CN217214644U

CN217214644U - Semiconductor device with a plurality of semiconductor chips

Info

Publication number: CN217214644U
Application number: CN202122960847.2U
Authority: CN
Inventors: 张肖雷
Original assignee: Yangtze Memory Technologies Co Ltd
Current assignee: Yangtze Memory Technologies Co Ltd
Priority date: 2021-11-26
Filing date: 2021-11-26
Publication date: 2022-08-16
Anticipated expiration: 2031-11-26

Abstract

The embodiment of the application discloses semiconductor equipment, semiconductor equipment include the wafer box, snatch mechanism and detection module. The wafer box is provided with an accommodating space for accommodating wafers, the wafer box comprises a plurality of bearing pieces which are positioned in the accommodating space and arranged at intervals along a preset direction, each bearing piece is used for bearing one wafer, the grabbing mechanism is used for grabbing the wafers placed on the bearing pieces and transferring the wafers to a preset position, the detection module is arranged on the wafer box and used for detecting the wafers placed on the bearing pieces and outputting detection signals, and the detection signals are used for indicating whether the wafers are on the bearing pieces or not. Through the design, the phenomenon that all wafers in the wafer box are broken due to collision between the wafers on the grabbing mechanism and the wafers in the wafer box can be effectively avoided.

Description

Semiconductor device with a plurality of semiconductor chips

Technical Field

The application relates to the technical field of semiconductor processing, in particular to a semiconductor device.

Background

During semiconductor processing, wafers are transferred between different tools to perform different processes on the wafers.

Before the grabbing mechanism grabs the wafer placed in the wafer box, the grabbing mechanism firstly carries out one-time scanning operation on the wafer placed in the wafer box through the detection module arranged on the grabbing mechanism to judge whether the positions and the number of the wafers placed in the wafer box are consistent with those of the wafers recorded in a control system of the semiconductor equipment or not, and after the grabbing mechanism finishes the scanning action, the wafers are grabbed from the wafer box and transferred to a processing machine table of the next process.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a semiconductor device, which can effectively avoid the phenomenon that all wafers in a wafer box are broken due to the fact that the wafers on a grabbing mechanism collide with the wafers in the wafer box.

In a first aspect, embodiments of the present application provide a semiconductor device; the semiconductor device comprises a wafer box, a grabbing mechanism and a detection module, wherein the wafer box is provided with an accommodating space for accommodating wafers, the wafer box comprises a plurality of bearing pieces which are positioned in the accommodating space and arranged at intervals along a preset direction, each bearing piece is used for bearing one wafer, the grabbing mechanism is used for grabbing the wafers placed on the bearing pieces and transferring the wafers to a preset position, the detection module is arranged on the wafer box and used for detecting the wafers placed on the bearing pieces and outputting detection signals, and the detection signals are used for indicating whether the wafers are on the bearing pieces or not.

According to the semiconductor equipment, the wafer is placed on the bearing piece in the containing space of the wafer box, before the grabbing mechanism grabs the wafer, the position and the number of the wafer in the wafer box are detected through the detection module arranged on the wafer box, a detection signal is output to the control system of the semiconductor equipment according to the detection result, and if the position and the number of the wafer indicated by the detection signal are the same as those recorded in the control system of the semiconductor equipment, the grabbing mechanism grabs the wafer in the wafer box and transfers the wafer to the preset position; in the related art, the detection module is arranged on the grabbing mechanism, before the grabbing mechanism grabs the wafers, the grabbing mechanism moves to the position close to the wafers in the wafer box and scans the wafers in the wafer box one by one to judge whether the positions and the number of the wafers in the wafer box are consistent with those of the wafers recorded in the control system of the semiconductor equipment, when the grabbing mechanism fails to transfer the last wafer grabbed from the wafer box to a preset position, the last wafer is taken to be close to the wafers in the wafer box for detection, the last wafer left on the grabbing mechanism collides with all the wafers in the wafer box in the scanning process of the grabbing mechanism to cause damage to all the wafers in the wafer box, compared with the related art, the design arranges the detection module on the wafer box, before the grabbing mechanism grabs the wafer, the grabbing mechanism does not need to be moved to the position close to the wafer placed in the wafer box and the wafer placed in the wafer box is scanned one by one, so that the positions and the number of the wafers in the wafer box can be detected, the phenomenon that the last wafer left on the grabbing mechanism collides with all the wafers in the wafer box due to faults of the grabbing mechanism is effectively avoided, all the wafers in the wafer box are broken, meanwhile, the positions and the number of the wafers in the wafer box can be detected without moving the grabbing mechanism to the position close to the wafer placed in the wafer box, the detection efficiency of the detection module for detecting the wafers in the wafer box is improved, the grabbing efficiency of the grabbing mechanism for grabbing the wafers is improved, and the processing efficiency of semiconductor equipment is improved.

In some embodiments, the detection module includes a plurality of emitting ends and a plurality of receiving ends, the emitting ends are disposed on the plurality of supporting members in a one-to-one correspondence, each emitting end is configured to emit an electrical signal, the receiving ends are disposed on the plurality of supporting members in a one-to-one correspondence, each receiving end is configured to receive the electrical signal reflected by the wafer, and output a detection signal according to the electrical signal reflected by the wafer.

Based on the above embodiment, by disposing the plurality of emitting ends on the plurality of carrier elements in a one-to-one correspondence manner and disposing the plurality of receiving ends on the plurality of carrier elements in a one-to-one correspondence manner, each carrier element in the wafer cassette is provided with an emitting end and a receiving end, each emitting end is used for emitting an electrical signal, each receiving end is used for receiving the electrical signal reflected by the wafer, and outputs a detection signal according to the electrical signal reflected by the wafer, each carrier element is provided with an emitting end for emitting the electrical signal to the wafer on the carrier element and a receiving end for receiving the electrical signal reflected by the wafer on the carrier element and outputting the detection signal, the emitting end and the receiving end on each carrier element can independently complete the detection of the wafer on the carrier element, thereby reducing the difficulty of the detection device in detecting the plurality of wafers, and at the same time, the transmitting end and the receiving end which are positioned on different bearing parts can simultaneously detect the wafers which are placed on different bearing parts, so that the detection efficiency of the detection module for detecting the wafers in the wafer box is further improved, and the processing efficiency of the semiconductor equipment is further improved.

In some embodiments, the wafer cassette includes a first inner wall surface enclosing an accommodation space and a second inner wall surface connecting a periphery of the first inner wall surface, each receiving end includes a first sub-receiving end and a second sub-receiving end, the first sub-receiving end and the second sub-receiving end are respectively located at two sides of the corresponding transmitting end, and the first sub-receiving end, the transmitting end and the second sub-receiving end are arranged along a first direction, wherein the first direction intersects with the first inner wall surface.

Based on the above embodiment, through the design of the first sub-receiving end and the second sub-receiving end, the area for receiving the electric signals reflected by the wafer on the detection module is increased, so that more electric signals reflected by the wafer can be received by the first sub-receiving end and the second sub-receiving end, and the accuracy and reliability of the detection result of the detection module are improved.

In some of these embodiments, the first direction is perpendicular to the first interior wall surface.

Based on the embodiment, the first direction is perpendicular to the first inner wall surface, so that the arrangement directions of the first sub-receiving end, the transmitting end and the second sub-receiving end are perpendicular to the first inner wall surface, more electric signals transmitted by the transmitting end can be projected onto the wafer, more electric signals reflected by the wafer can be projected by the first sub-receiving end and the second sub-receiving end, and the accuracy and the reliability of the detection result of the detection module are further improved.

In some embodiments, the detection module includes an emitting end and a plurality of receiving ends, the emitting end is connected to the wafer cassette and can move along a predetermined direction, the emitting end is used for emitting electrical signals, the plurality of receiving ends are disposed on the plurality of carriers in a one-to-one correspondence, and each receiving end is used for receiving the electrical signals reflected by the wafer and outputting the detection signals according to the electrical signals reflected by the wafer.

Based on the above embodiment, a plurality of receiving terminals are correspondingly arranged on a plurality of bearing pieces one by one, and one transmitting terminal is designed to be connected with the wafer cassette and can move along a preset direction, when the position and the number of wafers in the wafer cassette need to be detected, the transmitting terminal moves along the preset direction to transmit an electric signal to each wafer on each bearing piece one by one, the electric signal transmitted by the transmitting terminal is received by the receiving terminal on the bearing piece after being reflected by the wafer on the corresponding bearing piece, and the receiving terminal on the bearing piece outputs a detection signal to a control system of a semiconductor device according to the electric signal reflected by the wafer to judge whether the wafer exists on the bearing piece, so that the detection of the position and the number of the wafers in the wafer cassette by the detection device is realized; in addition, one transmitting end is designed to be connected with the wafer box and can move along the preset direction, so that the number of the transmitting ends is reduced while the position and the number of wafers in the wafer box are effectively detected by the detection module, the cost of the detection module is reduced, and the cost of the semiconductor equipment is reduced.

In some embodiments, the detection module includes a plurality of emission ends and a receiving end, the emission ends are disposed on the plurality of carriers in a one-to-one correspondence, each emission end is used for emitting an electrical signal, the receiving end is connected to the wafer cassette and can move along a predetermined direction, and the receiving end is used for receiving the electrical signal reflected by the wafer and outputting a detection signal according to the electrical signal reflected by the wafer.

Based on the above embodiment, a plurality of emission ends are correspondingly arranged on a plurality of bearing pieces one by one, and a receiving end is designed to be connected with a wafer box and can move along a preset direction, when the position and the number of wafers in the wafer box need to be detected, each emission end emits an electric signal to each wafer on each corresponding bearing piece, the receiving end moves along the preset direction and receives the electric signals emitted from the emission ends on each bearing piece to the wafers on the bearing piece and reflected by the wafers on the bearing piece one by one, and the receiving end outputs corresponding detection signals to a control system of a semiconductor device one by one according to the electric signals reflected by the wafers on each bearing piece so as to judge whether the wafers exist on the bearing piece, thereby realizing that the detection device detects the position and the number of the wafers in the wafer box; in addition, one receiving end is designed to be connected with the wafer box and can move along the preset direction, so that the number of the receiving ends is reduced while the position and the number of wafers in the wafer box are effectively detected by the detection module, the cost of the detection module is reduced, and the cost of the semiconductor equipment is reduced.

In some embodiments, the detection module includes a transmitting end and a receiving end, the transmitting end is connected to the wafer cassette and can move along a predetermined direction, the transmitting end is configured to transmit an electrical signal, the receiving end is connected to the wafer cassette and can move synchronously with the transmitting end along the predetermined direction, and the receiving end is configured to receive the electrical signal reflected by the wafer and output a detection signal according to the electrical signal reflected by the wafer.

Based on the above embodiment, by designing one transmitting terminal to be connected to the wafer box and to be movable in the predetermined direction, and one receiving terminal to be connected to the wafer box and the transmitting terminal and to be movable in synchronization with the transmitting terminal in the predetermined direction, when the position and the number of the wafers in the wafer box need to be detected, the transmitting end and the receiving end move along the preset direction together, the transmitting end transmits electric signals to the wafers on each bearing piece one by one, meanwhile, the receiving end receives the electric signals which are emitted from the emitting end on each bearing piece to the wafer on the bearing piece and reflected by the wafer one by one, the receiving end outputs detection signals to the control system of the semiconductor equipment according to the electric signals reflected by the wafer on each bearing piece, whether the wafer exists at the position is judged, so that the detection of the position and the number of the wafers in the wafer box by the detection equipment is realized; in addition, the transmitting end and the receiving end are designed to move along the preset direction, so that the number of the transmitting end and the receiving end is further reduced while the position and the number of the wafers in the wafer box are effectively detected by the detection module, the cost of the detection module is further reduced, and the cost of the semiconductor equipment is further reduced.

In some embodiments, the wafer includes two end faces disposed opposite to each other and a side face connecting the two end faces, and the transmitting end is disposed corresponding to the side face of the wafer, so that the electrical signal transmitted by the transmitting end is reflected by the side face of the wafer and then received by the receiving end.

Based on the embodiment, the transmitting end is arranged corresponding to the side face of the wafer, so that the electric signal transmitted to the wafer by the transmitting end can be effectively reflected to the receiving end by the side face of the wafer, and the accuracy and reliability of the detection result of the detection module are improved.

In some embodiments, the detection module is detachably connected with the wafer cassette via a connector.

Based on the embodiment, through the design of the connecting piece, the detachable connection between the detection module and the wafer box is realized, so that the damaged detection module can be detached and replaced conveniently.

In some embodiments, the gripping mechanism includes a robot arm and a suction nozzle, the suction nozzle is disposed on the robot arm, and the suction nozzle grips and picks the wafer placed on the carrier by vacuum suction.

Based on the embodiment, when the grabbing mechanism needs to grab the wafer, the suction nozzle on the mechanical arm is close to the surface of the wafer, the wafer is adsorbed in a vacuum adsorption mode, the wafer adsorbed by the suction nozzle is transferred to the preset position through the movement of the mechanical arm, and the difficulty of grabbing the wafer and transferring the wafer by the grabbing mechanism is reduced through the design of the mechanical arm and the suction nozzle.

According to the semiconductor equipment, the wafer is placed on the bearing piece in the containing space of the wafer box, before the grabbing mechanism grabs the wafer, the position and the number of the wafer in the wafer box are detected through the detection module arranged on the wafer box, a detection signal is output to the control system of the semiconductor equipment according to the detection result, and if the position and the number of the wafer indicated by the detection signal are the same as those recorded in the control system of the semiconductor equipment, the grabbing mechanism grabs the wafer in the wafer box and transfers the wafer to the preset position; in the related technology, the detection module is arranged on the grabbing mechanism, before the grabbing mechanism grabs the wafers, the grabbing mechanism moves to the position close to the wafers in the wafer box and scans the wafers in the wafer box one by one to judge whether the positions and the number of the wafers in the wafer box are consistent with the positions and the number of the wafers recorded in a control system of the semiconductor equipment, when the grabbing mechanism does not transfer the last wafer grabbed from the wafer box to the preset position due to failure, the last wafer is taken to be close to the wafers in the wafer box for detection, the last wafer left on the grabbing mechanism collides with all the wafers in the wafer box in the scanning process of the grabbing mechanism to cause damage to all the wafers in the wafer box, compared with the related technology, the design arranges the detection module on the wafer box, before the grabbing mechanism grabs the wafer, the grabbing mechanism does not need to be moved to the position close to the wafer placed in the wafer box and the wafer placed in the wafer box is scanned one by one, the positions and the number of the wafers in the wafer box can be detected, the situation that the grabbing mechanism collides the last wafer left on the grabbing mechanism with all the wafers in the wafer box due to faults is effectively avoided, the phenomenon that all the wafers in the wafer box are broken is caused, meanwhile, the positions and the number of the wafers in the wafer box can be detected without moving the grabbing mechanism to the position close to the wafer placed in the wafer box, the detection efficiency of the detecting module for detecting the wafers in the wafer box is improved, the grabbing efficiency of the grabbing mechanism for grabbing the wafers is improved, and the processing efficiency of semiconductor equipment is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a partial cross-sectional view of a semiconductor device in the related art;

FIG. 2 is a partial cross-sectional view of a semiconductor device in an embodiment of the present application;

FIG. 3 is a partial cross-sectional view of a semiconductor device in another embodiment of the present application;

FIG. 4 is a partial cross sectional view of a semiconductor device in accordance with another embodiment of the present application;

FIG. 5 is a partial cross sectional view of a semiconductor device in accordance with yet another embodiment of the present application;

FIG. 6 is a schematic representation of the reflection of an electrical signal in one embodiment of the present application;

FIG. 7 is a schematic representation of the reflection of an electrical signal in another embodiment of the present application;

FIG. 8 is a schematic representation of the reflection of an electrical signal in yet another embodiment of the present application.

Reference numerals: 11', a wafer box; 12', a grabbing mechanism; 13', a detection module; 20', a wafer; m' and presetting direction;

10. a semiconductor device; 11. a wafer box; 12. a grabbing mechanism; 121. a mechanical arm; 122. a suction nozzle; 13. a detection module; 131. a transmitting end; 132. a receiving end; 1321. a first sub-receiving end; 1322. a second sub-receiving end; 14. a carrier; 15. a slide rail; 20. a wafer; 30. an electrical signal; m, a preset direction.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

As shown in fig. 1, in the related art, the detection module 13 'is disposed on the grasping mechanism 12', and before the grasping mechanism 12 'grasps the wafer 20', the grasping mechanism 12 'moves to the vicinity of the wafer 20' placed in the cassette 11 'of the wafer 20' and moves in the predetermined direction M 'to perform the scanning operation on the wafers 20' placed in the cassette 11 'of the wafer 20' one by one, thereby determining whether the positions and the number of the wafers 20 'placed in the cassette 11' of the wafer 20 'are consistent with the positions and the number of the wafers 20' recorded in the control system of the semiconductor device.

However, when the grasping mechanism 12' is out of order (for example, a sensor disposed on the grasping mechanism 12' is damaged, which results in that a control system of the semiconductor device cannot know whether the wafer 20' is present on the grasping mechanism 12 '), and thus when the grasping mechanism 12' does not transfer the previous wafer 20' grasped from the cassette 11' of the wafers 20' to a predetermined position, the sensor disposed on the grasping mechanism 12' cannot accurately determine and output an alarm signal, so that the grasping mechanism 12' continues to carry the previous wafer 20' to be detected close to the wafer 20' in the cassette 11' of the wafers 20', and the previous wafer 20' left on the grasping mechanism 12' collides with all the wafers 20' in the cassette 11' of the wafers 20' during scanning by the grasping mechanism 12', which results in that all the wafers 20' in the cassette 11' of the wafers 20' are damaged. Therefore, it is a desirable problem to effectively avoid the wafer 20' in the wafer 20' cassette 11' from colliding with the wafer 20' in the wafer 20' cassette 11' and breaking all the wafers 20' in the wafer 20' cassette 11 '.

In order to solve the above technical problem, referring to fig. 2, a first aspect of the present invention provides a semiconductor apparatus 10, which can effectively prevent a wafer 20 on a gripping mechanism 12 from colliding with a wafer 20 in a wafer box 11, so as to prevent all wafers 20 in the wafer box 11 from being cracked.

The semiconductor device 10 includes a wafer cassette 11, a gripping mechanism 12, and a detection module 13. The wafer cassette 11 has an accommodating space for accommodating a wafer 20, the wafer cassette 11 includes a plurality of carriers 14 located in the accommodating space and arranged at intervals along a preset direction M, each carrier 14 is used for carrying one wafer 20, the grasping mechanism 12 is used for grasping the wafer 20 placed on the carrier 14 and transferring the wafer 20 to a preset position, the detection module 13 is disposed on the wafer cassette 11, the detection module 13 is used for detecting the wafer 20 placed on the carrier 14 and outputting a detection signal, and the detection signal is used for indicating whether there is a wafer 20 on the carrier 14.

Based on the semiconductor device 10 of the embodiment of the present application, the wafer 20 is placed on the carrier 14 in the accommodating space of the wafer box 11, before the grasping mechanism 12 grasps the wafer 20, the position and the number of the wafer 20 in the wafer box 11 are detected by the detection module 13 disposed on the wafer box 11, and a detection signal is output to the control system of the semiconductor device 10 according to the detection result, if the position and the number of the wafer 20 indicated by the detection signal are the same as the position and the number of the wafer 20 recorded in the control system of the semiconductor device 10, the grasping mechanism 12 grasps the wafer 20 in the wafer box 11 and transfers the wafer 20 to a preset position; in the related art, the detecting module 13 'is disposed on the grasping mechanism 12', before the grasping mechanism 12 'grasps the wafers 20', the grasping mechanism 12 'moves to the vicinity of the wafers 20' placed in the cassette 11 'and performs the scanning operation on the wafers 20' placed in the cassette 11 'one by one to determine whether the positions and the numbers of the wafers 20' placed in the cassette 11 'are identical to the positions and the numbers of the wafers 20' recorded in the control system of the semiconductor apparatus 10', when the grasping mechanism 12' moves the last wafer 2 'grasped from the cassette 11' to the predetermined position due to failure, the last wafer 20 'is brought close to the wafer 20' in the cassette 11 'to be detected, and the last wafer 20' left on the grasping mechanism 12 'collides with all the wafers 20' in the cassette 11 'during the scanning process of the grasping mechanism 12', compared with the related art, the design has the advantages that the detection module 13 is arranged on the wafer box 11, before the grabbing mechanism 12 grabs the wafers 20, the grabbing mechanism 12 does not need to be moved to the position close to the wafers 20 arranged in the wafer box 11 and the wafers 20 arranged in the wafer box 11 are scanned one by one, so that the positions and the number of the wafers 20 in the wafer box 11 can be detected, the phenomenon that the last wafer 20 left on the grabbing mechanism 12 collides with all the wafers 20 in the wafer box 11 due to faults of the grabbing mechanism 12, and all the wafers 20 in the wafer box 11 are cracked is effectively avoided, meanwhile, the positions and the number of the wafers 20 in the wafer box 11 can be detected without moving the grabbing mechanism 12 to the position close to the wafers 20 arranged in the wafer box 11, the detection efficiency of the detection module 13 for detecting the wafer 20 in the wafer box 11 is also improved, so that the grabbing efficiency of the grabbing mechanism 12 for grabbing the wafer 20 is improved, and further the processing efficiency of the semiconductor device 10 is improved.

The detailed structure of the semiconductor device 10 will be described below with reference to fig. 2 to 8.

As shown in fig. 2, the semiconductor apparatus 10 includes a wafer cassette 11, a grasping mechanism 12, and a detection module 13.

The wafer box 11 is used as a component for accommodating the wafer 20 in the semiconductor device 10, the wafer box 11 should be made of a material with good strength, the specific material of the semiconductor device 10 is not limited, and a designer can reasonably select the wafer box according to needs on the premise of saving cost as much as possible.

The wafer cassette 11 has an accommodating space for accommodating the wafer 20, the wafer cassette 11 includes a plurality of supporting members 14 located in the accommodating space and arranged at intervals along a predetermined direction M, and each supporting member 14 is used for supporting one wafer 20. The preset direction M may be a direction in which the bottom of the wafer box 11 vertically points to the top of the wafer box 11, or the preset direction M may be a direction in which the bottom of the wafer box 11 obliquely points to the top of the wafer box 11. Each carrier 14 may include two carrier blocks, the two carrier blocks are respectively and fixedly connected to two inner wall surfaces of the wafer cassette 11, and the two carrier blocks form a tray structure for carrying one wafer 20; of course, each carrier 14 may also include a carrier plate, the peripheral side of which is fixedly connected to the inner wall surface of the wafer cassette 11, and which forms a tray structure for carrying one wafer 20.

The grasping mechanism 12 is used for grasping the wafer 20 placed on the carrier 14 and transferring the wafer 20 to a predetermined position, wherein the predetermined position may be a middle transition position between the semiconductor device 10 and a next process step device, or a fixture of the next process step device. The specific structure of the grasping mechanism 12 will be described later.

The inspection module 13 is used as a component of the semiconductor device 10 for inspecting whether the wafer 20 is present on the carrier 14, the inspection module 13 is disposed on the wafer cassette 11, and the relative position relationship between the inspection module 13 and the wafer cassette 11 and the connection manner between the inspection module 13 and the wafer cassette 11 will be described below.

The detecting module 13 is configured to detect the wafer 20 placed on the carrier 14 and output a detecting signal, where the detecting signal is used to indicate whether there is the wafer 20 on the carrier 14, for example, when the detecting module 13 detects that there is the wafer 20 on the carrier 14, the detecting module 13 may output a detecting signal "1", and correspondingly, when the detecting module 13 detects that there is no wafer 20 on the carrier 14, the detecting module 13 outputs a detecting signal "0". The control system of the semiconductor apparatus 10 determines which carriers 14 in the pod 11 have the wafers 20 thereon according to the position of each receiving end 132 outputting the detection signal "1", and the control system of the semiconductor apparatus 10 determines the number of the wafers 20 in the pod 11 according to the number of the receiving ends 132 outputting "1". When the positions and the number of the wafers 20 in the wafer cassette 11 are consistent with the positions and the number of the wafers 20 recorded in the control system of the semiconductor apparatus 10, the control system sends an instruction to the gripping mechanism 12, so that the gripping mechanism 12 starts to grip the wafers 20 placed on the carrier 14 and transfer the wafers 20 to the preset positions.

Of course, the detecting module 13 may also output a detecting signal "0" when the detecting module 13 detects that there is a wafer 20 on the carrier 14, and correspondingly, the detecting module 13 outputs a detecting signal "1" when the detecting module 13 detects that there is no wafer 20 on the carrier 14. The control system of the semiconductor apparatus 10 determines which carriers 14 in the pod 11 have the wafers 20 according to the position of each receiving end 132 outputting the detection signal "0", and the control system of the semiconductor apparatus 10 determines the number of the wafers 20 in the pod 11 according to the number of the receiving ends 132 outputting "0". When the positions and the number of the wafers 20 in the wafer cassette 11 are consistent with the positions and the number of the wafers 20 recorded in the control system of the semiconductor apparatus 10, the control system sends an instruction to the gripping mechanism 12, so that the gripping mechanism 12 starts to grip the wafers 20 placed on the carrier 14 and transfer the wafers 20 to the preset positions.

As shown in fig. 2, it can be understood that the wafer cassette 11 includes a plurality of carriers 14 disposed in the accommodating space at intervals along the predetermined direction M, and each carrier 14 is used for carrying one wafer 20, the number of the wafers 20 in the wafer cassette 11 may be one or more, when the number of the wafers 20 in the wafer box 11 is plural, in order to improve the convenience of the inspection module 13 for inspecting each wafer 20 in the wafer box 11, it is further designed, in some embodiments, the detection module 13 includes a plurality of emitting ends 131 and a plurality of receiving ends 132, the plurality of emitting ends 131 are disposed on the plurality of carriers 14 in a one-to-one correspondence, each emitting end 131 is configured to emit an electrical signal 30, the plurality of receiving ends 132 are disposed on the plurality of carriers 14 in a one-to-one correspondence, each receiving end 132 is configured to receive the electrical signal 30 reflected by the wafer 20, and output a detection signal according to the electrical signal 30 reflected by the wafer 20. In this design, the plurality of emitting ends 131 are correspondingly disposed on the plurality of carriers 14 one by one, and the plurality of receiving ends 132 are correspondingly disposed on the plurality of carriers 14 one by one, so that each carrier 14 in the wafer cassette 11 is provided with one emitting end 131 and one receiving end 132, each emitting end 131 is used for emitting the electrical signal 30, each receiving end 132 is used for receiving the electrical signal 30 reflected by the wafer 20, and outputs the detection signal according to the electrical signal 30 reflected by the wafer 20, so that each carrier 14 is provided with the emitting end 131 for emitting the electrical signal 30 to the wafer 20 on the carrier 14, and the receiving end 132 for receiving the electrical signal 30 reflected by the wafer 20 on the carrier 14 and outputting the detection signal, and the emitting end 131 and the receiving end 132 on each carrier 14 can individually complete the detection of the wafer 20 on the carrier 14, the difficulty of the detection device for detecting a plurality of wafers 20 is reduced, and meanwhile, the emitting end 131 and the receiving end 132 on different carriers 14 can simultaneously detect the wafers 20 placed on different carriers 14, so that the detection efficiency of the detection module 13 for detecting the wafers 20 in the wafer box 11 is further improved, and the processing efficiency of the semiconductor device 10 is further improved.

It can be understood that, in the process of performing the detection by the detection module 13, after the transmitting end 131 transmits the electrical signal 30 to the wafer 20, the larger the area of the receiving end 132 that can receive the electrical signal 30 reflected by the wafer 20 is, the more accurate the detection result of the detection module 13 is, in order to improve the accuracy and reliability of the detection result of the detection module 13, so that the further design is that the wafer box 11 includes a first inner wall surface enclosing an accommodating space and a second inner wall surface connecting the periphery of the first inner wall surface, each receiving end 132 includes a first sub-receiving end 1321 and a second sub-receiving end 1322, the first sub-receiving end 1321 and the second sub-receiving end 1322 are respectively located at two sides of the corresponding transmitting end 131, and the first sub-receiving end 1321, the transmitting end 131 and the second sub-receiving end 1322 are arranged along a first direction, which intersects with the first inner wall surface. The first direction intersects with the first inner wall surface, that is, the first direction is inclined relative to the first inner wall surface, or the first direction at least includes a first component perpendicular to the first inner wall surface. It should be noted that, no matter how the slope of the first direction is inclined with respect to the first inner wall surface, it is only necessary to ensure that the electrical signal 30 emitted from the emitting end 131 can be received by the receiving end 132 after being reflected by the wafer 20. In this design, through the design of the first sub-receiving end 1321 and the second sub-receiving end 1322, an area on the detection module 13 for receiving the electrical signal 30 reflected by the wafer 20 is increased, so that more electrical signals 30 reflected by the wafer 20 can be received by the first sub-receiving end 1321 and the second sub-receiving end 1322, and the accuracy and reliability of the detection result of the detection module 13 are improved.

Considering that the size of the area where the first sub-receiving end 1321 and the second sub-receiving end 1322 can receive the electrical signal 30 reflected by the wafer 20 is directly affected by the slope of the first direction inclined with respect to the first inner wall surface, in order to increase the area on the first sub-receiving end 1321 and the second sub-receiving end 1322 that can receive the electrical signal 30 reflected by the wafer 20, so as to increase the accuracy and reliability of the detection result of the detection module 13, it is further designed that the first direction is perpendicular to the first inner wall surface, that is, the first sub-receiving end 1321, the transmitting end 131, and the second sub-receiving end 1322 are arranged along a direction perpendicular to the first inner wall surface. In the design, the first direction is perpendicular to the first inner wall surface, so that the arrangement directions of the first sub-receiving end 1321, the transmitting end 131 and the second sub-receiving end 1322 are perpendicular to the first inner wall surface, and more electric signals 30 transmitted by the transmitting end 131 can be projected onto the wafer 20, so that more electric signals 30 reflected by the wafer 20 can be received by the first sub-receiving end 1321 and the second sub-receiving end 1322, and the accuracy and reliability of the detection result of the detection module 13 are further improved.

As shown in fig. 3, it can be understood that the wafer cassette 11 includes a plurality of carriers 14 located in the accommodating space and arranged at intervals along the predetermined direction M, and each carrier 14 is used for carrying one wafer 20, the number of the wafers 20 in the wafer cassette 11 may be one or more, when the number of the wafers 20 in the wafer box 11 is plural, in order to improve the convenience of the detection module 13 for detecting each wafer 20 in the wafer box 11, the detection module 13 further includes an emitting end 131 and a plurality of receiving ends 132, the emitting end 131 is connected with the wafer box 11 and can move along the preset direction M, the emitting end 131 is used for emitting the electric signal 30, the plurality of receiving ends 132 are arranged on the plurality of bearing parts 14 in a one-to-one correspondence manner, each receiving end 132 is used for receiving the electric signal 30 reflected by the wafer 20, and outputs a detection signal according to the electric signal 30 reflected by the wafer 20. In the design, a plurality of receiving terminals 132 are correspondingly arranged on a plurality of carriers 14 one by one, and one emitting terminal 131 is designed to be connected with the wafer cassette 11 and can move along a preset direction M, when the position and the number of the wafers 20 in the wafer cassette 11 need to be detected, the emitting terminal 131 moves along the preset direction M, so as to emit an electrical signal 30 to each wafer 20 on each carrier 14 one by one, the electrical signal 30 emitted by the emitting terminal 131 is reflected by the wafer 20 on the corresponding carrier 14 and then received by the receiving terminal 132 on the carrier 14, and the receiving terminal 132 on the carrier 14 outputs a detection signal to a control system of the semiconductor device 10 according to the electrical signal 30 reflected by the wafer 20, so as to judge whether the wafer 20 exists on the carrier 14, thereby realizing that the detection device detects the position and the number of the wafers 20 in the wafer cassette 11; in addition, the design that one transmitting terminal 131 is connected with the wafer box 11 and can move along the preset direction M ensures that the detecting module 13 can effectively detect the positions and the number of the wafers 20 in the wafer box 11, reduces the number of the transmitting terminals 131, reduces the cost of the detecting module 13, and thus reduces the cost of the semiconductor device 10.

Specifically, the semiconductor device 10 further includes a driving mechanism, the driving mechanism may include a driving element (not shown), a sliding element (not shown), and a sliding rail 15, the sliding rail 15 is disposed along the preset direction M and fixedly connected to an inner wall surface of the wafer box 11, the sliding element is slidably connected to the sliding rail 15, the driving element is connected to the sliding element to drive the sliding element to move along the sliding rail 15, the emitting end 131 is disposed on a side of the sliding element facing the wafer 20, and the sliding element drives the emitting end 131 to slide along the sliding rail 15 under the action of the driving element, so that the emitting end 131 can emit the electrical signal 30 to each wafer 20 in the wafer box 11 one by one, the receiving end 132 on each bearing element 14 can receive the electrical signal 30 reflected by the corresponding wafer 20, and the detection module 13 can detect each wafer 20 in the wafer box 11. The specific structure of the driving member is not limited as long as the driving member can drive the sliding member to move along the sliding rail 15, for example, the driving member may be an air cylinder, and a portion of a piston rod of the air cylinder located outside a cylinder barrel of the air cylinder is directly or indirectly connected with the sliding member to drive the sliding member to move along the sliding rail 15. Of course, the specific structure of the sliding element is not limited, and the sliding element can be used to carry the emitting end 131 and be slidably engaged with the sliding rail 15, for example, the sliding element can be a sliding block slidably engaged with the sliding rail 15.

As shown in fig. 4, it can be understood that the wafer cassette 11 includes a plurality of carriers 14 disposed in the accommodating space and spaced along the predetermined direction M, and each carrier 14 is used for carrying one wafer 20, the number of the wafers 20 in the wafer cassette 11 may be one or more, when the number of wafers 20 in the wafer box 11 is a plurality of, in order to improve the convenience that the detection module 13 detects every wafer 20 in the wafer box 11, so further design, the detection module 13 includes a plurality of transmitting terminals 131 and a receiving terminal 132, a plurality of transmitting terminals 131 one-to-one set up on a plurality of carriers 14, every transmitting terminal 131 all is used for transmitting the signal of telecommunication 30, a receiving terminal 132 is connected with the wafer box 11 and can follow preset direction M and move, the receiving terminal 132 is used for receiving the signal of telecommunication 30 after the wafer 20 reflection, and output the detected signal according to the signal of telecommunication 30 after the wafer 20 reflection. In this design, by disposing the plurality of emitting ends 131 on the plurality of carriers 14 in a one-to-one correspondence, and one receiving end 132 is designed to be coupled to the wafer cassette 11 and movable in a predetermined direction M, when the position and number of the wafers 20 in the wafer cassette 11 need to be detected, each of the emitting terminals 131 emits the electrical signal 30 to each of the wafers 20 on each of the corresponding carriers 14, the receiving terminal 132 moves along the predetermined direction M, and receives the electrical signals 30 emitted from the emitting end 131 of each carrier 14 to the wafers 20 on the carrier 14 and reflected by the wafers 20 on the carrier 14 one by one, the receiving end 132 outputs corresponding detection signals to the control system of the semiconductor device 10 one by one according to the electrical signals 30 reflected by the wafers 20 on each carrier 14, so as to determine whether the wafers 20 exist on the carrier 14, therefore, the detection equipment can detect the positions and the number of the wafers 20 in the wafer box 11; in addition, one receiving end 132 is designed to be connected to the wafer cassette 11 and to be movable along the predetermined direction M, so that the number of receiving ends 132 is reduced, the cost of the detecting module 13 is reduced, and the cost of the semiconductor device 10 is reduced while the position and the number of the wafers 20 in the wafer cassette 11 are effectively detected by the detecting module 13.

Specifically, the semiconductor device 10 further includes a driving mechanism, the driving mechanism may include a driving element, a sliding element and a sliding rail 15, the sliding rail 15 is disposed along the preset direction M and is fixedly connected to an inner wall surface of the wafer box 11, the sliding element is slidably connected to the sliding rail 15, the driving element is connected to the sliding element to drive the sliding element to move along the sliding rail 15, the receiving end 132 is disposed on one side of the sliding element facing the wafer 20, the sliding element drives the receiving end 132 to slide along the sliding rail 15 under the action of the driving element, so that the receiving end 132 can receive the electric signals 30 reflected by each wafer 20 in the wafer box 11 one by one, and thus the detection module 13 detects each wafer 20 in the wafer box 11. The specific structure of the driving member is not limited as long as the driving member can drive the sliding member to move along the sliding rail 15, for example, the driving member may be an air cylinder, and a portion of a piston rod of the air cylinder located outside a cylinder barrel of the air cylinder is directly or indirectly connected with the sliding member to drive the sliding member to move along the sliding rail 15. Of course, the specific structure of the sliding member is not limited, and the sliding member can be used for carrying the emission end 131 and slidably engaging with the sliding rail 15, for example, the sliding member can be a sliding block slidably engaging with the sliding rail 15.

As shown in fig. 5, it can be understood that the wafer cassette 11 includes a plurality of carriers 14 located in the accommodating space and spaced along the predetermined direction M, and each carrier 14 is used for carrying one wafer 20, so that the number of the wafers 20 in the wafer cassette 11 may be one or more, when the number of the wafers 20 in the wafer cassette 11 is more, in order to improve the convenience of the detection module 13 for detecting each wafer 20 in the wafer cassette 11, it is further designed that, in some embodiments, the detection module 13 includes an emitting end 131 and a receiving end 132, the emitting end 131 is connected with the wafer cassette 11 and can move along the predetermined direction M, the emitting end 131 is used for emitting the electrical signal 30, the receiving end 132 is connected with the wafer cassette 11 and can move synchronously with the emitting end 131 along the predetermined direction M, the receiving end 132 is used for receiving the electrical signal 30 reflected by the wafer 20, and outputs a detection signal according to the electrical signal 30 reflected by the wafer 20. It should be noted that, no matter the transmitting terminal 131 and the receiving terminal 132 are connected to each other or arranged at an interval, only when the transmitting terminal 131 and the receiving terminal 132 detect the same wafer 20, the electrical signal 30 transmitted by the transmitting terminal 131 is transmitted by the wafer 20 and then can be received by the receiving terminal 132, only by ensuring that the transmitting terminal 131 and the receiving terminal 132 are connected to each other or arranged at an interval. In the design, by designing one emitting end 131 to be connected to the wafer cassette 11 and capable of moving along the predetermined direction M, and designing one receiving end 132 to be connected to the wafer cassette 11 and the emitting end 131 and capable of moving along the predetermined direction M and the emitting end 131 synchronously, when the position and number of the wafers 20 in the wafer cassette 11 need to be detected, the emitting end 131 and the receiving end 132 move along the predetermined direction M together, the emitting ends 131 emit the electrical signals 30 to the wafers 20 on each of the carriers 14 one by one, and the receiving end 132 receives the electrical signals 30 emitted from the emitting end 131 on each of the carriers 14 to the wafers 20 on the carriers 14 and reflected by the wafers 20 one by one, the receiving end 132 outputs the detection signals to the control system of the semiconductor apparatus 10 according to the electrical signals 30 reflected by the wafers 20 on each of the carriers 14 to determine whether the wafers 20 are present at the position, therefore, the position and the number of the wafers 20 in the wafer box 11 can be detected by the detection equipment; in addition, the emitting end 131 and the receiving end 132 are both designed to move along the predetermined direction M, so that the number of the emitting end 131 and the receiving end 132 is further reduced while the position and the number of the wafers 20 in the wafer cassette 11 are effectively detected by the detecting module 13, thereby further reducing the cost of the detecting module and further reducing the cost of the semiconductor device 10.

Specifically, in some embodiments, when one end of the transmitting terminal 131 is connected to the receiving terminal 132, the semiconductor device 10 further includes a driving mechanism, the driving mechanism may include a driving element, a sliding element and a sliding rail 15, the sliding rail 15 is disposed along the predetermined direction M and is fixedly connected to an inner wall surface of the wafer box 11, the sliding element is slidably connected to the sliding rail 15, the driving element is connected to the sliding element to drive the sliding element to move along the sliding rail 15, the transmitting terminal 131 and the receiving terminal 132 are arranged along a direction perpendicular to the predetermined direction M and are both disposed on a side of the sliding element facing the wafer 20, the sliding element drives the transmitting terminal 131 and the receiving terminal 132 to slide along the sliding rail 15 under the action of the driving element, so that the transmitting terminal 131 can transmit the electrical signal 30 to each wafer 20 in the wafer box 11 one by one, and correspondingly, the receiving terminals 132 can receive the electrical signal 30 reflected by each wafer 20 in the wafer box 11 one by one, thereby realizing that the detection module 13 detects each wafer 20 in the wafer box 11. The specific structure of the driving member is not limited herein as long as the driving member can drive the sliding member to move along the sliding rail 15, for example, the driving member may be an air cylinder, and a portion of the piston rod of the air cylinder located outside the cylinder barrel of the air cylinder is directly or indirectly connected with the sliding member to drive the sliding member to move. Of course, the specific structure of the sliding member is not limited, and the sliding member can be used for carrying the emission end 131 and slidably engaging with the sliding rail 15, for example, the sliding member can be a sliding block slidably engaging with the sliding rail 15.

In particular, in other embodiments, when the transmitting end 131 is spaced apart from the receiving end 132, the semiconductor device 10 further includes a first driving mechanism and a second driving mechanism, the first driving mechanism is configured to drive the emitting end 131 to move along the predetermined direction M, the second driving mechanism is configured to drive the receiving end 132 to move along the predetermined direction M, the first driving mechanism may include a first driving member, a first sliding member and a first sliding rail, the first sliding rail is disposed along the predetermined direction M and is fixedly connected to an inner wall surface of the wafer box 11, the first sliding member is slidably connected to the first sliding rail, the first driving member is connected to the first sliding member to drive the first sliding member to move along the first sliding rail, the emitting end 131 is disposed on a side of the first sliding member facing the wafer 20, the first sliding member drives the emitting end 131 to slide along the first sliding rail under the action of the first driving member, so that the transmitting terminal 131 can transmit the electric signal 30 to each wafer 20 in the wafer box 11 one by one; the second driving mechanism may include a second driving element, a second sliding element and a second sliding rail, the second sliding rail is disposed along the predetermined direction M and is fixedly connected to an inner wall surface of the wafer box 11, the second sliding element is slidably connected to the second sliding rail, the second driving element is connected to the second sliding element to drive the second sliding element to move along the second sliding rail, the receiving end 132 is disposed on one side of the second sliding element facing the wafer 20, the second sliding element drives the receiving end 132 to slide along the second sliding rail under the action of the second driving element, so that the receiving end 132 can receive the reflected electrical signals 30 from each wafer 20 in the wafer box 11 one by one, and the detection module 13 detects each wafer 20 in the wafer box 11. It should be noted that, the movement of the emitting end 131 along the preset direction M and the movement of the receiving end 132 along the preset direction M are synchronous movements, that is, in the process of detecting the wafer 20 in the wafer box 11 by the detecting module 13, the distance, the speed, and the direction of the movement of the emitting end 131 and the receiving end 132 relative to the bottom of the wafer box 11 are the same, so as to ensure that the electrical signal 30 emitted from the emitting end 131 to each wafer 20 on each bearing member 14 can be received by the receiving end 132 in time after being reflected by the wafer 20, thereby ensuring the accuracy and the reliability of the detection result of the detecting module 13.

It can be understood that the electrical signal 30 emitted from the emitting end 131 can be reflected to the receiving end 132 through the end surface of the wafer 20, so as to further improve the accuracy and reliability of the detection result of the detection module 13, it is further designed that the wafer 20 includes two end surfaces oppositely disposed and a side surface connecting the two end surfaces, the emitting end 131 is disposed corresponding to the side surface of the wafer 20, so that the electrical signal 30 emitted from the emitting end 131 is reflected through the side surface of the wafer 20 and then received by the receiving end 132. It should be noted that the direction of the electrical signal 30 emitted from the emitting end 131 may be perpendicular to the side surface of the wafer 20, or may be inclined with respect to the side surface of the wafer 20. In this design, the emitting end 131 is disposed corresponding to the side surface of the wafer 20, so that the electrical signal 30 emitted from the emitting end 131 to the wafer 20 can be effectively reflected to the receiving end 132 by the side surface of the wafer 20, thereby improving the accuracy and reliability of the detection result of the detection module 13.

Specifically, the path of the electrical signal 30 emitted from the emitting end 131 to the receiving end 132 via the side of the wafer 20 can be implemented, but is not limited to the following embodiments.

For example, as shown in fig. 6, the electric signal 30 emitted from the central region of the emitting end 131 is reflected by the surface of the wafer 20 and then returns to the emitting end 131, where the central region corresponds to a region where the electric signal 30 emitted from the emitting end 131 can return along the original path after being reflected by the lateral surface of the wafer 20.

For example, as shown in fig. 7, the electrical signal 30 emitted from the edge region of the emitting end 131 is reflected by the surface of the wafer 20 and then returns to the receiving end 132, wherein the edge region corresponds to a region where the electrical signal 30 emitted from the emitting end 131 can return to the receiving end 132 after being reflected by the side surface of the wafer 20.

For example, as shown in fig. 8, the electrical signal 30 emitted from the boundary of the emitting end 131 is reflected by the surface of the wafer 20 and returns to the boundary of the emitting end 131, wherein the boundary corresponds to the intersection line where the central region of the emitting end 131 intersects with the edge region.

It can be understood that the connection between the detection module 13 and the wafer box 11 can be non-detachable connection, so as to improve the convenience of installation and detachment of the detection module 13, so that the detection module 13 damaged by the equipment maintenance personnel can be replaced in time in the later period, and therefore, the detection module 13 is further designed to be detachably connected with the wafer box 11 through a connecting piece. In this design, through the design of connecting piece, realized being connected dismantled between detection module 13 and the wafer box 11 to dismantle the change to the detection module 13 that damages.

Specifically, the connecting piece may include a connecting plate and a screw, the connecting plate is detachably connected to the wafer box 11 by the screw, and the detection module 13 is fixed to the connecting plate by bonding with glue; of course, the connection member may be a screw, and the detection module 13 is detachably connected to the wafer cassette 11 via the screw.

Considering that the grabbing mechanism 12 needs to repeatedly complete the operation of grabbing the wafer 20 during the working process, in order to reduce the difficulty of grabbing the wafer 20 by the grabbing mechanism 12 and improve the grabbing efficiency of the grabbing mechanism 12, it is further designed that the grabbing mechanism 12 includes a robot arm 121 and a suction nozzle 122, the suction nozzle 122 is disposed on the robot arm 121, and the suction nozzle 122 grabs and picks up the wafer 20 placed on the carrier 14 by vacuum suction. The grasping mechanism 12 may further include a vacuum generator, the suction nozzle 122 is connected to the vacuum generator through an air tube, when the grasping mechanism 12 needs to grasp the wafer 20, the vacuum generator is started, so that air in the suction nozzle 122 is pumped away through the air tube, and thus air pressure inside the suction nozzle 122 is smaller than external atmospheric pressure, and a pressure difference formed inside and outside the suction nozzle 122 causes the wafer 20 to be sucked up by the suction nozzle 122, and the wafer 20 on the suction nozzle 122 is transferred to a preset position through movement of the mechanical arm 121. In this design, when the grasping mechanism 12 needs to grasp the wafer 20, the suction nozzle 122 on the robot arm 121 is brought close to the surface of the wafer 20 to adsorb the wafer 20 in a vacuum adsorption manner, so that the wafer 20 adsorbed by the suction nozzle 122 is transferred to a predetermined position by the movement of the robot arm 121, and the difficulty of grasping the wafer 20 and transferring the wafer 20 by the grasping mechanism 12 is reduced by the design of the robot arm 121 and the suction nozzle 122.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc., based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and operate, and therefore the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the above terms can be understood according to the specific situation by those skilled in the art.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor device, comprising:

the wafer box is provided with an accommodating space for accommodating wafers, and comprises a plurality of bearing pieces which are positioned in the accommodating space and arranged at intervals along a preset direction, wherein each bearing piece is used for bearing one wafer;

the grabbing mechanism is used for grabbing the wafer placed on the bearing piece and transferring the wafer to a preset position;

the detection module is arranged on the wafer box and used for detecting the wafer placed on the bearing piece and outputting a detection signal, and the detection signal is used for indicating whether the wafer is on the bearing piece or not.

2. The semiconductor device of claim 1, wherein the detection module comprises:

the emitting ends are arranged on the bearing pieces in a one-to-one correspondence mode, and each emitting end is used for emitting an electric signal;

and the receiving ends are arranged on the bearing pieces in a one-to-one correspondence manner, and each receiving end is used for receiving the electric signal reflected by the wafer and outputting the detection signal according to the electric signal reflected by the wafer.

3. The semiconductor device of claim 2,

the wafer box comprises a first inner wall surface and a second inner wall surface, wherein the first inner wall surface is used for enclosing the accommodating space, the second inner wall surface is connected with the periphery of the first inner wall surface, each receiving end comprises a first sub receiving end and a second sub receiving end, the first sub receiving ends and the second sub receiving ends are respectively located on two sides of the corresponding transmitting ends, the first sub receiving ends, the transmitting ends and the second sub receiving ends are arranged along a first direction, and the first direction is intersected with the first inner wall surface.

4. The semiconductor device according to claim 3,

the first direction is perpendicular to the first inner wall surface.

5. The semiconductor device of claim 1, wherein the detection module comprises:

the transmitting end is connected with the wafer box and can move along the preset direction, and the transmitting end is used for transmitting an electric signal;

6. The semiconductor device of claim 1, wherein the detection module comprises:

and the receiving end is connected with the wafer box and can move along the preset direction, and is used for receiving the electric signal reflected by the wafer and outputting the detection signal according to the electric signal reflected by the wafer.

7. The semiconductor device of claim 1, wherein the detection module comprises:

and the receiving end is connected with the wafer box and can synchronously move with the transmitting end along the preset direction, and the receiving end is used for receiving the electric signals reflected by the wafer and outputting the detection signals according to the electric signals reflected by the wafer.

8. The semiconductor device as claimed in claim 2, 5, 6 or 7, wherein the wafer comprises two oppositely disposed end faces and a side face connecting the two end faces, and the transmitting end is disposed corresponding to the side face of the wafer, so that the electrical signal transmitted by the transmitting end is reflected by the side face of the wafer and then received by the receiving end.

9. The semiconductor device according to claim 1,

the detection module is detachably connected with the wafer box through a connecting piece.

10. The semiconductor device according to claim 1,

the grabbing mechanism comprises a mechanical arm and a suction nozzle, the suction nozzle is arranged on the mechanical arm, and the suction nozzle grabs, picks and places the wafer on the bearing piece in a vacuum adsorption mode.