CN217253674U - Femtosecond laser cutting equipment for cutting PC material - Google Patents
Femtosecond laser cutting equipment for cutting PC material Download PDFInfo
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- CN217253674U CN217253674U CN202122404194.XU CN202122404194U CN217253674U CN 217253674 U CN217253674 U CN 217253674U CN 202122404194 U CN202122404194 U CN 202122404194U CN 217253674 U CN217253674 U CN 217253674U
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Abstract
The utility model discloses a femtosecond laser cutting equipment for cutting PC material, which comprises an ultrashort pulse laser and a Bessel cutting head, wherein the ultrashort pulse laser is used for emitting femtosecond laser; the femtosecond laser passes through the Bezier cutting head to form a Bezier beam, and the Bezier beam penetrates through the inside of the object to be processed to form a focusing light spot. The utility model discloses technical scheme sends femto second laser through adopting ultrashort pulse laser and focuses on the facula inside treating the processing thing through Bessel cutting head, realizes high accuracy, high quality cutting, guarantees to treat that processing thing cutting edge is clear, and the surface is clean.
Description
Technical Field
The utility model relates to a laser beam machining technical field, in particular to femto second laser cutting equipment for cutting PC material.
Background
PC (polycarbonate) is a high molecular polymer containing carbonate groups in molecular chains, has the characteristics of high transparency, light weight, impact resistance, sound insulation, heat insulation, flame retardancy, aging resistance and the like, and is a high-tech, extremely excellent in comprehensive performance, energy-saving and environment-friendly plastic material.
The existing laser cutting PC equipment has poor PC cutting edge quality, large heat influence, serious carbonization and rough cutting section, and can generate a large amount of harmful dust and gas.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a femto second laser cutting equipment for cutting PC material, when aiming at solving laser beam machining PC, the cutting cross-section is coarse, produces harmful substance's problem.
In order to achieve the above object, the present invention provides a femtosecond laser cutting apparatus for cutting a PC material, the femtosecond laser cutting apparatus including an ultrashort pulse laser for emitting femtosecond laser and a bessel cutting head; the femtosecond laser passes through the Bezier cutting head to form a Bezier beam, and the Bezier beam penetrates through the inside of the object to be processed to form a focusing light spot.
In an embodiment, the femtosecond laser cutting device further includes a plurality of mirror holders, the plurality of mirror holders are disposed between the ultrashort pulse laser and the optical path of the bessel cutting head, and the plurality of mirror holders change the optical path of the femtosecond laser to be incident into the bessel cutting head.
In an embodiment, the femtosecond laser cutting device further comprises a beam expander, and the beam expander is arranged between two adjacent reflector bases.
In an embodiment, the femtosecond laser cutting device further comprises a moving platform, wherein the moving platform is arranged below the object to be processed, and the moving platform can move the object to be processed.
In one embodiment, a focusing lens is arranged inside the Bezier cutting head, and the femtosecond laser passes through the focusing lens to form the Bezier beam.
In one embodiment, the focused spot has a diameter of 4 to 6 μm.
In one embodiment, the maximum pulse energy of the ultrashort pulse laser is 300 to 500 muj.
In one embodiment, the power of the ultrashort pulse laser is 100 to 120W.
In one embodiment, the pulse width of the ultrashort pulse laser is 400 to 600 fs.
In one embodiment, the cutting speed of the femtosecond laser cutting device is 180 to 200 mm/s.
The utility model discloses technical scheme produces the Bessel laser beam of high peak value high power through adopting ultrashort pulse laser instrument cooperation Bessel cutting head for PC cutting cross-section is level and smooth, and the heat influence is little, is difficult for producing harmful gas and material.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the femtosecond laser cutting apparatus of the present invention;
fig. 2 is a left side view of an embodiment of the femtosecond laser cutting apparatus according to the present invention;
fig. 3 is a front view of an embodiment of the femtosecond laser cutting apparatus of the present invention;
fig. 4 is a rear view of an embodiment of the femtosecond laser cutting apparatus according to the present invention;
fig. 5 is a schematic diagram of bessel beam forming according to an embodiment of the femtosecond laser cutting apparatus of the present invention;
FIG. 6 is a comparison graph of the overall appearance of the cutting effect of the prior art and the present invention;
fig. 7 is a comparison diagram of the cutting cross section of the prior art and the present invention.
The reference numbers indicate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
PC (polycarbonate) is a high molecular polymer containing carbonate groups in molecular chains, wherein aromatic polycarbonate is industrially produced and has the characteristics of high transparency, light weight, impact resistance, sound insulation, heat insulation, flame resistance, ageing resistance and the like. When the existing laser cutting PC is used for cutting, the PC has the defects of poor quality of a cutting edge, large heat influence, serious carbonization and rough cutting section, and a large amount of dust and harmful gas can be generated in the machining process. The utility model provides a femto second laser cutting equipment utilizes ultrashort pulse laser 100 cooperation Bessel cutting head 200 to produce the Bessel laser beam of high peak value high power for PC cutting cross-section is level and smooth, and the heat influence is little, is difficult for producing harmful gas and material.
Referring to fig. 1 to 7, in an embodiment of the present invention, the femtosecond laser cutting apparatus includes an ultrashort pulse laser 100 and a bessel cutting head 200, where the ultrashort pulse laser 100 is used to emit femtosecond laser 110; the femtosecond laser 110 passes through the Bezier cutting head 200 to form a Bezier beam 210, and the Bezier beam 210 penetrates through the inside of the object to be processed to form a focused light spot.
Specifically, the ultrashort pulse laser 100 can emit the femtosecond laser 110, the femtosecond laser 110 has ultrashort and ultrastrong characteristics, the pulse width of the femtosecond laser 110 is extremely low, the femtosecond laser 110 can concentrate the energy thereof in a limited action area completely, quickly and accurately, micro-size processing of materials such as PC is realized, and the ultrashort pulse laser has incomparable advantages compared with other laser processing. The bessel cutting head 200 can focus to form a very fine small focusing light spot, the energy is concentrated, and the better cutting effect can be realized by processing a PC material by the cutting head.
In this embodiment, the ultrashort pulse laser 100 cooperates with the bessel cutting head 200 to generate a bessel beam 210 with a high peak value and high power, and the bessel beam 210 acts on the inside of the PC material to be processed to form a focused spot, so as to modify a dense material, and become a bulk material easy to be broken. The generation steps are as follows: the ultra-short pulse laser 100 emits a femtosecond laser 110 with high peak power, the femtosecond laser 110 is incident into the bessel cutting head 200, and the bessel cutting head 200 shapes the femtosecond laser 110 with high peak power into a bessel laser beam with high peak power. The bessel beam 210 penetrates through the material of the object to be processed to form a focusing spot, and the bessel beam inherits the characteristic that the femtosecond laser 110 can quickly and accurately concentrate the energy of the femtosecond laser, and simultaneously, the laser energy is stronger and more concentrated through the focusing action of the bessel cutting head 200. The Bessel laser beam energy acts on the interior of a material of an object to be processed for processing, the original whole of the object to be processed, which has a compact structure, is tightly combined and is not easy to break, is changed into a fragile whole which is loosely combined and easy to break, and the process is called laser modification. And moving the object to be processed to enable the points to be connected into a line, modifying the object to be processed by laser on the path of the line, and then cracking the object to be processed by using a cracking machine, thereby finishing the processing flow of the object to be processed.
The Bessel beam 210 with high peak value and high power has small processing heat influence, no hot melting area and small melting edge, can not generate the phenomena of melting, cracking and the like of a processing surface, solves the problem of serious carbonization of the PC edge and the cross section in the prior art, ensures the smoothness of the processing surface, and realizes the processing with high precision, high quality and high resolution. In the laser beam machining process, harmful substances cannot be generated, and the problem that a large amount of harmful dust and gas are generated in the conventional laser cutting of the PC is solved.
Referring to fig. 6, the left side is the whole effect picture of prior art cutting PC material, and the right side does the utility model discloses the whole effect picture of femto second laser cutting equipment cutting PC material, the contrast can be seen out, and a little heterochrosis can appear in prior art at the cutting edge, this is because prior art cutting heat influences the big reason, and the utility model discloses then demonstrate the smooth characteristic of surfacing. Referring to fig. 7, the left side is the prior art cutting sectional view through microscope observation, and the right side is through microscope observation the utility model discloses cutting sectional view can see, and the prior art surface is comparatively coarse and the heat influence is big, the utility model discloses the surface is more smooth, and the heat influence is little, can accomplish the no trace cutting. To sum up, the utility model discloses contrast prior art has apparent progress.
The utility model discloses utilize femto second laser ultrashort pulse, energy concentration, the little characteristics of heat influence cooperation Bessel cutting head 200 the little characteristics of focus facula that produce, realize that PC material cutting cross-section is level and smooth, does not produce harmful substance such as dust, simultaneously the utility model discloses effectively improve machining efficiency.
Referring to fig. 1, further, the femtosecond laser cutting apparatus further includes a plurality of mirror holders 300, the plurality of mirror holders 300 are disposed between the light paths of the ultrashort pulse laser 100 and the bessel cutting head 200, and the plurality of mirror holders 300 change the light path of the femtosecond laser 110 to be incident into the bessel cutting head 200. The mirror mount 300 may be 2, 3, 4, 5, etc., and is not particularly limited herein. The plurality of mirror mounts 300 adjust the optical path of the femtosecond laser 110 to be incident into the bessel cutting head 200 to be integrated into a bessel beam 210 with high peak power.
Further, in order to enhance the processing effect, in this embodiment, the femtosecond laser cutting device further includes a beam expander 400, and the beam expander 400 is disposed between two adjacent mirror bases 300. After the femtosecond laser 110 with high peak power enters the beam expander 400, the laser beam with larger output diameter and smaller divergence angle is output, and when the femtosecond laser 110 enters the Bessel cutting head 200 due to the small divergence angle, the focusing effect is better, and the realization of high-quality and high-precision processing is facilitated.
In this embodiment, the femtosecond laser cutting device further comprises a mobile platform, wherein the mobile platform is arranged below the object to be processed, and the mobile platform can move the object to be processed. It can be appreciated that when the high peak power bessel laser beam 210 forms a focused spot inside the PC material, the focused spot is point-like. In order to meet the requirement of cutting the PC material, a cutting line is formed on the PC material, and the PC material to be processed can be cut by using a mobile platform, so that the focused light spot forms a cutting line from a point along a preset position.
Referring to fig. 5, in the present embodiment, a focusing lens 220 is disposed inside the bessel cutting head 200, and the femtosecond laser 110 passes through the focusing lens 220 to form the bessel beam 210. It will be appreciated that the femtosecond laser 110 passes through the processing of the mirrors and beam expander, and through the focusing lens 220 inside the bessel cutting head 200. The utility model discloses the light path principle of femto second laser cutting equipment does: the femtosecond laser 110 emitted from the ultrashort pulse laser 100 reaches the incident end surface of the focusing lens 220, and is transmitted through the incident end surface and then reaches the emergent end surface to be refracted, and the femtosecond laser 110 at the two sides of the focusing lens 220 are mutually focused to form the bessel beam 210.
In this embodiment, the focused spot has a diameter of 4 to 6 μm. It will be appreciated that the diameter of the focused spot may be 4 μm, or 5 μm, or 6 μm, etc., and may be selected according to the accuracy and quality requirements of the PC cut. The diameter of the focusing spot is 5 μm for example, the femtosecond laser 110 emitted by the ultrashort pulse laser 100 is integrated into a bessel laser beam 210 with high peak power through the bessel cutting head 200, the bessel laser beam penetrates through the inside of the PC material to form the focusing spot with the diameter of 5 μm, so that the energy of the small focusing spot is more concentrated, and the requirement of a user on the precise marking of the PC material can be met.
In the present embodiment, the maximum pulse energy of the ultrashort pulse laser 100 is 300 to 500 μ J. That is, the energy peak of the ultrashort pulse laser 100 may be 300 μ J, or 400 μ J, or the like. It can be understood that the larger the maximum pulse energy is, the larger the burst energy is, the flatter the cross section is generated when cutting the PC, and the less harmful substances such as dust are generated.
The utility model discloses femto second laser cutting equipment is when cutting PC, and its output has the direct relation with the melting ability of processing, and in order to reach better cutting effect, the power of ultrashort pulse laser 100 is higher, and Bessel laser beam 210 cutting speed is faster, and the material thickness that can cut is big more. If the power is too high, the heat influence around the notch is large, and melting loss is likely to occur. In this embodiment, the power of the ultrashort pulse laser 100 is 100 to 120W. For example, the power of the ultrashort pulse laser 100 is 100W.
The pulse width of the laser, i.e., the duration of the pulse energy. The shorter the pulse width of the laser is, the more energy released by the laser in a short time is, the shorter the time for contacting materials is, and when the laser is processed, the processing effect is clean, the heat influence is smaller, the precision is higher, and the rapid and accurate processing is realized. In this embodiment, the pulse width of the ultrashort pulse laser 100 is 400 to 600 fs. It is understood that the pulse width of the ultrashort pulse laser 100 may be 400fs, 500fs, 600 fs. The ultrashort pulse width ensures that the peak power of the laser is very high, and different from continuous laser or long pulse width laser, the short pulse width realizes relatively significant cold processing, thereby effectively reducing the problem of large thermal influence on the cutting section of the PC material in the processing process.
The cutting speed affects the production efficiency, and the faster the cutting speed, the faster the production efficiency. In the present embodiment, the cutting speed of the femtosecond laser cutting apparatus is 180 to 200 mm/s. The cutting speed of the femtosecond laser cutting equipment can be 180mm/s, 190mm/s, 200mm/s and the like, and can be selected according to requirements.
The above is only the optional embodiment of the present invention, and not limiting the patent scope of the present invention, all under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the specification and the attached drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A femtosecond laser cutting equipment for cutting PC material is characterized by comprising
An ultrashort pulse laser for emitting femtosecond laser;
the femtosecond laser passes through the Bezier cutting head to form a Bezier beam, and the Bezier beam penetrates through the inside of the object to be processed to form a focusing light spot.
2. The femtosecond laser cutting apparatus for cutting PC materials as set forth in claim 1, wherein the femtosecond laser cutting apparatus for cutting PC materials further comprises a plurality of mirror bases, the plurality of mirror bases being disposed between the ultrashort pulse laser and the optical path of the bessel cutting head, the plurality of mirror bases changing the optical path of the femtosecond laser to be incident into the bessel cutting head.
3. The femtosecond laser cutting apparatus for cutting PC material as set forth in claim 2, wherein the femtosecond laser cutting apparatus for cutting PC material further comprises a beam expander, the beam expander being disposed between two adjacent reflector holders.
4. The femtosecond laser cutting apparatus for cutting a PC material as set forth in claim 1, wherein the femtosecond laser cutting apparatus for cutting a PC material further comprises a moving platform provided below the object to be processed, the moving platform being capable of moving the object to be processed.
5. The femtosecond laser cutting apparatus for cutting PC material as set forth in claim 1, wherein a focusing lens is provided inside the bessel cutting head, and the femtosecond laser passes through the focusing lens to form the bessel beam.
6. The femtosecond laser cutting apparatus for cutting PC material as set forth in claim 1, wherein the diameter of the focused spot is 4 to 6 μm.
7. The femtosecond laser cutting apparatus for cutting PC materials as set forth in claim 1, wherein a maximum pulse energy of the ultrashort pulse laser is 300 to 500 μ J.
8. The femtosecond laser cutting apparatus for cutting PC material as set forth in claim 1, wherein the power of the ultrashort pulse laser is 100 to 120W.
9. The femtosecond laser cutting apparatus for cutting PC materials as set forth in claim 1, wherein the pulse width of the ultrashort pulse laser is 400 to 600 fs.
10. The femtosecond laser cutting apparatus for cutting PC materials as set forth in claim 1, wherein a cutting speed of the femtosecond laser cutting apparatus is 180 to 200 mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122404194.XU CN217253674U (en) | 2021-09-30 | 2021-09-30 | Femtosecond laser cutting equipment for cutting PC material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122404194.XU CN217253674U (en) | 2021-09-30 | 2021-09-30 | Femtosecond laser cutting equipment for cutting PC material |
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| CN217253674U true CN217253674U (en) | 2022-08-23 |
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| CN202122404194.XU Active CN217253674U (en) | 2021-09-30 | 2021-09-30 | Femtosecond laser cutting equipment for cutting PC material |
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- 2021-09-30 CN CN202122404194.XU patent/CN217253674U/en active Active
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