CN217213020U

CN217213020U - Chip test structure

Info

Publication number: CN217213020U
Application number: CN202220041205.4U
Authority: CN
Inventors: 黄种庆
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-01-07
Filing date: 2022-01-07
Publication date: 2022-08-16
Anticipated expiration: 2032-01-07
Also published as: TWM642370U

Abstract

The utility model discloses a chip testing structure, which comprises a chip, a testing seat main body and a testing sheet host, wherein the chip at least comprises a conducting end; at least one group of test piece assemblies are arranged in the test seat main body, each test piece assembly comprises four test pieces, and each test piece is provided with a needle leg and a needle point; two liang of a set of and the end that switches on of chip of the needle point of four test pieces switch on or four needle points merge the back that switches on with the end that switches on or one of them needle point switches on with the end that switches on of chip with the end that switches on respectively of switching on, three needle point merges the back that switches on and switches on with the end that switches on of chip in addition, the utility model discloses a multiunit is by the test piece subassembly that four test pieces constitute, when switching on with the kelvin circuit, the electric current is shunted to a plurality of test piece subassemblies, and the electric current that distributes every test piece like this is just very low, has promoted test piece life, can accord with the user demand of high-current and high-voltage to the mode of switching on of test piece and chip is diversified, and application scope is wide.

Description

Chip test structure

Technical Field

The utility model relates to an electronic chip tests technical field, in particular to chip test structure.

Background

Along with the rapid development of modern electronic products, an electronic chip is taken as an important composition core, quality detection control becomes stricter in the production and processing processes, in the actual detection process, the electronic chip is placed in a limiting frame by a test fixture through an automatic production line and is pressed by applying force, and the electronic chip is communicated with a detection circuit through a test piece, so that the performance detection of the electronic chip is realized.

For testing the positive and negative voltage drop or on-state resistance of a power device chip, in order to improve the testing accuracy, a kelvin test method is generally adopted, the kelvin test is a so-called four-wire test method, the four-wire test method aims to deduct the voltage drop caused by the resistance of a wire, the equivalent resistance of a 30-centimeter long wire is about ten milliohms to hundred milliohms generally, if the current passing through the wire is large enough (for example, in the ampere level), the voltage drop at two ends of the wire reaches dozens to hundred millivolts, so that the current passing through a test strip is overlarge, the resistance of the test strip is low, and the test strip is not suitable for high and low voltage or high and low current, the application range is small, and much inconvenience is brought to actual use.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming prior art not enough and providing a simple structure, convenient operation, the electric current that flows through the test piece can not be too high after being shunted, and the tolerance is high, is applicable to high-low voltage or high-low current to the diversified chip test structure of the mode of switching on of test piece and chip.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a chip test structure, comprising:

the chip at least comprises a conducting end;

a test socket body;

the test piece assembly is arranged on the test seat main body and comprises four test pieces, and each of the four test pieces is provided with a needle leg and a needle point;

wherein, every two needle points of the four test pieces are connected with the conduction end of the chip

Or the four needle points are respectively communicated with the conducting end

Or the four needle points are combined and conducted and then conducted with the conducting end

Or one of the needle points is conducted with the conducting end of the chip, and the other three needle points are conducted with the conducting end of the chip after being combined and conducted.

Furthermore, the needle point of the test piece is communicated with the conducting end of the chip through a probe.

Furthermore, the number of the test sheet assemblies is four, and the number of the conducting ends on the chip is four.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses the chip test structure of scheme, constitute by the test strip that four test strips constitute including the multiunit, when this chip test structure switches on with the kelvin circuit, the electric current of output is shunted to a plurality of test strip subassemblies, the electric current of distributing every test strip like this will be very low to promoted test strip life and measurement accuracy, can accord with high current and high-voltage user demand simultaneously, and the mode of switching on between the end of switching on of test strip and chip is diversified, has enlarged the scope of being suitable for, practicality greatly increased.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

fig. 1 is a schematic perspective view of a first embodiment of the present invention;

FIG. 2 is an enlarged view of portion A of FIG. 1;

FIG. 3 is a schematic view of a three-dimensional structure of a test socket main body and a test strip assembly according to an embodiment of the present invention;

FIG. 4 is a schematic structural view illustrating the conduction between the test strip and the conduction end of the chip in the second embodiment of the present invention;

fig. 5 is a schematic structural view of conduction between the test strip and the conduction end of the chip in the third embodiment of the present invention;

wherein: the test socket comprises a test socket body 1, a test strip assembly 2, a chip 6, a test strip 20, a conducting end 60, a needle point 200, a pin 201 and a probe 202.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1-3, the chip testing structure of the present invention includes a chip 6, a testing seat body 1 and a testing piece assembly 2; the chip 6 at least comprises a conducting end 60 which is conducted with the test piece component 2; at least one set of test strip assemblies 2 is disposed within the test socket body 1.

Specifically, each group of test strip assemblies 2 comprises four test strips 20, and the head parts and the tail parts of the four test strips 20 are respectively provided with a needle point 200 and a needle leg 201; the needle points 200 of the four test strips 20 are conducted with the conducting end 60 of the chip 6 in groups of two or four needle points 200 are respectively conducted with the conducting end 60 or four needle points 200 are conducted with the conducting end 60 after combined conduction or one of the needle points 200 is conducted with the conducting end 60 of the chip, and the other three needle points 200 are conducted with the conducting end 60 of the chip 6 after combined conduction.

Wherein the tip 200 of the test strip 20 is in communication with the conduction terminal 60 of the chip 6 through the probe 202.

Several examples are described below.

Example one

Referring to fig. 1-3, the chip testing structure in this embodiment includes a testing socket main body 1, four sets of testing sheet assemblies 2 are disposed in the testing socket main body 1, each set of testing sheet assembly includes four testing sheets 20, each two of the four testing sheets 20 form a set, two testing sheets 20 in each set are stacked up and down, and each testing sheet 20 has a needle point 200 and a pin 201.

The chip 6 has four conducting terminals 60 corresponding to the four groups of test piece assemblies 2, the four groups of test piece assemblies 2 in this embodiment are conducted with the four conducting terminals 60, and it is assumed that how the four conducting terminals 60 on the corresponding chip 6 are conducted is specifically described by using the first group of test piece assemblies, the second group of test piece assemblies, the third group of test piece assemblies and the fourth group of test piece assemblies, and the four conducting terminals are respectively the first conducting terminal, the second conducting terminal, the third conducting terminal and the fourth conducting terminal.

In the first set of test piece assemblies: the needle points of the four test pieces are conducted in a group of two by two through probes, and then the two probes are conducted with the first conducting end.

In the second set of test sheet assemblies: the needle points of the four test pieces are respectively communicated with the second conduction end through the probes.

In the third set of test sheet assemblies: and after the needle points of the four test pieces are conducted through one probe, conducting the probe with the third conducting end.

In the fourth set of test strip assemblies: the needle point of one test piece is conducted with the fourth conducting end through one probe, and after the needle points of the other three test pieces are conducted through one probe, the probes are conducted with the fourth conducting end.

Of course, in practical use, it is not necessary that the first group of test chip assemblies be aligned with the first conduction end, as long as it is ensured that the four test chip assemblies can be conducted with the four conduction ends on the chip, the distribution mode is not fixed, and there is no requirement for one-to-one correspondence.

During the in-service use, be linked together this chip test structure and kelvin circuit, on the electric current of kelvin circuit output was shunted a plurality of test piece subassemblies, the electric current on so distributing every test piece was just less to can promote life-span and the resistant of test piece when using, also can carry out the environmental test of high current or high voltage simultaneously, its practicality promotes greatly, and increased the degree of accuracy and the precision of test piece, practicality greatly increased.

In addition, the conduction mode of the conduction end of the test piece and the chip is diversified, so that the test piece has a wider application range.

Example two

Referring to fig. 4, the present embodiment further uses the first test chip assembly, the second test chip assembly, the third test chip assembly and the fourth test chip assembly to describe the conduction manner between the first test chip assembly, the second test chip assembly, the third test chip assembly and the fourth test chip assembly and the four conduction terminals on the corresponding chip.

In the first set of test piece assemblies: the needle point of one test piece is conducted with the fourth conducting end through one probe, and after the needle points of the other three test pieces are conducted through one probe, the probes are conducted with the fourth conducting end.

The second group of test piece assemblies and the third test piece assemblies are conducted in the same mode with the conducting ends, and the needle points of the four test pieces are conducted with the second conducting ends and the third conducting ends through the probes respectively.

In the fourth test piece assembly, the conduction mode of the fourth test piece assembly is opposite to that of the first test piece assembly and the conduction end.

EXAMPLE III

Referring to fig. 5, the present embodiment further uses the first test chip assembly, the second test chip assembly, the third test chip assembly and the fourth test chip assembly to describe the conduction manner between the first test chip assembly, the second test chip assembly, the third test chip assembly and the fourth test chip assembly and the four conduction terminals on the corresponding chip.

In the embodiment, after the test pieces in the first test piece assembly, the second test piece assembly, the third test piece assembly and the fourth test piece assembly are conducted in pairs by one probe, the probes are respectively conducted with the conducting ends.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All technical solutions formed by adopting equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. A chip test structure, comprising:

the chip at least comprises a conducting end;

a test socket body;

Or the four needle points are respectively communicated with the conducting end

Or the four needle points are combined to be conducted and then conducted with the conducting end

Or one of the needle points is conducted with the conduction end of the chip, and the other three needle points are conducted with the conduction end of the chip after being combined and conducted.

2. The chip test structure of claim 1, wherein: the needle point of the test piece is communicated with the conducting end of the chip through a probe.

3. The chip test structure of claim 1, wherein: the number of the test piece assemblies is four, and the number of the conducting ends on the chip is four.