CN217363294U - Micro earphone - Google Patents

Abstract

The utility model relates to an earphone technical field specifically is a micro earphone can solve among the prior art earphone and be difficult to satisfy small-size and go deep into the problem of ear demand. The micro earphone comprises a front cavity shell, a rear cavity shell and a middle cavity shell, wherein a loudspeaker module and a noise reduction microphone module are arranged in the front cavity shell; a main microphone module and a main control board are arranged in the rear cavity shell, and the loudspeaker module, the noise reduction microphone module and the main microphone module are respectively connected to the main control board; the middle cavity shell has flexibility and is positioned between the front cavity shell and the rear cavity shell, the front end of the middle cavity shell is communicated with the front cavity shell, and the rear end of the middle cavity shell is communicated with the rear cavity shell. The utility model discloses miniature earphone divide into front chamber shell, lumen shell and back chamber shell through the casing with the earphone to can rationally configure the inner structure and the electron device of earphone, be favorable to reducing the earphone size, the lumen shell has the flexibility, can adapt to different duct trails, increases the earphone and goes into the ear degree of depth and can satisfy the deep ear of different sign crowds and wear the demand.

Description

Micro earphone

Technical Field

The utility model relates to the technical field of earphones, specifically a miniature earphone of increase pleasant degree of depth.

Background

With the continuous development of earphone technology, the earphone is more and more popular in use, the functions, the structure and the appearance of the earphone are diversified, but the existing earphone is difficult to meet the requirements of tiny size and deep insertion due to the limitation of the size of an integrated part.

In order to meet the requirements of small size and deep in-ear, most earphone products generally accept the main function of earphone, for example, a lead wire is used in an earphone, usually, only a loudspeaker is arranged on an earphone main body, and a microphone meeting voice interaction is arranged on the lead wire, so that the earphone main body is miniaturized to increase the in-ear depth.

For wireless earphones such as TWS earphones (i.e., true wireless earphones), because there is no lead wire, the corresponding functional modules (speaker, microphone, battery, etc.) are all disposed on the earphone body, which results in the general size of the wireless earphones being larger, and some wireless earphones with larger size are suspended on the external ear, which is difficult to meet the requirements of small size and deep insertion.

SUMMERY OF THE UTILITY MODEL

The utility model provides a micro earphone can solve among the prior art earphone and be difficult to satisfy small-size and go deep into the problem of ear demand.

In order to achieve the technical purpose, the technical proposal of the utility model is that: a micro headset, comprising:

the front cavity shell is provided with a sound outlet hole and an ear sleeve positioned outside the sound outlet hole at the front end, and a loudspeaker module and a noise reduction microphone module are arranged in the front cavity shell;

the loudspeaker module, the noise reduction microphone module and the main microphone module are respectively connected with the main control board;

and the middle cavity shell is flexible and is positioned between the front cavity shell and the rear cavity shell, the front end of the middle cavity shell is communicated with the front cavity shell, and the rear end of the middle cavity shell is communicated with the rear cavity shell.

The longitudinal section of the middle cavity shell is wavy, the cross section of the middle cavity shell is in a ring shape with smooth transition, and the middle cavity shell can be bent and axially stretched.

Be formed with first joint portion on the rear end of front chamber shell, the front end of well chamber shell is formed with second joint portion, the rear end of well chamber shell is formed with third joint portion, be formed with fourth joint portion on the front end of back chamber shell, first joint portion with second joint portion cooperation joint, third joint portion with fourth joint portion cooperation joint.

The loudspeaker module and the front cavity shell are coaxially arranged, and the noise reduction microphone module is located on a sound channel of the loudspeaker module.

The loudspeaker body of the loudspeaker module is a micro-electromechanical loudspeaker, the noise reduction microphone body of the noise reduction microphone module is a micro-electromechanical microphone, and the main microphone body of the main microphone module is a micro-electromechanical microphone.

And the sound outlet hole is provided with acoustic mesh cloth, and the sound hole part of the loudspeaker module, the sound hole part of the main microphone module and the sound hole part of the noise reduction microphone module are all provided with acoustic mesh cloth.

And the rear cavity shell is provided with a sound pressure balance hole, and the sound pressure balance hole is provided with acoustic mesh cloth.

Still be equipped with IMU chip module in the back cavity shell, IMU chip module connect in the main control board.

The loudspeaker module includes speaker body and speaker FPC, it includes falls the microphone body of making an uproar and falls the microphone PCB of making an uproar to fall the microphone module, main microphone module includes main microphone body and main microphone PCB, IMU chip module includes IMU chip body and IMU chip PCB, fall the microphone PCB of making an uproar with speaker FPC welded connection, IMU chip PCB with main microphone PCB passes through FPC welded connection, speaker FPC through the bridging pencil connect in IMU chip PCB, the bridging pencil is worn to locate in the well chamber shell, IMU chip PCB connects the main control board.

The IMU chip module and the main microphone module are oppositely arranged in the direction vertical to the axial direction of the rear cavity shell.

Compared with the prior art, the utility model has the advantages of it is following and positive effect:

the utility model discloses a micro earphone, through dividing into the casing of earphone front chamber shell, well chamber shell and back chamber shell, thereby can rationally dispose the inner structure and the electron device of earphone, be favorable to reducing the earphone size, realize miniaturized design, for example need be close to the speaker module and the microphone module that makes an uproar of falling of earphone front end (being the sound end) and establish in the front chamber shell, the main microphone module that is used for collecting sound establishes in the back chamber shell, can set up in the well chamber shell and carry out the circuit etc. that electric connection and signal connection are carried out to electron device in the front chamber shell and the electron device in the back chamber shell;

the middle cavity shell has flexibility, can keep the deformed shape after being deformed by stress and canceling acting force, and can adapt to different auditory canal tracks, increase the in-ear depth of the earphone and meet the in-depth ear wearing requirements of people with different physical signs;

the main microphone module is established in the back chamber shell, compares the earphone that has the lead wire now and main microphone module establishes on the lead wire, the utility model discloses well microphone module position is comparatively fixed, does not basically have and rocks, and it is big to be difficult for causing microphone pickup distortion or noise, and is favorable to making the earphone structure succinct.

Drawings

Fig. 1 is a perspective view of a micro headset according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of a micro headset according to an embodiment of the present invention;

FIG. 3 is a schematic view of the inner structure of the front cavity housing in the embodiment of the present invention;

fig. 4 is a schematic diagram of the internal structure of the rear cavity shell in the embodiment of the present invention;

fig. 5 is a perspective view of a middle chamber shell in an embodiment of the present invention;

fig. 6 is a schematic view of a connection structure of the main microphone module and the IMU chip module according to an embodiment of the present invention.

Reference numerals: 10. a front cavity shell; 11. a sound outlet hole; 20. a rear cavity shell; 21. a sound pickup hole; 22. a fourth clamping part; 23. a sound pressure balance hole; 30. a middle chamber shell; 31. a second clamping part; 32. a third clamping connection part; 40. a speaker module; 41. a speaker body; 42. a speaker FPC; 50. a noise reduction microphone module; 51. a noise reduction microphone body; 52. a noise reduction microphone PCB; 60. a main microphone module; 61. a main microphone body; 62. a main microphone PCB; 70. mounting a bracket; 71. a through part; 80. an IMU chip module; 81. an IMU chip body; 82. an IMU chip PCB; 90. bridging the wire harness; 100. an IMU module support; 110. acoustic mesh cloth; 120. a primary coaxial line bundle; 130. a connector terminal; 140. ear cap; 150. an FPC board.

Detailed Description

The technical solution of the present invention will be described in further detail with reference to the accompanying drawings and the detailed description.

Referring to fig. 1 to 6, the micro headset of the present embodiment, in particular, a lead headset, includes a front cavity housing 10, a rear cavity housing 20, and a middle cavity housing 30.

The front cavity shell 10 encloses a front cavity of the earphone, a sound outlet hole 11 communicated with the front cavity of the earphone and an ear cap 140 located outside the sound outlet hole 11 are arranged at the front end of the front cavity shell 10 (i.e. the sound outlet end of the earphone), the ear cap 140 is sleeved on the front end of the front cavity shell 10, and a speaker module 40 and a noise reduction microphone module 50 are arranged in the front cavity shell 10.

The rear cavity shell 20 encloses a rear cavity of the earphone, the rear cavity shell 20 is provided with a sound pickup hole 21, a main microphone module 60 and a main control board (not shown) are arranged in the rear cavity shell 20, namely the rear cavity, the speaker module 40, the noise reduction microphone module 50 and the main microphone module 60 are respectively connected to the main control board, and the main control board is connected with external equipment through a main coaxial wire harness 120. Specifically, the head end of the main coaxial cable 120 extends into the rear cavity shell 20, and is connected to the main control board through a welding process, and the tail end is connected to an external device through a connector terminal 130 (such as a usb type-C or micro hdmi terminal); the sound pickup hole 21 is preferably located close to the rear end of the rear cavity housing 20, so that the sound pickup hole can be closer to the mouth of the user in a wearing state, the accuracy of voice signal pickup is improved, and the communication quality is improved.

The middle cavity shell 30 is flexible and tubular, is located between the front cavity shell 10 and the rear cavity shell 20, and encloses a middle cavity of the earphone, the front end of the middle cavity shell 30 is communicated with the front cavity shell 10, and the rear end is communicated with the rear cavity shell 20, so that the middle cavity is communicated with the front cavity and the rear cavity, and a complete earphone sound cavity is formed.

Specifically, the front cavity shell 10 and the rear cavity shell 20 are thin-walled shells formed by metal or polymer plastic, and the middle cavity shell 30 can be made of a conventional flexible material, for example, a flexible material prepared by adding carbon fiber or glass fiber to a flexible resin (one of silica gel, rubber, PA, PP, PE, PET, and TPEE) as a base. Wherein, PA is polyamide material commonly called nylon, PP is polypropylene, PE is polyethylene, PET is polyethylene terephthalate commonly called polyester resin, and TPEE is thermoplastic polyester elastomer. Earmuff 140 is for having elastic soft material preparation, for example silica gel, and its interference cover is established on the front end of front chamber shell 10, is equipped with the buckle structure of mutually supporting on the inner wall of earmuff 140 and the front end outer wall of front chamber shell 10 simultaneously to improve the reliability that earmuff 140 and front chamber shell 10 are connected, prevent effectively that earmuff 140 from droing along the axial.

According to the micro-earphone, the shell of the earphone is divided into the front cavity shell, the middle cavity shell and the rear cavity shell, so that the internal structure and electronic devices of the earphone can be reasonably configured, the size of the earphone is reduced, and the micro-design is realized; meanwhile, the middle cavity shell has flexibility, can keep the deformed shape after being stressed and deformed and canceling the acting force, can adapt to different auditory canal tracks, increases the in-ear depth of the earphone, and can meet the in-depth ear wearing requirements of people with different physical signs.

Further, as shown in fig. 2, the longitudinal section of the middle housing 30 is wavy, the cross section thereof is in a ring shape with smooth transition, and the middle housing 30 can be bent and axially stretched, so that the deformability of the middle housing 30 can be improved, the universality of the middle housing 30 with different auditory canal tracks can be further improved, and the requirements of people with different physical signs on deep ear wearing can be further met; meanwhile, the surface of the middle cavity shell 30 is smooth, so that the wearing comfort of the earphone can be improved.

For the connection of middle cavity shell 30 with front cavity shell 10 and rear cavity shell 20, in this embodiment, first joint portion 12 is formed on the rear end of front cavity shell 10, second joint portion 31 is formed on the front end of middle cavity shell 30, third joint portion 32 is formed on the rear end of middle cavity shell 30, fourth joint portion 22 is formed on the front end of rear cavity shell 20, first joint portion 12 cooperates the joint with second joint portion 31, and third joint portion 32 cooperates the joint with fourth joint portion 22.

As shown in fig. 2 and 3, the first catching portion 12 is a catching hole formed on the rear end surface of the front cavity case 10, and the second catching portion 31 is an annular constricted portion formed at the front end of the middle cavity case 30; similarly, the fourth engagement portion 22 is an engagement hole formed on the front end surface of the rear chamber case 20, and the third engagement portion 32 is an annular constricted portion formed at the rear end of the middle chamber case 30. During assembly, the front end and the rear end of the middle cavity shell 30 are respectively extruded into the front cavity shell 10 and the rear cavity shell 20 through deformation of the middle cavity shell, the first clamping portion 12 is clamped in the second clamping portion 31, the fourth clamping portion 22 is clamped in the third clamping portion 32, and glue dispensing processing can be performed at the clamping position to enhance connection reliability. The connecting structure has high reliability and simple structure, does not need to additionally arrange a fastening connecting piece, and is favorable for the miniaturization design of products.

As shown in fig. 2 and 3, a mounting bracket 70 is fixedly disposed in the front cavity housing 10, the speaker module 40 and the noise reduction microphone module 50 are both fixedly disposed on the mounting bracket 70, the speaker module 40 and the front cavity housing 10 are coaxially disposed, and the noise reduction microphone module 50 is located on a sound channel of the speaker module 40. The sound channel of the speaker module 40 faces the sound outlet 11, and the noise reduction microphone module 50 is located at the front side of the speaker module 40, so that the noise reduction of the sound emitted by the speaker module 40 is facilitated, and the noise reduction effect is improved. The mounting bracket 70 is formed in a ring-shaped sheet shape, and has a through portion 71 corresponding to the acoustic channel of the speaker module 40 so as not to interfere with the sound of the speaker module 40 being transmitted through the sound output hole 11.

In order to further reduce the size of the micro headset of this embodiment, the speaker body of the speaker module 40 in this embodiment is a micro electro mechanical system speaker, i.e. a MEMS speaker, the noise reduction microphone body of the noise reduction microphone module 50 is a micro electro mechanical system microphone, and the main microphone body of the main microphone module 60 is a micro electro mechanical system microphone, i.e. a MEMS microphone. The MEMS loudspeaker and the MEMS microphone are small in size, so that the size of the earphone is further reduced, and the in-ear depth and wearing concealment are improved.

For the function of richening this embodiment believe the earphone a little, still be equipped with IMU chip module 80 in the back chamber shell 20, inertia measurement unit chip module promptly, IMU chip module 80 connects in the main control board. The structure and the working principle of the IMU chip module 80 are the same as those of the prior art, and are not described herein, and may be a nine-axis or six-axis IMU chip module, which realizes wearing posture and orientation recognition and in-ear removal recognition, and performs partial signal processing and conversion.

Further, the speaker module 40 includes a speaker body 41 and a speaker FPC42, where the FPC is a short for flexible circuit board; the noise reduction microphone module 50 comprises a noise reduction microphone body 51 and a noise reduction microphone PCB52, wherein the PCB is a Printed Circuit Board (PCB), which is a hard board for short; the main microphone module 60 comprises a main microphone body 61 and a main microphone PCB62, the IMU chip module 80 comprises an IMU chip body 81 and an IMU chip PCB82, the noise reduction microphone PCB52 is connected with the speaker FPC42 in a welding manner, the IMU chip PCB82 is connected with the main microphone PCB62 through FPC in a welding manner, the speaker FPC42 is connected with the IMU chip PCB82 through a bridging wire harness 90, as shown in fig. 2 and 3, the bridging wire harness 90 is connected with the speaker FPC42 in a welding manner at one end, the other end is connected with the IMU chip PCB82 in a welding manner, the bridging wire harness 90 penetrates through the middle cavity shell 30, and the IMU chip PCB82 is connected with a main control board. Then each module all disposes PCB board or FPC board in this embodiment to each module is a complete independent part, adopt bridging pencil 90 and FPC soft board to connect between each module, finally connect the main control board by one of them module for example IMU chip PCB82 that IMU chip module 80 corresponds, then conveniently set up the position of each module according to the interior space condition of front cavity shell 10 and rear cavity shell 20 is nimble, and reduce the quantity of connecting the pencil, be favorable to making whole earphone structure more compact, the size is littleer.

Also, in order to further make the structure compact, as shown in fig. 6, the IMU chip module 80 and the main microphone module 60 are disposed opposite to each other in a direction perpendicular to the axial direction of the rear cavity case 20, and the FPC board 150, which is welded between the IMU chip module 80 and the main microphone module 60, is bent in an approximately semicircular shape. For example, if the back cavity housing 20 is a cylindrical housing, the IMU chip module 80 and the main microphone module 60 are disposed opposite to each other in the radial direction of the back cavity housing 20, and are attached as much as possible, and the structure is more compact, so that the space of the back cavity housing 20 is fully utilized, which is beneficial to further reducing the volume of the back cavity housing 20.

Specifically, an IMU module support 100 is fixedly disposed in the back cavity case 20, and the IMU chip PCB82 is fixedly disposed on the IMU module support 100, so that the IMU chip module 80 and the main microphone module 60 are fixedly disposed on the IMU module support 100. The IMU module holder 100 is specifically located in a gap between the IMU chip module 80 and the main microphone module 60, further making full use of space, and the IMU module holder 100 may be integrally formed with the rear cavity case 20.

In this embodiment, the sound outlet hole 11 of the front cavity shell 10 is provided with the acoustic mesh 110 to adjust the audio quality and prevent foreign matters from entering the earphone sound cavity; in a similar way, the sound hole position of the speaker module 40 is also provided with acoustic mesh cloth, the speaker module 40 and the front cavity shell 10 are pasted and sealed through the back adhesive, so as to adjust the output audio quality of the speaker, the sound hole position of the main microphone module 60 and the sound hole position of the noise reduction microphone module 50 are both provided with acoustic mesh cloth, the main microphone module is pasted and fixed through the back adhesive, and the input audio quality of the microphone is adjusted through the specific through hole rate.

Furthermore, the rear cavity shell 20 is further provided with a sound pressure balance hole 23, the sound pressure balance hole 23 is provided with acoustic mesh cloth, and the sound pressure balance hole 23 is matched with the acoustic mesh cloth thereon to balance the air pressure of the acoustic cavity.

In addition, it should be noted that, in this embodiment, the micro headset may also be a wireless headset, such as a TWS headset (true wireless headset), and at this time, the wireless communication module, such as a bluetooth module, is used to communicate with an external device without using a main coaxial cable to connect the external device.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or that equivalents may be substituted for elements thereof; such modifications and substitutions do not depart from the spirit and scope of the present invention, which is claimed in the appended claims.

Claims (10)

1. A micro headset, comprising:

the front cavity shell is provided with a sound outlet hole and an ear sleeve positioned outside the sound outlet hole at the front end, and a loudspeaker module and a noise reduction microphone module are arranged in the front cavity shell;

the rear cavity shell is provided with a sound pickup hole, a main microphone module and a main control board are arranged in the rear cavity shell, and the loudspeaker module, the noise reduction microphone module and the main microphone module are respectively connected to the main control board;

and the middle cavity shell has flexibility, is positioned between the front cavity shell and the rear cavity shell, and is communicated with the front cavity shell at the front end and the rear cavity shell at the rear end.

2. The micro-headset of claim 1,

the longitudinal section of the middle cavity shell is wavy, the cross section of the middle cavity shell is in a shape of a circular ring in smooth transition, and the middle cavity shell can be bent and axially stretched.

3. The micro-headset of claim 2,

be formed with first joint portion on the rear end of front chamber shell, the front end of well chamber shell is formed with second joint portion, the rear end of well chamber shell is formed with third joint portion, be formed with fourth joint portion on the front end of back chamber shell, first joint portion with second joint portion cooperation joint, third joint portion with fourth joint portion cooperation joint.

4. The micro-headset of claim 1,

the loudspeaker module and the front cavity shell are coaxially arranged, and the noise reduction microphone module is located on a sound channel of the loudspeaker module.

5. The micro headset of claim 1,

the loudspeaker body of the loudspeaker module is a micro-electromechanical loudspeaker, the noise reduction microphone body of the noise reduction microphone module is a micro-electromechanical microphone, and the main microphone body of the main microphone module is a micro-electromechanical microphone.

6. The micro-headset of claim 1,

and the sound outlet hole is provided with acoustic mesh cloth, and the sound hole part of the loudspeaker module, the sound hole part of the main microphone module and the sound hole part of the noise reduction microphone module are all provided with acoustic mesh cloth.

7. The micro headset of claim 1,

and the rear cavity shell is provided with a sound pressure balance hole, and the sound pressure balance hole is provided with acoustic mesh cloth.

8. The micro-headset according to any one of claims 1 to 7,

still be equipped with IMU chip module in the back cavity shell, IMU chip module connect in the main control board.

9. The micro-headset of claim 8,

the loudspeaker module includes speaker body and speaker FPC, it includes falls the microphone body of making an uproar and falls the microphone PCB of making an uproar to fall the microphone module, main microphone module includes main microphone body and main microphone PCB, IMU chip module includes IMU chip body and IMU chip PCB, fall the microphone PCB of making an uproar with speaker FPC welded connection, IMU chip PCB with main microphone PCB passes through FPC welded connection, speaker FPC through the bridging pencil connect in IMU chip PCB, the bridging pencil is worn to locate in the well chamber shell, IMU chip PCB connects the main control board.

10. The micro-headset of claim 9,

the IMU chip module and the main microphone module are oppositely arranged in the direction vertical to the axial direction of the rear cavity shell.

Images