CN217336010U

CN217336010U - Display device

Info

Publication number: CN217336010U
Application number: CN202220510171.9U
Authority: CN
Inventors: 杨寄桃; 黄少华; 胡向峰; 蔡胜平
Original assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Current assignee: Shenzhen Skyworth RGB Electronics Co Ltd
Priority date: 2022-03-08
Filing date: 2022-03-08
Publication date: 2022-08-30
Anticipated expiration: 2032-03-08

Abstract

The utility model discloses a display device, which comprises a back plate and a PCB (printed Circuit Board), wherein the PCB is provided with a transformer and components, pins of the transformer do not protrude out of the surface of the PCB facing the back plate, and pins of the components do not protrude out of the surface of the PCB facing the back plate; the PCB board orientation the surface of backplate is provided with the insulating piece, the insulating piece is attached on the surface of backplate. The problem of among the prior art because the spacing distance between PCB board and the backplate to lead to whole display device's thickness to increase, be unfavorable for realizing display device's ultra-thinness needs is solved.

Description

Display device

Technical Field

The utility model relates to a display device technical field especially relates to a display device.

Background

At present, an LED television mainly comprises six parts, namely glass, a diaphragm, an LED lamp bar, a back plate, a function board (a main board, a power supply board and the like) and a rear cover. As shown in fig. 1, taking a power panel as an example, a conventional power panel includes a PCB 20, various components 40 (e.g., diodes, transistors, resistors, etc.) are soldered on the PCB 20, and pins 41 of the soldered components 40 protrude from the back surface of the PCB 20, so that the PCB 20 and the back plate 10 need to be spaced apart from each other to ensure the electrical safety of the PCB, so that the protruding pins 41 can be accommodated in the space.

In order to separate the PCB board 20 from the back plate 10, the rivet column 11 and the convex hull screw hole column 12 are arranged on the back plate 10, the rivet column 11 and the convex hull screw hole column 12 both protrude out of the back plate 10, and the PCB board is arranged on the rivet column or/and the convex hull screw hole column, so that the PCB board and the back plate keep a certain separation distance, but because of the separation distance, the thickness of the whole display device is increased, more installation space is occupied, and the ultrathin requirement of the display device is not facilitated to be realized.

Accordingly, the prior art is yet to be improved and developed.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned prior art not enough, the utility model aims to provide a display device solves among the prior art because the spacing distance between PCB board and the backplate to lead to whole display device's thickness to increase, be unfavorable for realizing the problem that display device's ultra-thinness needs.

The technical scheme of the utility model as follows:

a display device comprises a back plate and a PCB, wherein components are arranged on the PCB, and pins of the components do not protrude out of the surface of the PCB facing the back plate;

the surface of the PCB, facing the back plate, is provided with an insulating sheet, and the insulating sheet is attached between the back plate and the surface of the PCB;

the backboard is provided with a clamping hook, and the PCB is embedded in the clamping hook.

Through the above scheme, through welding components and parts to the PCB board after, the back of PCB board does not have the pin and exposes, also there is not sharp-pointed pin protrusion at the back of PCB board, nevertheless consider that power part has the high pressure to exist, set up between PCB board and backplate through increasing the insulating piece, thereby avoid the high pressure of power to produce the influence to other devices on the backplate, it is provided with the insulating piece to make between the PCB board like this, and the thickness of insulating piece is less, be less than original riveting post or/and convex closure screw hole post far away, need not set up the spacing distance, thereby can cancel the design of original riveting post or/and convex closure screw hole post, thereby the thickness of structure has been reduced. Through set up the pothook on the backplate, removed rivet post and convex closure screw hole post on the former backplate, in order to guarantee the complete machine ultra-thinization, adopt broken hole bending process on the backplate, form the pothook, when the assembly, the PCB board inserts and inlay card in the pothook to fix the PCB board on the backplate

Further, still be provided with the transformer on the PCB board, the stitch of transformer do not bulge in the PCB board orientation the surface of backplate is provided with a plurality of location portions on the transformer, be provided with a plurality of spacing portions that match with location portion on the PCB board, and location portion is connected to spacing portion and the mounted position of injecing the transformer.

Through above-mentioned scheme, will make the stitch of transformer not protrusion in the PCB board, then its pin shortens, can not carry out the jack location, for making the location of transformer more accurate, set up a plurality of location portions on the transformer, cooperate through spacing portion on a plurality of location portions and the PCB board, can inject the position of PCB board and transformer, like this when the welding, prescribe a limit to the position of transformer on the PCB board earlier through location portion, carry out the welding of transformer again. Therefore, the installation position of the transformer is more accurate, and the transformer is installed.

Furthermore, the positioning part is a positioning hole, and the limiting part is a positioning bulge.

Through the scheme, the PCB is provided with the positioning protrusion, and the transformer is sleeved on the positioning protrusion through the positioning hole, so that the installation position of the transformer on the PCB is limited, and then the transformer is welded. Therefore, the installation position of the transformer is more accurate, and the installation of the transformer and the PCB is more efficient.

Further, the insulating sheet is a mylar sheet, and the mylar sheet covers the back of the PCB.

Through the scheme, the Mylar film has stable size, flatness, excellent tear strength, heat resistance, cold resistance, moisture resistance, water resistance, chemical corrosion resistance, super-strong insulating property and excellent electrical, mechanical, heat resistance and chemical resistance. Can replace common adhesive tapes and is suitable for packaging electronic components when the electronic components are packaged on a machine, so that the electronic components are safer in use.

Further, the thickness of the insulating sheet is 0.4-0.5 mm.

Through the scheme, the insulating sheet can be guaranteed to have small thickness, and meanwhile the high voltage of the transformer does not influence other components on one side of the backboard.

Furthermore, a threaded hole is formed in the back plate, and the PCB is fixed on the back plate through the threaded hole connected through a screw.

Through the scheme, the PCB is fixed on the back plate through the screws, so that the PCB is more firmly fixed.

Furthermore, the components are patch components, and the transformer is a patch transformer.

Through above-mentioned scheme, through encapsulating the optimization with components and parts for all components and parts and transformer can both carry out the paster ization and handle, and components and parts and transformer welding after the paster ization are handled form the finished product board on the PCB board, and with the components and parts welding after the paster ization to the PCB board after, the back of PCB board does not have the pin and exposes.

Further, the chip component comprises a component body and a chip part fixed on the component body;

one side that paster portion deviates from the components and parts body is provided with pastes the platform, and the electrode of components and parts body is connected with a subsides platform electricity, pastes the platform and connects on the PCB board.

Through above-mentioned scheme, the realization is to the paster encapsulation of components and parts, makes the components and parts after the encapsulation form paster components and parts, forms standard device, when installing paster components and parts, can directly adopt through-hole reflow soldering technique to weld, pastes the platform and directly sets up on the front of PCB board to there is convex sharp-pointed structure at the back that can not make the PCB board.

Furthermore, the display device further comprises a light bar, a diaphragm and glass, wherein the light bar is arranged on the back plate and deviates from one side of the PCB, the diaphragm is arranged on the light emitting side of the light bar, and the glass is arranged on the light emitting side of the diaphragm.

Through the scheme, the thickness of the whole display device is reduced, so that the display device is thinner.

Has the advantages that: compared with the prior art, the utility model provides a display device wherein can form the production board through paster ization processing, has optimized plug-in components material for the device is more standardized, and the production efficiency can be improved to the production board of paster ization moreover, has reduced the processing cost. The advantages of the whole machine paste are combined, and the insulating sheets are matched, so that the occupied space of the mode of interval arrangement between the original function board and the back board which are arranged at intervals is reduced, and the ultra-thin treatment of the whole machine is completed. By adopting the complete machine ultra-thinning processing scheme, the complete machine image quality performance is not influenced, the safety and the reliability are realized, meanwhile, the complete machine pasting of the components simplifies the production process, reduces the material cost, improves the production efficiency, and has extremely high popularization and application values.

Drawings

FIG. 1 is a cross-sectional view of a prior art display device;

fig. 2 is a cross-sectional view of a display device according to an embodiment of the present invention;

fig. 3 is a top view of a transformer of a display device according to an embodiment of the present invention;

fig. 4 is a cross-sectional view of a transformer of a display device according to an embodiment of the present invention in use;

fig. 5 is a left side view of components of a display device according to an embodiment of the present invention;

fig. 6 is a bottom view of components of a display device according to an embodiment of the present invention;

fig. 7 is a cross-sectional view of a display device according to an embodiment of the present invention.

The reference numbers in the figures: 1. a display device; 10. a back plate; 11. riveting columns; 12. a convex hull screw hole column; 13. a hook; 14. a threaded hole; 20. a PCB board; 21. a limiting part; 30. a transformer; 31. a positioning part; 40. a component; 41. a stitch; 42. a component body; 43. sticking a sheet part; 44. pasting a table; 50. an insulating sheet; 2. a light bar; 3. a membrane; 4. glass; 5. and (7) a rear cover.

Detailed Description

The utility model provides a display device, for making the utility model discloses a purpose, technical scheme and effect are clearer, make clear and definite, and it is right that the following refers to the attached drawing and lifts the example the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The technical scheme of the utility model as follows:

as shown in fig. 2, a display device 1 includes a back plate 10, a PCB 20, and a component 40 disposed on the PCB 20; different functional boards are formed according to the components to be mounted, and for example, a transformer 30 is mounted on a PCB board to form a power supply board. For convenience of structural description, the surface of the PCB 20 facing the backplane 10 is the back surface, and the surface of the PCB 20 where the component 40 is soldered is the front surface. The conventional transformer 30 and the component 40 both have pins 41, wherein, after the transformer 30 and the component 40 are soldered to the PCB 20, the pins 41 of the transformer 30 do not protrude from the back surface of the PCB 20, and the pins 41 of the component 40 do not protrude from the back surface of the PCB 20. The PCB board 20 is provided at the back thereof with an insulating sheet 50, and the insulating sheet 50 is attached to the surface of the back plate 10.

After welding components and parts 40 and transformer 30 to PCB board 20, PCB board 20's the back does not have the pin and exposes, also there is not sharp pin protrusion at PCB board 20's the back, but consider that the power part has the high pressure to exist, set up between PCB board 20 and backplate 10 through increasing insulating piece 50, thereby avoid the high pressure of power to exert an influence to other devices on the backplate 10, only insulating piece 50 has between making PCB board 20 like this, and insulating piece 50's thickness is less, be less than original riveting post 11 or/and convex closure screw post 12 far away, need not set up the spacing distance, thereby can cancel original riveting post 11 or/and convex closure screw post 12's design, thereby the thickness of structure has been reduced.

The function board has different functions according to the difference of the components 40, and is substantially a circuit board, and what function is realized by the function board in this embodiment can be determined according to actual conditions. Also, the component 40 may be various circuit devices such as a diode, a transistor, a resistor, an IC, or a capacitor. That is to say, the functions of the functional board, the specific form of the component 40, and the specific form of the transformer 30 in this embodiment can be preset as needed, as long as the pins 41 of the component 40 after being set do not protrude from the back surface of the PCB 20, the pins 41 of the transformer 30 do not protrude from the back surface of the PCB 20, and the insulating sheet 50 is disposed between the PCB 20 and the backplane 10, which can solve the problems in the prior art and achieve the corresponding effects.

As shown in fig. 3 and 4, the transformer 30 of the present embodiment is provided with a plurality of positioning portions 31, the PCB 20 is provided with a plurality of position limiting portions 21 matching the positioning portions 31, and the position limiting portions 21 are connected to the positioning portions 31 and define the installation position of the transformer 30. In order to prevent the pins 41 of the transformer 30 from protruding out of the PCB 20, the pins are shortened and cannot be inserted into the holes for positioning, so that the transformer 30 can be positioned more accurately, the transformer 30 is provided with a plurality of positioning portions 31, the positions of the PCB 20 and the transformer 30 can be limited by the plurality of positioning portions 31 being matched with the limiting portions 21 on the PCB 20, and thus, during welding, the positions of the transformer 30 on the PCB 20 are limited by the positioning portions 31, and then the transformer 30 is welded. This allows the transformer 30 to be mounted more accurately, and the transformer 30 is mounted.

The positioning portion 31 in this embodiment is a positioning hole, and the limiting portion 21 is a positioning protrusion. The plurality of positioning holes can be arranged in four, and connecting lines among the four positioning holes form a rectangle, so that the positioning form is stable. The PCB 20 is provided with a positioning bulge, and the transformer 30 is sleeved on the positioning bulge through the positioning hole, so that the installation position of the transformer 30 on the PCB 20 is limited, and then the transformer 30 is welded. This allows the transformer 30 to be mounted more accurately and the transformer 30 to be mounted more efficiently on the PCB 20.

It should be noted that the positioning portion 31 may also be a positioning post, and the corresponding limiting portion 21 is a hole. The positioning column is matched with the hole, so that the PCB 20 can limit the transformer 30. The positioning portion 31 may be an elastic clip or the like, and may be positioned by being engaged with the hole.

As shown in fig. 2, the insulation sheet 50 in this embodiment is a mylar sheet, and the mylar sheet covers the back surface of the PCB board 20. The Mylar film has stable size, flatness, excellent tear strength, heat resistance, cold resistance, moisture resistance, water resistance, chemical corrosion resistance, super-strong insulating property and excellent electrical, mechanical, heat resistance and chemical resistance. Can replace common adhesive tapes and is suitable for packaging electronic components when the electronic components are packaged on a machine, so that the electronic components are safer in use. The insulating sheet 50 may cover the entire rear surface of the PCB 20, or may cover the position where the transformer 30 is mounted on the PCB 20. When the insulation sheet 50 covers the installation position of the transformer 30 on the PCB 20, the use amount of the mylar sheet is reduced while the insulation effect is achieved, thereby saving the production resources and reducing the cost.

As shown in fig. 2, the insulating sheet 50 in the present embodiment has a thickness of 0.4 to 0.5 mm. By adopting the thickness of the insulation sheet 50 with the size, the insulation sheet 50 can be ensured to have small thickness, and meanwhile, the high voltage of the transformer 30 does not influence other components on one side of the backboard 10.

As shown in fig. 2, the back plate 10 of the present embodiment is provided with a hook 13, and the PCB 20 is embedded in the hook 13. Because the rivet columns 11 and the convex hull threaded hole columns 12 on the original back plate 10 are removed, in order to ensure the ultra-thinning of the whole machine, a broken hole bending process is adopted on the back plate 10 to form the clamping hooks 13, and during assembly, the PCB 20 is inserted into the clamping hooks 13 to be clamped and embedded, so that the PCB 20 is fixed on the back plate 10.

As shown in fig. 2, the back plate 10 of the present embodiment is provided with screw holes 14, and the PCB board 20 is fixed to the back plate 10 by screwing the screw holes 14. The PCB 20 is fixed on the back plate 10 by screws, so that the PCB 20 is fixed more firmly.

As shown in fig. 5 and 6, the component 40 in the present embodiment is a chip component, and the transformer 30 is a chip transformer. The components 40 are subjected to surface mounting treatment, and the surface-mountable transformer 30 can be jointly developed with a manufacturer, so that the surface-mounted components and the surface-mounted transformer 30 form standard components, mass production is facilitated, and cost is saved. Through encapsulating components 40 and parts and optimizing for all components 40 and transformer 30 can both carry out the paster ization and handle, and components 40 and transformer 30 after the paster ization are handled weld on PCB board 20, form the finished product board, and after components 40 after will pasting the paster and welding PCB board 20, no pin exposes in the back of PCB board 20.

As shown in fig. 5 and 6, the chip component in this embodiment includes a component body 42 and a chip portion 43 fixed on the component body 42, a slot is provided on the chip portion 43, the component body 42 can be pushed into the slot, so that the component can be limited on the chip portion 43, a mounting table 44 is provided on one side of the chip portion 43 departing from the component body 42, an electrode of the component body 42 is electrically connected with the mounting table 44, and the mounting table 44 is connected to the PCB 20. Through above-mentioned scheme, realize the paster encapsulation to components and parts 40, make the components and parts 40 after the encapsulation form paster components and parts, form standard device, when installing paster components and parts, can directly adopt through-hole reflow soldering technique to weld, paste the platform 44 and directly set up on PCB board 20's front to there is convex sharp-pointed structure at the back that can not make PCB board 20.

As shown in fig. 1, before the present solution is used, in order to ensure a safe distance, the distance between the bottom of the stud bolt 12 and the rivet 11 on the back plate 10 and the back surface of the PCB 20 is at least 9mm, the thickness of the PCB 20 is 1.6mm, the height of the component 40 on the PCB 20 is 14mm at most, and the minimum distance between the rear cover 5 and the PCB 20 is 5mm, so that the total height occupied by the power supply of the original display device is 9mm +1.6mm +14mm +5mm, which is 29.1 mm. As shown in fig. 2, after this scheme is adopted, the thickness of insulating piece 50 is 0.43mm, the thickness of PCB 20 is 1.6mm, the height of components and parts 40 on PCB 20 is the highest 14mm, the minimum distance of back lid 5 apart from PCB 20 is 5mm, so the total height that the power of the display device after this scheme of adoption occupy is 21.03mm for 0.43mm +1.6mm +14mm +5 mm.

Therefore, the overall height occupied by the display device is reduced by 7.8mm compared with the original height, the rivet columns 11 and the convex hull threaded hole columns 12 on the back plate 10 are removed, and the thickness of the display device is greatly reduced while the cost is reduced. And moreover, the production is carried out by using the patch materials, so that the process is less, the cost is lower and the efficiency is higher.

The utility model provides a display device 1 is still including being located the back lid 5 at the display device back, sets up deviate from on the backplate 10 the lamp strip 2 of PCB board 20 one side sets up the diaphragm 3 in the luminous side of lamp strip 2 to and set up the glass 4 in the light-emitting side of diaphragm 3. Thus, the thickness of the entire display device is made small, which makes the display device thinner.

To sum up, the embodiment of the utility model provides a display device wherein can form the production board through paster ization processing, has optimized plug-in components material for the device is more standardized, and the production board of paster ization can improve production efficiency moreover, has reduced the processing cost. The advantages of the whole machine paste are combined, and the insulating sheets are matched, so that the occupied space of the mode of interval arrangement between the original function board and the back board which are arranged at intervals is reduced, and the ultra-thin treatment of the whole machine is completed. By adopting the whole machine ultra-thinning processing scheme, the whole machine image quality performance is not influenced, the safety and the reliability are realized, meanwhile, the whole machine pasting of the components simplifies the production process, reduces the material cost, improves the production efficiency, and has extremely high popularization and application values.

It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. A display device comprises a back plate and a PCB, wherein components are arranged on the PCB, and pins of the components do not protrude out of the surface of the PCB facing the back plate;

the surface of the PCB board facing the back plate is provided with an insulating sheet, and the insulating sheet is positioned between the back plate and the PCB board;

2. The display device according to claim 1, wherein a transformer is further disposed on the PCB, pins of the transformer do not protrude from a surface of the PCB facing the back plate, a plurality of positioning portions are disposed on the transformer, a plurality of limiting portions matched with the positioning portions are disposed on the PCB, and the limiting portions are connected with the positioning portions and limit an installation position of the transformer.

3. The display device according to claim 2, wherein the positioning portion is a positioning hole, and the position-limiting portion is a positioning protrusion.

4. The display device according to claim 1, wherein the insulation sheet is a mylar sheet covering a back surface of the PCB board.

5. The display device according to claim 1, wherein the insulating sheet has a thickness of 0.4 to 0.5 mm.

6. The display device according to claim 1, wherein the back plate is provided with a threaded hole, and the PCB board is fixed on the back plate by screwing the threaded hole.

7. The display device according to claim 2, wherein the component is a chip component, and the transformer is a chip transformer.

8. The display device according to claim 7, wherein the chip component includes a component body, and a chip portion fixed to the component body;

one side that paster portion deviates from the components and parts body is provided with pastes the platform, the electrode of components and parts body with paste the bench electricity and be connected, paste the bench and connect on the PCB board.

9. The display device according to any one of claims 1 to 8, further comprising a light bar disposed on a side of the back plate facing away from the PCB, a diaphragm disposed on a light emitting side of the light bar, and a glass disposed on a light emitting side of the diaphragm.