CN217283647U

CN217283647U - PCB composite board soft pressing device

Info

Publication number: CN217283647U
Application number: CN202220266808.4U
Authority: CN
Inventors: 唐杰; 龙冈; 邓明旭
Original assignee: Mianyang Xinneng Zhizao Technology Co ltd
Current assignee: Mianyang Xinneng Zhizao Technology Co ltd
Priority date: 2022-02-09
Filing date: 2022-02-09
Publication date: 2022-08-23
Anticipated expiration: 2032-02-09

Abstract

The utility model discloses a PCB composite board soft pressing device, which comprises an object carrying board and a flexible pressing board covered on the object carrying board, wherein the flexible pressing board is formed by connecting a pressing board frame and a flexible film; the object carrying plate is sequentially provided with an object carrying table, a first ring table and a second ring table from the center to the edge, the first ring table is provided with a PCB composite plate positioning and adjusting assembly, and the second ring table is separately attached to the pressing plate frame; the flexible pressure plate air-conditioning system is characterized by further comprising an air passage connected with a vacuum pump, wherein one end of the air passage is located in the coverage area of the flexible pressure plate, and the other end of the air passage is located outside the coverage area of the flexible pressure plate. The utility model discloses a setting is carried thing board and flexible clamp plate, can carry out the gentle pressure to the PCB composite sheet through the mode of vacuum suction and handle, gets rid of the air of PCB composite sheet joint portion, makes the PCB composite sheet connect and fix.

Description

PCB composite board soft pressing device

Technical Field

The utility model belongs to PCB composite sheet manufacture equipment field relates to PCB composite sheet soft pressure device.

Background

The PCB board is an indispensable connector for server interconnection. Along with the continuous improvement of signal transmission rate, also more and more high to the PCB board requirement, in order to improve signal transmission quality, need to paste the compound PCB board that forms into an entirety by the circuit board that several printed circuit board or/and 3D printed circuit board and the circuit board or/and printed circuit board that by several 3D printed. In the prior art, a PCB composite board formed by compositing a 3D printed circuit board and a PCB printed circuit board does not exist, and no special equipment for manufacturing the PCB composite board exists.

In whole PCB preparation trade, if the PCB finished product appears the board and bends, phenomenon such as board perk, generally directly adopts the roast mode of pressure to correct at test and visual inspection in-process, levels the PCB board through the steel sheet hard-pressing, a PCB board correction method and orthotic devices have appeared in prior art, and this orthotic devices is more single, can only level the PBC board, can not reach the purpose with the accurate alignment of the electrically conductive wiring of pasting of a plurality of PBC boards, can not be applied to the preparation of compound PCB board.

Disclosure of Invention

In view of this, the utility model aims to provide a soft pressure equipment of PCB composite sheet is put.

The inventor provides a flexible pressing device for a PCB composite board, which comprises an object carrying board and a flexible pressing board covered on the object carrying board, wherein the flexible pressing board is formed by connecting a pressing board frame and a flexible film; the object carrying plate is sequentially provided with an object carrying table, a first ring table and a second ring table from the center to the edge, the first ring table is provided with a PCB composite plate positioning and adjusting assembly, and the second ring table is separately attached to the pressing plate frame; the flexible pressure plate air-conditioning device is characterized by further comprising an air passage connected with a vacuum pump, wherein one end of the air passage is located in the coverage area of the flexible pressure plate, and the other end of the air passage is located outside the coverage area of the flexible pressure plate.

According to the utility model discloses an embodiment of the soft pressure equipment of PCB composite sheet device, PCB composite sheet location adjusting part is the precision governor.

According to the utility model discloses an embodiment of PCB composite sheet soft pressure device, the clamp plate frame passes through the bonding of high temperature seal viscose with the flexile membrane.

According to the utility model discloses an embodiment of PCB composite sheet soft pressure device, the second ring bench is provided with the seal groove, the embedded sealing ring that is equipped with of seal groove.

According to the utility model discloses an embodiment of the soft pressure equipment of PCB composite sheet device, the one end of air flue sets up to the check of breathing in, the check of breathing in is located on the objective table, the other end of air flue is first aspirating hole, first aspirating hole sets up the objective table side.

According to the utility model discloses an embodiment of soft pressure equipment of PCB composite sheet device, the PCB composite sheet includes printed circuit board and 3D printed circuit board, the check area of breathing in is within 10% of 3D printed circuit board area.

According to the utility model discloses an embodiment of PCB composite sheet soft pressure device, the check of breathing in is provided with latticed seam of breathing in.

According to the utility model discloses an embodiment of PCB composite sheet soft pressure equipment device, first aspirating hole is connected with the first joint of bleeding, the first articulate vacuum pump of bleeding.

According to an embodiment of the flexible pressing device for the PCB composite board of the present invention, one end of the air passage is an air suction hole, and the air suction hole is located on the first circular table; the other end of the air passage is provided with a second air suction hole which is arranged on the side surface of the object carrying plate.

According to the utility model discloses an embodiment of soft pressure equipment of PCB composite sheet device, the second aspirating hole is connected with the second and bleeds the joint, the second bleeds the articulate vacuum pump.

Compared with the prior art, one of the technical solutions has the following advantages:

a) the utility model discloses a setting is carried thing board and flexible clamp plate, can carry out the gentle pressure to the PCB composite sheet through the mode of vacuum suction and handle, gets rid of the air of PCB composite sheet joint portion, makes the PCB composite sheet connect and fix.

b) The utility model discloses an among the embodiment, use the position that accurate regulator adjusted the PCB composite sheet, can realize that 3D printed circuit board and printed circuit board are accurate aligns among the PCB composite sheet.

c) The utility model discloses an among the embodiment, through the air flue design, can fully get rid of the air of PCB composite sheet joint portion.

d) In one embodiment of the present invention, the air in the covering area of the flexible pressing plate can be fully discharged by the air passage design.

e) The utility model discloses an among the embodiment, through second ring platform and clamp plate frame design, only need realize the rapid Assembly and the disassembly of year thing board and flexible clamp plate through atmospheric pressure adjustment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic perspective view of a PCB composite board soft pressing device according to a preferred embodiment of the present invention.

Fig. 2 is a schematic view of a three-dimensional explosion structure of a preferred embodiment of the flexible pressing device for PCB composite boards of the present invention.

Fig. 3 is a schematic view of a three-dimensional structure of an objective table in a preferred embodiment of the flexible pressing device for PCB composite boards of the present invention.

Fig. 4 is a schematic perspective view of a PCB composite board.

The labels in the figure are respectively:

100 of the loading plate is arranged on the base,

a stage (110) for placing a film on a substrate,

111 of the air-breathing grid, and a plurality of air-breathing grids,

112 a first suction hole is formed in the first side of the vacuum chamber,

113 a first suction connection for a suction line,

114 a hole for the air to be sucked,

115 of the second suction hole are provided,

116 a second suction connection for a second suction line,

120 a first ring table of a first ring table,

121 a mounting hole for the regulator, and,

122 a precision regulator, and a control device,

130 of the second ring table, and a second ring table,

131 are provided with a seal groove, 131,

132 a sealing ring is arranged on the outer side of the sealing ring,

200 of the flexible pressing plate,

210 the pressing plate frame is pressed by a pressing plate frame,

220 of the flexible film, and a flexible film,

300 a composite board of a PCB (printed Circuit Board),

301 a Printed Circuit Board (PCB) having a printed circuit board,

302 print the circuit board.

Detailed Description

The following description of an embodiment is made with reference to the accompanying drawings.

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it may not be further defined and explained in subsequent figures.

Referring to fig. 4, the PCB composite board 300 of the present invention is a circuit board composed of a PCB 301 and a 3D PCB. In the composite pasting process, the conductive wiring is required to be accurately aligned, and the gap is full of filling type pasting. Printed circuit board 301 passes through the gum with printed circuit board 302 and bonds, in the bonding treatment process, at first passes through soft pressure equipment is put into the oven with the soft pressure equipment device that has the PCB composite sheet in the pre-compaction processing again and is softened the gum to soft pressure equipment device carries out evacuation and soft pressure processing, at last through hard pressure processing, obtains PCB composite sheet product at last. At the gum process of softening and the in-process of pressing firmly, soft pressure equipment all has the fixed action to the PCB composite sheet, ensures that printed circuit board 301 is fixed all the time with printed circuit board 302's relative position, ensures that printed circuit board 301 and printed circuit board 302 are accurate to be aimed at.

The flexible pressing device for PCB composite boards described in this embodiment mainly functions to perform vacuum pre-pressing treatment on the PCB composite board 300 and fix the PCB 301 and the PCB 302 during the composite bonding process. See fig. 1-3. The soft pressing device comprises an object carrying plate 100 and a flexible pressing plate 200 covering the object carrying plate 100, wherein the flexible pressing plate 200 is detachably connected with the object carrying plate 100, and specifically, in the embodiment, the flexible pressing plate 200 is connected with and separated from the object carrying plate 100 through air pressure regulation.

Referring to fig. 1 and 2, the flexible platen 200 is formed by connecting a platen frame 210 and a flexible film 200. In this embodiment, the pressing plate frame 210 is a rectangular ring structure, the flexible film 200 is a rectangle, the flexible film 200 is disposed on the inner side of the pressing plate frame 210, and the pressing plate frame 210 and the flexible film 200 are bonded by a high-temperature sealing adhesive, so that the pressing plate frame 210 and the flexible film 200 are not separated when the soft pressing device is baked in an oven. The high-temperature sealing adhesive or high-temperature-resistant sealant belongs to the existing material, has high bonding strength, good sealing property, high temperature resistance (300-1730 ℃), corrosion resistance, and can be widely applied to severe places such as metal, metallurgy, ceramics, organic and inorganic materials, acid-resistant tanks, blast furnace linings, molten iron temperature measuring probes, ingot molds and the like.

The object table 100 has an object table 110, a first ring table 120 and a second ring table 130 arranged in sequence from the center to the edge. The first ring table 120 is mounted with a positioning and adjusting component of the PCB composite board 300, in this embodiment, the positioning and adjusting component of the PCB composite board 300 is a precision adjuster 122. The first ring table 120 is provided with an adjuster mounting hole 121, and a fine adjuster 122 is mounted on the adjuster mounting hole 121. The fine adjuster 122 is determined according to the shape and size of the PCB composite board. In this embodiment, fig. 2 shows a case where 8 fine adjusters 122 are mounted on the first stage 120. The fine adjuster 122 is used to adjust the position of the printed circuit board 301 to be precisely aligned with the conductive traces of the printed circuit board.

In this embodiment, the flexible pressing plate 200 is connected to and separated from the carrier plate 100 by air pressure adjustment. Namely, the second ring platform 130 is separately attached to the pressing plate frame 210; the device further comprises an air passage connected with a vacuum pump, wherein one end of the air passage is positioned in the covering area of the flexible pressing plate 200, and the other end of the air passage is positioned outside the covering area of the flexible pressing plate 200. A sealing groove 131 is formed in the second annular platform 130, and a sealing ring 132 is embedded in the sealing groove 131. When the soft pressing device is vacuumized, the sealing ring 132 has better sealing effect under the extrusion force of the second ring platform 130 and the pressing plate frame 210.

In this embodiment, two arrangements of the air passages are shown. Preferably, both airway settings are used simultaneously. One way of arranging the air passage is that one end of the air passage is provided with an air suction grid 111, and the air suction grid 111 is provided with a grid-shaped air suction slit. The air suction grid 111 is located on the object stage 110, a first air suction hole 112 is formed in the other end of the air passage, the first air suction hole 112 is formed in the side surface of the object plate 100, the first air suction hole 112 is connected to a first air suction joint 113, and the first air suction joint 113 is connected to a vacuum pump (the vacuum pump is not shown in the drawing). The area of the suction grid 111 is within ± 10% of the area of the 3D printed circuit board 302, and preferably, the size of the suction grid 111 is equal to the size of the printed circuit board 302. The suction compartment 111 is designed to facilitate the suction of air from the portion of the printed circuit board 302 overlapping the printed circuit board 301, on the one hand, and to position the printed circuit board 302, on the other hand.

In another way, one end of the air passage is provided with an air suction hole 114, and the air suction hole 114 is positioned on the first annular table 120; the other end of the air passage is provided with a second air suction hole 115, and the second air suction hole 115 is arranged on the side surface of the object carrying plate 100. The second pumping hole 115 is connected to a second pumping connector 116, and the second pumping connector 116 is connected to a vacuum pump (the vacuum pump is not shown in the drawing).

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the spirit and scope of the invention, and such modifications and enhancements are intended to be within the scope of the invention.

Claims

1. A flexible pressing device for a PCB composite board is characterized by comprising an object carrying board and a flexible pressing board covered on the object carrying board, wherein the flexible pressing board is formed by connecting a pressing board frame and a flexible film; the object carrying plate is sequentially provided with an object carrying table, a first ring table and a second ring table from the center to the edge, the first ring table is provided with a PCB (printed circuit board) composite plate positioning and adjusting assembly, and the second ring table is separately attached to the pressing plate frame; the flexible pressure plate air-conditioning device is characterized by further comprising an air passage connected with a vacuum pump, wherein one end of the air passage is located in the coverage area of the flexible pressure plate, and the other end of the air passage is located outside the coverage area of the flexible pressure plate.

2. The PCB composite board soft pressing apparatus of claim 1, wherein the PCB composite board positioning adjustment assembly is a precision adjuster.

3. The PCB composite board soft pressing device of claim 1, wherein the pressing plate frame and the flexible film are bonded by a high temperature sealing glue.

4. The flexible pressing device for PCB composite boards as claimed in claim 1, wherein the second ring platform is provided with a sealing groove, and a sealing ring is embedded in the sealing groove.

5. The flexible pressing device for the PCB composite board according to claim 1, wherein one end of the air passage is provided with an air suction grid, the air suction grid is positioned on the objective table, the other end of the air passage is provided with a first air suction hole, and the first air suction hole is arranged on the side surface of the objective table.

6. The PCB composite board soft pressing device of claim 5, wherein the PCB composite board comprises a printed circuit board and a 3D printed circuit board, and the area of the suction grid is within +/-10% of the area of the 3D printed circuit board.

7. The PCB composite board soft pressing device of claim 6, wherein the air suction grids are provided with grid-shaped air suction slits.

8. The PCB composite board soft pressing device of claim 5, wherein the first air pumping hole is connected with a first air pumping connector, and the first air pumping connector is connected with a vacuum pump.

9. The flexible pressing device for PCB composite boards according to claim 1, wherein one end of the air channel is an air suction hole, and the air suction hole is positioned on the first annular table; the other end of the air passage is provided with a second air suction hole which is arranged on the side surface of the object carrying plate.

10. The flexible pressing device for PCB composite boards according to claim 9, wherein the second air pumping hole is connected with a second air pumping connector, and the second air pumping connector is connected with a vacuum pump.