside the housing, and the other end extends out of the housing and is connected to the cooling assembly 60.

Two different embodiments are provided in this embodiment depending on the mounting position of the thermal insulator 90, as follows.

In one embodiment, the thermal insulator 90 is connected to an inner wall surface of the accommodation channel, and the thermal insulator 90 is disposed between an outer peripheral surface of the vehicle body sensor and the inner wall surface of the accommodation channel.

Specifically, the thermal insulation member 90 is placed between the outer peripheral surface of the vehicle body sensor and the inner wall surface of the accommodating passage to achieve the thermal insulation effect and the buffer connection effect, thereby reducing the rigid connection between the mounting case 80 and the vehicle body sensor.

In another embodiment, the mounting housing 80 is formed with a plurality of enclosures connected in series, at least one of the enclosures being a hollow structure, and the thermal barrier 90 being housed within the interior of the hollow structure.

Specifically, the heat insulating member 90 is accommodated in the hollow structure, so that the surrounding plate has a heat insulating effect, the mounting case 80 has a heat insulating effect, the heat insulating member 90 is accommodated in the surrounding plate, and the surrounding plate has a protection effect on the heat insulating member 90.

As shown in fig. 3, the cooling assembly 60 includes a water cooling head 610 and a plurality of partition plates 620, the water cooling head 610 has a receiving cavity, and a water inlet 611 and a water outlet 612 which are communicated with the receiving cavity, the plurality of partition plates 620 are arranged inside the receiving cavity at intervals, an overflow channel is formed between two adjacent partition plates 620, and the plurality of overflow channels are sequentially communicated end to end.

Specifically, water in the water tank 30 enters the inside of the overflowing channel communicated with the water inlet 611 through the water inlet 611 of the cooling assembly 60 of the telescopic water pipe 50, flows in the accommodating cavity, finally flows out of the overflowing channel communicated with the water outlet 612, and flows back to the water tank 30 from the water outlet 612 through the telescopic water pipe 50, the inside of the accommodating cavity is divided into a plurality of overflowing channels to realize qualitative flow of water flow, meanwhile, the contact area of the water flow with the water cooling head 610 and the partition plate 620 is increased, and the refrigeration effect is favorably improved.

Further, the water cooling head 610 has a contact surface abutting against the hot end surface of the semiconductor chilling plate 70, and the area of the contact surface is not smaller than that of the hot end surface.

Wherein, the contact surface of water-cooling head 610 is greater than the area of hot terminal surface to realize good radiating effect.

In order to facilitate the connection between the water cooling head 610 and the telescopic water pipe 50, the water inlet 611 and the water outlet 612 of the water cooling head 610 are provided with connecting joints made of stainless steel, so as to facilitate the installation of the telescopic water pipe 50 on the connecting joints.

Of course, the connector is not limited to a stainless steel connector, but may be a connector made of other materials, specifically, the connector is stainless to facilitate the connection of the telescopic water pipe 50.

In this embodiment, the heat sink of the vehicle body sensor further includes a dc power supply 20, and the dc power supply 20 is electrically connected to the water pump 40 of the water supply assembly and the semiconductor cooling plate 70.

Specifically, adopt DC power supply 20 to supply power to improve the holistic stability of device, the guarantee device is whole to tend towards intellectuality improvement convenience simultaneously.

In the present embodiment, the dc power supply 20 may be a battery pack.

Example two

The embodiment provides a vehicle body, and the vehicle body comprises a vehicle body sensor and a heat dissipation device of the vehicle body sensor in the first embodiment.

Specifically, the automobile body sensor is cooled through the heat dissipation device adopting the automobile body sensor, the effect of sustainable cooling is achieved, the cooling efficiency is improved, the influence of the temperature of the external environment on the automobile body sensor is reduced, the detection accuracy of the automobile body sensor is favorably guaranteed, and the use safety of the automobile body is improved.

From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:

semiconductor refrigeration piece 70 cooperation water circulative cooling device's form is in order to realize cooling down the processing to the automobile body sensor, wherein semiconductor refrigeration piece 70's cold junction and automobile body sensor butt to realize cooling body sensor, water circulative cooling device adopts the heat of circulating flow water in order to take away semiconductor refrigeration piece 70's hot junction, improve semiconductor refrigeration piece 70's refrigeration effect, adopt the mode and the sustainable use of physics cooling, the efficiency of cooling has been improved, use cost is reduced. Simultaneously, this application has the installation casing 80 that separates temperature piece 90 through the setting to fix a position the installation to the automobile body sensor, not only realizes fixing a position the automobile body sensor and makes things convenient for semiconductor refrigeration piece 70 to carry out the effect of cooling to the automobile body sensor, also keeps apart the heat in the external environment moreover to avoid the automobile body sensor to receive ambient temperature's influence to lead to the problem that measurement of efficiency is low to the temperature rise.

It is to be understood that the above-described embodiments are only some of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in other sequences than those illustrated or described herein.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat sink for a vehicle body sensor, characterized in that one end surface of the vehicle body sensor is mounted on a vehicle body, said heat sink for a vehicle body sensor comprising:

the cold end surface of the semiconductor refrigeration piece (70) is abutted against the other end surface of the vehicle body sensor;

the mounting shell (80), the mounting shell (80) is connected with the semiconductor refrigeration sheet (70), the mounting shell (80) is provided with an accommodating channel, and the vehicle body sensor is accommodated in the accommodating channel;

the thermal insulation piece (90) is mounted on the mounting shell (80), and the thermal insulation piece (90) extends along the circumferential direction of the accommodating channel to wrap the vehicle body sensor;

the water circulation cooling device at least comprises a water supply assembly and a cooling assembly (60), wherein the cooling assembly (60) is abutted to the hot end face of the semiconductor refrigeration sheet (70), the cooling assembly (60) comprises a water inlet (611) and a water outlet (612), and the water inlet (611) and the water outlet (612) are respectively communicated with the water supply assembly to realize water circulation.

2. The heat sink of a vehicle body sensor according to claim 1, wherein the water supply assembly comprises:

a mounting seat (10);

the water tank (30), the said water tank (30) is installed on said mount pad (10), the said water tank (30) has water supply inlet (31), return water inlet (32), water filling port (33) and drainage outlet;

a plurality of telescopic water pipes (50), wherein the water inlet (611) of the cooling assembly (60) and the water outlet (612) of the cooling assembly (60) are respectively communicated with the water supply port (31) and the water return port (32) through the telescopic water pipes (50);

the water pump (40), water pump (40) are provided with one at least, water pump (40) set up in water tank (30) or on telescopic water pipe (50) to regulation and control circulation flow rate.

3. The heat sink for a vehicle body sensor according to claim 2, wherein the bottom of the water tank (30) is provided with one of a mounting protrusion and a mounting groove, and the other of the mounting protrusion and the mounting groove is provided on the mounting seat (10), and at least a portion of the mounting protrusion protrudes into the mounting groove to position the water tank (30).

4. The heat sink for a vehicle body sensor according to claim 1,

the thermal insulation piece (90) is connected with the inner wall surface of the accommodating channel, and the thermal insulation piece (90) is arranged between the outer peripheral surface of the vehicle body sensor and the inner wall surface of the accommodating channel; or

The mounting shell (80) is formed by a plurality of enclosing plates which are connected in sequence, at least one enclosing plate is of a hollow structure, and the heat insulation piece (90) is accommodated in the hollow structure.

5. The heat sink of a vehicle body sensor according to claim 1, wherein the cooling assembly (60) comprises:

the water cooling head (610) is provided with an accommodating cavity, and the water inlet (611) and the water outlet (612) which are communicated with the accommodating cavity;

a plurality of baffle (620), it is a plurality of baffle (620) interval sets up the inside in holding chamber, adjacent two form between baffle (620) and overflow the passageway, it is a plurality of overflow the passageway head and the tail and communicate in order.

6. The heat sink of the vehicle body sensor according to claim 5, wherein the water cooling head (610) has a contact surface abutting against the hot end surface of the semiconductor cooling fin (70), and the area of the contact surface is not smaller than that of the hot end surface.

7. The heat sink for vehicle body sensor according to claim 5, wherein the water cooling head (610) is provided with a connection joint made of stainless steel at the water inlet (611) and the water outlet (612).

8. The heat sink for the vehicle body sensor according to any one of claims 1 to 7, further comprising a DC power supply (20), wherein the DC power supply (20) is electrically connected with the water pump (40) of the water supply assembly and the semiconductor chilling plate (70).

9. The heat sink of a vehicle body sensor according to any one of claims 1 to 7, wherein the semiconductor chilling plate (70) is a double-layer semiconductor chilling plate (70).

10. A vehicle body characterized in that it comprises a heat sink of a vehicle body sensor according to any one of claims 1 to 9.