CN217256678U

CN217256678U - PCB substrate feeding mechanism for stamping die

Info

Publication number: CN217256678U
Application number: CN202220043211.3U
Authority: CN
Inventors: 陈沛文
Original assignee: Dongguan Xinlang Hardware & Plastic Products Co ltd
Current assignee: Dongguan Xinlang Hardware & Plastic Products Co ltd
Priority date: 2022-01-07
Filing date: 2022-01-07
Publication date: 2022-08-23
Anticipated expiration: 2032-01-07

Abstract

The application discloses PCB base plate feed mechanism for stamping die belongs to stamping die technical field, and its technical scheme main points include the punching machine and set up in the frame of punching machine feeding department, be provided with the track that length direction extends to punching machine feeding department in the frame, be provided with in the frame and be used for with on the track PCB base plate propelling movement to blevile of push on the punching machine, be provided with the device that gathers materials that is used for holding the PCB base plate in the frame, be provided with in the frame and be used for taking out and placing the pick-up device on the track with the PCB base plate on the device that gathers materials, this application has the effect that can improve the material loading efficiency and the security height of PCB base plate.

Description

PCB substrate feeding mechanism for stamping die

Technical Field

The present application relates to a PCB substrate feeding mechanism, and more particularly, it relates to a PCB substrate feeding mechanism for a stamping die.

Background

The substrate is a basic material for manufacturing a PCB, and generally, the substrate is a Copper Clad Laminate, and in manufacturing the single-sided and double-sided printed boards, a hole machining, an electroless Copper plating, an electrolytic Copper plating, an etching and the like are selectively performed on a substrate material, namely, a Copper Clad Laminate (CCL), to obtain a desired circuit pattern. Another type of multilayer printed board is also manufactured by using a core thin copper clad laminate as a base, and alternately laminating and bonding the conductive pattern layers and a prepreg (Pregpr' eg) together at one time to form more than 3 layers of conductive pattern interlayer interconnection. It has the functions of conducting electricity, insulating and supporting. The performance, quality, workability in manufacturing, manufacturing cost, manufacturing level, and the like of the printed board greatly depend on the substrate material.

The existing processing procedure of the PCB substrate needs to be punched and formed by a punching machine, and generally, an operator manually puts the PCB substrate on a workbench of the punching machine in the process of punching the PCB substrate by the punching machine so as to process the PCB substrate by the punching machine, but the efficiency is lower when the operator manually puts the PCB substrate on the workbench of the punching machine, and the safety problem is greater.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a PCB base plate feed mechanism for stamping die, its advantage lies in can improving the material loading efficiency and the security of PCB base plate.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a PCB base plate feed mechanism for stamping die, includes the punching machine and sets up in the frame of punching machine feeding department, be provided with the track that length direction extends to punching machine feeding department in the frame, be provided with in the frame and be used for with the track on the PCB base plate propelling movement to the blevile of push on the punching machine, be provided with the device that gathers materials that is used for holding the PCB base plate in the frame, be provided with in the frame and be used for taking out and placing the pick device on the track with the PCB base plate on the device that gathers materials.

By adopting the technical scheme, when the PCB substrates need to be subjected to punch forming, the PCB substrates are placed on the collecting device, then the picking device is started, the PCB substrates of the collecting device are picked and placed on the track by the picking device, then the pushing device pushes the PCB substrates into the punching machine along the length direction of the track, and the punching machine operates according to the step after the PCB substrates are subjected to punch forming.

In summary, the collecting device on the rack collects the PCB substrates on the collecting device one by one and places the PCB substrates on the track, and then the pushing device pushes the PCB substrates on the track into the punching machine for punch forming, so as to achieve the purposes of improving the feeding efficiency of the PCB substrates and ensuring high safety.

The utility model discloses further set up to: the material pushing device comprises a rodless cylinder and a push plate, wherein the rodless cylinder is arranged on the rack and is arranged in a flat shape with the track, and the push plate is arranged on a rodless cylinder sliding block and is used for pushing the PCB substrate on the track to move along the direction of the punching machine.

Through adopting above-mentioned technical scheme, when needs carry out stamping forming in advancing the PCB base plate on the track punching press, start no pole cylinder, drive the push pedal by the sliding block on the no pole cylinder and advance the punching press with the PCB base plate on the track in, can carry out the stamping forming of PCB base plate.

The utility model discloses further set up to: the track both sides all are provided with the baffle that is used for the direction PCB base plate, just be located the track both sides in the frame and all be provided with and be used for the drive to correspond the baffle along the actuating cylinder that drives with the removal of track looks vertical direction.

Through adopting above-mentioned technical scheme, when needs carry out stamping forming to different PCB base plates, can start according to the width of PCB base plate and drive actuating cylinder, drive the baffle that corresponds by driving actuating cylinder and move or carry on back of the body mutually, until two baffles and PCB base plate laminating mutually.

The utility model discloses further set up to: the pick-up device comprises a support seat arranged on the rack, a first moving cylinder horizontally arranged on the support seat and vertical to the track, a second moving cylinder vertically arranged on a piston rod of the first moving cylinder, a support plate arranged on the piston rod of the second moving cylinder, and a plurality of suckers arranged on the support plate and used for sucking the PCB substrate.

By adopting the technical scheme, when the PCB substrate needs to be placed on the track from the material collecting device, the first moving cylinder is started, the piston rod of the first moving cylinder drives the second moving cylinder to move above the material collecting device, then the piston rod of the second moving cylinder drives the supporting plate to move downwards, the sucker is attached to the PCB substrate on the material collecting device, and then the PCB substrate is sucked by the sucker; the second moving cylinder drives the supporting plate to move upwards, the first moving cylinder drives the PCB substrate on the sucker to move to the position above the track, then the second moving cylinder drives the supporting plate to move to the track, the sucker loosens the PCB substrate, the PCB substrate is placed on the track, and the PCB substrate can be pushed to the punching machine along the track by the material pushing device.

The utility model discloses further set up to: the material collecting device comprises a bottom plate arranged on the rack, limiting plates arranged on two sides of the bottom plate and a pushing cylinder arranged on the rack and used for driving any limiting plate.

Through adopting above-mentioned technical scheme, when needs place the PCB base plate on the device that gathers materials, start the push cylinder, drive the limiting plate that corresponds by the push cylinder and move or carry on the back of the body the motion towards another limiting plate mutually, until two limiting plates and PCB base plate laminate mutually.

The utility model discloses further set up to: and an electric heating lamp is arranged on the rack and between the track and the punching machine and used for softening the PCB substrate.

Through adopting above-mentioned technical scheme, when the PCB base plate passed the electric heat lamp, can shine and soften the PCB base plate by the electric heat lamp to make things convenient for the punching machine to carry out stamping forming to the PCB base plate.

To sum up, the utility model has the advantages of it is following:

1. the PCB substrates on the collecting device are picked one by one through the picking device on the rack and placed on the track, and then the pushing device pushes the PCB substrates on the track into the punching machine for punch forming, so that the purposes of improving the feeding efficiency of the PCB substrates and ensuring high safety are achieved.

2. When the PCB substrate on the track needs to be pushed into the punching machine for punching forming, the rodless cylinder is started, the sliding block on the rodless cylinder drives the push plate to push the PCB substrate on the track into the punching machine, and then the punching forming of the PCB substrate can be carried out.

3. When the PCB substrate needs to be placed on the track from the inside of the material collecting device, the first moving cylinder is started, the piston rod of the first moving cylinder drives the second moving cylinder to move above the material collecting device, then the piston rod of the second moving cylinder drives the supporting plate to move downwards, the sucker is made to be attached to the PCB substrate on the material collecting device, and then the PCB substrate is sucked by the sucker; the second moving cylinder drives the supporting plate to move upwards, the first moving cylinder drives the PCB substrate on the sucker to move to the upper portion of the track, then the second moving cylinder drives the supporting plate to move to the track, the sucker loosens the PCB substrate, the PCB substrate is placed on the track, and the PCB substrate can be pushed to a punching machine along the track by the material pushing device.

Drawings

FIG. 1 is a schematic view of the overall structure of the present embodiment;

FIG. 2 is a side view of the present embodiment;

fig. 3 is an enlarged schematic view of a in paint 2.

Description of reference numerals: 1. a punch press; 2. a frame; 3. a track; 4. a rodless cylinder; 5. pushing the plate; 6. a baffle plate; 7. a driving cylinder; 8. a base plate; 9. a limiting plate; 10. a push cylinder; 11. an electric heating lamp; 12. a supporting seat; 13. a first moving cylinder; 14. a second moving cylinder; 15. a support plate; 16. and (4) sucking discs.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The utility model provides a PCB base plate feed mechanism for stamping die, as shown in fig. 1, 2, including punching machine 1 and install the frame 2 in punching machine 1 feed department, install the track 3 that length direction extends to punching machine 1 feed department on the frame 2, install the blevile of push that is used for PCB base plate propelling movement to punching machine 1 on the track 3 on the frame 2, install the device that gathers materials that is used for holding the PCB base plate on the frame 2, install the pick device that is used for taking out and placing the PCB base plate on the device that gathers materials on the track 3 on the frame 2.

As shown in fig. 1 and 2, the material collecting device includes a bottom plate 8 mounted on the frame 2, limit plates 9 mounted on two sides of the bottom plate 8, and a pushing cylinder 10 mounted on the frame 2 and used for driving any one of the limit plates 9. When the PCB substrate needs to be placed on the material collecting device, the pushing cylinder 10 is started, the corresponding limiting plate 9 is driven by the pushing cylinder 10 to move towards the other limiting plate 9 or move back to back until the two limiting plates 9 are attached to the PCB substrate.

As shown in fig. 1 and 2, an electric heating lamp 11 is installed on the frame 2 between the rail 3 and the punch 1, and the electric heating lamp 11 is used for softening the PCB substrate. When the PCB substrate passes through the electric heat lamp 11, the electric heat lamp 11 irradiates the PCB substrate and softens the PCB substrate, thereby facilitating the punch press 1 to punch-form the PCB substrate.

As shown in fig. 2 and 3, the material pushing device includes a rodless cylinder 4 mounted on the frame 2 and disposed parallel to the rail 3, and a push plate 5 mounted on a slide block of the rodless cylinder 4 and used for pushing the PCB substrate on the rail 3 to move along the direction of the punch 1. When the PCB substrate on the track 3 needs to be pushed into the punching machine 1 for punch forming, the rodless cylinder 4 is started, and the sliding block on the rodless cylinder 4 drives the push plate 5 to push the PCB substrate on the track 3 into the punching machine 1, so that the punch forming of the PCB substrate can be carried out.

Further, the two sides of the track 3 are both provided with a baffle 6 for guiding the PCB substrate, and the rack 2 and the two sides of the track 3 are both provided with a driving cylinder 7 for driving the corresponding baffle 6 to move along the direction vertical to the track 3. When needs carry out stamping forming to different PCB base plates, can start driving actuating cylinder 7 according to the width of PCB base plate, drive baffle 6 that corresponds and move or carry on the back of the body motion by driving actuating cylinder 7 mutually, until two baffles 6 and PCB base plate laminate mutually.

As shown in fig. 2 and 3, the pick-up device includes a supporting base 12 installed on the frame 2, a first moving cylinder 13 horizontally installed on the supporting base 12 and perpendicular to the rail 3, a second moving cylinder 14 vertically installed on a piston rod of the first moving cylinder 13, a supporting plate 15 installed on a piston rod of the second moving cylinder 14, and a plurality of suction cups 16 installed on the supporting plate 15 and used for sucking the PCB substrate. When a PCB substrate needs to be placed on the track 3 from the material collecting device, the first moving cylinder 13 is started, the piston rod of the first moving cylinder 13 drives the second moving cylinder 14 to move above the material collecting device, then the piston rod of the second moving cylinder 14 drives the supporting plate 15 to move downwards, the sucker 16 is attached to the PCB substrate on the material collecting device, and then the sucker 16 sucks the PCB substrate; the second moving cylinder 14 drives the supporting plate 15 to move upwards, the first moving cylinder 13 drives the PCB substrate on the sucker 16 to move to the position above the rail 3, then the second moving cylinder 14 drives the supporting plate 15 to move to the rail 3, the sucker 16 loosens the PCB substrate, the PCB substrate is placed on the rail 3, and the PCB substrate can be pushed to the punching machine 1 along the rail 3 by the pushing device.

The utility model discloses a working process and beneficial effect as follows: when the PCB substrates need to be subjected to punch forming, the PCB substrates are placed on the collecting device, then the picking device is started, the PCB substrates of the collecting device are picked up and placed on the rail 3 by the picking device, then the PCB substrates are pushed into the punch 1 along the length direction of the rail 3 by the pushing device, and the punch 1 operates according to the step after the PCB substrates are subjected to punch forming.

In summary, the pick-up device on the frame 2 picks up the PCB substrates on the collecting device one by one and places the PCB substrates on the rail 3, and then the material pushing device pushes the PCB substrates on the rail 3 into the punching machine 1 for punch forming, so as to achieve the purposes of improving the feeding efficiency of the PCB substrates and ensuring high safety.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, any modification, equivalent replacement, or improvement made within the design concept of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a PCB base plate feed mechanism for stamping die, includes punching machine (1) and sets up in frame (2) of punching machine (1) feeding department, its characterized in that: be provided with track (3) that length direction extends to punching machine (1) feeding department on frame (2), be provided with the blevile of push that is used for going up PCB base plate propelling movement to punching machine (1) on track (3) in frame (2), be provided with the device that gathers materials that is used for holding the PCB base plate in frame (2), be provided with the pick device that is used for taking out and placing the PCB base plate on the device that gathers materials on frame (2).

2. The PCB substrate feeding mechanism for the stamping die as claimed in claim 1, wherein: the material pushing device comprises a rodless cylinder (4) which is arranged on the rack (2) and is arranged in a flat shape with the rail (3) and a push plate (5) which is arranged on a sliding block of the rodless cylinder (4) and is used for pushing the PCB substrate on the rail (3) to move along the direction of the punch (1).

3. The PCB substrate feeding mechanism for the stamping die as claimed in claim 2, wherein: the PCB base plate guide rail is characterized in that baffle plates (6) used for guiding the PCB base plate are arranged on two sides of the rail (3), and driving cylinders (7) used for driving the corresponding baffle plates (6) to move in the direction perpendicular to the rail (3) are arranged on the rack (2) and located on two sides of the rail (3).

4. The PCB substrate feeding mechanism for the stamping die as claimed in claim 1, wherein: the pick-up device comprises a supporting seat (12) arranged on the rack (2), a first moving cylinder (13) horizontally arranged on the supporting seat (12) and vertical to the track (3), a second moving cylinder (14) vertically arranged on a piston rod of the first moving cylinder (13), a supporting plate (15) arranged on a piston rod of the second moving cylinder (14) and a plurality of suckers (16) arranged on the supporting plate (15) and used for sucking the PCB substrate.

5. The PCB substrate feeding mechanism for the stamping die as claimed in claim 1, wherein: the material collecting device comprises a bottom plate (8) arranged on the rack (2), limiting plates (9) arranged on two sides of the bottom plate (8) and a pushing cylinder (10) arranged on the rack (2) and used for driving any one of the limiting plates (9).

6. The PCB substrate feeding mechanism for the stamping die as claimed in claim 1, wherein: and an electric heating lamp (11) is arranged on the rack (2) and between the track (3) and the punch (1), and the electric heating lamp (11) is used for softening the PCB substrate.