CN217216991U - Fixing device of chip radiator - Google Patents
Fixing device of chip radiator Download PDFInfo
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- CN217216991U CN217216991U CN202123305953.3U CN202123305953U CN217216991U CN 217216991 U CN217216991 U CN 217216991U CN 202123305953 U CN202123305953 U CN 202123305953U CN 217216991 U CN217216991 U CN 217216991U
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- fastener
- radiator
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Abstract
The utility model discloses a fixing device of a chip radiator, relating to the technical field of electronics; in the fixing device of the chip radiator, the radiator is arranged above the front surface of the PCB; the at least one first fastener is provided with a first head, the first fastener penetrates through the PCB, the first head of the first fastener is positioned on the back of the PCB, and one end, far away from the first head, of the first fastener is arranged on one side, close to the radiator; the at least one second fastener is provided with a second head, the second fasteners and the first fasteners are arranged in a one-to-one correspondence mode, the second heads of the second fasteners are located on the other side, away from the first fasteners, of the radiator, and one end, away from the second heads, of the second fasteners sequentially penetrates through the radiator and the mounting holes of the first fasteners so that the radiator can be fixed on the PCB. The arrangement mode enables the structure to be more compact, the connection between the chip and the radiator to be more reliable, and the improvement of the heat radiation effect of the radiator is facilitated.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a fixing device of chip radiator.
Background
On a PCB of an electronic product such as a notebook computer, a tablet computer, etc., a stud is usually mounted to fix a position of a heat sink. In the prior art, the patch stud is directly fixed on the PCB in a welding mode, and the torsion borne by the patch stud is small, so that when the radiator is assembled or disassembled in a factory, the patch stud is easy to fall off in the screw screwing process, a gap is formed between the radiator and a chip, the radiating effect of the chip is reduced, and the performance of the chip is influenced or even the chip is burnt out.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a fixing device of chip radiator makes the structure compacter, connects reliably and help the radiator to improve the radiating effect.
According to the utility model discloses fixing device of chip radiator, it includes:
a PCB board;
the radiator is arranged above the front surface of the PCB;
the first fastener is provided with a first head, the first fastener penetrates through the PCB, the first head of the first fastener is positioned on the back face of the PCB, and one end, far away from the first head, of the first fastener is arranged on one side, close to the radiator;
at least one second fastener, have the second head, the second fastener with first fastener one-to-one sets up, the one end of first fastener seted up with the mounting hole that the second fastener is corresponding, the second head of second fastener is located the radiator is kept away from the opposite side of first fastener, the one end that the second fastener was kept away from the second head is worn to locate in proper order the radiator with the mounting hole, in order with the radiator is fixed on the PCB board.
According to the utility model discloses fixing device of chip radiator has following beneficial effect at least: the first fastener penetrates through the PCB, a first head of the first fastener is positioned on the back of the PCB, and one end, far away from the first head, of the first fastener is arranged on one side, close to the radiator; the second head of the second fastener is positioned on the other side of the radiator far away from the first fastener, and one end of the second fastener far away from the second head sequentially penetrates through the radiator and the mounting holes of the first fastener so as to fix the radiator on the PCB. The arrangement mode of the fixing device of the chip radiator enables the structure to be more compact, the connection between the chip and the radiator to be more reliable, and the improvement of the radiating effect of the radiator is facilitated.
According to some embodiments of the present invention, the fixing device of the chip heat sink further comprises a chip, wherein the chip is disposed between the PCB board and the heat sink.
According to some embodiments of the invention, the diameter of the first head is greater than the diameter of the one end of the first fastener.
According to some embodiments of the invention, the diameter of the second head is greater than the diameter of the one end of the second fastener.
According to some embodiments of the present invention, the first fastener is provided with a gap between the first head and the back of the PCB, the gap is used for the first fastener the first head with the back welding of the PCB.
According to some embodiments of the invention, the height of the first fastener is 3.7 mm.
According to some embodiments of the invention, the first fastener is a bolt.
According to some embodiments of the invention, the second fastener is a screw or a screw.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The accompanying drawings are included to provide a further understanding of the technical aspects of the present invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention, and together with the description, serve to explain the technical aspects of the present invention and not to limit the technical aspects of the present invention.
Fig. 1 is a cross-sectional view of a fixing device for a chip heat sink according to an embodiment of the present invention.
Reference numerals:
a fixing device 100 of a chip heat sink;
PCB 110, heat sink 120, chip 130, first fastener 140, second fastener 150.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, and may be, for example, a fixed connection or a movable connection, a detachable connection or a non-detachable connection, or an integral connection; may be mechanically, electrically or otherwise in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other elements or indirectly connected through one or more other elements or in an interactive relationship between two elements.
In the description of the present invention, unless otherwise explicitly defined, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and for those of ordinary skill in the art, the specific meaning of the above terms in the present invention can be understood in a specific situation.
On a PCB of an electronic product such as a notebook computer or a tablet pc, a stud is usually used to fix a position of a heat sink. In the prior art, the patch stud is directly fixed on the PCB in a welding mode, and the torsion borne by the patch stud is small, so that when the radiator is assembled or disassembled in a factory, the patch stud is easy to fall off in the screw screwing process, a gap is formed between the radiator and a chip, the radiating effect of the chip is reduced, and the performance of the chip is influenced or even the chip is burnt out.
Therefore, the utility model provides a fixing device 100 of chip radiator makes the structure compacter, connects reliably and helps radiator 120 to improve the radiating effect.
A fixing device 100 for a chip heat sink according to an embodiment of the present invention is described below with reference to fig. 1.
Referring to fig. 1, a fixing apparatus 100 of a chip heat sink includes: the heat sink includes a PCB 110, a heat sink 120, at least one first fastener 140, and at least one second fastener 150, the heat sink 120 being disposed over a front surface of the PCB 110; at least one first fastening member 140 having a first head, the first fastening member 140 being disposed through the PCB 110, the first head of the first fastening member 140 being located on the back of the PCB 110, one end of the first fastening member 140 away from the first head being disposed near one side of the heat sink 120; at least one second fastening member 150 has a second head portion, the second fastening members 150 are disposed in one-to-one correspondence with the first fastening members 140, one end of the first fastening member 140 is provided with a mounting hole corresponding to the second fastening member 150, the second head portion of the second fastening member 150 is located at the other side of the heat sink 120 away from the first fastening member 140, and one end of the second fastening member 150 away from the second head portion sequentially penetrates through the heat sink 120 and the mounting hole to fix the heat sink 120 on the PCB 110. The fixing device 100 for the chip heat sink has a more compact structure, and the chip 130 and the heat sink 120 are more reliably connected, which helps to improve the heat dissipation effect of the heat sink 120.
In this embodiment, the fixing device 100 for a chip heat sink includes two first fastening members 140, the two first fastening members 140 are disposed through the PCB 110, first heads of the two first fastening members 140 are disposed on a back surface of the PCB 110, ends of the two first fastening members 140 far away from the first heads are disposed in abutment with one side of the heat sink 120, and the two first fastening members 140 are disposed at different positions of the PCB 110 respectively; the two first fastening pieces 140 are respectively and correspondingly provided with a second fastening piece 150, one end of each of the two first fastening pieces 140 is provided with a mounting hole corresponding to the second fastening piece 150, the second head portions of the two second fastening pieces 150 are respectively located on the other side of the heat sink 120 away from the corresponding first fastening piece 140, and one end of each of the two second fastening pieces 150 away from the second head portions sequentially penetrates through the heat sink 120 and the mounting hole corresponding thereto so as to fix the heat sink 120 on the PCB 110. In the fixing apparatus 100 for a chip heat sink, the number of the first fastening members 140 may be other, and is not limited to this embodiment.
Referring to fig. 1, it can be understood that the fixing device 100 of the chip heat sink further includes a chip 130, and the chip 130 is disposed between the PCB 110 and the heat sink 120. The chip 130 is disposed between the PCB 110 and the heat sink 120, so that the connection between the chip 130 and the heat sink 120 is more reliable, which is helpful for improving the heat dissipation effect of the heat sink 120.
In the present embodiment, specifically, the chip 130 is disposed on the PCB 110, and the heat sink 120 is disposed on the chip 130 and on the convex portion of the chip 130.
It should be noted that, in this embodiment, the chip 130 is a CPU, and this fixing device of the CPU heat sink makes the connection between the heat sink 120 and the CPU more reliable, which is helpful to improve the heat dissipation effect of the CPU heat sink 120.
It will be appreciated that the diameter of the first head is greater than the diameter of one end of the first fastener 140. The first head is disposed in such a manner that the second fastening member 150 is more closely attached to the heat sink 120 by the pulling force of the first head of the first fastening member 140, and the first fastening member 140 is prevented from falling off.
It will be appreciated that the diameter of the second head is greater than the diameter of one end of the second fastener 150. The arrangement mode of the second head part enables the first fastening piece 140 to be more tightly attached to the heat sink 120 due to the pulling force of the second head part in the second fastening piece 150, so that the structure is more compact and the connection is reliable.
Referring to fig. 1, it can be understood that a gap is provided between the head of the first fastening member 140 and the back surface of the PCB 110, and the gap is used for welding the first head of the first fastening member 140 to the back surface of the PCB 110. The use of solder in the gap allows the first head of the first fastener 140 to be soldered to the back surface of the PCB 110, which makes the connection between the first fastener 140 and the PCB 110 more reliable.
It can be appreciated that the height of the first fastener 140 is 3.7 mm. The first fastening member 140 with a height of 3.7mm, minus the thickness of the PCB, has a substantial height of the first fastening member 140 protruding from the front surface of the PCB, which is equal to the height of the chip 130, so that the end of the first fastening member 140 away from the first head portion abuts against one side of the heat sink 120, and the connection between the chip 130 and the PCB 110, the heat sink 120 is more reliable.
In the present embodiment, the height of the first fastening member 140 is 3.7mm, minus the thickness of the PCB of 1.6mm, and the actual height of the first fastening member 140 protruding from the front surface of the PCB is 2.1 mm.
It is understood that the first fastener 140 is a bolt.
It should be noted that, one end of the bolt is provided with a mounting hole corresponding to the second fastening member 150, and one end of the second fastening member 150, which is far away from the second head portion, sequentially penetrates through the heat sink 120 and the mounting hole, so as to fix the heat sink 120 on the PCB 110.
It is understood that the second fastener 150 is a screw or bolt.
In this embodiment, the second fastening member 150 is a screw, one end of the first fastening member 140 is provided with a mounting hole corresponding to the screw, and one end of the screw away from the second head portion is sequentially disposed through the heat sink 120 and the mounting hole.
It should be noted that the second fastening member 150 may be a screw or a screw, or another fastening member that can make the connection between the chip 130 and the heat sink 120 more reliable, and one end of the first fastening member 140 is provided with a mounting hole corresponding to the screw or another fastening member that can make the connection between the chip 130 and the heat sink 120 more reliable, which is not limited to the embodiment of the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the principle of the present invention, several improvements and decorations can be made, which are also considered as the protection scope of the present invention.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. A fixing device of a chip radiator is characterized by comprising:
a PCB board;
the radiator is arranged above the front side of the PCB;
the first fastener is provided with a first head and is arranged on the PCB in a penetrating mode, the first head of the first fastener is located on the back face of the PCB, and one end, far away from the first head, of the first fastener is arranged on one side, close to the radiator;
at least one second fastener, have the second head, the second fastener with first fastener one-to-one sets up, the one end of first fastener seted up with the mounting hole that the second fastener is corresponding, the second head of second fastener is located the radiator is kept away from the opposite side of first fastener, the one end that the second fastener was kept away from the second head is worn to locate in proper order the radiator with the mounting hole, in order with the radiator is fixed on the PCB board.
2. The apparatus of claim 1, further comprising a chip disposed between the PCB and the heat spreader.
3. The die heat spreader fixture of claim 1, wherein the first head portion has a diameter greater than a diameter of the one end of the first fastener.
4. The die heat spreader fixture of claim 1, wherein the second head portion has a diameter greater than a diameter of the one end of the second fastener.
5. The apparatus as claimed in claim 1, wherein a gap is formed between the first head of the first fastener and the back surface of the PCB, and the gap is used for soldering the first head of the first fastener and the back surface of the PCB.
6. The apparatus of claim 1, wherein the first fastener has a height of 3.7 mm.
7. The apparatus as claimed in any one of claims 1 to 6, wherein the first fastener is a bolt.
8. The apparatus as claimed in any one of claims 1 or 6, wherein the second fastener is a screw or a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123305953.3U CN217216991U (en) | 2021-12-24 | 2021-12-24 | Fixing device of chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123305953.3U CN217216991U (en) | 2021-12-24 | 2021-12-24 | Fixing device of chip radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217216991U true CN217216991U (en) | 2022-08-16 |
Family
ID=82784793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123305953.3U Active CN217216991U (en) | 2021-12-24 | 2021-12-24 | Fixing device of chip radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217216991U (en) |
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2021
- 2021-12-24 CN CN202123305953.3U patent/CN217216991U/en active Active
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