CN217251113U - Pickling device is used in production of semiconductor monocrystalline silicon piece - Google Patents
Pickling device is used in production of semiconductor monocrystalline silicon piece Download PDFInfo
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- CN217251113U CN217251113U CN202220548947.6U CN202220548947U CN217251113U CN 217251113 U CN217251113 U CN 217251113U CN 202220548947 U CN202220548947 U CN 202220548947U CN 217251113 U CN217251113 U CN 217251113U
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- monocrystalline silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model is suitable for a semiconductor monocrystalline silicon piece production field provides a semiconductor is pickling plant for monocrystalline silicon piece production, including box and case lid, the case lid articulates on the box, the case lid deviates from one side fixedly connected with handle of box, still includes: two mounting grooves are formed in the inner end face of the box body, second electric push rods are arranged inside the mounting grooves, a placing component is arranged between the telescopic ends of the second electric push rods, and the placing component is used for containing monocrystalline silicon wafers. The utility model discloses a control second electric putter's flexible end shortens, drives and places the subassembly and descends, makes and places the subassembly and immerses in the pickling tank, washes away the impurity on monocrystalline silicon piece surface, will place the subassembly again and rise, sprays high pressure water through the shower nozzle and washes monocrystalline silicon piece's surface, washes away residual pickling solution on the monocrystalline silicon piece, avoids corroding monocrystalline silicon piece, makes the cleaning performance better; the monocrystalline silicon wafer can be dried through the drying component.
Description
Technical Field
The utility model belongs to semiconductor monocrystalline silicon piece production field especially relates to a semiconductor is pickling device for monocrystalline silicon piece production.
Background
Monocrystalline silicon is a relatively active non-metallic element, is an important component of crystal materials, and is in the front of the development of new materials. The solar photovoltaic power generation and heat supply semiconductor material is mainly used as a semiconductor material and utilizes solar photovoltaic power generation, heat supply and the like. When monocrystalline silicon is manufactured into a solar cell, a series of processing treatments are needed, most importantly, a monocrystalline silicon rod raw material is cut into monocrystalline silicon pieces, and then the monocrystalline silicon pieces are cleaned, wherein the cleaning of the monocrystalline silicon pieces mainly comprises that particles, metal, oil stains, white spots, fingerprints and the like are easily generated on the surfaces of the monocrystalline silicon pieces in the production process, the performance of a solar cell assembly is affected along the surfaces, and therefore the pickling must be carried out through a professional cleaning agent.
The existing cleaning device is complex in structure and poor in cleaning effect, and meanwhile, the existing cleaning device does not have a drying function.
In order to avoid the above technical problems, it is necessary to provide a pickling apparatus for semiconductor single crystal silicon wafer production to overcome the above-mentioned drawbacks of the prior art.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a semiconductor monocrystalline silicon wafer production uses pickling plant, it is complicated to aim at solving the belt cleaning device structure, and clean effect is not good, and current belt cleaning device does not possess dry effect simultaneously yet.
The embodiment of the utility model provides a realize like this, a semiconductor monocrystalline silicon wafer production uses pickling plant, comprising a box body and a box cover, the case lid articulates on the box, one side fixedly connected with handle that the case lid deviates from the box still includes:
two mounting grooves are formed in the inner end face of the box body, a second electric push rod is arranged inside each mounting groove, and a placing component is arranged between the telescopic ends of the two second electric push rods and used for containing monocrystalline silicon wafers;
an acid dipping component is arranged on the inner end face of the box body and is positioned on one side of the placing component, and the acid dipping component is used for preliminarily cleaning the monocrystalline silicon wafer in an acid solution soaking mode;
the inner side surface of the box body is provided with a plurality of spray heads, all the spray heads are annularly arranged around the placing assembly, and the spray heads wash the monocrystalline silicon wafer in a water spraying mode;
one side of the box cover close to the box body is fixedly connected with a drying assembly, the drying assembly is arranged on the other side of the placing assembly, and the drying assembly dries the monocrystalline silicon wafer in a hot air blowing mode towards the placing assembly.
Further technical scheme, place the subassembly including connecting elbow and cylinder mould, the one end fixed connection of connecting elbow is in the flexible end of second electric putter, the other end and the cylinder mould fixed connection of connecting elbow, two the connecting elbow sets up the both sides at the cylinder mould respectively.
According to a further technical scheme, the pickling assembly comprises a pickling tank arranged at the bottom in the box body, and pickling solution is contained in the pickling tank.
According to the technical scheme, a sliding groove is formed in the side face of the pickling tank, a baffle used for shielding the pickling tank is connected to the inside of the sliding groove in a sliding mode, a first electric push rod is fixedly connected to the outer side face of the box body, the first electric push rod penetrates through the telescopic end of the box body and is fixedly connected with the baffle, a protection box is fixedly connected to the outer side face of the box body, and the protection box is used for protecting the first electric push rod.
Further technical scheme, the stoving subassembly includes a plurality of heating rod and two fans, a plurality of heating rod fixed connection is close to the one side of placing the subassembly at the case lid, two mounting holes have been seted up to the case lid, and two fans are fixed mounting respectively in the inside of mounting hole, one side fixedly connected with that the case lid deviates from the box is used for the radiating heat exchanger of fan.
According to the further technical scheme, the spray head is fixedly connected with a water delivery hose, one end of the water delivery hose is fixedly connected with a water source supply assembly, and the water source supply assembly is used for providing high-pressure water for the spray head.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the embodiment of the utility model provides a pair of semiconductor is pickling unit for monocrystalline silicon piece production shortens through the flexible end of control second electric putter, drives and places the subassembly and descends, makes and places the subassembly and dip in the pickling bath, washes away the impurity on monocrystalline silicon piece surface, will place the subassembly again and rise, washes monocrystalline silicon piece's surface through shower nozzle blowout high pressure water, washes remaining pickling solution on the monocrystalline silicon piece, avoids corroding monocrystalline silicon piece, makes cleaning effect better.
The embodiment of the utility model provides a semiconductor is pickling installation for monocrystalline silicon piece production, can dry the monocrystalline silicon piece after wasing through the stoving subassembly, avoid remaining moisture on the monocrystalline silicon piece to cause the corruption to the monocrystalline silicon piece; through setting up first electric putter, baffle, after pickling is accomplished, control first electric putter's flexible end extension to drive the baffle and shelter from the pickling pond, rivers go into pickling solution when avoiding wasing and cause pickling solution concentration to descend, make pickling solution can use repeatedly, practiced thrift the resource, and the pickling effect can not reduce.
Drawings
Fig. 1 is a schematic structural view of a first form of the present invention;
fig. 2 is a schematic structural view of a second form of the present invention;
fig. 3 is a schematic structural view of a second form of the front view section of the present invention;
fig. 4 is a schematic structural diagram of a side view section of a second embodiment of the present invention.
In the drawings: the box body 1, the box cover 2, the second electric push rod 3, the connecting elbow 4, the net cage 5, the pickling tank 6, the first electric push rod 7, the baffle 8, the spray head 9, the heating rod 10, the fan 11, the protection box 12, the heat dissipation cover 13 and the handle 14.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
The following detailed description is provided for the specific embodiments of the present invention.
As shown in fig. 1-4, for the utility model provides a pair of semiconductor monocrystalline silicon piece is pickling plant for production, including box 1 and case lid 2, case lid 2 articulates on box 1, one side fixedly connected with handle 14 that case lid 2 deviates from box 1 still includes:
two mounting grooves are formed in the box body 1, a second electric push rod 3 is arranged in each mounting groove, and a placing component is arranged between the telescopic ends of the two second electric push rods 3 and used for placing monocrystalline silicon wafers;
an pickling assembly is arranged in the box body 1, the pickling assembly is positioned on one side of the placing assembly, and the pickling assembly is used for preliminarily cleaning the monocrystalline silicon wafer in an acid solution soaking mode;
a plurality of spray heads 9 are arranged on the inner side surface of the box body 1, all the spray heads 9 are annularly arranged around the placing assembly, and the spray heads 9 wash the monocrystalline silicon wafer in a water spraying mode;
and a drying component is fixedly connected to one side, close to the box body 1, of the box cover 2, is arranged on the other side of the placing component, and dries the monocrystalline silicon wafer in a hot air blowing mode towards the placing component.
In the embodiment of the present invention, as shown in fig. 4, as a preferred embodiment of the present invention, the placing component includes a connecting elbow 4 and a net cage 5, the one end fixed connection of the connecting elbow 4 is at the telescopic end of the second electric putter 3, the other end of the connecting elbow 4 is fixedly connected with the net cage 5, two the connecting elbow 4 is respectively disposed at two sides of the net cage 5.
The telescopic end of the second electric push rod 3 goes up and down to drive the connecting elbow 4 to go up and down, thereby driving the mesh cage 5 to go up and down.
In the embodiment of the present invention, as shown in fig. 3, as a preferred embodiment of the present invention, the pickling assembly includes a pickling tank 6 disposed at the bottom inside the box 1, a pickling solution is contained inside the pickling tank 6, and the pickling solution is used for pickling the monocrystalline silicon wafer.
In the embodiment of the present invention, as shown in fig. 3, as a preferred embodiment of the present invention, a sliding groove has been opened on the side of the pickling tank 6, the inside sliding connection of the sliding groove has a baffle 8 for shielding the pickling tank 6, the lateral surface fixedly connected with first electric putter 7 of the box 1, the first electric putter 7 runs through the telescopic end and the baffle 8 fixed connection of the box 1, the lateral surface fixedly connected with protection box 12 of the box 1, the protection box 12 is used for protecting the first electric putter 7.
After pickling is accomplished, the flexible end extension of first electric putter 7 to drive baffle 8 and remove to pickling tank 6 direction, finally accomplish sheltering from pickling tank 6, during rivers entered pickling tank 6 when avoiding washing, guaranteed the concentration of pickling solution, make pickling solution can used repeatedly.
In the embodiment of the utility model, as shown in fig. 1-3, as the utility model discloses a preferred embodiment, the stoving subassembly includes a plurality of heating rod 10 and two fans 11, a plurality of heating rod 10 fixed connection is close to the one side of placing the subassembly at case lid 2, two mounting holes have been seted up to case lid 2, and two fans 11 are fixed mounting in the inside of mounting hole respectively, one side fixedly connected with that case lid 2 deviates from box 1 is used for the radiating radiator cap 13 of fan 11.
The power switch of the heating rod 10 is turned on, the heating rod 10 emits heat, the temperature inside the box body 1 rises, the power switch of the fan 11 is turned on, and the fan 11 blows hot air to take away moisture through the surface of the monocrystalline silicon piece, so that the monocrystalline silicon piece can be dried in an accelerated manner, and the drying effect is better.
In the embodiment of the present invention, as shown in fig. 4, as a preferred embodiment of the present invention, the nozzle 9 is fixedly connected with a water delivery hose, and one end of the water delivery hose is fixedly connected with a water source supply assembly; the water supply assembly is preferably provided inside the tank, and the water supply assembly is used to supply high pressure water to the spray head.
This pickling device is used in production of semiconductor monocrystalline silicon piece, open case lid 2, put the monocrystalline silicon piece in cylinder mould 5, the flexible end of control second electric putter 3 shortens, thereby drive cylinder mould 5 descends, make cylinder mould 5 dip in pickling tank 6, carry out the pickling to the monocrystalline silicon piece, after the pickling, control cylinder mould 5 rises, the flexible end extension of first electric putter 7 of again control, thereby drive baffle 8 and shelter from pickling tank 6, then spout high pressure water through shower nozzle 9 and wash the monocrystalline silicon piece, wash away the residual pickling solution in monocrystalline silicon piece surface, then open the switch of heating rod 10, heating rod 10 sends out the heat, make the inside temperature of box 1 rise, open the switch of fan 11, fan 11 blows hot air and takes away moisture through the monocrystalline silicon piece surface, thereby can accelerate the drying monocrystalline silicon piece, make the stoving effect better.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a semiconductor is pickling plant for monocrystalline silicon piece production, includes box and case lid, the case lid articulates on the box, its characterized in that still includes:
two mounting grooves are formed in the inner end face of the box body, a second electric push rod is arranged inside each mounting groove, and a placing component is arranged between the telescopic ends of the two second electric push rods and used for containing monocrystalline silicon wafers;
an acid dipping component is arranged on the inner end face of the box body and is positioned on one side of the placing component, and the acid dipping component is used for preliminarily cleaning the monocrystalline silicon wafer in an acid solution soaking mode;
the inner side surface of the box body is provided with a plurality of spray heads, all the spray heads are annularly arranged around the placing assembly, and the spray heads wash the monocrystalline silicon wafer in a water spraying mode;
one side of the box cover close to the box body is fixedly connected with a drying assembly, the drying assembly is arranged on the other side of the placing assembly, and the drying assembly dries the monocrystalline silicon wafer in a hot air blowing mode towards the placing assembly.
2. The pickling device for the production of the semiconductor monocrystalline silicon piece according to claim 1, wherein the placing component comprises a connecting elbow and a net cage, one end of the connecting elbow is fixedly connected to the telescopic end of the second electric push rod, the other end of the connecting elbow is fixedly connected with the net cage, and the two connecting elbows are respectively arranged on two sides of the net cage.
3. The pickling device for producing the semiconductor single-crystal silicon wafer as claimed in claim 1, wherein the pickling assembly comprises a pickling tank arranged at the bottom in the box body, and pickling solution is contained in the pickling tank.
4. The pickling device for the production of the semiconductor monocrystalline silicon piece according to claim 3, wherein a sliding groove is formed in the side surface of the pickling tank, a baffle plate used for shielding the pickling tank is connected to the inside of the sliding groove in a sliding manner, a first electric push rod is fixedly connected to the outer side surface of the box body, and the first electric push rod penetrates through the telescopic end of the box body and is fixedly connected with the baffle plate.
5. The pickling device for the production of the semiconductor monocrystalline silicon piece according to claim 1, wherein the drying component comprises a plurality of heating rods and two fans, the plurality of heating rods are fixedly connected to one side of the box cover close to the placing component, the box cover is provided with two mounting holes, and the two fans are respectively and fixedly mounted inside the mounting holes.
6. The pickling apparatus for producing a semiconductor single-crystal silicon wafer according to claim 1, wherein the shower head is fixedly connected with a water hose, one end of the water hose is fixedly connected with a water source supply assembly, and the water source supply assembly is used for supplying high-pressure water to the shower head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220548947.6U CN217251113U (en) | 2022-03-14 | 2022-03-14 | Pickling device is used in production of semiconductor monocrystalline silicon piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220548947.6U CN217251113U (en) | 2022-03-14 | 2022-03-14 | Pickling device is used in production of semiconductor monocrystalline silicon piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217251113U true CN217251113U (en) | 2022-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220548947.6U Active CN217251113U (en) | 2022-03-14 | 2022-03-14 | Pickling device is used in production of semiconductor monocrystalline silicon piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217251113U (en) |
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2022
- 2022-03-14 CN CN202220548947.6U patent/CN217251113U/en active Active
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