CN217283869U

CN217283869U - Novel built-in heat dissipation power supply structure

Info

Publication number: CN217283869U
Application number: CN202220682544.0U
Authority: CN
Inventors: 孙明岩; 孙传宇
Original assignee: Xi'an Yingke Power Supply Co ltd
Current assignee: Xi'an Yingke Power Supply Co ltd
Priority date: 2022-03-27
Filing date: 2022-03-27
Publication date: 2022-08-23
Anticipated expiration: 2032-03-27

Abstract

The utility model provides a novel built-in heat dissipation power supply structure, which belongs to the technical field of power electronic layout, and comprises a power supply shell, heat dissipation tooth sheets, a side plate, a top plate, a double-layer circuit board and the like, wherein the power supply shell comprises a base and two mounting plates, and the heat dissipation tooth sheets are uniformly arranged at the bottom of the base; the curb plate passes through the side of installation screw seal installation at the installation inner tower, and the roof passes through the top of fixed screw seal installation at the installation inner tower, is provided with a plurality of electrical interfaces and pilot lamp on the roof. Compared with the prior art, the heating element of the power supply structure is close to the heat conducting shell, the phenomenon of overhigh local temperature cannot occur, the size is saved due to the double-layer arrangement scheme, heat dissipation is more favorable, when the temperature in the cavity rises quickly, the fans on the two sides can be automatically opened based on the sensor switch, heat dissipation is jointly performed through the shell and the fans, the product quality is guaranteed, and the risk that the product is damaged due to overheating is reduced.

Description

Novel built-in heat dissipation power supply structure

Technical Field

The utility model relates to a power electronics overall arrangement technical field especially relates to a novel built-in heat dissipation power supply structure.

Background

The power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads. Among the current power module, common power module does not design dedicated heat dissipation and ventilation structure, because power module during operation, power device can produce a large amount of heats, and under long-time behavior, power device produces the heat and can conduct to control circuit and chip, and control circuit can influence its each item performance index at work under the high heat environment for a long time, causes the potential safety hazard. In addition, the control circuit and the power device are generally arranged on the same circuit board, and reasonable layout and division are not performed.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a novel heat dissipation overall arrangement and double-deck circuit board structure, this power structure's the original paper that generates heat is close to heat conduction casing, the too high phenomenon of local temperature can not appear, and the volume is not only practiced thrift to the double-deck scheme of arranging, more favourable heat dissipation, when the inside temperature of cavity risees fast, the both sides fan can be opened based on sensor switch is automatic, dispels the heat jointly through casing and fan, guarantees product quality, reduces the risk that the product damaged because of overheated.

In order to achieve the above object, the embodiments of the present invention adopt the following technical solutions:

the utility model provides a novel built-in heat dissipation power supply structure, includes power casing, heat dissipation pick, curb plate and roof, wherein: the power supply shell comprises a base and two mounting plates, connecting holes are formed in two sides of the base, the two mounting plates are vertically arranged on two sides of the base, an installation inner table is arranged on the inner side of each mounting plate, a side step for installing a side plate is formed between the side face of the installation inner table and the inner wall of each mounting plate, a top step for installing a top plate is formed between the top face of the installation inner table and the inner wall of each mounting plate, and mounting holes are symmetrically formed in the side step and the top step; the heat dissipation tooth sheets are uniformly arranged at the bottom of the base; the two side plates are hermetically arranged on the side surface of the mounting inner platform through mounting screws, and the mounting screws are matched with the mounting holes for positioning; the roof passes through the top of fixed screw seal installation at the installation inner tower, is provided with a plurality of electrical interfaces and pilot lamp on the roof.

Preferably, the two mounting plates are respectively provided with an air inlet channel and an air outlet channel, an air inlet fan is installed in the air inlet channel, and an air outlet fan is installed in the air outlet channel.

Preferably, the top plate is further provided with a top isolation bin, the top isolation bin is composed of a bin body and a cover body, the cover body is connected with the bin body through a top screw, and the bottom of the top isolation bin is provided with a wiring hole for connecting a power supply shell.

Preferably, the power supply further comprises a double-layer circuit board arranged in the power supply shell, the double-layer circuit board is composed of a first circuit board and a second circuit board, the first circuit board and the second circuit board are supported through four bolts, and the first circuit board and the second circuit board are respectively provided with a plurality of DC/DC power supply modules and a common mode filter which work independently.

The utility model discloses a novel built-in heat dissipation power supply structure has following beneficial effect:

1) this power compact structure can hold double-deck power supply circuit board, and high reasonable in design can make the generating heat original paper of circuit board closely adjacent heat dissipation casing. Meanwhile, the heat dissipation tooth sheets are arranged, and the heat dissipation performance is improved.

2) The fan has still been configured to the both sides of this power structure, and this fan can configure temperature sensor and realize automatic cooling, and when the inside temperature of cavity risees fast, both sides fan can be based on sensor switch is automatic to be opened, dispels the heat jointly through casing and fan, guarantees product quality, reduces the risk that the product damaged because of overheated.

3) The top of the power supply structure is provided with the top isolation bin for arranging the control circuit, the control circuit and the power circuit are arranged in a separated mode, integral ripples can be reduced, and the anti-jamming capability of the circuit is improved.

4) This power structure makes things convenient for the split and maintains, and curb plate and roof are all installed through the screw.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic view of the internal structure of the present invention;

fig. 4 is a schematic view of the fan arrangement of the present invention;

fig. 5 is a schematic diagram of the circuit board structure of the present invention.

In the figure, 1-power supply shell, 101-base, 102-mounting plate, 103-connecting hole, 104-mounting inner platform, 105-mounting hole, 106-air inlet channel, 107-air outlet channel, 108-air inlet fan, 109-air outlet fan, 2-heat dissipation toothed sheet, 3-side plate, 301-mounting screw, 4-top plate, 401-fixing screw, 402-electrical interface, 403-indicator light, 5-top isolation bin, 501-bin body, 502-cover body, 503-top screw, 504-wiring hole and 6-double-layer circuit board.

Detailed Description

The invention is further explained according to the attached drawings:

as shown in fig. 1 to 5, the internal heat dissipation power supply structure includes a power supply housing 1, heat dissipation fins 2, side plates 3, and a top plate 4, wherein: the power supply shell 1 is composed of a base 101 and two mounting plates 102, wherein three connecting holes 103 are respectively formed in two sides of the base 101, and the connecting holes 103 are used for integrally mounting the structure. The two mounting plates 102 are vertically arranged at the tail ends of two sides of the base 101 and are load-bearing main bodies, the mounting plates 102 and the base 101 can be integrally manufactured, a mounting inner table 104 is arranged on the inner side of the mounting plates 102, the top of the mounting inner table 104 is 2-5 cm higher than the bottom of the top of the mounting plates 102, the side edge of the mounting inner table 104 is retracted 2-5 cm lower than the side edge of the mounting plates 102, a side step for mounting the side plate 3 is formed between the side surface of the mounting inner table 104 and the inner wall of the mounting plates 102, a top step for mounting the top plate 4 is formed between the top surface of the mounting inner table 104 and the inner wall of the mounting plates 102, and mounting holes 105 are symmetrically formed in the side step and the top step; the radiating fins 2 are uniformly arranged at the bottom of the base 101; the two side plates 3 are hermetically arranged on the side surface of the mounting inner platform 104 through mounting screws 301, and the mounting screws 301 are matched with the mounting holes 105 for positioning; the top plate 4 is hermetically mounted on the top of the mounting inner table 104 by fixing screws 401, and a plurality of electrical interfaces 402 and indicator lights 403 are provided on the top plate 4.

In the figure, two mounting plates 102 are respectively provided with an air inlet channel 106 and an air outlet channel 107, an air inlet fan 108 is installed in the air inlet channel 106, and an air outlet fan 109 is installed in the air outlet channel 107.

In this embodiment, the top plate 4 is further provided with a top isolation bin 5, the top isolation bin 5 is composed of a bin body 501 and a cover body 502, the cover body 502 is connected with the bin body 501 through a top screw 503, the bottom of the top isolation bin 5 is provided with a wire routing hole 504 for communicating with the power supply housing 1, and a potting process can be further adopted after the wire routing. In practical application, a control circuit is arranged in the top isolation bin, and a power unit, a filter and the like are arranged inside the shell on the lower side.

Specifically, the power supply further comprises a double-layer circuit board 6 installed in the power supply shell 1, wherein the double-layer circuit board 6 is composed of a first circuit board and a second circuit board, the first circuit board and the second circuit board are supported through four bolts, and a plurality of DC/DC power supply modules and a common-mode filter which work independently are arranged on the first circuit board and the second circuit board respectively. And the input end and the output end of the DC/DC power supply module are both connected with a common-mode filter. The power heating devices of the circuit board should be arranged next to the housing, for example: and power devices are arranged on the top of the first circuit board and the bottom of the second circuit board. Specifically, the DC/DC power module and the common mode filter both adopt the existing structures, and the scheme only relates to the layout and the structure.

It should be noted that this power structure is particularly suitable for vehicle mounted power, power casing bottom design is from heat dissipation tooth, both sides design grafting fan around the power, the fan is inlayed and is connected with the casing inside, the fan chooses for use 24V 0.5A specification, provide voltage through power self, the inside temperature sensor that is equipped with of power, when the long-time during operation of power, the inside temperature of power risees, when the heat can not be conducted away through casing self, after the sensor senses the temperature and surpasss the settlement scope, switch on power fan device through temperature detect switch, induced draft through a side fan, a side fan bloies, reach the purpose of the inside cooling of power, when the temperature reduces to below the setting value, temperature switch disconnection, the fan stops working, the power heat is conducted to the external world through casing self. In the power supply working process, if for underloading work, the inside temperature of power cavity can not be too high, the power will generate heat the device through the casing and produce and go away from the heat conduction, when heavy load during operation, the inside temperature of cavity risees, the fan passes through sensor switch and opens automatically, dispel the heat jointly through casing and fan, make the inside temperature of product cavity can not be too high, product quality has been guaranteed, reduce the risk that the product damaged because of overheated, realize the automatic switch fan through temperature sensor switch at fan switch in-process.

It should be noted that in the scheme, each group of outputs are independent units, and are sealed in a shell, so that interference between every two outputs is reduced, and the overall ripple of the power module is obviously reduced; the PCB is divided into an upper layer and a lower layer for layout, each layer is arranged in an independent cavity, the PCB is completely used as a grounding surface except for wiring, the layout is equivalent to that a partition board is additionally arranged between the upper layer and the lower layer, and the interference between the upper layer and the lower layer can be reduced.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a novel built-in heat dissipation power supply structure which characterized in that, includes power casing (1), heat dissipation pick (2), curb plate (3) and roof (4), wherein:

the power supply shell (1) consists of a base (101) and two mounting plates (102), connecting holes (103) are formed in two sides of the base (101), the two mounting plates (102) are vertically arranged on two sides of the base (101), a mounting inner table (104) is arranged on the inner side of each mounting plate (102), side steps for mounting the side plates (3) are formed between the side surface of the mounting inner table (104) and the inner wall of each mounting plate (102), top steps for mounting the top plate (4) are formed between the top surface of the mounting inner table (104) and the inner wall of each mounting plate (102), and mounting holes (105) are symmetrically formed in each of the side steps and the top steps;

the heat dissipation tooth sheets (2) are uniformly arranged at the bottom of the base (101);

the two side plates (3) are hermetically arranged on the side surface of the mounting inner platform (104) through mounting screws (301), and the mounting screws (301) are matched with the mounting holes (105) for positioning;

roof (4) are through set screw (401) seal installation at the top of installation inner tower (104), are provided with a plurality of electrical interfaces (402) and pilot lamp (403) on roof (4).

2. The novel built-in heat dissipation power supply structure of claim 1, wherein the two mounting plates (102) are respectively provided with an air inlet channel (106) and an air outlet channel (107), an air inlet fan (108) is installed in the air inlet channel (106), and an air outlet fan (109) is installed in the air outlet channel (107).

3. The novel built-in heat dissipation power supply structure according to claim 1, wherein a top isolation bin (5) is further arranged on the top plate (4), the top isolation bin (5) is composed of a bin body (501) and a cover body (502), the cover body (502) is connected with the bin body (501) through a top screw (503), and a wiring hole (504) for communicating with the power supply housing (1) is formed in the bottom of the top isolation bin (5).

4. The novel built-in heat dissipation power supply structure as claimed in claim 1, further comprising a double-layer circuit board (6) installed in the power supply housing (1), wherein the double-layer circuit board (6) is composed of a first circuit board and a second circuit board, the first circuit board and the second circuit board are supported by four bolts, and a plurality of DC/DC power supply modules and a common mode filter which work independently are respectively arranged on the first circuit board and the second circuit board.