CN217217018U

CN217217018U - Plastic part with three-dimensional circuit

Info

Publication number: CN217217018U
Application number: CN202221033844.2U
Authority: CN
Inventors: 孙江龙
Original assignee: Dongguan Ruijin Technology Co ltd
Current assignee: Dongguan Ruijin Technology Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-08-16
Anticipated expiration: 2032-04-29

Abstract

The utility model relates to a three-dimensional circuit technical field, concretely relates to plastic part with three-dimensional circuit, including three-dimensional plastic substrate, attach to the three-dimensional circuit of three-dimensional plastic substrate and set up in the radium carving guide wire of the both sides of three-dimensional circuit, the three-dimensional circuit including in proper order attach to three-dimensional plastic substrate surface attach to enhancement layer, conducting layer and circuit protection layer, the surface of three-dimensional plastic substrate is the sand blasting face. The three-dimensional plastic substrate is used as a substrate, the three-dimensional circuit is directly attached to the surface of the substrate, the three-dimensional plastic substrate of the electronic equipment plays the functions of protection, support and the like, and the electrical connection function of the circuit board is concentrated on the three-dimensional plastic substrate, so that a PCB (printed circuit board) is omitted, the space is saved, and the electronic equipment is favorably refined. The surface of the three-dimensional plastic substrate is a sand blasting surface, so that the connection stability of the adhesive force enhancement layer and the three-dimensional plastic substrate is improved, and the conductive layer and the circuit protection layer are conveniently attached.

Description

Plastic part with three-dimensional circuit

Technical Field

The utility model relates to a three-dimensional circuit technical field, concretely relates to plastic part with three-dimensional circuit.

Background

The existing circuit board mainly comprises a bonding pad, a through hole, a mounting hole, a lead, a component, a connector, a filler, an electrical boundary and the like, and the circuit board enables the circuit to be miniaturized and visualized and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout. The circuit board may be referred to as a printed wiring board or a printed circuit board.

The existing circuit board is installed in the electronic equipment, although the circuit of the electronic equipment can be simplified, the circuit board still occupies partial space, and the circuit board is also required to be provided with a mounting hole so as to be matched and fixed with a plastic base material of the electronic equipment, so that the circuit board is not beneficial to refinement and function centralization.

Disclosure of Invention

In order to overcome the defects and deficiencies existing in the prior art, the utility model aims to provide a plastic part with a three-dimensional circuit.

The purpose of the utility model is realized through the following technical scheme: the utility model provides a plastic part with three-dimensional circuit, includes three-dimensional plastic substrate, attaches to the three-dimensional circuit of three-dimensional plastic substrate and sets up in the radium carving guide wire of the both sides of three-dimensional circuit, the three-dimensional circuit including in proper order attach to the surperficial enhancement layer, conducting layer and the circuit protection layer of attaching to of three-dimensional plastic substrate, the surface of three-dimensional plastic substrate is the sand blasting face.

Preferably, the adhesion enhancement layer is a nickel plating layer, and the laser etching guide lines are arranged on two sides of the nickel plating layer.

Preferably, the conductive layer is a copper plating layer.

Preferably, the circuit protection layer is a tin plating layer.

Preferably, the thickness of the adhesion enhancing layer is 0.1 to 0.6 μm.

Preferably, the thickness of the conductive layer is 80-120 μm.

Preferably, the thickness of the circuit protection layer is 80-120 μm.

Preferably, the three-dimensional plastic base material is provided with a via hole.

Preferably, the three-dimensional plastic substrate extends to form a mounting convex ridge, and the mounting convex ridge is provided with a mounting hole.

The beneficial effects of the utility model reside in that: the utility model discloses a plastic part with three-dimensional circuit to three-dimensional plastic substrate is the base member, directly adheres to three-dimensional circuit at its surface, and electronic equipment's three-dimensional plastic substrate both plays effects such as protection, support of itself, concentrates on three-dimensional plastic substrate with the electrical connection function of circuit board again, saves installation PCB circuit board, saves space, is favorable to becoming more meticulous of electronic equipment. In addition, the adhesion enhancement layer, the conductive layer and the circuit protection layer are sequentially adhered to the surface of the three-dimensional plastic base material, and the surface of the three-dimensional plastic base material is a sand blasting surface, so that the connection stability of the adhesion enhancement layer and the three-dimensional plastic base material is improved, and the conductive layer and the circuit protection layer are conveniently adhered; the laser carving guide lines are arranged on two sides of the three-dimensional circuit, and the trend of the three-dimensional circuit can be determined according to the laser carving guide lines, so that the three-dimensional circuit is reasonably arranged, and the deviation of the three-dimensional circuit is avoided.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a cross-sectional view of the present invention;

the reference signs are: 1. a three-dimensional plastic substrate; 2. a stereo circuit; 21. attaching a reinforcing layer; 22. a conductive layer; 23. a circuit protection layer; 3. laser etching a guide line; 4. a via hole; 5. mounting the convex ridge; 6. and (7) installing holes.

Detailed Description

In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying drawings, which are not intended to limit the present invention.

As shown in fig. 1-2, a plastic part with a three-dimensional circuit 2 comprises a three-dimensional plastic substrate 1, the three-dimensional circuit 2 attached to the three-dimensional plastic substrate 1, and laser etching guide lines 3 arranged on two sides of the three-dimensional circuit 2, wherein the three-dimensional circuit 2 comprises an attachment enhancement layer 21, a conductive layer 22 and a circuit protection layer 23 which are sequentially attached to the surface of the three-dimensional plastic substrate 1, and the surface of the three-dimensional plastic substrate 1 is a sand-blasting surface.

The plastic part with the three-dimensional circuit 2 takes the three-dimensional plastic substrate 1 as a base body, the three-dimensional circuit 2 is directly attached to the surface of the base body, the three-dimensional plastic substrate 1 of the electronic equipment plays roles of protection, support and the like, the electrical connection function of a circuit board is centralized on the three-dimensional plastic substrate 1, a PCB (printed circuit board) is omitted, the space is saved, the refinement of the electronic equipment is facilitated, and the plastic part is particularly suitable for communication antennas. In addition, the adhesion enhancement layer 21, the conductive layer 22 and the circuit protection layer 23 are sequentially adhered to the surface of the three-dimensional plastic substrate 1, and the surface of the three-dimensional plastic substrate 1 is a sand blasting surface, so that the connection stability of the adhesion enhancement layer and the three-dimensional plastic substrate 1 is improved, and the conductive layer 22 and the circuit protection layer 23 are conveniently adhered; radium carving guide wire 3 sets up in the both sides of three-dimensional circuit 2, can confirm the trend of three-dimensional circuit 2 according to radium carving guide wire 3 to rationally arrange three-dimensional circuit 2, avoid 2 squints of three-dimensional circuit.

In this embodiment, the adhesion enhancing layer 21 is a nickel plating layer, and the laser etching guide lines 3 are disposed on two sides of the nickel plating layer.

By adopting the technical scheme, the nickel plating layer is attached to the surface of the three-dimensional plastic base material 1, has better adhesiveness, is beneficial to the conductive layer 22 to be attached to the nickel plating layer, and avoids the conductive layer 22 from falling off from the surface of the three-dimensional plastic base material 1. Radium carving guide wire 3 sets up in the both sides of nickel coating, adopts radium carving equipment to carry out radium carving according to predetermineeing radium carving route in the actual production process, confirms three-dimensional circuit 2's trend to rational arrangement three-dimensional circuit 2 avoids three-dimensional circuit 2 skew.

In the present embodiment, the conductive layer 22 is a copper plating layer.

In the present embodiment, the circuit protection layer 23 is a tin plating layer.

By adopting the technical scheme, the conductive layer 22 and the adhesion enhancement layer 21 are protected and the three-dimensional circuit 2 is prevented from being corroded due to good ductility and corrosion resistance.

In the present embodiment, the thickness of the adhesion enhancing layer 21 is 0.1 to 0.6 μm. Under the condition of meeting the requirement of enough adhesive force strength, the thickness of the adhesion enhancement layer 21 is controlled to be 0.1-0.6 μm, so that the material is saved, and the pollution is reduced. Preferably, the thickness of the adhesion enhancing layer 21 is 0.5 μm.

In this embodiment, the thickness of the conductive layer 22 is 80-120 μm. Preferably, the thickness of the conductive layer 22 is 100 μm.

In the present embodiment, the thickness of the circuit protection layer 23 is 80 to 120 μm. Preferably, the thickness of the circuit protection layer 23 is 100 μm.

In this embodiment, the three-dimensional plastic substrate 1 is provided with a via hole 4.

In this embodiment, the three-dimensional plastic substrate 1 extends to have a mounting ridge 5, and the mounting ridge 5 is provided with a mounting hole 6.

By adopting the technical scheme, the plastic part is matched with a screw or a bolt to be locked on the electronic equipment, so that the plastic part is convenient to install and fix in the electronic equipment, and the plastic part with the three-dimensional circuit is particularly suitable for communication antennas.

The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.

Claims

1. A plastic part with three-dimensional circuit, its characterized in that: including three-dimensional plastic substrate, attach to the three-dimensional circuit of three-dimensional plastic substrate and set up in the radium carving guide wire of the both sides of three-dimensional circuit, the three-dimensional circuit including in proper order attach to the surface of three-dimensional plastic substrate adheres to enhancement layer, conducting layer and circuit protection layer, the surface of three-dimensional plastic substrate is the sand blasting face.

2. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the adhesion enhancement layer is a nickel plating layer, and the laser etching guide lines are arranged on two sides of the nickel plating layer.

3. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the conductive layer is a copper plating layer.

4. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the circuit protection layer is a tin coating.

5. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the thickness of the adhesion enhancing layer is 0.1-0.6 μm.

6. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the thickness of the conductive layer is 80-120 μm.

7. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the thickness of the circuit protection layer is 80-120 μm.

8. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the three-dimensional plastic base material is provided with a via hole.

9. The plastic part with three-dimensional circuit as claimed in claim 1, wherein: the three-dimensional plastic substrate extends to have a mounting convex ridge, the mounting convex ridge has been seted up the mounting hole.