CN217239006U - Circuit board structure of display unit, display unit and circuit board - Google Patents
Circuit board structure of display unit, display unit and circuit board Download PDFInfo
- Publication number
- CN217239006U CN217239006U CN202221069049.9U CN202221069049U CN217239006U CN 217239006 U CN217239006 U CN 217239006U CN 202221069049 U CN202221069049 U CN 202221069049U CN 217239006 U CN217239006 U CN 217239006U
- Authority
- CN
- China
- Prior art keywords
- chip
- mounting
- pad
- row
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model relates to a LED shows technical field, concretely relates to display element circuit board structure, display element and circuit board. This display element circuit board structure includes: the substrate unit, the first and second connection pads, the mounting pad, and the common electrode pad. The substrate unit comprises a substrate unit, a first row of mounting areas, a second row of mounting areas and a third row of mounting areas, wherein the first row of mounting areas, the second row of mounting areas and the third row of mounting areas are sequentially arranged on one side of the substrate unit at intervals; first and second connection pads disposed at an interval on the first column mounting area; the mounting pad comprises an R chip mounting area and an extension welding area connected with the R chip mounting area, the R chip mounting area is arranged on the second row of mounting areas, and the extension welding area extends towards the third row of mounting areas; and a common electrode pad disposed on the third column mounting land and spaced apart from the extended land. The problem that the product contrast is low due to the fact that the area of a metal pad is too large in the line technology, pad metal migration is obvious, and product failure can be caused can be solved.
Description
Technical Field
The utility model relates to a LED shows technical field, concretely relates to display element circuit board structure, display element and circuit board.
Background
The BT board is a general name for processing the BT substrate into the PCB. With the improvement of the display screen control chip technology, the common cathode product has the advantages of low power consumption, simple circuit design and the like compared with the common anode product, the market demand is gradually increased, and various packaging factories begin to release the common cathode product.
However, in the prior art, the area of a metal pad of a small-pitch 1010 device is too large, so that the product contrast is low, the pad metal migration is obvious, and the product failure can be caused.
SUMMERY OF THE UTILITY MODEL
To the defect that exists among the prior art, the utility model aims to provide a display element circuit board structure, display element and circuit board can solve the line technique in the metal pad area too big, lead to the product contrast low to pad metal migration is obvious, can lead to the problem that the product became invalid.
In order to achieve the above purpose, the utility model adopts the technical proposal that:
the utility model provides a display element circuit board structure, include:
a substrate unit, one side of which is sequentially provided with a first row mounting area, a second row mounting area and a third row mounting area at intervals;
first and second connection pads disposed on the first column mounting region at an interval;
mounting pads comprising R chip mounting areas disposed on the second column of mounting areas and extended pads connected to the R chip mounting areas, the extended pads extending toward the third column of mounting areas;
a common electrode pad disposed on the third column of mounting lands and spaced apart from the extended land.
In some optional schemes, the substrate unit is square, via holes connected to the first connection pad, the second connection pad, the extension land and the common electrode pad are disposed at four corners of the substrate unit, corresponding pins are disposed at the other side of the substrate unit, and copper solder is disposed in the via holes and used for connecting the first connection pad, the second connection pad, the extension land and the common electrode pad to the corresponding pins.
In some optional schemes, the boundary edge of the via hole, the first connection pad, the second connection pad, the extension welding area and the common electrode pad is in a circular arc shape.
In some optional schemes, the boundary edge of the via hole and the corresponding pin is in a circular arc shape.
In some alternatives, the pin is a copper piece.
In some alternatives, the first connection pad, the second connection pad, the mounting pad, and the common electrode pad are copper pieces.
In another aspect, a display unit is provided, which includes:
a substrate unit, one side of which is sequentially provided with a first row mounting area, a second row mounting area and a third row mounting area at intervals;
first and second connection pads disposed at an interval on the first column mounting area;
mounting pads comprising R chip mounting areas disposed on the second column of mounting areas and extended pads connected to the R chip mounting areas, the extended pads extending toward the third column of mounting areas;
a common electrode pad disposed on the third column mounting area and spaced apart from the extension land;
r chip, G chip and B chip, just G chip and B chip are established on the base plate unit, the R chip is established R chip installing zone, R chip, G chip and B chip interval set up, and are located in the second is listed as the installing zone.
In some optional schemes, the first poles of the R chip, the G chip and the B chip are overlapped with the common pole bonding pad through wires, and the second poles of the G chip and the B chip are overlapped with the first connection bonding pad and the second connection bonding pad through wires, respectively.
In another aspect, a circuit board is provided, including: the display unit circuit board structures are arranged in sequence transversely and longitudinally.
In some optional schemes, round holes are formed at junctions of four adjacent substrate units, and the round holes are distributed to each substrate unit to serve as via holes.
Compared with the prior art, the utility model has the advantages of: the G chip and the B chip are directly provided on the substrate unit 10, and the R chip is provided on the R chip mounting area 31. In a product with the R chip, the G chip and the B chip, because the metal area of the bonding pad is greatly reduced, the area of the exposed black BT substrate unit 10 is increased, and the contrast and the color consistency are improved. The G chip and the B chip are not provided with bonding pads and are directly arranged on the substrate unit 10, so that the generation factor of metal migration is reduced, and the industrial pain point of metal migration of the bonding pads is solved; the R chip is fixed on the bonding pad, and because the electrode of the R chip is of a vertical structure, the phenomenon of metal migration is difficult to occur due to factors such as gravity. In addition, the display unit can also automatically select two connection modes of common cathode and common anode according to actual requirements.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board structure of a display unit according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display unit according to an embodiment of the present invention;
fig. 3 is a schematic right-view diagram of fig. 2 according to an embodiment of the present invention;
fig. 4 is a schematic front view of fig. 2 according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a circuit board in an embodiment of the present invention;
fig. 6 is a schematic diagram of the circuit board after the display chip is mounted thereon in the embodiment of the present invention.
In the figure: 10. a substrate unit; 1. a first connection pad; 2. a second connection pad; 3. mounting a bonding pad; 31. an R chip mounting region; 32. an extension welding area; 4. a common electrode pad; 5. a pin; 6. and (6) a via hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making creative efforts shall fall within the protection scope of the present application.
The following describes embodiments of the display unit circuit board structure, the display unit and the circuit board in detail with reference to the drawings.
As shown in fig. 1, the utility model provides a display element circuit board structure, include: a substrate unit 10, first and second connection pads 1 and 2, a mounting pad 3, and a common electrode pad 4.
Wherein, a first row of mounting areas, a second row of mounting areas and a third row of mounting areas are sequentially arranged on one side of the substrate unit 10 at intervals; a first connection pad 1 and a second connection pad 2 which are disposed at an interval on the first column mounting area; a mounting pad 3 including an R chip mounting area 31 and an extension land 32 connected to the R chip mounting area 31, the R chip mounting area 31 being disposed on the second column of mounting areas, the extension land 32 extending toward the third column of mounting areas; and a common electrode pad 4 disposed on the third column mounting area and spaced apart from the extended land 32.
As shown in fig. 2 to 4, when the circuit board structure of the display unit is used, the R chip, the G chip and the B chip are spaced apart and located in the second column of the mounting region. Wherein the G chip and the B chip are directly provided on the substrate unit 10, and the R chip is provided on the R chip mounting area 31. In the product with the R chip, the G chip and the B chip, the metal area of the bonding pad is greatly reduced, the area of the exposed black BT substrate unit 10 is increased, and the contrast and the color consistency are improved.
In addition, when water vapor permeates into the interior of the lamp beads, metal elements of the bonding pads are easily electrolyzed to form metal ions, the metal ions electrolyzed by the bonding pads of the P electrode or the N electrode can migrate along the direction of an electric field under the action of external voltage, and short circuit and electric leakage are finally caused; the R chip is fixed on the bonding pad, and the electrode of the R chip is of a vertical structure, so that the metal migration phenomenon is difficult to occur due to factors such as gravity.
In this example, when the bottom of the R chip is the first electrode, the bottom of the R chip is attached to the R chip mounting region 31 of the mounting pad 3, the first electrodes of the G chip and the B chip are connected to the first connection pad 1 and the second connection pad 2 respectively through wires, and the second electrodes of the R chip, the G chip and the B chip are connected to the common electrode pad 4 through wires, that is, the cathode and anode connections of the R, G and the B chip are completed. When the first electrode is an anode, the second electrode is a cathode, and when the first electrode is a cathode, the second electrode is an anode, so that the display unit circuit board structure can also realize two connection modes of common cathode and common anode, and can be selected autonomously according to actual requirements.
In some alternative embodiments, the substrate unit 10 is square, vias 6 connected to the first connection pad 1, the second connection pad 2, the extension land 32 and the common electrode pad 4 are provided at four corners of the substrate unit 10, corresponding pins 5 are provided at the other side of the substrate unit 10, and solder copper is provided in the vias 6 for connecting the first connection pad 1, the second connection pad 2, the extension land 32 and the common electrode pad 4 with the corresponding pins 5.
In this embodiment, the first connection pad 1, the second connection pad 2, the extension land 32 and the common electrode pad 4 on one side of the substrate unit 10 are connected to the pins 5 on the other side of the substrate unit 10 through the copper solder disposed in the via 6 on the substrate unit 10, so that the electrical connection between R, G and the B chip can be realized only by connecting the four pins 5 on the back side of the substrate unit 10 with wires, wherein one pin 5 is used as the common electrode, and the other three pins are used as R, G and the other electrode of the B chip, so as to realize the control of R, G and the B chip.
In some alternative embodiments, the boundary edges of the via 6 with the first connection pad 1, the second connection pad 2, the extended land 32, and the common electrode pad 4 are circular arc-shaped.
When the circuit board structure of the display unit is used, a display screen is formed by a plurality of continuous and vertical arranged common use, and a single BT circuit board structure is installed with R, G and a B chip to form one display unit. A plurality of display element circuit board structures share a base plate, and every display element circuit board structure occupies a square region on the base plate, sets up a circular port at four adjacent display element circuit board structures and shares, and one of them display element circuit board structure's via hole 6 occupies the region of a quarter circle promptly. Therefore, the via holes 6 are located outside in the plane direction of the first connection pad 1, the second connection pad 2, the extended land 32, and the common electrode pad 4, and the respective leads 5 are located inside in the plane direction of all the via holes 6.
The first connection pad 1, the second connection pad 2, the extension land 32 and the common electrode pad 4 on one side of each substrate unit 10 are partially located at four corners of a square area, a circular hole is commonly arranged in four adjacent display unit circuit board structures, and each substrate unit 10 is divided into a quarter of circular areas to be used as a through hole 6, namely, a pin 5 arranged on the back of the substrate unit 10 is connected. The design can facilitate the arrangement of the via hole 6, and the intersection edges of the via hole 6, the first connection pad 1, the second connection pad 2, the extension land 32 and the common electrode pad 4 are arc-shaped, so that the connection stability can be ensured.
In some alternative embodiments, the boundary between the via 6 and the corresponding pin 5 is a circular arc. In this embodiment, the circular arc interface can ensure the connection stability between the via 6 and the corresponding pin 5.
In some alternative embodiments, the pins 5 are copper pieces. The first connection pad 1, the second connection pad 2, the mounting pad 3 and the common electrode pad 4 are made of copper. In this embodiment, the lead 5, the first connection pad 1, the second connection pad 2, the mounting pad 3 and the common electrode pad 4 are made of copper, so that power can be saved and the service life of the display unit can be prolonged.
As shown in fig. 1 to 4, in addition, the present invention also provides a display unit, including: a substrate unit 10, first and second connection pads 1 and 2, a mounting pad 3, a common electrode pad 4, an R chip, a G chip, and a B chip.
Wherein, a first row of mounting areas, a second row of mounting areas and a third row of mounting areas are sequentially arranged on one side of the substrate unit 10 at intervals; the first connection pads 1 and the second connection pads 2 are arranged on the first column of mounting areas at intervals; the mounting pad 3 includes an R chip mounting area 31 and an extension land 32 connected to the R chip mounting area 31, the R chip mounting area 31 being disposed on the mounting areas of the second column, the extension land 32 extending toward the mounting areas of the third column; the common electrode pad 4 is disposed on the third column mount area, and is disposed at a distance from the extension land 32; the G chip and the B chip are provided on the substrate unit 10, the R chip is provided in the R chip mounting region 31, and the R chip, the G chip, and the B chip are provided at intervals and are located in the second row mounting region.
The G chip and the B chip are directly provided on the substrate unit 10, and the R chip is provided on the R chip mounting area 31. In the product with the R chip, the G chip and the B chip, the metal area of the bonding pad is greatly reduced, the area of the exposed black BT substrate unit 10 is increased, and the contrast and the color consistency are improved. The G chip and the B chip are not provided with bonding pads and are directly arranged on the substrate unit 10, so that the generation factor of metal migration is reduced, and the industrial pain point of metal migration of the bonding pads is solved; the R chip is fixed on the bonding pad, and the electrode of the R chip is of a vertical structure, so that the metal migration phenomenon is difficult to occur due to factors such as gravity. In addition, the display unit can also automatically select two connection modes of common cathode and common anode according to actual requirements.
In some alternative embodiments, the first poles of the R chip, the G chip, and the B chip are wire-bonded to the common electrode pad 4, and the second poles of the G chip and the B chip are wire-bonded to the first connection pad 1 and the second connection pad 2, respectively.
In this embodiment, the bottom of the R chip is provided with an electrode, which can be directly conductive through the mounting pad 3, and can rapidly realize the lap joint of the cathode and anode of the R chip, the G chip and the B chip.
As shown in fig. 5 and fig. 6, in addition, the utility model discloses still provide a circuit board, include: the display unit circuit board structures are arranged in sequence transversely and longitudinally.
In this implementation, all install R chip, G chip and B chip and overlap joint wire after a plurality of display element circuit board structure horizontal and longitudinal arrangement in proper order, encapsulate, then can cut apart into solitary display element according to single display element circuit board structure, during the user's use, form the display screen with the display element laminating together again. The efficiency can be improved by adopting a mode of dividing a plurality of display unit circuit boards which are sequentially arranged transversely and longitudinally together.
In this embodiment, a circular hole is formed at the boundary between the adjacent four substrate units 10, and the circular hole is divided into the substrate units 10 to serve as the via hole 6.
In this example, the first connection pad 1, the second connection pad 2, the extension land 32, and the common electrode pad 4 on one side of each substrate unit 10 are partially located at four corners of a square region, a circular hole is formed at a boundary of four adjacent substrate units 10, and each substrate unit 10 is divided into a quarter circular region serving as a via 6 to be connected to the pin 5 disposed on the back surface of the substrate unit 10. The design can facilitate the arrangement of the via hole 6, and the intersection edges of the via hole 6, the first connection pad 1, the second connection pad 2, the extension land 32 and the common electrode pad 4 are arc-shaped, so that the connection stability can be ensured.
In summary, the G chip and the B chip are directly disposed on the substrate unit 10, and the R chip is disposed on the R chip mounting region 31. In the product with the R chip, the G chip and the B chip, the metal area of the bonding pad is greatly reduced, the area of the exposed black BT substrate unit 10 is increased, and the contrast and the color consistency are improved. The G chip and the B chip are not provided with bonding pads and are directly arranged on the substrate unit 10, so that the generation factor of metal migration is reduced, and the industrial pain point of metal migration of the bonding pads is solved; the R chip is fixed on the bonding pad, and the electrode of the R chip is of a vertical structure, so that the metal migration phenomenon is difficult to occur due to factors such as gravity. In addition, the display unit can also automatically select two connection modes of common cathode and common anode according to actual requirements.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in this application, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A display unit circuit board structure, comprising:
a substrate unit (10) having a first row of mounting areas, a second row of mounting areas and a third row of mounting areas sequentially spaced from each other on one side thereof;
a first connection pad (1) and a second connection pad (2) which are disposed on the first column mounting area with an interval therebetween;
a mounting pad (3) including an R chip mounting region (31) and an extended land (32) connected to the R chip mounting region (31), the R chip mounting region (31) being disposed on the second column of mounting regions, the extended land (32) extending toward the third column of mounting regions;
a common electrode pad (4) disposed on the third column mounting area and spaced apart from the extended land (32).
2. A display unit circuit board structure according to claim 1, characterized in that the substrate unit (10) is square, vias (6) connecting the first connection pad (1), the second connection pad (2), the extension land (32) and the common electrode pad (4) are provided at each of four corners of the substrate unit (10), and corresponding pins (5) are provided at the other side of the substrate unit (10), and copper solder is provided in the vias (6) for connecting the first connection pad (1), the second connection pad (2), the extension land (32) and the common electrode pad (4) with the corresponding pins (5).
3. A display unit circuit board structure according to claim 2, characterized in that the boundary edges of the via hole (6) with the first connection pad (1), the second connection pad (2), the extended land area (32) and the common electrode pad (4) are circular arc shaped.
4. A display unit circuit board structure according to claim 2, characterized in that: the boundary edge of the via hole (6) and the corresponding pin (5) is arc-shaped.
5. A display unit circuit board structure according to claim 2, wherein: the pins (5) are made of copper.
6. A display unit circuit board structure according to claim 1, wherein: the first connecting pad (1), the second connecting pad (2), the mounting pad (3) and the common electrode pad (4) are made of copper.
7. A display unit, comprising:
a substrate unit (10) having a first row of mounting areas, a second row of mounting areas and a third row of mounting areas sequentially spaced from each other on one side thereof;
a first connection pad (1) and a second connection pad (2) which are disposed on the first column mounting area with an interval therebetween;
a mounting pad (3) including an R chip mounting region (31) and an extended land (32) connected to the R chip mounting region (31), the R chip mounting region (31) being disposed on the second column of mounting regions, the extended land (32) extending toward the third column of mounting regions;
a common electrode pad (4) disposed on the third column mounting land and spaced apart from the extended land (32);
r chip, G chip and B chip, just G chip and B chip are established on base plate unit (10), the R chip is established R chip installing zone (31), R chip, G chip and B chip interval set up, and are located in the second row installing zone.
8. The display unit of claim 7, wherein: the first poles of the R chip, the G chip and the B chip are in lap joint with the common pole bonding pad (4) through wires, and the second poles of the G chip and the B chip are in lap joint with the first connecting bonding pad (1) and the second connecting bonding pad (2) through wires respectively.
9. A circuit board, comprising: a plurality of the display unit wiring board structures of claim 1, and the plurality of display unit wiring board structures are arranged in sequence in the lateral and longitudinal directions.
10. The wiring board of claim 9, wherein: round holes are formed in the junctions of the four adjacent substrate units (10), and the round holes are distributed to the substrate units (10) to serve as through holes (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221069049.9U CN217239006U (en) | 2022-04-29 | 2022-04-29 | Circuit board structure of display unit, display unit and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221069049.9U CN217239006U (en) | 2022-04-29 | 2022-04-29 | Circuit board structure of display unit, display unit and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217239006U true CN217239006U (en) | 2022-08-19 |
Family
ID=82821305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221069049.9U Active CN217239006U (en) | 2022-04-29 | 2022-04-29 | Circuit board structure of display unit, display unit and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217239006U (en) |
-
2022
- 2022-04-29 CN CN202221069049.9U patent/CN217239006U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213459749U (en) | Battery piece and photovoltaic module | |
| CN107658583B (en) | Electric connector | |
| CN217239006U (en) | Circuit board structure of display unit, display unit and circuit board | |
| CN104633618B (en) | A kind of electric connection structure, assembly method and the lamps and lanterns of LED lamp panel and power panel | |
| CN216213439U (en) | Full-color LED display unit and LED circuit board | |
| CN112951971B (en) | All-in-one flip full-color SMD LED | |
| CN202084542U (en) | Chip in-line small bridge | |
| CN212277219U (en) | LED packaging support plate and LED packaging structure | |
| CN103972676A (en) | Surface mount type conductive terminal convenient to assemble and manufacturing method thereof and LED module easy to assemble | |
| CN210805771U (en) | 8-in-1 full-color SMD LED | |
| CN109659376B (en) | Solar cell panel and preparation method thereof | |
| CN219575973U (en) | Electrical connection structure and electrical connection assembly | |
| CN216698420U (en) | Lamp pearl circuit board and combination lamp plate | |
| CN216213527U (en) | LED packaging structure and LED display device | |
| CN219435876U (en) | Integrated packaging structure using vertical structure light-emitting wafer and display device | |
| CN215494455U (en) | Mini LED backlight plate, backlight lamp and liquid crystal display screen | |
| CN217588914U (en) | Copper substrate structure of current field effect tube | |
| CN214505491U (en) | Three-wire point-control LED lamp bead with trimming notches and point-control LED lamp string | |
| CN211828765U (en) | LED light-emitting unit group and display panel | |
| CN210519156U (en) | Converged communication equipment | |
| CN216054777U (en) | LED light-emitting device, display module and display equipment | |
| CN217364703U (en) | Surface mount type airflow sensor | |
| CN217693836U (en) | BT circuit board structure | |
| CN217740524U (en) | Boss type lining plate module structure | |
| CN210092121U (en) | Upright chip support structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |