CN217359656U

CN217359656U - Detection system for semiconductor packaging structure

Info

Publication number: CN217359656U
Application number: CN202220284725.8U
Authority: CN
Inventors: 李诗婷; 张桂铭; 刘记纲; 汪立庭
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2022-02-11
Filing date: 2022-02-11
Publication date: 2022-09-02
Anticipated expiration: 2032-02-11

Abstract

The disclosed embodiment relates to a detection system for a semiconductor packaging structure, which comprises: heating furnace; and the optical system is positioned outside the heating furnace, a perspective window is formed in the side surface of the heating furnace, and the optical system acquires the image of the object to be measured in the heating furnace through the perspective window. An object of the utility model is to provide a detecting system for semiconductor package structure to observe the production and the change of semiconductor package structure defect in the heating environment.

Description

Detection system for semiconductor packaging structure

Technical Field

The embodiment of the utility model provides a detecting system for semiconductor package structure is related to.

Background

With the trend of electronic 3C products (computers), Communication and consumer electronics (consumer electronics) becoming smaller and thinner, deformation of composite material structures in products becomes more and more important, and thus the testing of products at ambient temperature must be more precise to ensure reliability of testing in product environments. In the development of products toward miniaturization, inspection of products for defects in materials and dimensional accuracy of the products must be finer. Many defects of the packaged product are generated in a heating process, and a chip (chip) finds abnormality after the heating process and then observes the defect pattern using a microscope, which generally has the following problems: only defect patterns were observed; the heating process can be divided into stages of heating up → holding temperature → cooling down, etc. preliminarily, and it is impossible to know at which stage the defect is generated; the continuous change condition of a chip (chip) when the defect is generated in a heating environment cannot be observed; optical inspection equipment such as microscopes and video cameras cannot be used in a heated environment.

SUMMERY OF THE UTILITY MODEL

To solve the problems in the related art, an object of the present invention is to provide a detection system for a semiconductor package structure, so as to observe the generation and variation of defects in the semiconductor package structure in a heating environment.

To achieve the above object, the present invention provides a detecting system for a semiconductor package structure, including: a heating furnace; and the optical system is positioned outside the heating furnace, a perspective window is formed in the side surface of the heating furnace, and the optical system acquires the image of the object to be measured in the heating furnace through the perspective window.

Preferably, in the inspection system for the semiconductor package structure, the optical system obtains an image of a side surface of the object to be inspected in the heating furnace through the transparent window.

Preferably, the optical system includes a CCD camera that takes an image acquired via the microscope, a microscope, and a moving mechanism that carries the CCD camera and the microscope and is used to adjust the relative position of the microscope and the object to be measured inside the heating furnace, the microscope and the transparent window being located at the same height level.

Preferably, one end of the microscope faces the perspective window, and the other end of the microscope is connected with the CCD camera through the light path.

Preferably, the inspection system for a semiconductor package structure further comprises: the driver drives the three-axis platform to move in three axes.

Preferably, the drive is a motor.

Preferably, the control system determines the direction and distance of movement of the three axis platform from the image from the CCD camera.

Preferably, each shaft of the three-shaft platform is provided with a motor.

Preferably, the gas supply means supplies nitrogen gas.

Preferably, the heating furnace is an oxygen-free environment.

Preferably, the distance between the object to be measured and the camera is located in the focal length section of the camera.

Preferably, the inspection system for a semiconductor package structure further comprises: and the air knife is positioned between the perspective window and the optical system, and the air emitted by the air knife passes through the interval between the optical system and the perspective window.

Preferably, the air knife is arranged on the outer side wall of the side surface of the heating furnace and is positioned above the perspective window.

Preferably, the heating furnace is internally provided with a heating plate, and the heating plate is used for bearing the object to be measured.

Preferably, the heating furnace further has a plurality of Infrared (IR) lamps disposed above the heating plate.

Preferably, the inspection system for a semiconductor package structure further comprises: and the shockproof platform is used for bearing the heating furnace and the optical system.

Preferably, the material of the load-bearing surface of the anti-vibration platform is marble.

Preferably, the support leg of the anti-vibration platform comprises a vibration damping device.

Preferably, the image comprises a photograph and/or a video for the inspection system of the semiconductor packaging structure.

Drawings

Fig. 1 to 4 are a schematic perspective view, a front view, a top view and a left side view, respectively, of an inspection system for a semiconductor package structure according to an embodiment of the present application.

Detailed Description

In order to better understand the spirit of the embodiments of the present application, the following further description is given in conjunction with some preferred embodiments of the present application.

Embodiments of the present application will be described in detail below. Throughout the specification, the same or similar components and components having the same or similar functions are denoted by like reference numerals. The embodiments described herein with respect to the figures are illustrative in nature, are diagrammatic in nature, and are used to provide a basic understanding of the present application. The embodiments of the present application should not be construed as limiting the present application.

As used herein, the terms "substantially", "substantially" and "about" are used to describe and illustrate minor variations. When used in conjunction with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely as well as instances where the event or circumstance occurs in close proximity. For example, when used in conjunction with numerical values, the terms can refer to a range of variation of less than or equal to ± 10% of the stated numerical value, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%. For example, two numerical values are considered to be "substantially" the same if the difference between the two numerical values is less than or equal to ± 10% (e.g., less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1%, or less than or equal to ± 0.05%) of the mean of the values.

In this specification, unless specified or limited otherwise, relative terms such as: terms of "central," "longitudinal," "lateral," "front," "rear," "right," "left," "inner," "outer," "lower," "upper," "horizontal," "vertical," "above," "below," "top," "bottom," and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the orientation as then described in the discussion or as shown in the drawing figures. These relative terms are for convenience of description only and do not require that the present application be constructed or operated in a particular orientation.

Additionally, amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity, and should be interpreted flexibly to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited.

Moreover, for convenience in description, "first," "second," "third," etc. may be used herein to distinguish between different elements of a figure or series of figures. "first," "second," "third," etc. are not intended to describe corresponding components.

Fig. 1 to 4 are a schematic perspective view, a front view, a top view and a left view, respectively, of an inspection system 10 for a semiconductor package structure (e.g., a chip, a substrate, a die, etc. package), according to an embodiment of the present application, wherein the inspection system 10 for a semiconductor package structure includes a heating furnace (oven)100 and an optical system 200, the optical system 200 is located outside the heating furnace 100, a transparent window 300 is provided at a side of the heating furnace 100, the optical system 200 is aligned with the transparent window 300, and an image of an object to be tested inside the heating furnace 100 is acquired through the transparent window 300. In some embodiments, the oven 100 and the optical system 200 are carried by a shock platform, and the support legs 520 of the shock platform include shock absorbing devices, such as pneumatic shock absorbers, damping spring shock absorbers, and the like. In some embodiments, the material of the load-bearing surface 500 of the anti-seismic platform is marble.

In some embodiments, the optical system 200 includes a Charge Coupled Device (CCD) camera 220, a microscope 240, and a moving mechanism 260, one end of the microscope 240 faces the transparent window 300, and an air knife 400 is disposed between the transparent window 300 and the optical system 200, wherein the air knife 400 is disposed on an outer sidewall of a side surface of the heating furnace 100 and above the transparent window 300, and wind emitted from the air knife 400 passes through a space between the optical system 200 and the transparent window 300, thereby blocking radiant heat from the transparent window 200 and avoiding damage to the optical system 200. The other end of the microscope 240 is connected to the CCD camera 220 through an optical path, and the distance between the object to be measured and the CCD camera 220 is located within the focal length of the camera, so that the object to be measured in the heating furnace 100 can be clearly observed by the CCD camera 220, and the CCD camera 220 takes a picture or records a video through the microscope 240 to obtain an image. The transparent window 300 of the embodiment of the present application is located at the side surface (not the top surface/the bottom surface) of the heating furnace 100, and the microscope 240 and the transparent window 300 are located at the same height, so that the process of generating defects of the semiconductor package structure during the heating process can be observed from the side surface, and the cross section of the object to be measured can also be observed; and the problem of image distortion caused by refraction due to the change of air density between the optical system and the heating furnace (influenced by the temperature of the heating furnace) when the object to be measured is observed from the upper part can be avoided.

In some embodiments, the movement mechanism 260 is a three-axis (i.e., x-axis, y-axis, and z-axis) stage, the movement mechanism 260 carrying the CCD camera 220 and the microscope 240. In some embodiments, the inspection system 10 of the semiconductor package further includes a motor serving as a driver, and each axis of the three-axis platform is driven by a corresponding motor. The inspection system 10 for semiconductor packages further includes a gas supply device 120, and a gas spraying port of the gas supply device 120 is located in the heating furnace 100. in some embodiments, the gas supply device 120 supplies nitrogen gas, thereby providing an oxygen-free environment for the heating furnace 100. In some embodiments, the gas supply device may also supply oxygen, carbon dioxide, compressed dry air, humidified air, high humidity air, etc. to create a heating environment suitable for production, or may directly use the current temperature and humidity. The heating furnace 100 includes a heating plate for supporting an object to be measured and a plurality of Infrared (IR) lamps above the heating plate, and the heating plate and the IR lamps can be heated simultaneously to control the temperature difference between the upper portion and the lower portion of the object to be measured within 10 ℃, so as to avoid material changes (e.g., warpage due to different thermal stresses) caused by the temperature difference between the upper portion and the lower portion.

In some embodiments, a control system (e.g., a computer or processor) is electrically connected to the movement mechanism 260 and the motor for controlling the position and/or orientation of the movement mechanism 260. Therefore, the moving mechanism 260 can be moved semi-automatically rather than manually, and the control system controls the moving mechanism 260 to adjust the relative positions of the microscope 240 and the object to be measured in the heating furnace 100. In some embodiments, the CCD camera 220 is also electrically connected to the control system and transmits the acquired images to the control system, which can determine the direction and distance to control the motor-driven moving mechanism 260 through the images from the CCD camera 220. In some embodiments, the microscope 240 may be a product manufactured by mitutoyo brand model number FS70, the CCD camera 220 employs a phase difference AF (auto focus) mode, for example, a Line sensor auto focus (LAFF) system is used to keep monitoring the object to be measured in the whole process, the object to be measured is located on the focal length of the CCD camera 220 in the whole temperature variation process, and the CCD camera 220 can record and track the target point on the object to be measured for a long time. In some embodiments, the control system may process images (including photos and videos) acquired by the CCD camera 220 using Image processing software, such as a matrix Image Library (Matrox Image Library) and an open source computer vision Library (OpenCV). In some embodiments, a temperature sensor may be provided in the furnace 100 to monitor the temperature within the furnace 100 in real time and may be synchronized to the control system. In some embodiments, the temperature profile of the heating furnace 100 can be customized according to different production processes of the object to be measured, and the temperature of the heating furnace 100 can be controlled within 350 ℃. In some embodiments, the lateral dimension of the test object within the furnace 100 may be within 15cm, the available magnification of the microscope 240 is 20 to 2500 times, the heating environment of the furnace 100 may be air, nitrogen, etc., and an oxygen detector may be provided in the furnace 100 to monitor the presence or absence of oxygen while simulating an oxygen-free environment.

The inspection system 10 of the embodiments of the present application can simulate the temperature of the heating process of the semiconductor package and monitor the change of the side of the package throughout the temperature change to observe the specific stage of defect generation. The optical system 200 is located at the side of the heating furnace 100, the photographed image is not distorted due to the density change of the gas, and the air knife further reduces the radiant heat transferred from the heating furnace 100 to the optical system 200, and the optical system 200 is not damaged by the high temperature of the heating furnace 100.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An inspection system for a semiconductor package structure, comprising:

a heating furnace;

and the optical system is positioned outside the heating furnace, a perspective window is formed in the side surface of the heating furnace, and the optical system acquires the image of the object to be measured in the heating furnace through the perspective window.

2. The inspection system of claim 1, wherein the optical system obtains an image of a side surface of the dut inside the furnace through the transparent window.

3. The inspection system according to claim 1, wherein the optical system comprises a CCD camera for capturing the image captured by the microscope, a microscope, and a moving mechanism for carrying the CCD camera and the microscope and adjusting a relative position of the microscope and the object in the heating furnace.

4. The detecting system for detecting the semiconductor package according to claim 3, wherein one end of the microscope faces the transparent window, and the other end of the microscope is connected to the CCD camera via the optical path.

5. The inspection system for semiconductor packages according to claim 4, further comprising:

the driver, the moving mechanism is the triaxial platform, the driver drive the triaxial platform does the triaxial and removes.

6. The inspection system for semiconductor packages according to claim 5, wherein the driver is a motor.

7. The inspection system for semiconductor packages according to claim 1, further comprising:

a gas supply device, a gas spraying opening of the gas supply device is positioned in the heating furnace.

8. The inspection system for semiconductor packages according to claim 7, wherein the gas supply device supplies nitrogen gas.

9. The inspection system for semiconductor packages according to claim 1, further comprising:

and the air knife is positioned between the perspective window and the optical system, and the air emitted by the air knife passes through the optical system and the interval between the perspective windows.

10. The inspection system of claim 1, wherein the heating furnace has a heating plate therein, and the heating plate is used for carrying the object to be inspected.