CN217306457U - Wafer rack assembly and wafer rack - Google Patents
Wafer rack assembly and wafer rack Download PDFInfo
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- CN217306457U CN217306457U CN202220740988.5U CN202220740988U CN217306457U CN 217306457 U CN217306457 U CN 217306457U CN 202220740988 U CN202220740988 U CN 202220740988U CN 217306457 U CN217306457 U CN 217306457U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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Abstract
The utility model relates to a rack component and a wafer rack, which comprises a rack body with a general shape; the wafer rack comprises a rack body and is characterized in that a containing cavity for containing wafers with set sizes is arranged in the rack body, and the appearance size of the rack body are matched with a carrier for loading the existing wafer rack and a production line for producing the existing wafer rack; the wafer rack also comprises a loading structure arranged on the rack body and used for loading the electronic tag. The wafer rack is provided with the rack body with a universal appearance, and the appearance size of the strip body are matched with the carrier for loading the existing wafer rack and the production line for producing the existing wafer rack, so that the existing carrier and the production line can be matched, the universality of the existing carrier and the production line is improved, the equipment cost can be reduced, and the production efficiency is improved. Through set up loading structure on the film frame body to can be used to load electronic tags, and then can make this wafer film frame carry out wireless bidirectional transmission with external equipment's data information.
Description
Technical Field
The utility model relates to a wafer production field, more specifically say, relate to a wafer rack subassembly and wafer rack.
Background
Most of the containers commonly used for wafer production in the market at present are wafer racks, and the wafer racks have the following defects: 1) the existing wafer rack is generally used for loading wafers corresponding to the external dimension of the wafer rack, the external dimension of the wafer rack is generally designed corresponding to a carrier for loading the wafer rack and a production line for producing the wafer rack, so the carrier and the production line with the same specification can only be matched with the wafer rack with fixed dimension, when a wafer with smaller dimension needs to be produced, the wafer rack with the corresponding dimension needs to be manufactured generally, and the corresponding wafer rack can only be placed by replacing the carrier and adjusting the production line, so that the packaging cost and the equipment cost are increased, and the production efficiency is reduced. 2) The wafer rack on the market at present is generally not provided with a loading structure for loading an electronic tag, so that the electronic tag cannot be arranged on the wafer rack, and data transmission between data information of the wafer rack and external equipment cannot be realized.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, provides a modified wafer rack, further provides a modified rack subassembly.
The utility model provides a technical scheme that its technical problem adopted is: a wafer rack is constructed, which comprises a rack body with a universal shape; the wafer rack body is internally provided with an accommodating cavity for accommodating wafers with set sizes, and the appearance size of the wafer rack body are matched with a carrier for loading the existing wafer rack and a production line for producing the existing wafer rack;
the wafer rack also comprises a loading structure arranged on the rack body and used for loading the electronic tag.
In some embodiments, the wafer holder body comprises a first end for placing the wafer therein and a second end arranged opposite to the first end;
the sheet rack body comprises a first side wall and a second side wall which are oppositely arranged; the first side wall is provided with a first extending part; the first extending part is positioned at the first end and extends towards one side opposite to the second side wall; the second side wall is provided with a second extending part which is positioned at the first end and extends towards one side opposite to the first side wall;
the shapes of the first extending part and the second extending part are matched with a carrier for loading the existing sheet rack body and a production line for producing the existing sheet rack body;
the distance between the outermost edges of the first extension part and the second extension part is matched with the inner size of a carrier for loading the existing sheet rack body.
In some embodiments, the inner wall surface of the first side wall is provided with a plurality of first limiting grooves,
a plurality of second limiting grooves are formed in the inner wall surface of the second side wall;
the first limiting grooves and the second limiting grooves are arranged in a one-to-one correspondence mode and matched with each other to limit the position of the wafer.
In some embodiments, the outer wall surface of the first side wall and/or the second side wall is provided with a reinforcing rib plate; the reinforcing rib plate extends from the first end to the second end;
the loading structure is arranged on the reinforcing rib plate.
In some embodiments, the loading structure comprises a receptacle portion protrudingly provided on the gusset; the accommodating part is provided with an accommodating cavity for accommodating the electronic tag.
In some embodiments, the receiving portion is integrally formed with the stiffener plate.
In some embodiments, the wafer rack further comprises a protection structure disposed on the rack body for protecting a sheet tag.
In some embodiments, the protection structure includes a receiving groove disposed on the sheet holder body for receiving the sheet type label.
In some embodiments, the inner shape and size of the containing groove are matched with the sheet type label,
the protection structure further comprises a transparent protection cover arranged on the accommodating groove in a covering mode.
The utility model also constructs a wafer rack component, which comprises at least two wafer racks that can be spliced with each other;
and the wafer frame is provided with a splicing structure for splicing with the other wafer frame.
Implement the utility model discloses a sheet frame subassembly and wafer sheet frame has following beneficial effect: the wafer rack is provided with the rack body with a universal appearance, and the appearance and the overall dimension of the strip body are matched with the carrier for loading the existing wafer rack and the production line for producing the existing wafer rack, so that the existing carrier and the production line can be matched, the universality of the existing carrier and the production line is improved, the equipment cost can be reduced, and the production efficiency is improved. In addition, the wafer rack body is provided with the loading structure, so that the wafer rack body can be used for loading the electronic tags, and further the data information of the wafer rack and the external equipment can be wirelessly transmitted in a two-way mode.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic structural view of a wafer rack according to some embodiments of the present invention;
FIG. 2 is a schematic view of another angle of the wafer rack shown in FIG. 1;
FIG. 3 is a schematic view of a guide plate state of a plate holder assembly according to some embodiments of the present invention;
FIG. 4 is a schematic view of another guide vane of the cassette assembly of FIG. 3;
FIG. 5 is a cross-sectional view of the cassette assembly of FIG. 3;
fig. 6 is another cross-sectional view of the cassette assembly of fig. 3.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, the embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 and 2 show some preferred embodiments of the wafer holder of the present invention. The wafer holder 10 can be used in a production line to receive wafers 20. The production line may be an automated production line and the wafer rack 10 may be loaded in a carrier, which may be a self-locking carrier. The wafer rack 10 can enhance the universality of the carrier and the production line, reduce the equipment cost and improve the production efficiency.
As shown in fig. 1 and 2, in some embodiments, the wafer rack may include a rack body 11, the rack body 11 having a general shape, the shape and dimensions of which may be adapted to a carrier for loading an existing wafer rack and a production line for producing an existing wafer rack. In some embodiments, each rack body 11 has a receiving cavity 110 therein, and the receiving cavity 110 can be used for receiving a wafer 20 with a set size. For example, the receiving cavity 110 of wafer rack X1 may be configured to correspond to an 8 "wafer 20; the accommodating cavity 110 of the wafer rack X2 is arranged corresponding to the 6-inch wafer 20; the shapes and the external dimensions of the wafer frame body 11 of the wafer frame X1 and the wafer frame body X2 of the wafer frame X2 are consistent, so that the wafer frame X2 can be loaded by using a self-locking carrier for loading the wafer frame X2, and a 6-inch wafer 20 can be produced by using an automatic production line for producing 8-inch wafers 20, and the process does not need to replace the production line and design the corresponding self-locking carrier. Through the appearance and the overall dimension of the wafer rack body 11, the carrier for loading the existing wafer rack and the production line for producing the existing wafer rack are matched, when wafers with different dimensions are produced, the self-locking carrier and the production line do not need to be replaced, so that the universality of the existing carrier and the production line can be improved, the equipment cost can be reduced, and the production efficiency can be improved. In some embodiments, the accommodating chamber 110 can be adapted to the wafer 20 with a predetermined size by thickening the inner wall of the wafer holder body 11 or thinning the inner wall of the wafer holder body 11 to design a corresponding size. It should be noted that the present invention refers to the existing carrier and production line, which is the existing self-locking carrier and production line for loading the standard size and producing the standard size wafers 20.
Further, in some embodiments, the holder body 11 is a hollow structure with two ends penetrating, that is, two ends of the holder body 11 are provided with openings communicating with the accommodating cavity 110. Specifically, the holder body 11 includes a first end 11a and a second end 11 b. The first end 11a is for receiving the wafer 20, and the second end 11b is disposed opposite to the first end. In some embodiments, the opening size of the first end 11a of the wafer holder body 11 may be larger than the opening size of the second end 11b of the wafer holder body 11, and the opening size of the first end 11a of the wafer holder body 11 may be larger than the opening size of the second end 11b, so that the wafer 20 can be loaded from the opening of the first end 11a and contained in the containing cavity 110, and can be prevented from being pulled out from the opening of the second end 11 b.
Further, in some embodiments, the holder body 11 can include a first sidewall 111 and a second sidewall 112; the first sidewall 111 and the second sidewall 112 are disposed opposite to each other. In some embodiments, the holder body 11 can further include a third sidewall 113 and a fourth sidewall 114; the third sidewall 113 and the fourth sidewall 114 may be disposed between the first sidewall 111 and the second sidewall 112, and the third sidewall 113 and the fourth sidewall 114 may be disposed at an interval and connected to the first sidewall 111 and the second sidewall 112, respectively. The first sidewall 111, the second sidewall 112, the third sidewall 113 and the fourth sidewall 114 may be surrounded to form the accommodating chamber 110.
Further, in some embodiments, the inner wall surface of the first sidewall 111 may be provided with a plurality of first limiting grooves 1111, and the plurality of first limiting grooves 1111 may be spaced along the length direction of the first sidewall 111. This first spacing groove 1111 can be for running through the logical groove of this first lateral wall 111 inside and outside, through link up the setting with it to the face can play the glue that subtracts and alleviate whole weight effect, and on the other hand can conveniently wash. The first limiting groove 1111 may include a first straight line groove and a first diagonal line groove; the first straight line groove may extend from a first end of the sheet rack body 11 toward the accommodating cavity 110, the first diagonal line groove is located at a lower portion of the sheet rack body 11, and one end of the first diagonal line groove may be connected with the first straight line groove and the other end may extend to a second end opening of the sheet rack body 11. The first straight line groove can be used for guiding the wafer 20, and the first inclined line groove can prevent the wafer 20 from falling off.
Further, in some embodiments, a second retaining groove 1121 may be formed on an inner wall surface of the second sidewall 112, and the second retaining groove 1121 may cooperate with the first retaining groove 1111 to retain the wafer 20. The number of the second positioning grooves 1121 may be multiple, and the plurality of second positioning grooves 1121 may be disposed at intervals along the length direction of the second sidewall 112. The second limiting grooves 1121 may be disposed in one-to-one correspondence with the first limiting grooves 1111. The first limiting grooves 1111 and the second limiting grooves 1121 are symmetrically and uniformly distributed, which is beneficial to effectively separating the wafer 20 and limiting the movement space of the wafer 20, so as to effectively prevent the wafer 20 from being damaged. The second limiting groove 1121 may be a through groove penetrating through the inner side and the outer side of the second sidewall 112, and through penetrating the through groove, the function of reducing the overall weight by reducing the glue can be achieved in the square, and the cleaning is convenient. The second limiting groove 1121 may include a second linear groove and a second diagonal groove; the second linear slot may extend from the second end of the sheet rack body 11 toward the accommodating cavity 110, the second diagonal slot is located at the lower portion of the sheet rack body 11, and one end of the second diagonal slot may be connected with the second linear slot and the other end may extend to the second end opening of the sheet rack body 11. The second linear slot is used for guiding the wafer 20, and the second diagonal slot is used for preventing the wafer 20 from falling off.
In some embodiments, the height and width of the first retaining groove 1111 and the second retaining groove 1121 may be the same as those of a standard wafer rack 10, so that the process for manufacturing the retaining grooves can be universal, and the manufacturing cost can be reduced.
Further, in some embodiments, the third sidewall 113 may be disposed at a height smaller than the first sidewall 111 and the second sidewall 112. Both ends of the third sidewall 113 can be respectively connected to the first sidewall 111 and the second sidewall 112, and can be integrally formed with the third sidewall 113. In some embodiments, the outer wall surface of the third sidewall 113 can be protruded with a limiting rib 1131, and the limiting rib 1131 can limit the sheet holder body 11 when the sheet holder body 11 is placed on an automatic production line, so that the sheet holder body 11 can be stably placed on the automatic production line.
Further, in some embodiments, the height of the fourth sidewall 114 may be smaller than the height of the first sidewall 111 and the second sidewall 112, so that after the wafer is accommodated in the accommodating chamber 110, a part of the wafer may be exposed from the top of the fourth sidewall 114, thereby facilitating detection of whether the wafer rack stores wafers.
Further, in some embodiments, the outer wall surfaces of the first side wall 111 and the second side wall 112 may be provided with reinforcing ribs 115, and the reinforcing ribs 115 may be extended from the first end 11a toward the second end 11 b. In some embodiments, two reinforcing ribs 115 are disposed on each of the first side wall 111 and the second side wall 112 at intervals, and the reinforcing ribs 115 may be integrally formed with the first side wall 111 and the second side wall 112, and specifically, may be integrally formed with the first side wall 111 and the second side wall 112 by injection molding. The reinforcing rib 115 may serve to reinforce the strength of the first and second sidewalls 111 and 112. It will be appreciated that in other embodiments, the stiffener plates 115 on the first side wall 111 may be omitted, or the stiffener plates 115 on the second side wall 112 may be omitted.
Further, in some embodiments, a first extending portion 116 is disposed on the first sidewall 111, and the first extending portion 116 may be located at the first end 11a of the sheet rack body 11, and may be integrally formed with the first sidewall 11a, and may extend from the first end 11a of the sheet rack body 11 along the outer side of the first sidewall 111. The shape of the first extending portion 116 is adapted to the self-locking carrier and the automatic production line, which facilitates the mounting of the sheet frame body 11 on the existing self-locking carrier and automatic production line.
Further, in some embodiments, a second extending portion 117 may be disposed on the second side wall 112, and the second extending portion 117 may be located at the second end 11b of the sheet rack body 11, and may be integrally formed with the second side wall 11b, and may extend from the second end 11b of the sheet rack body 11 along the outside of the second side wall 112. The second extension 117 is adapted to the self-locking carrier and the automatic production line, which facilitates the mounting of the sheet rack body 11 on the existing self-locking carrier and automatic production line.
Further, in some embodiments, the distance between the outermost edges of the first extension 116 and the second extension 117 is adapted to the inner dimension of the carrier for loading the existing wafer rack body 11, so as to be suitable for the existing self-locking carrier and the automatic production line.
Further, in some embodiments, the holder body 11 further includes a third extending portion 118, and the third extending portion 118 can be disposed at an end of the first sidewall 111 away from the first extending portion 116, and can be disposed to extend downward. The third extension portion 118 can be integrally formed with the first sidewall 111, and in some embodiments, the third extension portion 118 can be integrally formed with the first sidewall 111 by injection molding. The third extending portion 118 is provided with a first limiting notch 1181, and the first limiting notch 1181 can be used for limiting in cooperation with a carrier. In some embodiments, the first limit notch 1181 may be an arcuate notch.
Further, in some embodiments, the holder body 11 further includes a fourth extending portion 119, and the fourth extending portion 119 can be disposed at an end of the second sidewall 112 away from the second extending portion 117 and can extend downward. The fourth extension 119 can be integrally formed with the second sidewall 112, and in some embodiments, the fourth extension 119 can be integrally formed with the second sidewall 112 by injection molding. The fourth extending portion 119 is provided with a second limiting notch 1191, the second limiting notch 1191 may be disposed opposite to the first limiting notch 1181, and the second limiting notch 1191 may be matched with the carrier for limiting. In some embodiments, the second limit notch 1191 can be an arcuate slot.
Further, in some embodiments, the wafer rack further includes a loading structure 12, and the loading structure 12 may be disposed on the rack body 11 for loading the electronic tag. In particular, the electronic tag may be a stick-type electronic tag. Of course, it is understood that in other embodiments, the electronic tag may not be limited to a stick-type electronic tag. In some embodiments, the loading structure 12 may be disposed on the stiffener plate 115, although it is understood that in other embodiments, the loading structure 12 may not be limited to being disposed on the stiffener plate 115. The loading structure 12 may include receiving portions that may be disposed on the stiffener plate 115 and integrally formed with the stiffener plate 115. Specifically, it may be integrally formed with the reinforcing rib plate 115 by injection molding. The receptacle is a tubular projection provided on the stiffener plate 115. The accommodating portion is provided with a tubular accommodating cavity, the accommodating cavity can be arranged along the longitudinal direction of the reinforcing rib plate 115, and one end of the accommodating cavity, which is opposite to the second end 11b, is provided with an opening for accommodating an electronic tag. Through setting up this holding portion holding electronic tags to the wireless bidirectional transmission of data information of wafer frame and external equipment can be realized to the accessible electronic tags.
Further, in some embodiments, the wafer rack further includes a protection structure 13, and the protection structure 13 is disposed on the rack body 11 and can be used for disposing a sheet type label and protecting the sheet type label. In some embodiments, the protection structure 13 may include a receiving groove 131, the receiving groove 131 may be a shallow groove, the receiving groove 131 is disposed on the frame body 11, and specifically, in some embodiments, the receiving groove 131 may be disposed on the fourth sidewall 114. In some embodiments, the inner shape and size of the accommodating groove 131 may be adapted to the sheet type label. Specifically, the receiving groove 131 may be a square groove, the depth of which may be slightly greater than the depth of the sheet type label, and the length and width of which may be slightly greater than the length and width of the sheet type label. In some embodiments, the protective structure 13 further comprises a transparent protective cover; the transparent protective cover can cover the receiving groove 131 and can be detachably connected to the receiving groove 131, and the transparent protective cover can protect the sheet type label, for example, the sheet type label can be prevented from being torn or wetted. It is understood that in other embodiments, the protection structure 13 is not limited to be disposed on the fourth sidewall 114, and the protection structure 13 may be omitted in some embodiments.
Fig. 3-6 illustrate some embodiments of the present invention wafer rack assembly. The wafer rack assembly may include at least two wafer racks 10 as described above. The two wafer frames 10 can be spliced together, thereby facilitating the implementation of the guide. The wafer frame 10 is provided with a splicing structure, and the splicing structure can be used for detachably splicing two wafer frames 10. Specifically, the first extension portion 116 and the second extension portion 117 can be disposed on another rack body 11 to be detachably connected for a splicing structure of the guide vane. Of course, it is understood that in other embodiments, the splicing structure may be disposed only on the first extension 116 or only on the second extension 117.
In some embodiments, the splicing structure can include a first latch 1161 disposed on the first extension 116 and a second receptacle 1171 disposed on the second extension 117 of the other rack body 11. When the first wafer frame 10a and the second wafer frame 10b are assembled, the first wafer frame 10a and the second wafer frame 10b can be rotated 180 degrees, the first extending portion 116 of one of the first wafer frame and the second extending portion 117 of the other one of the first wafer frame and the second wafer frame can be correspondingly arranged, the first pin 1161 on the first extending portion 116 can be detachably inserted into the second inserting hole 1171 in the second extending portion 117, and the first wafer frame 10a and the second wafer frame 10b can be assembled, so that wafer guiding is facilitated, and practicability and convenience can be improved. It will be appreciated that in some embodiments, the splice structure may also include a first receptacle disposed on the first extension 116 and a second latch disposed on the second extension 117 of the other rack body 11. Of course, it is understood that in other embodiments, the wafer holder 10 may be assembled with an existing wafer holder 10 for guiding, and only the existing wafer holder 10 is required to have a corresponding splicing structure, such as a corresponding pin or socket. In other embodiments, the wafer rack 10 may be assembled with a standard profile wafer rack 10 that is commercially available and that has the same dimensions as the receiving cavity 110 of the wafer rack 10, and then guided.
It is to be understood that the foregoing examples merely represent preferred embodiments of the present invention, and that the description thereof is more specific and detailed, but not intended to limit the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (10)
1. A wafer rack, comprising a rack body (11) having a universal profile; the wafer rack body (11) is internally provided with an accommodating cavity (110) for accommodating wafers (20) with set sizes, and the appearance size of the wafer rack body (11) are matched with a carrier for loading the existing wafer rack and a production line for producing the existing wafer rack;
the wafer rack also comprises a loading structure (12) arranged on the rack body (11), and the loading structure (12) is used for loading the electronic tag.
2. Wafer rack according to claim 1, characterized in that the rack body (11) comprises a first end (11a) into which the wafer (20) is placed, and a second end (11b) arranged opposite to the first end (11 a);
the slice rack body (11) comprises a first side wall (111) and a second side wall (112) which are oppositely arranged; the first side wall (111) is provided with a first extension part (116); the first extension (116) is located at the first end (11a) and extends towards a side opposite to the second side wall (112); the second side wall (112) is provided with a second extending part (117), and the second extending part (117) is positioned at the first end (11a) and extends towards the side opposite to the first side wall (111);
the shapes of the first extension part (116) and the second extension part (117) are matched with a carrier for loading the existing sheet rack body (11) and a production line for producing the existing sheet rack body (11);
the distance between the outermost edges of the first extension part (116) and the second extension part (117) is matched with the inner size of a carrier for loading the existing sheet rack body (11).
3. The wafer rack according to claim 2, wherein the inner wall surface of the first sidewall (111) is provided with a plurality of first limiting grooves (1111),
a plurality of second limiting grooves (1121) are formed in the inner wall surface of the second side wall (112);
the first limiting grooves (1111) and the second limiting grooves (1121) are arranged in a one-to-one correspondence manner and are matched with each other to limit the wafer (20).
4. The wafer rack according to claim 2, characterized in that the outer wall surface of the first side wall (111) and/or the second side wall (112) is provided with a reinforcing rib plate (115); the reinforcing rib plate (115) extends from the first end (11a) to the second end (11 b);
the loading structure (12) is arranged on the reinforcing rib plate (115).
5. The wafer rack according to claim 4, characterized in that the loading structure (12) comprises a receptacle portion protruding from the stiffener plate (115); the accommodating part is provided with an accommodating cavity for accommodating the electronic tag.
6. The wafer rack according to claim 5, characterized in that the receiving portion is integrally formed with the stiffener plate (115).
7. Wafer rack according to claim 1, characterized in that it further comprises a protection structure (13) arranged on the rack body (11) for protecting sheet labels.
8. The wafer rack according to claim 7, wherein the protection structure (13) comprises a receiving groove (131) disposed on the rack body (11) for receiving the sheet tag.
9. The wafer rack according to claim 8, wherein the receiving groove (131) has an inner shape and size adapted to the sheet label,
the protection structure (13) further comprises a transparent protection cover covering the containing groove (131).
10. A wafer rack assembly, comprising at least two wafer racks (10) according to any one of claims 1 to 9 that are spliceable to each other;
the wafer frame (10) is provided with a splicing structure for splicing with the other wafer frame (10).
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CN202220740988.5U CN217306457U (en) | 2022-03-31 | 2022-03-31 | Wafer rack assembly and wafer rack |
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CN202220740988.5U CN217306457U (en) | 2022-03-31 | 2022-03-31 | Wafer rack assembly and wafer rack |
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