CN217305881U - Single-camera three-dimensional face acquisition and recognition equipment - Google Patents
Single-camera three-dimensional face acquisition and recognition equipment Download PDFInfo
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- CN217305881U CN217305881U CN202122760845.9U CN202122760845U CN217305881U CN 217305881 U CN217305881 U CN 217305881U CN 202122760845 U CN202122760845 U CN 202122760845U CN 217305881 U CN217305881 U CN 217305881U
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Abstract
The embodiment of the utility model provides a relate to face identification technical field, disclose a three-dimensional face acquisition and recognition equipment of single-phase machine, include: the device comprises an equipment shell, a printed circuit board, an infrared collecting camera and an infrared speckle projector, wherein the printed circuit board, the infrared collecting camera and the infrared speckle projector are arranged in the equipment shell; the equipment shell is provided with an assembling hole, and the printed circuit board is provided with an avoiding notch; the infrared acquisition camera is positioned in the avoiding notch and is electrically connected with the printed circuit board, and one end of the infrared acquisition camera, which is provided with a camera head, extends into the assembly hole; the infrared speckle projector is positioned in the avoiding notch and is electrically connected with the printed circuit board, and one end of the infrared speckle projector, which is provided with a projection head, extends into the assembly hole. The utility model discloses a having seted up on the messenger printed circuit board and dodging the breach to form to dodging infrared acquisition camera and infrared speckle projecting apparatus, realize reducing the purpose of this equipment thickness from this.
Description
Technical Field
The embodiment of the utility model provides a relate to face identification technical field, in particular to three-dimensional face of single-phase machine gathers identification equipment.
Background
With the continuous progress of society, the quality of life of people is increasingly improved, and the rapid and effective automatic identity authentication is urgently required. As the intrinsic attributes of people, the biological characteristics of fingerprints, human faces, irises, voiceprints and the like, the method has strong self-stability and individual difference and becomes the most ideal basis for automatic identity verification. Accordingly, biometric identification technology has been rapidly developed in recent decades. The human face recognition technology utilizes the collected facial features and contour data of the human face to analyze and recognize, is an important part in the biological feature recognition technology, has the characteristics of directness, friendliness and convenience, is easy to accept by users, and thus is widely researched and applied.
Three-dimensional face acquisition and recognition equipment is a new technology, and one part of the technology is equipment for acquiring face data by using a single camera, fitting and analyzing and then recognizing the face data. Based on the problem of the internal structure layout, the equipment in the form has the problem that the product thickness is large, and the equipment is difficult to be applied to a scene with requirements on the thickness and the size of the equipment, such as an intelligent door lock.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model aims to provide a three-dimensional face of single-phase machine gathers identification equipment to overcome the identification equipment among the prior art and be difficult to be applied to the problem that has the required scene to equipment thickness size because of product thickness is great.
In order to solve the above technical problem, an embodiment of the utility model provides a three-dimensional face acquisition and recognition equipment of single-phase machine, include: the device comprises a device shell, a printed circuit board, an infrared collecting camera and an infrared speckle projector, wherein the printed circuit board, the infrared collecting camera and the infrared speckle projector are arranged in the device shell;
the equipment shell is provided with an assembling hole, and the printed circuit board is provided with an avoiding notch;
the infrared acquisition camera is positioned in the avoiding notch and is electrically connected with the printed circuit board, and one end of the infrared acquisition camera, which is provided with a camera head, extends into the assembly hole;
the infrared speckle projector is positioned in the avoiding notch and electrically connected with the printed circuit board, and one end of the infrared speckle projector, which is provided with a projection head, extends into the assembly hole.
The embodiment of the application comprises a printed circuit board, an infrared collecting camera and an infrared speckle projector which are arranged in an equipment shell, wherein the infrared speckle projector is used for generating speckle patterns on the surface of a human face and has no invasion to the human body; the infrared acquisition camera is used for acquiring dynamic images of the face surface. The method is different from the method of connecting an infrared collecting camera and an infrared speckle projector to a printed circuit board in the prior art. The embodiment of this application dodges the breach through having seted up on printed circuit board to the other end to setting up the infrared collection camera and the infrared speckle projector of accomplishing on equipment shell forms dodges, and then reduces the difference in height between infrared collection camera and the infrared speckle projector and the printed circuit board, realizes reducing the purpose of this equipment thickness from this. And the infrared acquisition camera and the infrared speckle projector also have the function of reducing the power consumption of the equipment.
In addition, the avoidance notch comprises a first avoidance notch and a second avoidance notch which are arranged on the two opposite side edges of the plane where the printed circuit board is located, and the assembly hole comprises a first assembly hole and a second assembly hole; the infrared acquisition camera is positioned in the first avoidance notch and is electrically connected with the printed circuit board, and one end of the infrared acquisition camera, which is provided with a camera head, extends into the assembly hole; the infrared speckle projector is positioned in the second avoidance notch and is electrically connected with the printed circuit board, and one end of the infrared speckle projector, which is provided with a projection head, extends into the assembly hole. Considering that the infrared collecting camera and the infrared speckle projector which are arranged at too close distances may have mutual negative influence when in work, the arrangement distance between the infrared collecting camera and the infrared speckle projector is pulled as far as possible on the premise that the size of the printed circuit board is met, so that a first avoidance notch and a second avoidance notch are respectively arranged on the edges of two opposite sides of the plane where the printed circuit board is located. The infrared collecting camera and the infrared speckle projector are respectively avoided through the first avoiding notch and the second avoiding notch, so that the negative influence of the infrared collecting camera and the infrared speckle projector during working is reduced, and the design difficulty of the printed circuit board can be reduced.
In addition, an infrared LED lamp is attached to the printed circuit board. The infrared LED lamp is the light filling equipment that uses when daylighting environment is abominable and weather environment changes lead to light can't reach the collection effect. Different from the way of adopting split type LED lamp setting on printed circuit board among the prior art, the embodiment of this application does benefit to the height that can save the connecting piece between infrared LED lamp and the printed circuit board simultaneously to simplify the circuit through adorning infrared LED lamp subsides on printed circuit board, realizes not additionally increasing equipment thickness's purpose from this. Moreover, the integrated infrared LED lamp also has the functions of further reducing the power consumption of the equipment and reducing the cost.
In addition, the assembly holes further comprise a third assembly hole for accommodating the infrared LED lamp; the arrangement positions of the first avoidance notch, the second avoidance notch and the infrared LED lamp are located on a straight line; correspondingly, the arrangement positions of the first assembly hole, the second assembly hole and the third assembly hole are also located on a straight line. The purpose of setting up the third pilot hole is for making things convenient for infrared LED lamp to carry out the light filling to the face. In consideration of the overall layout problem of the equipment, the arrangement positions of the first avoidance gap, the second avoidance gap and the infrared LED lamp are located on a straight line; correspondingly, the position that sets up of first pilot hole, second pilot hole and third pilot hole also is located a straight line, set up the infrared collection camera and the infrared speckle projector of accomplishing on equipment shell promptly and be located a straight line with the position that sets up of infrared LED lamp, and infrared LED lamp is located between infrared collection camera and the infrared speckle projector under this kind of setting mode, so can make equipment internal layout more scientific, reasonable, infrared LED lamp is more suitable to the light filling area of people's face, the outward appearance of equipment is also more pleasing to the eye.
In addition, a computing chip is integrated on the printed circuit board; a heat conducting piece is clamped between the computing chip and the equipment shell; and/or a heat conducting piece is clamped between one end of the infrared acquisition camera, which penetrates through the first avoidance notch, and the equipment shell; and/or a heat conducting piece is clamped between one end of the infrared speckle projector, which penetrates through the second avoidance notch, and the equipment shell. Specifically, a computing chip and other electronic components can be integrated on the printed circuit board and used for image acquisition, data processing, image storage, analysis and recognition and signal output, and the printed circuit board has high integration level and is favorable for reducing power consumption and cost. Here, the heat conduction piece sets up and can be transmitted the equipment casing with the heat that produces when infrared collection camera and the infrared speckle projector work to the calculation chip. It will be appreciated that the thermal paste transfers heat generated by the computing chip to the side of the device housing having the mounting holes, and transfers heat generated by the infrared collection camera and the infrared speckle projector to the side opposite the mounting holes. Wherein, the heat conducting piece is preferably a heat conducting patch with smaller thickness.
In addition, the infrared collecting camera is connected with the printed circuit board through a first connector, and the infrared speckle projector is connected with the printed circuit board through a second connector; bonding pieces are arranged on the first connector and the second connector in a pressure-sharing mode. The setting of bonding piece can ensure that first connector and second connector are firmly fixed on printed circuit board, avoids taking place the risk that becomes flexible or drop. Wherein, the adhesive piece is preferably a back adhesive foam sticker with excellent adhesive capacity.
In addition, the infrared collecting camera and the infrared speckle projector are respectively fixed in the first assembling hole and the second assembling hole in a sticking mode. Make infrared collection camera and infrared speckle projector fix in first mounting hole and second mounting hole through pasting the mode and can make equipment structure simpler, and do not produce stress during the installation, do benefit to above-mentioned device and stabilize work.
In addition, the equipment shell comprises a front shell and a rear cover which are connected, the front shell is provided with an opening, and the rear cover is covered with the opening and forms an accommodating space for accommodating the printed circuit board, the infrared collecting camera and the infrared speckle projector together with the front shell; the front shell is provided with the assembling hole. In order to facilitate the arrangement of the printed circuit board, the infrared collecting camera and the infrared speckle projector inside the equipment shell, the equipment shell can be split into a front shell and a rear cover which are provided with accommodating spaces after being butted. The front shell is a shell with a box-packed structure, the rear cover is a corresponding cover body, in one implementation mode, the printed circuit board which is completely arranged can be fixed with the front shell by using the connecting piece, the front shell and the rear cover which are completely assembled are fixed together by using the connecting piece, and the structure is simple, stable and reliable.
In addition, the size of the rear cover is larger than the caliber of the opening, the rear cover comprises a central part facing the opening and an edge part surrounding the central part and positioned around the opening, and the edge part is provided with a mounting hole. Considering that the equipment has the demand of going up the wall again or setting up in the door body, cover after not realizing holding above-mentioned device with the mounting hole setting, avoid causing the action that produces stress such as extrusion to the device when the installation from this. Preferably, the rear cover is provided with at least three mounting holes.
In addition, the front shell is made of Zn3 alloy, and the rear cover is made of stainless steel. Because the front shell is of a box-packed structure, Zn3 alloy material can be adopted, the die-casting molding is facilitated, and the cost is low. And then the design of setting up the mounting hole is covered, so can adopt and adopt the shaping of stainless steel sheet metal, corrosion-resistant, pleasing to the eye, with low costs to can absorb some installation stress.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a front view of a single-camera three-dimensional face acquisition and recognition device provided in an embodiment of the present application;
fig. 2 is a side view of a single-camera three-dimensional face acquisition and recognition device according to an embodiment of the present application;
fig. 3 is a top view of a single-camera three-dimensional face acquisition and recognition device provided in an embodiment of the present application;
fig. 4 is an exploded perspective view of a single-camera three-dimensional face acquisition and recognition device according to an embodiment of the present disclosure;
in the figure, 1-device housing, 11-front shell, 110-assembly hole, 111-first assembly hole, 112-second assembly hole, 113-third assembly hole, 12-back cover, 121-mounting hole; 2-a printed circuit board, 20-an avoidance gap, 21-a first avoidance gap, 22-a second avoidance gap; 3-an infrared acquisition camera, 31-a first connector; 4-infrared speckle projector 41-second connector; 5-an infrared LED lamp; 6-calculating the chip; 7-a thermally conductive member; 8-bonding member; 9-PET face paste.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following describes each embodiment of the present invention in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.
At present, more existing face acquisition and recognition equipment is two-dimensional face acquisition and recognition equipment, three-dimensional face acquisition and recognition equipment is a new technology, and one part of the three-dimensional face acquisition and recognition equipment is equipment for respectively acquiring face data and performing recognition after fitting analysis by a plurality of cameras. Because the number of the used cameras is large, the product has the defects of large volume, high power consumption and high cost; the other part is equipment for acquiring face data and performing identification after fitting analysis by a single camera, and although the number of cameras used by the equipment is sharply reduced, the problems of large product thickness, high power consumption and high cost are caused due to unreasonable internal structure layout, so that the equipment is difficult to apply to a scene with small requirement volume, especially small thickness, of an intelligent door lock.
The applicant has noted that prior art single camera acquisition identification devices generally comprise a housing, and a printed circuit board, a camera and a speckle projector disposed within the housing. Specifically, the camera and the speckle projector are arranged on the printed circuit board, namely, the camera and the speckle projector are convex compared with the circuit board, so that the whole thickness of the equipment is at least the thickness of the printed circuit board plus the height of the device with the larger height dimension in the camera and the speckle projector. Moreover, the height of the camera and the height of the speckle projector are larger than those of the LED lamps, so that the LED lamps are away from the surface of the shell when the shell meets the setting requirements of the camera and the speckle projector. To eliminate this distance, the LED lamps in the prior art are arranged on the printed circuit board in a split type. All of the above results in the thickness of the single-camera collecting and identifying device being large.
In order to solve the problem of the thickness of single-camera acquisition and identification equipment, the inventor researches and discovers that the shape of a printed circuit board can be adjusted to a certain degree, avoidance is formed in an assembly area of a camera and a speckle projector, and the purpose of reducing the thickness of a product is further achieved.
As shown in fig. 1 and 4, the single-camera three-dimensional face acquisition and recognition device provided in the embodiment of the present application includes: an apparatus housing 1, and a Printed Circuit Board (PCB) 2, an infrared collection camera 3, and an infrared speckle projector 4 disposed within the apparatus housing 1; an assembly hole 110 is formed in the equipment shell 1, and an avoidance gap 20 is formed in the printed circuit board 2; the infrared acquisition camera 3 is positioned in the avoiding notch 20 and is electrically connected with the printed circuit board 2, and one end of the infrared acquisition camera 3, which is provided with a camera head, extends into the assembling hole 110; the infrared speckle projector 4 is located in the avoiding notch 20 and electrically connected to the printed circuit board 2, and one end of the infrared speckle projector 4 having a projection head extends into the assembly hole 110.
Through having seted up on printed circuit board 2 and dodging breach 20 to the other end to setting up the infrared collection camera 3 and the infrared speckle projector 4 of accomplishing on equipment housing 1 forms dodges, and then reduces the difference in height between infrared collection camera 3 and the infrared speckle projector 4 and the printed circuit board 2, realizes reducing the purpose of this equipment thickness from this. Specifically, the single-camera three-dimensional face acquisition and recognition equipment can save the thickness of one printed circuit board 2, and the thickness is at least 3 mm. The setting position of the avoidance notch 20 on the printed circuit board 2 may be determined according to actual requirements, and the avoidance notch 20 may be located in the middle position or in the edge position. Generally, the avoiding notch 20 is disposed at the edge of the printed circuit board 2 to avoid affecting the disposition of other devices on the printed circuit board 2, and to reduce the design difficulty of the printed circuit board 2.
In some embodiments, the avoiding notch 20 includes a first avoiding notch 21 and a second avoiding notch 22 disposed at two opposite side edges of the plane where the printed circuit board 2 is located, and the mounting hole 110 includes a first mounting hole 111 and a second mounting hole 112; one end of the infrared acquisition camera 3, which is provided with a camera head, is arranged in the first assembling hole 111, and the other end of the infrared acquisition camera passes through the first avoidance notch 21; one end of the infrared speckle projector 4 having a projection head is disposed in the second assembly hole 112, and the other end passes through the second avoidance gap 22. On the premise that the size of the printed circuit board 2 is met, the distance between the infrared collecting camera 3 and the infrared speckle projector 4 is set as far as possible, on one hand, the calculation requirement of the structured light three-dimensional visual algorithm is mainly met, and on the other hand, the negative influence of the structured light three-dimensional visual algorithm and the infrared speckle projector during working can be reduced due to mutual interference. Specifically, the infrared collection camera 3 works on the principle that projected light is reflected on the surface of an object, and then reflected light is obtained to form an image. In the actual use process, a glass sheet is additionally arranged at a certain distance in front of the camera head of the infrared acquisition camera 3, namely at the position of the first assembling hole 111 to seal and protect the camera head; a glass sheet is additionally arranged at a certain distance in front of the projection head of the infrared speckle projector 4, namely at the position of the second assembly hole 112, so that the projection head is sealed and protected. The problem that the light projected from the infrared speckle projector 4 enters the infrared collecting camera 3 for image formation because the distance between the infrared collecting camera 3 and the infrared speckle projector 4 is short is avoided. In addition, in the present embodiment, a first avoidance notch 21 and a second avoidance notch 22 are respectively disposed on two opposite side edges of the plane on which the printed circuit board 2 is located. At this time, the first avoidance notch 21 and the second avoidance notch 22 are equivalent to notches formed on the printed circuit board 2, and the infrared collecting camera 3 and the infrared speckle projector 4 are respectively avoided by the above setting. Compared with the mode of arranging the avoidance notch 20 at the middle position of the printed circuit board 2, the mode of arranging the avoidance notch 20 at the edge can reduce the design difficulty of the printed circuit board 2. And after the infrared collecting camera 3 and the infrared speckle projector 4 are assembled in the equipment shell 1, the end faces of the other ends of the infrared collecting camera 3 and the infrared speckle projector 4 and the plane where the printed circuit board 2 is located form a complete rectangle, so that the attractiveness of the internal layout of the equipment is improved. In other embodiments, the end of the infrared collecting camera 3 having the camera head may be disposed in the second mounting hole 112, and the end of the infrared speckle projector 4 having the projection head may be disposed in the first mounting hole 111, which is not limited in particular.
In some embodiments, the printed circuit board 2 has an infrared LED lamp 5 mounted thereon. Compared with a split type LED lamp in the prior art, the mounted infrared LED lamp 5 is beneficial to simplifying a circuit and simultaneously can save the height of a connecting piece between the infrared LED lamp 5 and the printed circuit board 2, so that the purpose of not additionally increasing the thickness of equipment is realized. In addition, the attached infrared LED lamp 5 also has the functions of further reducing the power consumption of the apparatus and reducing the cost.
In some embodiments, referring to fig. 1, the mounting holes 110 further include a third mounting hole 113 for receiving the infrared LED lamp 5; the arrangement positions of the first avoidance notch 21, the second avoidance notch 22 and the infrared LED lamp 5 are located on a straight line; accordingly, the positions of the first, second, and third fitting holes 111, 112, and 113 are also located on a straight line. Set up the infrared camera 3 and the infrared speckle projector 4 that accomplish on equipment casing 1 promptly and be located a straight line with the setting position of infrared LED lamp 5, and infrared LED lamp 5 is located between infrared camera 3 and the infrared speckle projector 4 under this kind of setting mode, so can make equipment internal layout more scientific, reasonable, and infrared LED lamp 5 is more suitable to the light filling region of people's face, and the outward appearance of equipment is also more pleasing to the eye. More specifically, the first fitting hole 111, the second fitting hole 112, and the third fitting hole 113 are located on a common horizontal line for better suitability for practical use.
In some embodiments, the printed circuit board 2 may also have integrated thereon a computing chip 6 and other electronic components for image acquisition, data processing, image storage, analysis and identification, signal output, and the like. And heat conducting pieces 7 are respectively clamped between the computing chip 6 and the equipment shell 1, between one end of the infrared collecting camera 3, which penetrates through the first avoidance notch 21, and the equipment shell 1, and between one end of the infrared speckle projector 4, which penetrates through the second avoidance notch 22, and the equipment shell 1. It will be appreciated that the provision of the thermal conductor 7 here enables heat generated by the computing chip 6, the infrared collection camera 3 and the infrared speckle projector 4 during operation to be transferred to the device housing 1. The heat conductive paste transfers heat generated by the computing chip 6 to a face of the device case 1 having the fitting hole 110, and transfers heat generated by the infrared collection camera 3 and the infrared speckle projector 4 to a face opposite to the fitting hole 110. Among them, the heat-conducting member 7 is preferably a heat-conducting patch or pad having a small thickness.
In some embodiments, the infrared collection camera 3 is connected to the printed circuit board 2 by a first connector 31, and the infrared speckle projector 4 is connected to the printed circuit board 2 by a first connector 31; the first connector 31 and the second connector 41 are provided with bonding pieces 8 in a pressure-equalizing manner. The first connector 31 and the second connector 41 are flex cables. The adhesive member 8 is provided to ensure that the first connector 31 and the second connector 41 are firmly fixed on the printed circuit board 2, so as to increase the compactness of the internal structure and avoid the risk of loosening or falling off. Wherein, the adhesive piece 8 is preferably a back adhesive foam sticker with excellent adhesive capacity.
In some embodiments, the infrared collecting camera 3 and the infrared speckle projector 4 are fixed in the first assembling hole 111 and the second assembling hole 112 respectively by means of adhesion. The mode of pasting makes infrared collection camera 3 and infrared speckle projector 4 fix and can make equipment structure simpler in first pilot hole 111 and second pilot hole 112, and does not produce stress during the installation, does benefit to above-mentioned device and stabilizes work. Specifically, a sticking method such as glue may be used. Glue is coated on the side body of the infrared acquisition camera 3 and the infrared speckle projector 4, then the infrared acquisition camera 3 is pasted in the first assembly hole 111, the infrared speckle projector 4 is pasted in the second assembly hole 112, in order to adapt to the above-mentioned fixing, all be to the cylindrical support that is of the inside extension of equipment housing 1 on first assembly hole 111 and the second assembly hole 112, so as to form a great contact surface with the side body of the infrared acquisition camera 3 and the infrared speckle projector 4, and then realize that the assembly relation of the infrared acquisition camera 3 and the infrared speckle projector 4 in the equipment housing 1 is reliable and firm.
In some embodiments, to facilitate the placement of the printed circuit board 2, the infrared collection camera 3 and the infrared speckle projector 4 inside the device housing 1, the device housing 1 may be split into a front case 11 and a rear cover 12, as shown in fig. 2. Specifically, the device housing 1 includes a front case 11 and a rear cover 12 connected to each other, the front case 11 has an opening for accommodating the above-mentioned devices, and the mounting holes 110 are formed in the front case 11 and include a first mounting hole 111, a second mounting hole 112, and a third mounting hole 113. Correspondingly, the rear cover 12 covers the opening and encloses an accommodating space with the front shell 11. In one implementation, the printed circuit board 2 after being arranged and the front shell 11 can be fixed together by using a connector, and the front shell 11 and the rear cover 12 after being assembled can be fixed together by using a connector, so that the structure is simple, stable and reliable. The connector may be a bolt.
In addition, a PET face sticker 9 is further disposed on an outer side of one face of the front case 11 on which the mounting hole 110 is disposed (i.e., a front end face of the front case 11) to beautify the appearance of the product. The PET surface sticker 9 is also provided with a gum film-coated foam sticker for sealing and vibration isolation of the front end surface during installation by a user. Correspondingly, the PET surface sticker 9 and the gum film-coated foam sticker are also provided with assembly holes 110 corresponding to the first assembly hole 111, the second assembly hole 112 and the third assembly hole 113.
In some embodiments, the size of the rear cover 12 is larger than the opening, the rear cover 12 includes a central portion facing the opening, and an edge portion surrounding the central portion and located around the opening, and the edge portion is provided with a mounting hole 121. Reference is made to fig. 3. In consideration of the requirement that the device is installed on the upper wall or in the door body, the installation hole 121 is formed in the rear cover 12 that does not accommodate the device, thereby preventing the device from being extruded and the like to generate stress during installation. Preferably, one mounting hole 121 may be provided at a central position at the upper side edge and one mounting hole 121 may be provided at both side positions at the lower side edge, thereby forming a stable mounting relationship of a triangle.
In some embodiments, since the front housing 11 is a box-packed structure, the front housing 11 may be made of Zn3 alloy, which is beneficial to die-casting and low in cost. And the rear cover 12 is provided with a design of a mounting hole 121, the rear cover 12 can be made of stainless steel, is formed by stainless steel sheet metal plates, is corrosion-resistant, attractive and low in cost, and can absorb part of mounting stress.
To sum up, this application embodiment has solved in certain distance, environment, and single camera can acquire facial three-dimensional data of people, locks fast and discernment object, and it is little influenced by external light, has littleer product thickness in order to obtain better embeddability, lower cost, consumption and higher reliability. The equipment is convenient to install and operate, and can be independently used for collecting and identifying the equipment, and can also be used on line with an external industrial personal computer and the like for storing images and further analyzing the images.
It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in its practical application.
Claims (10)
1. A single-camera three-dimensional face acquisition and recognition device is characterized by comprising: the device comprises an equipment shell, a printed circuit board, an infrared collecting camera and an infrared speckle projector, wherein the printed circuit board, the infrared collecting camera and the infrared speckle projector are arranged in the equipment shell;
the equipment shell is provided with an assembling hole, and the printed circuit board is provided with an avoiding notch;
the infrared acquisition camera is positioned in the avoiding notch and is electrically connected with the printed circuit board, and one end of the infrared acquisition camera, which is provided with a camera head, extends into the assembly hole;
the infrared speckle projector is positioned in the avoiding notch and electrically connected with the printed circuit board, and one end of the infrared speckle projector, which is provided with a projection head, extends into the assembly hole.
2. The single-camera three-dimensional face acquisition and recognition device according to claim 1, wherein the avoidance gap comprises a first avoidance gap and a second avoidance gap which are arranged on two opposite side edges of a plane where the printed circuit board is located, and the assembly holes comprise a first assembly hole and a second assembly hole;
the infrared acquisition camera is positioned in the first avoidance notch and is electrically connected with the printed circuit board, and one end, provided with a camera head, of the infrared acquisition camera extends into the assembly hole;
the infrared speckle projector is positioned in the second avoidance notch and electrically connected with the printed circuit board, and one end of the infrared speckle projector, which is provided with a projection head, extends into the assembly hole.
3. The single-camera three-dimensional face acquisition and recognition device according to claim 1 or 2, wherein an infrared LED lamp is attached to the printed circuit board.
4. The single-camera three-dimensional face acquisition and recognition device according to claim 2, wherein the assembly holes further comprise a third assembly hole for accommodating the infrared LED lamp;
the arrangement positions of the first avoidance notch, the second avoidance notch and the infrared LED lamp are located on a straight line; the arrangement positions of the first assembly hole, the second assembly hole and the third assembly hole are also located on a straight line.
5. The single-camera three-dimensional face acquisition and recognition device according to claim 4, wherein the printed circuit board is further provided with a computing chip; a heat conducting piece is clamped between the computing chip and the equipment shell; and/or a heat conducting piece is clamped between one end of the infrared acquisition camera, which penetrates through the first avoidance notch, and the equipment shell; and/or a heat conducting piece is clamped between one end of the infrared speckle projector, which penetrates through the second avoidance notch, and the equipment shell.
6. The single-camera three-dimensional face acquisition and recognition device according to claim 5, wherein the infrared acquisition camera is connected to the printed circuit board through a first connector, and the infrared speckle projector is connected to the printed circuit board through a second connector; bonding pieces are arranged on the first connector and the second connector in a pressure-sharing mode.
7. The single-camera three-dimensional face collection and recognition device according to claim 6, wherein the infrared collection camera and the infrared speckle projector are fixed in the first assembly hole and the second assembly hole respectively by means of adhesion.
8. The single-camera three-dimensional face acquisition and recognition device according to claim 1, wherein the device housing comprises a front shell and a rear cover which are connected, the front shell is provided with an opening, and the rear cover is provided with the opening and encloses with the front shell an accommodating space for accommodating the printed circuit board, the infrared acquisition camera and the infrared speckle projector; the front shell is provided with the assembly hole.
9. The single-camera three-dimensional face acquisition and recognition device according to claim 8, wherein the size of the rear cover is larger than the caliber of the opening, the rear cover comprises a central portion facing the opening and a rim portion surrounding the central portion and located around the opening, and the rim portion is provided with a mounting hole.
10. The single-camera three-dimensional face acquisition and recognition device according to claim 9, wherein the front shell is made of Zn3 alloy, and the rear cover is made of stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122760845.9U CN217305881U (en) | 2021-11-11 | 2021-11-11 | Single-camera three-dimensional face acquisition and recognition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122760845.9U CN217305881U (en) | 2021-11-11 | 2021-11-11 | Single-camera three-dimensional face acquisition and recognition equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217305881U true CN217305881U (en) | 2022-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122760845.9U Active CN217305881U (en) | 2021-11-11 | 2021-11-11 | Single-camera three-dimensional face acquisition and recognition equipment |
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| Country | Link |
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| CN (1) | CN217305881U (en) |
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2021
- 2021-11-11 CN CN202122760845.9U patent/CN217305881U/en active Active
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