CN217216993U - High-density circuit board with high conductivity - Google Patents
High-density circuit board with high conductivity Download PDFInfo
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- CN217216993U CN217216993U CN202123398166.8U CN202123398166U CN217216993U CN 217216993 U CN217216993 U CN 217216993U CN 202123398166 U CN202123398166 U CN 202123398166U CN 217216993 U CN217216993 U CN 217216993U
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- thermoplastic resin
- circuit board
- mounting
- plates
- bayonet lock
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model relates to a high density type circuit board that electric conductive property is high, include: the n thermoplastic resin plates are connected through at least four rubber columns, so that a heat dissipation channel is formed between the two adjacent thermoplastic resin plates; the thermoplastic resin plates are provided with at least two wire passing holes for leading wires to pass through, a telescopic pipe is arranged between every two adjacent thermoplastic resin plates, and the telescopic pipe is communicated with the two wire passing holes on the two coaxially arranged thermoplastic resin plates; still include the mounting bracket, the mounting bracket is used for n the thermoplastic resin board supports, slidable mounting has two at least installed parts on the mounting bracket, be provided with the mounting hole that is used for the mounting to run through on the installed part, just still be provided with the elasticity bayonet lock subassembly on the installed part, elasticity bayonet lock subassembly is in with the setting a plurality of draw-in groove adaptations on the mounting bracket, and the one end of elasticity bayonet lock subassembly runs through the installed part and stretches into in the mounting hole.
Description
Technical Field
The utility model relates to a high-density type circuit board correlation technique field specifically is a high-density type circuit board that electric conductive property is high.
Background
The circuit board has the name: the printed circuit board comprises a circuit board, a PCB (printed circuit board), an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board, a PCB, an ultrathin circuit board, an ultrathin multilayer high-density printed circuit board, a printed multilayer high-density printed circuit board and the like, wherein the circuit is miniaturized and visualized by the multilayer high-density printed circuit board, the miniaturized and visualized circuit plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, and the multilayer high-density printed circuit board can be called as the printed circuit board or the printed multilayer high-density printed circuit board.
The existing circuit board, especially the multilayer circuit board is piled up fixedly in succession through the solidity glue film, under the operation requirement of high-frequency high-speed high density, the heat can appear piling up, can't carry out effectual quick heat dissipation, influence the use accuracy and the life-span of circuit board, need cooperate outside heat abstractor to cooperate, this consumption that has just caused the external energy, in the outside heat dissipation in-process facing the circuit board in big size, on a large scale and the special environment, can cause huge external energy waste and the big drawback of the degree of difficulty.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high density type circuit board that electric conductive property is high to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a high-density circuit board having high conductivity, comprising:
the n thermoplastic resin plates are connected through at least four rubber columns, so that a heat dissipation channel is formed between the two adjacent thermoplastic resin plates;
the thermoplastic resin plates are provided with at least two wire passing holes for leading wires to pass through, a telescopic pipe is arranged between every two adjacent thermoplastic resin plates, and the telescopic pipe is communicated with the two wire passing holes on the two coaxially arranged thermoplastic resin plates;
still include the mounting bracket, the mounting bracket is used for n the thermoplastic resin board supports, slidable mounting has two at least installed parts on the mounting bracket, be provided with the mounting hole that is used for the mounting to run through on the installed part, just still be provided with the elasticity bayonet lock subassembly on the installed part, elasticity bayonet lock subassembly is in with the setting a plurality of draw-in groove adaptations on the mounting bracket, and the one end of elasticity bayonet lock subassembly runs through the installed part and stretches into in the mounting hole.
As a further aspect of the present invention: the thermoplastic resin plate is provided with a conductive circuit layer and a gold-plated layer located on one side, far away from the thermoplastic resin plate, of the conductive circuit layer, and the wire penetrating hole is connected with the two conductive circuit layers on the two thermoplastic resin plates.
As a further aspect of the present invention: the mounting frame comprises two side plates which are oppositely arranged and positioned at two sides of the n thermoplastic resin plates, and the end parts of the thermoplastic resin plates are inserted into insertion grooves formed in the side plates and are fixed through clamping pieces;
the two side plates are fixed through a fixing frame detachably connected with the side plates.
As a further aspect of the present invention: the clamping piece comprises two clamping plates, the clamping plates are fixed with the upper wall or the lower wall of the inserting groove through a plurality of elastic pieces, and when the thermoplastic resin plate is inserted between the two clamping plates, the elastic pieces are elastically deformed.
As a further aspect of the present invention: a sliding block is fixed on one side of the mounting piece facing the side plate and is slidably mounted in a sliding groove formed in the side plate;
the slider is the setting of class "T" type structure, just the shape of spout with the slider adaptation.
As a further aspect of the present invention: the elastic clamping pin assembly comprises a clamping pin, one end of the clamping pin extends into the mounting hole, and the other end of the clamping pin penetrates through the through groove and is in clamping fit with the clamping groove;
still include the spring, the spring is arranged in the interior caulking groove that sets up on the installed part, just the both ends of spring respectively with fix extension on the bayonet lock reaches the inner wall butt in the caulking groove.
As a further aspect of the present invention: one end of the clamping pin extending into the mounting hole is provided with an inclined surface, and the inclined surface faces the direction in which the fixing piece is inserted into the mounting hole.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model relates to a novelty, through separating a plurality of thermoplastic resin boards and setting up, in order to form heat dissipation channel, thereby make the circuit board can ensure that the air flows when using, in order to realize the effective heat dissipation to the circuit board, prevent that the high problem that leads to the resistance value to increase of components and parts temperature such as resistance from taking place, the effectual high electric conductive property that has realized, can realize accepting fixedly to a plurality of thermoplastic resin boards through the curb plate that sets up, prevent that high density circuit board from perk the foot condition and taking place, and can make things convenient for the fixed of circuit board, can not cause the damage to the circuit board when fixed.
Drawings
Fig. 1 is a schematic structural diagram of a high-density circuit board with high conductivity;
FIG. 2 is a half-sectional view of a high-conductivity, high-density circuit board;
FIG. 3 is a schematic structural diagram of a side plate of a high-conductivity high-density circuit board;
FIG. 4 is a schematic diagram of a mounting member of a high-conductivity high-density printed circuit board;
FIG. 5 is a half-sectional view of a mounting member in a high-density circuit board having high electrical conductivity;
in the figure: the spring comprises a thermoplastic resin plate 1, a gold-plated layer 2, a conductive circuit layer 3, a wire passing hole 4, a side plate 5, a rubber column 6, a telescopic pipe 7, a clamping plate 8, an inserting groove 9, an elastic part 10, a sliding groove 11, a clamping groove 12, a fixing frame 13, an installing part 14, a sliding block 15, a through groove 16, a clamping pin 17, an embedded groove 18 and a spring 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
In addition, an element of the present invention may be said to be "secured to" or "disposed on" another element, either directly on the other element or with intervening elements present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1 and 2, in an embodiment of the present invention, a high-density circuit board with high electrical conductivity includes: the circuit board comprises n thermoplastic resin boards 1, wherein a conductive circuit layer 3 and a gold plating layer 2 located on one side, far away from the thermoplastic resin boards 1, of the conductive circuit layer 3 are arranged on the thermoplastic resin boards 1, and the gold plating layer 2 is formed on the conductive circuit layer 3 to protect the conductive circuit layer 3.
Adjacent two connect through at least four rubber columns 6 between the thermoplastic resin board 1 to form heat dissipation channel between two adjacent thermoplastic resin boards 1, thereby make the circuit board can ensure that the air flows when using, with the realization to the effective heat dissipation of circuit board, prevent that components and parts such as resistance temperature height from resulting in the problem of resistance value increase to take place, the effectual high electric conductive property that has realized.
Wherein, it should be noted that, the setting of rubber column 6 can realize that two adjacent thermoplastic resin boards 1 support, and when taking place to rock, rubber column 6 can produce elastic deformation simultaneously, and effectual protection to the circuit board, simultaneously in order to ensure the elastic action of rubber column 6, the diameter of rubber column 6 is from middle to both sides grow gradually.
Further, at least two wire passing holes 4 for passing a conducting wire are formed in the thermoplastic resin plates 1, the conducting wire passing hole 4 is connected with the two conducting circuit layers 3 on the two thermoplastic resin plates 1, a telescopic pipe 7 is installed between every two adjacent thermoplastic resin plates 1, and the telescopic pipe 7 is communicated with the two wire passing holes 4 on the two thermoplastic resin plates 1 which are coaxially arranged.
The extension tube 7 can effectively protect the conducting wire, and meanwhile, the buffer motion of two adjacent thermoplastic resin plates 1 is not influenced, and it should be noted that a through hole for the conducting wire to penetrate through is formed in the position where the extension tube 7 is connected with the upper end face of one thermoplastic resin plate 1, so that the conducting wire can be connected with the conducting circuit layer 3.
High-density type circuit board that electric conductive property is high still including being used for n the thermoplastic resin board 1 carries out the mounting bracket that supports, slidable mounting has two at least installed parts 14 on the mounting bracket, be provided with the mounting hole that is used for the mounting part to run through on the installed part 14, still be provided with the elasticity bayonet lock subassembly on the installed part 14, elasticity bayonet lock subassembly is in with the setting a plurality of draw-in grooves 12 adaptations on the mounting bracket, and the one end of elasticity bayonet lock subassembly runs through installed part 14 and stretches into in the mounting hole, can realize the fixed of mounting bracket through the installed part 14 that sets up, and then realize the installation of circuit board, need not to punch on the circuit board, the effectual circuit board that has prevented when the installation can not cause the problem of damage because of the fix with screw to the circuit board and take place.
Further, please refer to fig. 3, the mounting bracket includes two side plates 5 disposed oppositely and located at two sides of the n thermoplastic resin plates 1, the end portions of the thermoplastic resin plates 1 are inserted into insertion slots 9 formed in the side plates 5 and fixed by clamping members, the clamping members include two clamping plates 8, the clamping plates 8 are fixed to the upper wall or the lower wall of the insertion slots 9 by a plurality of elastic members 10, and when the thermoplastic resin plates 1 are inserted between the two clamping plates 8, the elastic members 10 are elastically deformed.
It can be understood that inserting through the setting puts groove 9 and can realize preventing of thermoplastic resin board 1, realize being connected of curb plate 5 and thermoplastic resin board 1, need not to adopt other mountings to fix, simple to operate, and convenient the dismantlement, easily follow-up maintenance etc. when needs are installed, insert the tip of thermoplastic resin board 1 and put between two splint 8, splint 8 can extrude elastic component 10, make elastic component 10 take place deformation, thereby elastic component 10 counteracts at splint 8, the realization is fixed to the centre gripping of thermoplastic resin board 1.
Preferably, an end of the clamping plate 8 remote from the side plate 5 is provided with an inclined portion so as to facilitate insertion and placement of the thermoplastic resin plate 1.
In order to fix the two side plates 5, the high-density circuit board with high conductivity further comprises at least two fixing frames 13, two ends of each fixing frame 13 are detachably mounted on the two side plates 5, specifically, the fixing pieces 13 can be connected with the side plates 5 in a bolt fixing mode, and of course, other detachable mounting structures can be adopted, so long as the mounting requirements are met, and the application is not specifically limited to this.
Still further, referring to fig. 1 and 4, a sliding block 15 is fixed on one side of the mounting member 14 facing the side plate 5, and the sliding block 15 is slidably mounted in a sliding slot 11 provided on the side plate 5; the sliding block 15 is arranged in a T-like structure, and the sliding groove 11 is matched with the sliding block 15 in shape.
Through the sliding fit of the arranged slide block 15 and the sliding groove 11, the installation part 14 can be stably moved on the side plate 5, and the use is convenient.
In order to improve the integrity of the present invention, please refer to fig. 5, the present invention further defines the resilient latch assembly as follows: the elastic clamping pin assembly comprises a clamping pin 17, one end of the clamping pin 17 extends into the mounting hole, and the other end of the clamping pin 17 penetrates through the through groove 16 and is in clamping fit with the clamping groove 12; the spring 19 is arranged in an embedded groove 18 formed in the mounting part 14, and two ends of the spring 19 are respectively abutted against an extending part fixed on the bayonet 17 and the inner wall of the embedded groove 18.
Under the state of not installing, bayonet lock 17 is under spring 19's effect, one end is inserted in the mounting hole, the other end breaks away from draw-in groove 12, at this moment, installed part 14 can freely move, when having put the mounting in the mounting hole, the mounting will extrude bayonet lock 17 and remove, make bayonet lock 17 card put in the draw-in groove 12 of current installed part 14 position, realize the fixed of installed part 14 relative curb plate 5, also when using, move installed part 14 to the fixed orifices on accepting the thing, only need to realize the rigidity of curb plate 5 through the mounting is fixed, it is fixed to need not manual regulation, therefore, the clothes hanger is strong in practicability.
Preferably, one end of the bayonet lock 17 extending into the mounting hole is provided with an inclined surface, the inclined surface faces the direction that the fixing piece is inserted into the mounting hole, and the fixing piece can be conveniently extruded by the bayonet lock 17 to move through the arranged inclined surface.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A high-density circuit board with high conductivity is characterized by comprising:
the heat dissipation device comprises n thermoplastic resin plates (1), wherein two adjacent thermoplastic resin plates (1) are connected through at least four rubber columns (6) so that a heat dissipation channel is formed between the two adjacent thermoplastic resin plates (1);
the thermoplastic resin plates (1) are provided with at least two wire passing holes (4) for leading wires to pass through, a telescopic pipe (7) is arranged between every two adjacent thermoplastic resin plates (1), and the telescopic pipe (7) is communicated with the two wire passing holes (4) on the two thermoplastic resin plates (1) which are coaxially arranged;
still include the mounting bracket, the mounting bracket is used for n thermoplastic resin board (1) supports, slidable mounting has two at least installed parts (14) on the mounting bracket, be provided with the mounting hole that is used for the mounting to run through on installed part (14), still be provided with the resilient bayonet lock subassembly on installed part (14), the resilient bayonet lock subassembly with set up a plurality of draw-in grooves (12) adaptation on the mounting bracket, and the one end of resilient bayonet lock subassembly runs through installed part (14) and stretches into in the mounting hole.
2. The high-density circuit board with high conductivity according to claim 1, wherein the thermoplastic resin board (1) is provided with a conductive circuit layer (3) and a gold-plated layer (2) on one side of the conductive circuit layer (3) far away from the thermoplastic resin board (1), and the lead penetrates through the wire through hole (4) to connect the two conductive circuit layers (3) on the two thermoplastic resin boards (1).
3. The high-conductivity high-density circuit board as claimed in claim 1, wherein the mounting frame comprises two side plates (5) which are oppositely arranged and located at two sides of the n thermoplastic resin plates (1), and the end parts of the thermoplastic resin plates (1) are inserted into insertion grooves (9) formed in the side plates (5) and fixed by clamping members;
the two side plates (5) are fixed through a fixing frame (13) detachably connected with the side plates.
4. A highly conductive high-density circuit board as claimed in claim 3, wherein said holding member comprises two holding plates (8), said holding plates (8) are each fixed to the upper or lower wall of said insertion groove (9) by a plurality of elastic members (10), and said elastic members (10) are elastically deformed when said thermoplastic resin plate (1) is inserted between said two holding plates (8).
5. A highly conductive and dense circuit board as claimed in claim 3, wherein a slider (15) is fixed to the side of the mounting member (14) facing the side plate (5), and the slider (15) is slidably mounted in a sliding slot (11) provided in the side plate (5);
the sliding block (15) is arranged in a T-shaped structure, and the sliding groove (11) is matched with the sliding block (15) in shape.
6. The high-conductivity high-density circuit board as claimed in claim 3, wherein the elastic bayonet lock assembly comprises a bayonet lock (17) with one end extending into the mounting hole, and the other end of the bayonet lock (17) penetrates through the through groove (16) on the mounting part (14) and is in clamping fit with the bayonet lock (12);
still include spring (19), spring (19) are arranged in interior caulking groove (18) that set up on installed part (14), just the both ends of spring (19) respectively with fix extension on bayonet lock (17) and the inner wall butt of interior caulking groove (18).
7. The high-density circuit board with high conductivity as claimed in claim 6, wherein one end of the bayonet lock (17) extending into the mounting hole is provided with an inclined surface, and the inclined surface faces to the direction of inserting the fixing piece into the mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123398166.8U CN217216993U (en) | 2021-12-30 | 2021-12-30 | High-density circuit board with high conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123398166.8U CN217216993U (en) | 2021-12-30 | 2021-12-30 | High-density circuit board with high conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217216993U true CN217216993U (en) | 2022-08-16 |
Family
ID=82787588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123398166.8U Active CN217216993U (en) | 2021-12-30 | 2021-12-30 | High-density circuit board with high conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217216993U (en) |
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2021
- 2021-12-30 CN CN202123398166.8U patent/CN217216993U/en active Active
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