CN217318341U

CN217318341U - Film stamping die

Info

Publication number: CN217318341U
Application number: CN202123053007.4U
Authority: CN
Inventors: 李亚民
Original assignee: Wuhan Jianyi Technology Co ltd
Current assignee: Wuhan Jianyi Technology Co ltd
Priority date: 2022-06-08
Filing date: 2022-06-08
Publication date: 2022-08-30
Anticipated expiration: 2032-06-08

Abstract

The utility model belongs to the technical field of stamping die, specifically be a film stamping die, including cover half and circuit board, the both sides of cover half are equipped with the buffer block, install a plurality of installation interfaces on the circuit board, it is a plurality of equal threaded connection has infrared bulb on the installation interface, be equipped with installation mechanism, it is a plurality of between circuit board and the cavity infrared bulb equidistant rectangle evenly distributed that is on the circuit board, installation mechanism includes the U-shaped plate with cavity one end lateral wall fixed connection, U-shaped plate and circuit board phase-match, be equipped with two slots on the baffle, the first spring of inner wall fixedly connected with of L-shaped plate. The utility model relates to a be rectangle evenly distributed through the infrared lamp, carry out thermally equivalent to the mould to the messenger can evenly soften the film, secondly, conveniently installs and dismantles the circuit board, increases operating space when taking out the circuit board, more conveniently maintains and maintains the infrared bulb.

Description

Film stamping die

Technical Field

The utility model relates to a stamping die technical field specifically is a film stamping die.

Background

The film stamping die with the patent number of 201720461989.5 comprises a movable die and a fixed die, wherein a core is arranged on the fixed die, a cavity is arranged on the movable die, a cavity is arranged in the fixed die, and a heating module is arranged in the cavity; the fixed die is internally provided with a plurality of exhaust pipes, one ends of the exhaust pipes are communicated with the core, the other ends of the exhaust pipes are communicated with the outer surface of the fixed die, when the movable die and the fixed die are closed, gas is filled into the cavity through the gas inlet holes, and the gas is pumped and discharged outwards through the exhaust pipes, so that a gas pressure difference is formed between the fixed die and the movable die. The utility model discloses stamping die can be with the high-efficient and stable punching out of film, and can effectively reduce the defective percentage, and then reduction in production cost.

In the above patent, the heating module 6 is an infrared heating module. This infrared heating module is preferably the infrared bulb that sets up in cavity 5, and this kind of infrared bulb can heat up in the time of the utmost point short by a wide margin, and because the loss is great in the production, this infrared bulb is convenient for later stage maintenance and change: when the infrared bulbs are replaced, it is inconvenient to perform the relevant operations on the infrared bulbs in a narrow space in the cavity 5, and secondly, the infrared bulbs are not uniformly distributed, the mold is not uniformly heated, and the film cannot be uniformly softened.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

For solving the technical problem who exists among the background art, the utility model provides a film stamping die is rectangle evenly distributed through the infrared lamp, carries out the thermally equivalent to the mould to the messenger can evenly soften the film, secondly, conveniently installs and dismantles the circuit board, increases operating space when taking out the circuit board, more conveniently maintains and maintains the infrared bulb.

(II) technical scheme

For solving the technical problem, the utility model provides a film stamping die, including cover half and circuit board, the both sides of cover half are equipped with the buffer block, be equipped with the cavity in the cover half, install a plurality of installation interfaces on the circuit board, it is a plurality of equal threaded connection has infrared bulb on the installation interface, be equipped with installation mechanism between circuit board and the cavity.

Preferably, a plurality of infrared bulbs are uniformly distributed on the circuit board in a rectangular shape at equal intervals.

Preferably, the mounting mechanism comprises a U-shaped plate fixedly connected with one end side wall of the cavity, and the U-shaped plate is matched with the circuit board.

Preferably, the other end lateral wall fixedly connected with baffle and the L shaped plate of cavity, be equipped with two slots on the baffle, the inner wall fixedly connected with first spring of L shaped plate.

Preferably, the lower extreme fixedly connected with of first spring is the board of falling U, be equipped with the dead slot on the board of falling U, the inner wall fixedly connected with of dead slot has a plurality of second springs, and is a plurality of the common fixedly connected with clamp plate of second spring, the clamp plate offsets with the circuit board.

Preferably, the side wall of the inverted U-shaped plate is fixedly connected with a pull rod.

The above technical scheme of the utility model has following profitable technological effect:

1. the utility model discloses a when infrared bulb on a plurality of installation interfaces generates heat, because infrared bulb evenly distributed carries out the thermally equivalent to the mould to the messenger can evenly soften the film.

2. The utility model discloses when needs break down the infrared bulb and need repair, the user upwards stimulates the first spring of falling U-shaped board and compression through the pull rod to it is spacing no longer to extrude the circuit board to make the clamp plate, upwards lifts up the circuit board, can take out the circuit board promptly, and increase processing space is convenient to maintain or maintain the infrared bulb on the circuit board.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is an enlarged view of the structure at A in FIG. 1;

FIG. 3 is a side view of the inverted U-shaped plate of the present invention;

fig. 4 is a side view of the U-shaped plate of the present invention.

In the figure: the device comprises a circuit board 1, a fixed die 2, a 3L-shaped plate, a first spring 4, a cavity 5, a baffle 6, an inverted U-shaped plate 7, a pull rod 8, a buffer block 9, a pressing plate 10, a U-shaped plate 11, a mounting interface 12, an infrared bulb 13, a hollow groove 14 and a second spring 15.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the utility model provides a film stamping die, including cover half 2 and circuit board 1, the both sides of cover half 2 are equipped with buffer block 9, are equipped with in the cover half 2 and are equipped with cavity 5, install a plurality of installation interface 12 on the circuit board 1, and equal threaded connection has infrared bulb 13 on a plurality of installation interface 12, and a plurality of infrared bulbs 13 equidistant rectangle evenly distributed that is on circuit board 1 installs the power on circuit board 1, provides infrared bulb 13's power.

Be equipped with installation mechanism between circuit board 1 and cavity 5, installation mechanism include with 5 one end lateral wall fixed connection's of cavity U-shaped plate 11, U-shaped

plate

11 and 1 phase-match of circuit board, 5 other end lateral wall fixed connection of cavity 6 and L shaped plate 3, be equipped with two slots on the baffle 6, the first spring 4 of the inner wall fixed connection of L shaped plate 3, the lower extreme fixedly connected with of first spring 4 falls U-shaped plate 7, L-shaped plate 3 carries on spacingly to falling U-shaped plate 7, make it keep vertical rebound, the skew problem can not take place, it is more convenient to remove.

Be equipped with dead slot 14 on the U-shaped board 7, a plurality of second springs 15 of the inner wall fixedly connected with of dead slot 14, the common fixedly connected with clamp plate 10 of a plurality of second springs 15, clamp plate 10 offsets with circuit board 1, and the lateral wall fixedly connected with pull rod 8 of U-shaped board 7 removes through pull rod 8 and conveniently drives U-shaped board 7 and upwards removes.

The utility model discloses a theory of operation and use flow: when heating through infrared bulb 13 on a plurality of installation interfaces 12, because infrared bulb 13 evenly distributed can evenly generate heat, it is effectual that generates heat, can evenly soften the film.

When needs take place to damage infrared bulb 13, need maintain it, 3 spacing down to the U-shaped plate 7 at L shaped plate, the user drives the U-shaped plate 7 rebound and compresses first spring 4 through upwards pulling pull rod 8, when the U-shaped plate 7 that falls carries out the rebound, it is spacing no longer to extrude circuit board 1 through clamp plate 10 to drive a plurality of second springs 15, the user upwards lifts up circuit board 1, make the other end of circuit board 1 break away from the spacing of U-shaped plate 11, can take out circuit board 1, the convenience is maintained or is maintained infrared bulb 13 on the circuit board 1.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. A film stamping die comprises a fixed die (2) and a circuit board (1), and is characterized in that buffer blocks (9) are arranged on two sides of the fixed die (2), a cavity (5) is arranged in the fixed die (2), a plurality of mounting interfaces (12) are mounted on the circuit board (1), infrared bulbs (13) are in threaded connection with the mounting interfaces (12), and a mounting mechanism is arranged between the circuit board (1) and the cavity (5);

the infrared bulbs (13) are uniformly distributed on the circuit board (1) in a rectangular shape at equal intervals;

the mounting mechanism comprises a U-shaped plate (11) fixedly connected with the side wall of one end of the cavity (5), and the U-shaped plate (11) is matched with the circuit board (1);

a baffle (6) and an L-shaped plate (3) are fixedly connected to the side wall of the other end of the cavity (5), two slots are formed in the baffle (6), and a first spring (4) is fixedly connected to the inner wall of the L-shaped plate (3);

the lower end of the first spring (4) is fixedly connected with an inverted U-shaped plate (7), the inverted U-shaped plate (7) is provided with a hollow groove (14), the inner wall of the hollow groove (14) is fixedly connected with a plurality of second springs (15), the second springs (15) are jointly and fixedly connected with a pressing plate (10), and the pressing plate (10) is abutted to the circuit board (1);

the side wall of the inverted U-shaped plate (7) is fixedly connected with a pull rod (8).