CN217334091U

CN217334091U - Vehicle-mounted camera module

Info

Publication number: CN217334091U
Application number: CN202221069809.6U
Authority: CN
Inventors: 马晓波
Original assignee: Hunan Yuemo Advanced Semiconductor Co ltd
Current assignee: Hunan Yuemo Advanced Semiconductor Co ltd
Priority date: 2022-05-06
Filing date: 2022-05-06
Publication date: 2022-08-30
Anticipated expiration: 2032-05-06

Abstract

The utility model belongs to the technical field of on-vehicle camera and chip package, a on-vehicle camera module is disclosed, including base plate, chip, lens glass and closing cap, the bottom of closing cap is fixed on the base plate around the chip, and the top of closing cap is equipped with central through-hole, and central through-hole is just to the camera induction zone setting of chip, and lens glass sets up on the top of closing cap and sealed central through-hole, and the chip compresses tightly to be fixed between base plate and closing cap. The utility model discloses an on-vehicle camera module, through set up the closing cap on the base plate, the closing cap can keep apart to be connected between chip and lens glass, can adopt a small amount of glue to bond lens glass to can accurate control lens glass and the distance between the chip, guarantee imaging parameters such as focus between lens glass and chip induction area, promote the imaging effect of on-vehicle camera.

Description

Vehicle-mounted camera module

Technical Field

The utility model relates to an on-vehicle camera and chip package technical field especially relate to an on-vehicle camera module.

Background

As shown in fig. 1, the camera module generally includes a substrate 1 ', a chip 2' and a lens glass 3 ', first, the bottom surface of the chip 2' (CMOS chip) is attached to the substrate 1 ', and a metal lead 21' is provided; then, glue is used for forming an adhesive layer 4 ' on the surface of the chip 2 ', the adhesive layer 4 ' encloses and blocks the periphery of the camera sensing region, lens glass is adhered to the surface of the adhesive layer 4 ' and a cavity is formed above the camera sensing region on the surface of the chip 2 '; finally, the metal lead 21' is protected by plastic package to form the whole camera module.

In the camera module adopting the mode, the cavity height is formed by the bonding layer, so that the bonding layer is glue, the using amount of the glue is large, and the glue possibly overflows to a camera sensing area on the surface of the chip 2' before solidification to influence the imaging effect; in addition, the glue is gelatinous and soft before being cured, so that the distance between the lens glass 3 'and the chip 2' cannot be accurately controlled, imaging parameters such as focal length and the like are influenced, and the imaging effect is influenced; the metal lead 21' is easily damaged in the packaging process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an on-vehicle camera module to solve the big problem that influences the formation of image effect of chip packaging in-process glue quantity.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides an on-vehicle camera module, includes base plate, chip and lens glass, still includes:

the bottom end of the sealing cover is fixed on the substrate in a surrounding mode around the chip, a central through hole is formed in the top end of the sealing cover and is right opposite to a camera sensing area of the chip, the lens glass is arranged on the top end of the sealing cover and seals the central through hole, and the chip is tightly pressed and fixed between the substrate and the sealing cover.

Optionally, the bottom end of the cover is fixed to the substrate by adhesion.

Optionally, when the cover is fixed on the substrate, a lead cavity is formed among the cover, the chip and the substrate, and leads between the chip and the substrate are located in the lead cavity.

Optionally, the lead cavity is filled with a plastic package body to fix the lead.

Optionally, the top of closing cap is equipped with the recess, central through-hole locate the diapire of recess and with the recess coaxial arrangement, lens glass locates in the recess.

Optionally, the outer edge of the lens glass abuts against the inner side wall of the groove.

Optionally, the bottom of the lens glass is adhered to the bottom wall of the groove.

Optionally, the depth of the groove is equal to the thickness of the lens glass.

Optionally, the bottom surface of the chip is bonded to the substrate, and the surface of the chip is bonded to the outer side surface of the bottom wall of the groove.

Optionally, the thickness of the bottom wall of the groove is equal to the imaging parameter between the chip and the lens glass.

The utility model has the advantages that:

the utility model discloses an on-vehicle camera module, through set up the closing cap on the base plate, the closing cap can keep apart to be connected between chip and lens glass, can adopt a small amount of glue to bond lens glass to can accurate control lens glass and the distance between the chip, guarantee imaging parameters such as focus between lens glass and chip induction area, promote the imaging effect of on-vehicle camera.

Drawings

FIG. 1 is a schematic diagram of a package structure of a conventional vehicle-mounted camera module in the prior art;

fig. 2 is a schematic view of a package structure of a vehicle-mounted camera module according to an embodiment of the present invention;

fig. 3 is a schematic diagram of the connection between the chip and the substrate according to the embodiment of the present invention.

In the figure:

1', a substrate; 2. chip'; 21' a metal lead; 3' lens glass; 4' bonding layer;

1. a substrate; 2. a chip; 21. a lead wire; 22. a lead cavity; 3. a lens glass; 4. sealing the cover; 41. a central through hole; 42. and (6) a groove.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected", "connected" and "fixed" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1, which is a schematic view of a package structure of a conventional vehicle-mounted camera module in the prior art, the vehicle-mounted camera module includes a substrate 1 ', a chip 2 ' and a lens glass 3 ', wherein a bottom surface of the chip 2 ' is bonded to a surface of the substrate 1 ', a bonding layer 4 ' with a certain height is formed by coating glue around a camera sensing region on the surface of the chip 2 ' and is used for bonding the lens glass 3 ', and since the bonding layer 4 ' is glue and has volume change before and after curing, a distance between the lens glass 3 ' and the surface of the chip 2 ' is uncontrollable, which affects an imaging effect. In order to improve the imaging effect of on-vehicle camera module, the utility model provides an on-vehicle camera module, as shown in fig. 2, including base plate 1, chip 2 and lens glass 3, still include closing cap 4, on current on-vehicle camera module basis, removed the adhesive linkage 4 'that has a take the altitude, adjust the distance between lens glass 3 and the chip 2 through setting up closing cap 4, ensured imaging parameter's stability, do benefit to and improve the imaging effect.

As shown in fig. 2, the bottom end of the cover 4 is fixed on the substrate 1 around the chip 2, the top end of the cover 4 is provided with a central through hole 41, the central through hole 41 is arranged opposite to the camera sensing area of the chip 2, the lens glass 3 is arranged at the top end of the cover 4 and seals the central through hole 41, and the chip 2 is tightly fixed between the substrate 1 and the cover 4.

It can be understood that the cover 4 has better structural strength and stability relative to the adhesive layer 4' formed by the glue solidification, and is not easy to deform, therefore, the lens glass 3 is arranged on the cover 4, which is beneficial to ensuring the distance between the lens glass 3 and the chip 2, and providing stable imaging parameters. The lens glass 3 is arranged on the sealing cover 4, so that the lens glass 3 is favorably positioned and fixed, the position deviation caused by the change of the curing volume of the bonding layer 4' in the prior art is avoided, and the imaging effect is improved. The utility model discloses an on-vehicle camera module, through set up closing cap 4 on base plate 1, closing cap 4 can keep apart and connect between chip 2 and lens glass 3, can adopt the glue that a small amount of thickness is neglected to bond lens glass 3 to can accurate

control lens glass

3 and 2 distances of chip, guarantee lens glass 3 and chip 2 go up imaging parameters such as focus between the camera induction zone, promote on-vehicle camera's imaging effect. In a preferred embodiment, the material of the cover 4 may be a structurally strong material such as rigid plastic, glass, or metal.

Alternatively, the bottom end of the cover 4 is adhesively secured to the substrate 1.

As shown in fig. 2, the bottom end of the cover 4 is arranged around the periphery of the chip 2, and is fixedly bonded to the substrate 1, and preferably, the outer edge of the cover 4 is aligned with the outer edge of the substrate 1, that is, has the same size and shape, so that the cover 4 and the substrate 2 are conveniently aligned, mounted and bonded and fixed, and further, after the cover 4 is bonded through the structural design, the central through hole 41 just corresponds to the camera sensing area of the chip 2, and the mounting efficiency is improved. In the conventional arrangement, the bottom surface of the chip 2 is bonded to the substrate 1, and the cap 4 is also bonded to the substrate 1, which is beneficial to the stability of the relative positions of the three.

Alternatively, when the cover 4 is fixed on the substrate 1, a lead cavity 22 is formed among the cover 4, the chip 2 and the substrate 1, and the lead 21 between the chip 2 and the substrate 1 is located in the lead cavity 22.

Referring to fig. 2 again, when the cover 4 is fixedly bonded to the substrate 1, the outer edge of the cover 4 is aligned with the outer edge of the substrate 1, a sealed lead cavity 22 is formed between the inner edge of the cover 4 and the outer edge of the chip 2 and between the substrates 1, and the metal lead 21 between the chip 2 and the substrate 1 is located in the lead cavity 22, so as to isolate and protect the lead 21.

Optionally, the lead cavity 22 is filled with a plastic encapsulation body to fix the lead 21.

It can be understood that the lead 21 is located in the lead cavity 22, and the lead cavity 22 still has a large space, so as to avoid poor contact caused by shaking of the lead 21, and the lead cavity 22 is filled with a plastic package body for packaging, so as to fix the position of the lead 21 and improve reliability. Specifically, the top end of the sealing cover 4 may be provided with a main inlet communicated with the lead cavity 22, and a plastic package body is gradually injected into the lead cavity 22, so as to further increase the connection strength between the substrate 1, the chip 2 and the sealing cover 4, and form a stable vehicle-mounted camera module.

Optionally, the top end of the cover 4 is provided with a groove 42, the central through hole 41 is provided on the bottom wall of the groove 42 and is coaxially arranged with the groove 42, and the lens glass 3 is provided in the groove 42.

As shown in fig. 2, the top end of the sealing cover 4 is provided with a groove 42 coaxial with the camera sensing region of the chip 2, and the bottom wall of the groove 42 is provided with a central through hole 41 coaxial with the center, so that when the sealing cover 4 is installed, the concentricity of the groove 42, the central through hole 41 and the camera sensing region can be ensured, the installation positioning accuracy and the installation efficiency are improved, and the imaging effect is good.

Optionally, the outer edge of the lens glass 3 abuts against the inner side wall of the groove 42.

It can be understood that, when the outer diameter of the lens glass 3 is equal to the inner diameter of the groove 42, the outer edge of the lens glass 3, i.e. the outer peripheral wall, can stop against the inner side wall of the groove 42, so that the mounting and positioning efficiency of the lens glass 3 is improved, and the positioning is accurate.

Optionally, the bottom of the lens glass 3 is bonded to the bottom wall of the recess 42.

In this embodiment, the glues used for bonding all have negligible thickness, so the thickness of a small amount of glue used for bonding does not affect the imaging effect. The bottom of lens glass 3 bonds in the diapire of recess 42, and only the diapire thickness of preset recess 42 just can obtain the accurate interval between lens glass 3 and the chip 2, and is difficult for taking place to warp and the displacement, and the distance between lens glass 3 and the chip 2 is stable, and imaging parameters is stable, and then does benefit to and improves the imaging.

Optionally, the depth of the groove 42 is equal to the thickness of the lens glass 3.

Referring to fig. 2 again, the lens glass 3 is mounted and adhered in the groove 42, and when the depth of the groove 42 is equal to the thickness of the lens glass 3, the surface of the lens glass 3 is aligned and pressed with the surface of the cover 4, so that the lens glass 3 has a flat surface appearance, which is beneficial to ensuring stable spacing between the lens glass 3 and the chip 2, and high positioning accuracy.

Alternatively, the bottom surface of the chip 2 is bonded to the substrate 1, and the surface of the chip 2 is bonded to the outer side surface of the bottom wall of the groove 42. It can be understood that the lens glass 3, the bottom wall of the groove 42 and the chip 2 are sequentially bonded on the substrate 1 from top to bottom, and the bonding and press-fitting are performed for multiple times, so that the connection can be realized by using less glue, and the glue has negligible thickness, thereby being beneficial to positioning and mounting and improving the imaging effect.

Optionally, the thickness of the bottom wall of the recess 42 is equal to the imaging parameters between the chip 2 and the lens glass 3.

When the bottom thickness that sets up recess 42 comes the interval of adjusting between chip 2 and the lens glass 3, this interval no longer receives the curing process influence of bonding glue, utilizes less glue bonding location back, adopts the plastic-sealed body to encapsulate the clearance and all around again, including lead wire chamber 22 etc. further fixed and keep apart, and then obtains the on-vehicle camera module that positioning accuracy is high, the imaging effect is reliable and stable.

In the vehicle-mounted camera module provided in the above embodiment, when packaging or mounting is performed, first, the chip 2 (in this embodiment, a CMOS chip) is attached to the substrate 1 and metal leads 21 are punched, as shown in fig. 3; then, glue is coated on the surface of the chip 2 and the substrate 1, and the bottom end of the sealing cover 4 and the outer side surface of the bottom wall of the groove 42 are respectively adhered to the surfaces of the substrate 1 and the chip 2, wherein the lead 21 is sealed in the lead cavity 22 by the sealing cover 4 so as to protect the lead 21; the lens glass 3 is then glued in the recess 42 and so that the lens glass 3 is flush with the top surface of the cover 4. Finally, a plastic package body is filled in the lead cavity 22 to protect the lead 21, so that the vehicle-mounted camera module shown in fig. 2 is obtained.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a vehicle-mounted camera module, includes base plate (1), chip (2) and lens glass (3), its characterized in that, vehicle-mounted camera module still includes:

the sealing cover (4), the bottom of sealing cover (4) winds chip (2) is fixed on base plate (1), the top of sealing cover (4) is equipped with central through-hole (41), central through-hole (41) are just right the camera response area setting of chip (2), lens glass (3) set up the top of sealing cover (4) is sealed central through-hole (41), chip (2) compress tightly to be fixed base plate (1) with between sealing cover (4).

2. The vehicle camera module according to claim 1, wherein the bottom end of the cover (4) is adhesively fixed to the base plate (1).

3. The vehicle camera module according to claim 1, wherein when the cover (4) is fixed on the substrate (1), a lead cavity (22) is formed between the cover (4), the chip (2) and the substrate (1), and leads (21) between the chip (2) and the substrate (1) are located in the lead cavity (22).

4. A vehicle camera module according to claim 3, characterized in that the lead cavity (22) is filled with a plastic encapsulation to fix the leads (21).

5. A vehicle camera module according to claim 1, wherein the top end of the cover (4) is provided with a groove (42), the central through hole (41) is provided in the bottom wall of the groove (42) and is coaxially arranged with the groove (42), and the lens glass (3) is provided in the groove (42).

6. A vehicle camera module according to claim 5, characterized in that the outer edge of the lens glass (3) abuts against the inner side wall of the recess (42).

7. A vehicle camera module according to claim 5, characterized in that the bottom of the lens glass (3) is glued to the bottom wall of the recess (42).

8. A vehicle camera module according to claim 5, characterized in that the depth of the groove (42) is equal to the thickness of the lens glass (3).

9. A vehicle camera module according to claim 5, characterized in that the bottom surface of the chip (2) is bonded to the substrate (1) and the surface of the chip (2) is bonded to the outer side of the bottom wall of the recess (42).

10. A vehicle camera module according to claim 5, characterized in that the thickness of the bottom wall of the recess (42) is equal to the imaging parameters between the chip (2) and the lens glass (3).