CN217283201U

CN217283201U - Bus gateway device with efficient heat dissipation

Info

Publication number: CN217283201U
Application number: CN202221028115.8U
Authority: CN
Inventors: 张春岗
Original assignee: Beijing Guoren Zhengfang Technology Co ltd
Current assignee: Beijing Guoren Zhengfang Technology Co ltd
Priority date: 2022-04-28
Filing date: 2022-04-28
Publication date: 2022-08-23
Anticipated expiration: 2032-04-28

Abstract

The utility model discloses a bus gateway device with high-efficiency heat dissipation, which comprises a bus gateway box body, wherein bus gateway equipment is arranged in the bus gateway box body, a coiled pipe is arranged on the lower surface of the bus gateway equipment, the head end and the tail end of the coiled pipe are communicated with a mounting box, a sealing baffle is arranged in the mounting box, a circulating pump is arranged between the inner side walls of the two sealing baffles, a cooling cavity is arranged between the left side wall of the sealing baffle and the inner side wall of the mounting box on the left side, the heat in the cooling cavity can be guided out through a heat conducting copper pipe after the semiconductor refrigerator is started, the temperature of the cooling liquid in the cooling cavity is reduced, the cooling liquid in the cooling cavity is pumped into the coiled pipe by arranging the circulating pump, and the cooling liquid in the coiled pipe is supplemented into the cooling cavity, and liquid cooling circulation is formed, the temperature of the pipe wall of the coiled pipe is reduced, and the bus gateway equipment is directly cooled.

Description

Bus gateway device with efficient heat dissipation

Technical Field

The utility model belongs to the technical field of communication equipment, concretely relates to high-efficient radiating bus gateway device.

Background

In the underground operation track, information in all aspects can be exchanged in time only by means of a wireless communication network, and smooth, safe and efficient operation of the subway can be guaranteed. The wireless communication network plays an important role in subway traffic, but in practical application, due to the complexity of a traffic system, the construction process of the wireless communication network of the city subway faces many problems, and the research and development of a relevant, stable and reliable bus gateway device are particularly important for accelerating the construction efficiency of the city subway wireless communication network and ensuring reliable operation.

At present, a bus gateway device on the market mostly adopts passive heat dissipation for the internal heat dissipation problem, generally, a plurality of holes are formed in a shell for heat dissipation, under the condition of high-temperature environment or long-time load, the temperature of an internal chip is extremely high, the service life of internal elements is shortened, and the chip can reduce the working efficiency at high temperature, so that the bus gateway device with high heat dissipation efficiency is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high-efficient radiating bus gateway device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: a bus gateway device with high-efficiency heat dissipation comprises a bus gateway box body, wherein bus gateway equipment is arranged inside the bus gateway box body, a coiled pipe is arranged on the lower surface of the bus gateway equipment, the head end and the tail end of the coiled pipe are communicated with a mounting box, two sealing partition plates are arranged inside the mounting box, a circulating pump is arranged between the inner side walls of the two sealing partition plates, a cooling cavity is arranged between the left side wall of the sealing partition plate and the inner side wall of the mounting box on the left side, a heat conduction copper pipe is arranged in an array manner inside the cooling cavity, the upper ends of a plurality of heat conduction copper pipes penetrate through the mounting box and are provided with semiconductor refrigerators, the rear end of each semiconductor refrigerator penetrates through the bus gateway box body and extends to the outside of the bus gateway box body, an air inlet groove is formed in the bottom array of the bus gateway box body, and a bus gateway box cover is hinged to the upper surface of the bus gateway box body, the top of bus gateway case lid has seted up the mounting groove, the inner wall of mounting groove is provided with cooling fan.

Preferably, the outer wall of the circumference of the coiled pipe is provided with two support frames, and the two support frames are arranged on the bottom surface in the bus gateway box body.

Preferably, the lower surface of the bus gateway box body is provided with a filter screen plate in an abutting mode, and the air inlet grooves are located right above the filter screen plate.

Preferably, the left end and the right end of the filter screen plate are both provided with positioning cushion blocks in a sleeved mode, and the positioning cushion blocks are both arranged on the lower surface of the bus gateway box body.

Preferably, the circumferential outer wall of the coiled pipe is provided with a plurality of radiating fins.

Preferably, the water inlet pipe of the circulating pump penetrates through the left side sealing partition plate and is communicated with the cooling cavity, and the water outlet pipe of the circulating pump penetrates through the right side sealing partition plate and is communicated with the coiled pipe.

Preferably, the front face of the bus gateway box body is bilaterally symmetrically provided with two buckles, and the two buckles are movably connected with the front face of the bus gateway box cover.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) this high-efficient radiating bus gateway device, through setting up coiled pipe and semiconductor cooler, can start the back at semiconductor cooler, the heat through the heat conduction copper pipe in will cooling intracavity coolant liquid is derived, the temperature of cooling intracavity inside coolant liquid descends, through setting up the circulating pump, take out the inside to the coiled pipe with the inside coolant liquid in cooling intracavity, the inside coolant liquid in coiled pipe supplyes to the inside in cooling chamber, constitute the liquid cooling circulation, the temperature of coiled pipe wall descends, directly cool down to bus gateway equipment.

(2) This high-efficient radiating bus gateway device, through setting up radiator fan, can start the back at radiator fan for outside air current gets into the intake stack through the space between two locating pad pieces, after coiled pipe wall temperature descends, radiating fin's surface temperature descends, the air current that gets into bus gateway box through the intake stack contacts back temperature with coiled pipe wall and radiating fin surface and descends, and back and bus gateway equipment surface contact, carries out the forced air cooling to bus gateway equipment.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a rear sectional view of the present invention;

fig. 3 is a cross-sectional top view of the present invention;

fig. 4 is a rear perspective view of the present invention.

In the figure: 1. a bus gateway box; 2. a bus gateway device; 3. a serpentine tube; 4. mounting a box; 5. sealing the partition plate; 6. a circulation pump; 7. a cooling cavity; 8. a heat conducting copper pipe; 9. a semiconductor refrigerator; 10. a support frame; 11. an air inlet groove; 12. filtering the screen plate; 13. positioning a cushion block; 14. a bus gateway box cover; 15. mounting grooves; 16. a heat radiation fan; 17. locking; 18. and (4) radiating fins.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a bus gateway device with high heat dissipation efficiency, which comprises a bus gateway box 1, a bus gateway device 2 is disposed inside the bus gateway box 1, a serpentine tube 3 is disposed on the lower surface of the bus gateway device 2, a mounting box 4 is connected to the head end and the tail end of the serpentine tube 3, two seal partition plates 5 are disposed inside the mounting box 4, a circulation pump 6 is disposed between the inner side walls of the two seal partition plates 5, a cooling chamber 7 is disposed between the left side wall of the left seal partition plate 5 and the inner side wall of the mounting box 4, an internal array of the cooling chamber 7 is provided with heat conduction copper tubes 8, the upper ends of the heat conduction copper tubes 8 penetrate the mounting box 4 and are provided with a semiconductor refrigerator 9, the rear end of the semiconductor refrigerator 9 penetrates the bus gateway box 1 and extends to the outside of the bus gateway box 1, an air inlet 11 is disposed on the bottom array of the bus gateway box 1, the upper surface of bus gateway box 1 articulates there is bus gateway case lid 14, and mounting groove 15 has been seted up at the top of bus gateway case lid 14, and the inner wall of mounting groove 15 is provided with cooling fan 16.

In this embodiment, preferably, the circumferential outer wall of the coiled pipe 3 is provided with two support frames 10, and the two support frames 10 are both arranged on the bottom surface of the bus gateway box 1, and by arranging the support frames 10, a space can be reserved between the coiled pipe 3 and the bottom surface of the bus gateway box 1, so that the air flow entering the bus gateway box 1 through the air inlet groove 11 can be fully contacted with the circumferential outer wall of the coiled pipe 3, and the cooling efficiency of the air flow is improved.

In this embodiment, preferably, the lower surface of the bus gateway box 1 supports and is equipped with the filter screen plate 12, and a plurality of air inlet tank 11 all is located directly over the filter screen plate 12, and through setting up the filter screen plate 12, can filter the air current that is about to pass through the air inlet tank 11, filters out the dust in the air current for the dust is detained at the lower surface of filter screen plate 12, prevents that the dust from piling up in bus gateway box 1 is inside, reduces bus gateway device 2's radiating efficiency.

In this embodiment, it is preferred, all the cover of left end and the right-hand member of filter plate 12 is equipped with location cushion 13, two location cushion 13 all set up the lower surface at bus gateway box 1, through setting up location cushion 13, can provide the support for filter plate 12, make filter plate 12 can offset with bus gateway box 1's lower surface, bed hedgehopping bus gateway box 1 simultaneously, make outside air current can get into air inlet duct 11 through the space between two location cushion 13, carry out the forced air cooling to bus gateway equipment 2.

In this embodiment, preferably, the circumferential outer wall of the serpentine tube 3 is provided with a plurality of heat dissipation fins 18, the heat dissipation fins 18 are arranged in an array, the contact area between the serpentine tube 3 and the air flow can be increased by arranging the heat dissipation fins 18, when the temperature of the tube wall of the serpentine tube 3 is reduced, the surface temperature of the heat dissipation fins 18 is reduced, and the temperature of the air flow entering the bus gateway box 1 through the air inlet 11 is reduced through heat exchange.

In this embodiment, preferably, the inlet tube of the circulation pump 6 penetrates through the left sealing partition plate 5 and is communicated with the cooling cavity 7, the outlet tube of the circulation pump 6 penetrates through the right sealing partition plate 5 and is communicated with the coiled pipe 3, after the circulation pump 6 is started, the cooling liquid in the cooling cavity 7 is pumped into the coiled pipe 3, and the cooling liquid in the coiled pipe 3 is supplemented into the cooling cavity 7, so that liquid cooling circulation is formed.

In this embodiment, preferably, the front surface of the bus gateway box 1 is bilaterally symmetrically provided with the latches 17, and both the latches 17 are movably connected with the front surface of the bus gateway box cover 14, so that after the latches 17 are opened, the bus gateway box cover 14 can be opened to overhaul the bus gateway device 2 inside the bus gateway box 1.

The utility model discloses a theory of operation and use flow: when the device is used, when the bus gateway equipment 2 runs, the semiconductor refrigerator 9 is started, the cold end of the semiconductor refrigerator 9 abuts against the heat conduction copper pipe 8, the hot end of the semiconductor refrigerator 9 extends to the outside of the bus gateway box body 1, so that the semiconductor refrigerator 9 guides heat in cooling liquid in the cooling cavity 7 out through the heat conduction copper pipe 8, the temperature of the cooling liquid in the cooling cavity 7 is reduced, the circulating pump 6 is started, the cooling liquid in the cooling cavity 7 is pumped to the inside of the coiled pipe 3 by the circulating pump 6, the cooling liquid in the coiled pipe 3 is supplemented to the inside of the cooling cavity 7 to form liquid cooling circulation, the coiled pipe 3 abuts against the lower surface of the bus gateway equipment 2, the bus gateway equipment 2 is directly cooled, the heat dissipation fan 16 is started, external air flow enters the air inlet tank 11 through a gap between the two positioning cushion blocks 13, and after the temperature of the pipe wall of the coiled pipe 3 is reduced, the surface temperature of the heat radiating fins 18 is reduced, and the temperature of the air flow entering the bus gateway box body 1 through the air inlet groove 11 is reduced after the air flow contacts with the pipe wall of the coiled pipe 3 and the surfaces of the heat radiating fins 18, so that the bus gateway device 2 is cooled by air cooling.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-efficient radiating bus gateway device, includes bus gateway box (1), its characterized in that: the bus gateway device comprises a bus gateway box body (1), bus gateway devices (2) are arranged inside the bus gateway box body (1), coiled pipes (3) are arranged on the lower surface of each bus gateway device (2), mounting boxes (4) are communicated with the head ends and the tail ends of the coiled pipes (3), sealing partition plates (5) are arranged inside the mounting boxes (4), two sealing partition plates (5) are arranged, a circulating pump (6) is arranged between the inner side walls of the two sealing partition plates (5), a cooling cavity (7) is arranged between the left side wall of each sealing partition plate (5) and the inner side wall of each mounting box (4), heat conducting copper pipes (8) are arranged in the cooling cavity (7) in an array mode, the upper ends of the heat conducting copper pipes (8) penetrate through the mounting boxes (4) and are provided with semiconductor refrigerators (9), the rear ends of the semiconductor refrigerators (9) penetrate through the bus gateway box body (1) and extend to the outside of the bus gateway box body (1), the air inlet groove (11) has been seted up to the bottom array of bus gateway box (1), the upper surface of bus gateway box (1) articulates there is bus gateway case lid (14), mounting groove (15) have been seted up at the top of bus gateway case lid (14), the inner wall of mounting groove (15) is provided with cooling fan (16).

2. The bus gateway apparatus with efficient heat dissipation as recited in claim 1, wherein: the circumference outer wall of coiled pipe (3) is provided with support frame (10), and support frame (10) are equipped with two, two support frame (10) all set up the bottom surface in bus gateway box (1).

3. The bus gateway apparatus with efficient heat dissipation as recited in claim 1, wherein: the lower surface of the bus gateway box body (1) is provided with a filter screen plate (12) in an abutting mode, and the air inlet grooves (11) are located right above the filter screen plate (12).

4. A bus gateway device with efficient heat dissipation as defined in claim 3, wherein: the left end and the right end of the filter screen plate (12) are both provided with positioning cushion blocks (13) in a sleeved mode, and the positioning cushion blocks (13) are both arranged on the lower surface of the bus gateway box body (1).

5. The bus gateway device with efficient heat dissipation of claim 1, wherein: the heat dissipation device is characterized in that heat dissipation fins (18) are arranged on the outer wall of the circumference of the coiled pipe (3), and a plurality of heat dissipation fins (18) are arranged in an array mode.

6. The bus gateway device with efficient heat dissipation of claim 1, wherein: the water inlet pipe of the circulating pump (6) penetrates through the left sealing partition plate (5) and is communicated with the cooling cavity (7), and the water outlet pipe of the circulating pump (6) penetrates through the right sealing partition plate (5) and is communicated with the coiled pipe (3).

7. The bus gateway device with efficient heat dissipation of claim 1, wherein: the front face of the bus gateway box body (1) is symmetrically provided with buckles (17), and the two buckles (17) are movably connected with the front face of the bus gateway box cover (14).