CN217191446U - Cartridge cleaning machine - Google Patents

Cartridge cleaning machine Download PDF

Info

Publication number
CN217191446U
CN217191446U CN202220045819.XU CN202220045819U CN217191446U CN 217191446 U CN217191446 U CN 217191446U CN 202220045819 U CN202220045819 U CN 202220045819U CN 217191446 U CN217191446 U CN 217191446U
Authority
CN
China
Prior art keywords
module
cleaning machine
control signal
relative humidity
alarm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220045819.XU
Other languages
Chinese (zh)
Inventor
郭盾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202220045819.XU priority Critical patent/CN217191446U/en
Application granted granted Critical
Publication of CN217191446U publication Critical patent/CN217191446U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The utility model discloses a wafer box cleaning machine, wafer box cleaning machine includes: the monitoring module is used for monitoring the wafer box and acquiring the relative humidity of the dried wafer box after being cleaned; the control module is used for receiving the relative humidity acquired by the monitoring module and generating a corresponding control signal according to a comparison result of the relative humidity and a preset alarm threshold value of the relative humidity; and the alarm module is used for receiving the control signal and giving an alarm. Through the structure, the humidity inside the wafer box is controlled to ensure the surface quality of the silicon wafer in the subsequent silicon wafer storage.

Description

Cartridge cleaning machine
Technical Field
The utility model relates to a cleaning device field especially relates to a wafer box cleaning machine.
Background
The cleaning process of the silicon polished wafer plays an increasingly greater role in IC manufacturing, and it is estimated that the loss caused by silicon wafer surface particles and metal contamination accounts for more than half of the total loss in the whole device manufacturing, not only are cleaning steps more and more, but also international semiconductor technology development lines put higher requirements on the acceptable particle size and number of the silicon wafer surface, after the silicon wafer is cleaned, the surface particle density is very low, the phenomenon of particle growth occurs in the storage process of some silicon wafers, the particle growth generally begins to be represented by the increase of small-size particles, the color is changed when the silicon wafers are observed under the irradiation of strong light, and the particles on the silicon wafer surface are aggregated to form time-dependent fog (TDH).
Since TDH is generated during subsequent storage, it cannot be predicted and detected in advance, and has a fatal influence on subsequent device processing. The reasons for TDH generation are currently believed to be several: chemical liquid residue after cleaning, the drying degree of the cleaned silicon wafer, the environment (cleanliness, humidity, chemical atmosphere and the like) for storing the silicon wafer, and the cleanliness and humidity of the wafer box. After the study it was found that wafers, when packaged in a cassette and vacuum packed, will be in a relatively tight space, and the humidity of the cassette prior to packing is critical. At present, the monitoring of the humidity level of the wafer box mainly comprises the step of carrying out spot check on the humidity level inside the wafer box through a humidity monitoring meter, and the actual humidity level inside the wafer box after cleaning is hardly managed well.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, an embodiment of the utility model expects to provide a wafer box cleaning machine, can carry out effectual humidity monitoring to the wafer box after wasing through this wafer box cleaning machine.
The technical scheme of the utility model is realized like this:
a wafer cassette cleaning machine, said wafer cassette cleaning machine comprising:
the monitoring module is used for monitoring the wafer box and acquiring the relative humidity of the dried wafer box after being cleaned; the control module is used for receiving the relative humidity acquired by the monitoring module and generating a corresponding control signal according to a comparison result of the relative humidity and a preset alarm threshold value of the relative humidity; and the alarm module is used for receiving the control signal and giving an alarm.
The embodiment of the utility model provides a wafer box cleaning machine obtains the humidity of the spool box after wasing effectively through monitoring module, and will through control module monitoring module obtains humidity and alarm threshold value contrast, if the contrast result is not conform to the technology demand then report to the police and carry out vacuum drying again with the spool box to the staff, through the inside humidity of this spool box cleaning machine of above-mentioned structure can effectively monitor the spool box and in time report to the police to the staff suggestion, reduce the risk that silicon chip surface produced TDH, improve the process quality of silicon chip.
Drawings
FIG. 1 is a schematic view of a prior art developing apparatus for cleaning a cassette;
fig. 2 is a schematic view of a cartridge cleaning machine according to an embodiment of the present invention.
Detailed Description
In order to illustrate embodiments of the present invention or technical solutions in the prior art more clearly, the following description will be made in conjunction with the accompanying drawings in embodiments of the present invention to describe the technical solutions in the embodiments of the present invention clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, a schematic diagram of a prior art flushing apparatus 10 for cleaning cassettes is shown, which includes a loading port 1, an unloading port 4, a cleaning module 2 and a drying module 3. Put into washing unit 10 through loading port 1 will treat to wash the spool box, washing unit 10 is inside to have the manipulator that is used for shifting to treat to wash the spool box, and the manipulator will be treated to wash the spool box and transmit to washing module 2, and washing module 2 carries out self-cleaning to the spool box. After the cleaning is finished, the mechanical arm transmits the cleaned wafer box to the drying module 3, and the wafer box is dewatered and dried by a heating unit in the drying module 3 in a vacuum environment. The completed dry cassettes are transferred to an unload port 4 for use.
In the process of using the washing unit 10 among the prior art to wash the wafer box, because the wafer box material has certain absorptive capacity to moisture content, if the humidity level of the wafer box after the completion of washing is higher, then packing and transportation afterwards deposit the in-process of wafer, just have very big probability to produce TDH, cause the influence to the normal production of customer end.
The wafer box developing device in the prior art only finishes the cleaning and drying processes of the wafer box, and does not have the humidity detection function after the cleaning is finished, so that the drying degree of the wafer box after the cleaning is not completely guaranteed, once the humidity level of the wafer box after the cleaning is finished is too high, TDH is easily formed, and the normal production of a client side is affected. It is therefore necessary to check the cassette humidity after it has been cleaned and dried to avoid a higher humidity level than would be practical, resulting in TDH formation on the wafers stored therein. The embodiment of the utility model provides a wafer box cleaning machine 100, this wafer box cleaning machine 100 still include monitoring module 20, control module 30 and alarm module 40 outside the module based on washing unit 10.
The monitoring module 20 is used for detecting the humidity of the wafer box after the wafer box is cleaned, and ensures that the wafer box put into use is in a good drying condition after the wafer box is cleaned. This monitoring module 20 realizes the function of acquireing the inside relative humidity of spool box through the humidity inductor.
The control module 30 is configured to receive the relative humidity acquired by the monitoring module 20, compare the acquired relative humidity with a preset alarm threshold of the relative humidity, and according to a comparison result, the control module 30 can send a corresponding control signal. The control module 30 includes an interactive interface for setting an alarm threshold, through which a worker can set a humidity alarm threshold that meets the actual processing needs to meet the subsequent process flow. Preferably, the TDH is observed under the conditions that the relative humidity is respectively 35%, 40% and 45%, and the TDH is minimally influenced when the relative humidity is lower than 35%; when the relative humidity is more than 45%, the TDH is obviously deteriorated, and the use requirement of the client cannot be met. Therefore, the control module 30 compares the relative humidity obtained by the monitoring module 20 with 35%, 40%, 45%, and generates a first control signal when the relative humidity is less than 35%; when the relative humidity is more than 35% and less than 45%, generating a second control signal; when the relative humidity is greater than 45%, a third control signal is generated. When the control module 30 generates the second control signal or the third control signal, it indicates that the humidity inside the magazine is high and the magazine cannot be put into subsequent use, and the magazine needs to be conveyed to the drying module 3 for further drying again; when the control module 30 generates the first control signal, which indicates that the humidity inside the magazine meets the process requirement, the magazine transfer unloading port 4 is put into subsequent use.
The alarm module 40 is configured to receive the control signal sent by the control module 30, and feed back different alarm prompts according to different control signals. The alarm module 40 feeds back different control signals by setting alarm indicating lamps with different colors so as to represent the humidity condition of the wafer box and inform workers to perform corresponding treatment. Preferably, alarm indicator lamps with three colors of red, yellow and green are arranged, and when the alarm module 40 receives the first control signal, the green alarm indicator lamp is flashed; when receiving the second control signal, flashing the yellow light alarm indicator lamp; when the third control signal is received, the red light alarm indicator lamp is flickered. The alarm indicator lamps with different colors are flickered, so that a worker can master the cleaning state of the wafer box in the wafer box cleaning machine in real time, and the fact that the delivery wafer box is in a drying condition meeting the process requirement after the cleaning is finished is guaranteed.
When the embodiment of the utility model works, the wafer box to be cleaned is placed into the wafer box cleaning machine through the loading port, the manipulator transports the wafer box to the cleaning module and the drying module in turn, the wafer box completing the drying process is transported to the monitoring module to obtain the relative humidity inside the wafer box, the relative humidity is compared with the relative humidity inside the wafer box, the alarm indicator lamp with the corresponding color flickers according to the comparison result, when the red and yellow lamps flick, the humidity inside the wafer box does not accord with the process standard, the manipulator retransmits the wafer box to the drying module for drying, when the green lamp flickers, the wafer box can be put into subsequent use, the worker pays special attention to the alarm indicator lamp according to the corresponding color, the separation and boxing operation under the condition that the humidity level inside the wafer box exceeds the normal value is avoided, thereby the TDH generation caused in the subsequent storage and transportation can be avoided, the problems of quality crisis, customer complaint and the like caused by the fact that the client cannot be normally used due to the influence of the TDH are effectively avoided.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (9)

1. The utility model provides a wafer box cleaning machine which characterized in that, wafer box cleaning machine includes:
the monitoring module is used for monitoring the wafer box and acquiring the relative humidity of the dried wafer box after being cleaned;
the control module is used for receiving the relative humidity acquired by the monitoring module and generating a corresponding control signal according to a comparison result of the relative humidity and a preset alarm threshold value of the relative humidity;
the alarm module is used for receiving the control signal and giving an alarm;
the device also comprises a loading port, an unloading port, a cleaning module and a drying module.
2. The cassette cleaning machine of claim 1, wherein the control module is configured to:
when the relative humidity is less than 35%, generating a first control signal;
when the relative humidity is more than 35% and less than 45%, generating a second control signal;
when the relative humidity is greater than 45%, a third control signal is generated.
3. The cassette cleaning machine of claim 2, wherein the alarm module includes three red, yellow and green alarm lights, the alarm module being configured to receive different control signals to flash different ones of the alarm lights.
4. The cassette cleaning machine of claim 3, wherein the alarm module is configured to:
when the first control signal is received, green light flickers;
when the second control signal is received, flashing yellow light;
and when the third control signal is received, the lamp blinks red light.
5. The cassette cleaning machine of claim 1, wherein the monitoring module obtains the relative humidity of the cassette via a humidity sensor.
6. The cassette cleaning machine of claim 2, wherein the control module is further configured to redry the cassette when the second control signal or the third control signal is generated.
7. The cassette cleaning machine of claim 2, wherein the control module is further configured to transfer the cassette out of the cassette cleaning machine when the first control signal is generated.
8. A cassette cleaning machine as defined in claim 1 further comprising a robot for transferring the cassettes between modules.
9. The cassette cleaning machine of claim 1, wherein the control module includes an interactive interface for inputting the alarm threshold.
CN202220045819.XU 2022-01-10 2022-01-10 Cartridge cleaning machine Active CN217191446U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220045819.XU CN217191446U (en) 2022-01-10 2022-01-10 Cartridge cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220045819.XU CN217191446U (en) 2022-01-10 2022-01-10 Cartridge cleaning machine

Publications (1)

Publication Number Publication Date
CN217191446U true CN217191446U (en) 2022-08-16

Family

ID=82790015

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220045819.XU Active CN217191446U (en) 2022-01-10 2022-01-10 Cartridge cleaning machine

Country Status (1)

Country Link
CN (1) CN217191446U (en)

Similar Documents

Publication Publication Date Title
CN106583175B (en) Treatment fluid supply method and processing liquid supplying device
JP5511190B2 (en) Operation method of substrate processing apparatus
CN105209402A (en) A system and method for performing a wet etching process
TWI459490B (en) A substrate processing apparatus and a substrate processing method, and a memory medium
US20020155647A1 (en) Method of manufacturing semiconductor devices with use of wafer carrier having conditioning units
JP2004031901A (en) Wafer processing apparatus equipped with sensor box
WO2014088078A1 (en) Substrate processing device, application method for substrate device and storage medium
CN1104047C (en) Semiconductor producing system
US20080031510A1 (en) Method of and apparatus for inspecting wafers in chemical mechanical polishing equipment
CN217191446U (en) Cartridge cleaning machine
CN107546163A (en) A kind of wafer transportation resources, wafer conveying arrangement and system
CN111986984B (en) Method for reducing time fog generated on surface of silicon polishing sheet
CN105931691B (en) Nuclear Power Station's Exhausted Fuels radgas processing method
US6808589B2 (en) Wafer transfer robot having wafer blades equipped with sensors
JP2004327546A (en) Semiconductor manufacturing system
JP2001196283A (en) Semiconductor manufacturing device and its manufacturing method
JP3494765B2 (en) Cleaning treatment apparatus and control method therefor
JPH04354345A (en) Semiconductor circuit testing system
CN112880369A (en) Device and method for controlling TDH (time domain reflectometry) of silicon wafer
JP2011096843A (en) Wafer transfer apparatus and wafer size discriminating method
CN107024913B (en) A kind of logic control method and control device of the feeding of annular conveyor line material
TWI829534B (en) Material handling methods and handling systems
JPS6256661B2 (en)
TW202327741A (en) Substrate processing apparatus and substrate processing method
TWI834341B (en) Wafer cassette detection method and device, wafer cassette cleaning machine

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065

Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd.

Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd.

Address before: 710100 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province

Patentee before: Xi'an yisiwei Material Technology Co.,Ltd.

Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd.