CN217306440U

CN217306440U - Novel spraying plate for reaction chamber of semiconductor coating equipment

Info

Publication number: CN217306440U
Application number: CN202220599569.4U
Authority: CN
Inventors: 韩万华; 董彬
Original assignee: Wuxi Shengteng Semiconductor Technology Co ltd
Current assignee: Wuxi Shengteng Semiconductor Technology Co ltd
Priority date: 2022-03-18
Filing date: 2022-03-18
Publication date: 2022-08-26
Anticipated expiration: 2032-03-18

Abstract

The utility model relates to a spray board technical field, and disclose a semiconductor coating equipment reaction chamber is with novel board that sprays, including spraying the board and seting up in the hole that sprays that a plurality of symmetries of spraying inboard set up, the inside screw thread that sprays the board wears to be equipped with a plurality of bolts that are the setting of ring symmetry along spraying the board axis, the fixed cover in the outside of bolt is equipped with the rubber wheel, a plurality of rubber wheels are close to one side common contact mutually and are connected with the stereoplasm rubber ring, the first ring channel has been seted up on the surface that sprays the board, be equipped with spacing slewing mechanism between stereoplasm rubber ring and the first ring channel, a plurality of locating holes have been seted up to the internal surface bottom of ring channel, the inside of locating hole is equipped with positioning mechanism. The utility model discloses can twist simultaneously a plurality of construction bolts and move when spraying the board and installing, improve the installation effectiveness that sprays the board.

Description

Novel spraying plate for reaction chamber of semiconductor coating equipment

Technical Field

The utility model relates to a spray board technical field especially relates to a semiconductor coating equipment reaction chamber is with novel board that sprays.

Background

The spraying plate is an important part in the semiconductor coating equipment, mainly for performing rapid and stable coating work between semiconductors.

Wherein patent number is CN205077140U discloses a semiconductor coating equipment reaction chamber is with novel board that sprays, should spray the board and including the board main part that sprays that the system has fixed screw, the system has the aperture in the board main part that sprays, and should spray the board and have certain defect when the installation:

when the spraying plate is installed, the plurality of external bolts penetrate out of the fixing screw holes and are connected with the inside of equipment, and bolt tightening operation needs to be repeated for multiple times, so that the spraying plate is complex.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that the spraying plate in the prior art is connected with equipment inside when the installation is worn out fixed screw and is connected through a plurality of outside bolts, needs the bolt tightening operation of repeated many times, comparatively loaded down with trivial details problem, and the novel spraying plate for semiconductor coating equipment reaction chamber that provides.

In order to realize the purpose, the utility model adopts the following technical scheme:

a novel spray plate for a reaction chamber of semiconductor coating equipment comprises a spray plate and a plurality of symmetrically arranged spray holes arranged in the spray plate, wherein a plurality of bolts symmetrically arranged in a ring shape along the central axis of the spray plate are penetrated through the internal threads of the spray plate,

the outer side of the bolt is fixedly sleeved with a rubber wheel, one side of the plurality of rubber wheels close to each other is connected with a hard rubber ring in a contact way,

a first annular groove is formed in the surface of the spray plate, a limiting and rotating mechanism is arranged between the hard rubber ring and the first annular groove,

a plurality of positioning holes are formed in the bottom of the inner surface of the annular groove, and positioning mechanisms are arranged inside the positioning holes.

Preferably, one side of the hard rubber ring far away from the spraying plate is fixedly provided with a plurality of connecting plates, the connecting plates are internally and rotatably provided with rotating rods, one end of each rotating rod close to the first annular groove is fixedly provided with a roller, and the roller is positioned in the first annular groove.

Preferably, a second annular groove is formed in the inner wall of the first annular groove, and the wheel wall of the roller is in contact connection with the inner side walls of the first annular groove and the second annular groove.

Preferably, positioning mechanism includes the arc, the arc with even board fixed connection to the outside of bull stick is located to the cover, the locating lever is worn to be equipped with in the inside both ends of arc all slides, the locating lever is worn to locate in the locating hole, the pole wall cover of locating lever is equipped with the spring, the both ends of spring respectively with arc and locating lever fixed connection.

Preferably, a pull rod is fixedly arranged between every two adjacent positioning rods.

Preferably, the connecting plate is fixedly connected with the hard rubber ring through a bolt.

Preferably, the pull rod is arranged in a U shape.

Compared with the prior art, the utility model provides a semiconductor coating equipment reaction chamber is with novel board that sprays possesses following beneficial effect:

1. this semiconductor coating equipment reaction chamber is with novel board that sprays, through bolt, rubber wheel, stereoplasm rubber ring, first ring channel, second ring channel and the spacing slewing mechanism that is equipped with, rotate a plurality of rubber wheels of stereoplasm rubber ring simultaneous drive and rotate for the rubber wheel drives the bolt and rotates, can improve the high-speed joint that sprays board and coating equipment.

2. This semiconductor coating equipment reaction chamber is with novel board that sprays, through the stereoplasm rubber ring that is equipped with, arc, locating hole and positioning mechanism, can confirm the position of stereoplasm rubber ring after the rotation of stereoplasm rubber ring.

The part that does not relate to among the device all is the same with prior art or can adopt prior art to realize, the utility model discloses convenient operation can twist simultaneously a plurality of construction bolts when spraying the board and installing, accomplishes being connected between bolt and screw and the equipment in the shortest time, has improved the installation effectiveness who sprays the board.

Drawings

FIG. 1 is a schematic structural view of a novel spray plate for a reaction chamber of a semiconductor coating device according to the present invention;

fig. 2 is an enlarged view of a portion a of fig. 1.

In the figure: 1 spraying plate, 2 spraying holes, 3 bolts, 4 rubber wheels, 5 hard rubber rings, 6 first annular grooves, 7 connecting plates, 8 rotating rods, 9 idler wheels, 10 second annular grooves, 11 arc-shaped plates, 12 positioning rods, 13 positioning holes, 14 springs and 15 pull rods.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example 1

Referring to fig. 1, a novel spray plate for a reaction chamber of a semiconductor coating device comprises a spray plate 1 and a plurality of symmetrically arranged spray holes 2 arranged inside the spray plate 1, and the spray holes 2 can spray substances.

Referring to fig. 1, a plurality of bolts 3 which are annularly and symmetrically arranged along the central axis of the spraying plate are arranged on the inner thread of the spraying plate 1 in a penetrating manner, and the spraying plate 1 can be installed by connecting the bolts 3 with the inside of a coating device.

Referring to fig. 1, the fixed cover in outside of bolt 3 is equipped with rubber wheel 4, and a plurality of rubber wheels 4 are close to one side and contact jointly and are connected with stereoplasm rubber ring 5 mutually, and the rotation of accessible stereoplasm rubber ring 5 drives a plurality of rubber wheels and carries out 4 rotations.

Example 2

Embodiment 2 as shown in fig. 1-2, on the basis of embodiment 1, a first annular groove 6 is formed in the surface of the spray plate 1, a limiting rotation mechanism is arranged between the hard rubber ring 5 and the first annular groove 6, a plurality of connecting plates 7 are fixedly arranged on one side of the hard rubber ring 5 away from the spray plate 1, the connecting plates 7 are fixedly connected with the hard rubber ring 5 through bolts, so that the connecting plates 7 can be separated from the hard rubber ring 5,

referring to fig. 2, the rotating rod 8 is rotatably arranged inside the connecting plate 7, the roller 9 is fixedly sleeved at one end of the rotating rod 8 close to the first annular groove 6, the roller 9 is located in the first annular groove 6, and the rotating convenience of the hard rubber ring 5 is improved through the roller 9.

Example 3

Embodiment 3 is based on embodiment 2 and as shown in fig. 2, a second annular groove 10 is formed in the inner wall of the first annular groove 6, the wheel wall of the roller 9 is in contact connection with the inner side walls of the first annular groove 6 and the second annular groove 10, and the rotation of the roller 9 is limited by the arrangement of the second annular groove 10, so that the rotation of the whole hard rubber ring 5 is limited.

Example 4

Embodiment 4 is as shown in fig. 2 on the basis of embodiment 1, a plurality of locating holes 13 have been seted up to the internal surface bottom of ring channel, the inside of locating hole 13 is equipped with positioning mechanism, positioning mechanism includes arc 11, arc 11 and even board 7 fixed connection to the cover is located the outside of bull stick 8, locating lever 12 is worn to be equipped with in the inside both ends of arc 11 all slides, locating lever 12 wears to locate in locating hole 13, through the grafting of locating lever 12 and locating hole 13, confirm the position of stereoplasm rubber ring 5.

Referring to fig. 2, a spring 14 is sleeved on a rod wall of each positioning rod 12, two ends of each spring 14 are fixedly connected with the arc-shaped plate 11 and the corresponding positioning rod 12, a pull rod 15 is fixedly arranged between every two adjacent positioning rods 12, the pull rods 15 are arranged in a U-shape, and the two positioning rods 12 can be driven to be pulled by pulling the pull rods 15 at the same time to complete connection and separation of the positioning rods 12 and the positioning holes.

In the utility model, when the spray plate 1 is installed, the spray plate 1 is placed in the coating equipment, and two pull rods 15 are pulled simultaneously, so that the pull rods 15 drive the positioning rods 12 to separate from the positioning holes 13, and the springs 14 are stretched, then the two pull rods 15 are rotated, so that the pull rods 15 drive the arc plate 11, the connecting plate 7 and the hard rubber ring 5 to rotate, and the hard rubber ring 5 limits the rotation of the hard rubber ring 5 through the contact between the roller 9 and the first annular groove 6 and the second annular groove 10, when the hard rubber ring 5 rotates, the plurality of rubber wheels 4 start to be driven to rotate simultaneously through the friction between the hard rubber wheels 4, so that the plurality of rubber wheels 4 start to drive the bolts 3 to rotate and are connected with the threaded holes in the equipment, the installation efficiency is improved, when the screwing distance of the bolts 3 is constant, the pull rods are loosened, and the elastic force of the springs 14 is restored, and the positioning rod 13 is pulled to be inserted into the positioning hole 13 at the corresponding position in the first annular groove 6, so that the position of the hard rubber ring 5 can be determined.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A novel spray plate for a reaction chamber of semiconductor coating equipment comprises a spray plate (1) and a plurality of symmetrically arranged spray holes (2) arranged in the spray plate (1), and is characterized in that a plurality of bolts (3) which are annularly and symmetrically arranged along the central axis of the spray plate are arranged on the inner thread of the spray plate (1) in a penetrating way,

the outer side of the bolt (3) is fixedly sleeved with a rubber wheel (4), one side of the rubber wheels (4) close to each other is connected with a hard rubber ring (5) in a contact manner,

a first annular groove (6) is formed in the surface of the spray plate (1), a limiting and rotating mechanism is arranged between the hard rubber ring (5) and the first annular groove (6),

a plurality of positioning holes (13) are formed in the bottom of the inner surface of the annular groove, and a positioning mechanism is arranged inside the positioning holes (13).

2. The novel spray plate for the reaction chamber of the semiconductor coating equipment according to claim 1, wherein a plurality of connecting plates (7) are fixedly arranged on one side of the hard rubber ring (5) far away from the spray plate (1), a rotating rod (8) is rotatably arranged inside the connecting plates (7), a roller (9) is fixedly sleeved on one end of the rotating rod (8) close to the first annular groove (6), and the roller (9) is positioned in the first annular groove (6).

3. The novel shower plate for the reaction chamber of the semiconductor coating equipment according to claim 2, wherein the inner wall of the first annular groove (6) is provided with a second annular groove (10), and the wall of the roller (9) is in contact connection with the inner side walls of the first annular groove (6) and the second annular groove (10).

4. The novel spraying plate for the reaction chamber of the semiconductor coating equipment according to claim 1, wherein the positioning mechanism comprises an arc plate (11), the arc plate (11) is fixedly connected with the connecting plate (7) and sleeved outside the rotating rod (8), positioning rods (12) are slidably arranged at both ends of the inside of the arc plate (11), the positioning rods (12) are arranged in the positioning holes (13) in a penetrating manner, springs (14) are sleeved on rod walls of the positioning rods (12), and both ends of the springs (14) are respectively fixedly connected with the arc plate (11) and the positioning rods (12).

5. The novel spray plate for the reaction chamber of the semiconductor coating equipment according to claim 4, wherein a pull rod (15) is fixedly arranged between two adjacent positioning rods (12).

6. The novel spray plate for the reaction chamber of the semiconductor coating equipment according to claim 2, wherein the connecting plate (7) is fixedly connected with the hard rubber ring (5) through a bolt.

7. The novel shower plate for the reaction chamber of a semiconductor coating device according to claim 5, wherein the pull rod (15) is U-shaped.