CN217183550U - PCB base plate adopts ironware and magnetic component to adsorb location structure - Google Patents

Abstract

The embodiment of the utility model discloses PCB base plate adopts ironware and magnetic component to adsorb location structure, and it includes: a base plate; the iron pieces are fixed on the PCB substrate; the magnetic assemblies are arranged between the iron piece and the bottom plate and fixed on the bottom plate; the magnetic assembly is magnetically connected with the iron piece to realize that the PCB substrates are adsorbed and positioned on the bottom plate. The utility model provides a PCB base plate adopts ironware and magnetic component to adsorb location structure, has not only reduced the post-processing degree of difficulty of bottom plate, has improved PCB base plate installation's the degree of accuracy, need not to design accuse deep hole on the PCB board simultaneously, only needs to fix ironware on the PCB base plate, very big reduction the processing cost of PCB base plate, reduced keeping away of PCB base plate and a wire-wound degree of difficulty.

Description

PCB base plate adopts ironware and magnetic component to adsorb location structure

Technical Field

The utility model relates to a RGB directly shows technical field, especially relates to a PCB base plate adopts ironware and magnetic component to adsorb location structure.

Background

With the increasing market demand of high-density and high-definition display, the era of micro-space display comes, and Min-LED has been started. The Min-LED is a special LED, is an all-solid-state active light-emitting device, and has the characteristics of low working voltage, high luminous efficiency, quick response, reliable performance, wide working temperature range and the like.

At present, when a PCB substrate and a bottom plate in a Min-LED product are designed to be guided and positioned in a fool-proof way, a protruded bottom plate positioning column is usually designed on the bottom plate, and a control deep hole is designed on the PCB substrate. However, the bottom plate positioning column needs to be post-processed, the processing difficulty is high, and the precision after post-processing is not high. In addition, because the PCB substrate is required to be designed with deep control holes, the processing cost of the PCB is higher, and the difficulty of avoiding and winding the PCB substrate is increased.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a PCB base plate adopts ironware and magnetic component to adsorb location structure, and it is not high to aim at solving the precision behind the bottom plate reference column post-processing in the prior art, leads to PCB substrate mounting off normal, the higher technical problem of PCB processing cost simultaneously.

In order to solve the above problem, an embodiment of the utility model provides a PCB base plate adopts ironware and magnetic component to adsorb location structure, and it includes:

a base plate;

the iron pieces are fixed on the PCB substrate;

the magnetic assemblies are arranged between the iron piece and the bottom plate and fixed on the bottom plate;

the magnetic assembly is magnetically connected with the iron piece to realize that the PCB substrates are adsorbed and positioned on the bottom plate.

Further, the PCB base plate adopt among iron member and the magnetic component absorption location structure, the magnetic component includes magnet seat and magnet, magnet passes through the magnet seat is fixed on the bottom plate.

Furthermore, in the structure that the PCB substrate is adsorbed and positioned by the iron piece and the magnetic component, an opening cavity is arranged on the magnet seat, and the magnet is arranged in the opening cavity.

Furthermore, in the structure that the PCB substrate adopts an iron piece and magnetic component adsorption positioning structure, the opening cavity comprises an inner cavity and an outer cavity, the inner cavity is communicated with the outer cavity, and the magnet is fixedly connected with the magnet seat in the inner cavity.

Furthermore, in the structure that the PCB substrate adopts an iron piece and a magnetic component to adsorb and position, the diameter of the inner cavity is smaller than that of the outer cavity.

Furthermore, in the structure that the PCB substrate adopts an iron piece and a magnetic component to adsorb and position, the height of the opening cavity is at least 0.5 mm higher than that of the magnet.

Furthermore, in the structure that the PCB substrate adopts an iron piece and a magnetic component to adsorb and position, the magnet seat is a nail-shaped magnet seat.

Furthermore, the PCB substrate adopt the iron piece and the magnetic component to adsorb the location structure in, the magnet seat is the magnet seat of five metals material or the magnet seat of plastic material.

Furthermore, in the structure that the PCB substrate adopts iron pieces and magnetic components to adsorb and position, each iron piece is arranged at four corners of the PCB substrate.

Furthermore, in the PCB substrate adopting an iron piece and magnetic component adsorption positioning structure, each group of magnetic components is magnetically connected with one iron piece in a non-contact manner.

Compared with the prior art, the embodiment of the utility model provides a PCB base plate adopts ironware and magnetic component to adsorb location structure, through set up a plurality of ironware and a plurality of magnetic component of group between PCB base plate and bottom plate, wherein, the ironware is fixed on the PCB base plate, and magnetic component fixes on the bottom plate. When installing the PCB base plate on the bottom plate, only need to connect ironware through magnetic component magnetism, need not to set up the bottom plate reference column on the bottom plate, alright realize the location and prevent slow-witted function, the post-processing degree of difficulty of bottom plate has been reduced, the degree of accuracy of PCB base plate installation has been improved, and processing cost and material cost have been saved, need not to design accuse deep hole on the PCB board simultaneously, only need to fix ironware on the PCB base plate, very big reduction the processing cost of PCB base plate, the wire-wound degree of difficulty of keeping away of PCB base plate has been reduced, still can reduce the sheet layer of PCB base plate in certain degree simultaneously.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic view of a structure of a PCB substrate using an iron member and a magnetic assembly for adsorption and positioning according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a PCB substrate according to an embodiment of the present invention;

fig. 3 is a partial schematic view of a PCB substrate adopting an iron member and magnetic component adsorption positioning structure provided by an embodiment of the present invention;

fig. 4 is a schematic structural view of a magnet holder according to an embodiment of the present invention;

fig. 5 is a cross-sectional view of a magnet holder according to an embodiment of the present invention;

fig. 6 is a schematic view of a structure of a PCB substrate using an iron member and a magnetic assembly for adsorption and positioning according to another embodiment of the present invention;

fig. 7 is a schematic structural diagram of a PCB substrate according to another embodiment of the present invention;

fig. 8 is a schematic partial structural view of a PCB substrate according to an embodiment of the present invention;

fig. 9 is a schematic view of a partial structure of a PCB substrate according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present application, the term "some embodiments" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic diagram of a structure of a PCB substrate using an iron member and a magnetic component for adsorption positioning according to an embodiment of the present invention; fig. 2 is a schematic structural diagram of a PCB substrate according to an embodiment of the present invention. As shown in fig. 1-2, a PCB substrate adopts an iron member and magnetic component adsorption positioning structure, which includes:

a base plate 10;

the iron pieces 201 are fixed on the PCB substrate 20;

the magnetic assemblies 101 are arranged between the iron piece 201 and the bottom plate 10, and are fixed on the bottom plate 10;

the magnetic assembly 101 is magnetically connected with the iron member 201, so that the PCB substrate 20 is attracted and positioned on the bottom plate 10.

The embodiment of the utility model provides a PCB base plate 20 adopts ironware 201 and magnetic component 101 to adsorb location structure, mainly is applied to in the big straight following formula LCD TV of size or the commercial display, through set up a plurality of ironware 201 and a plurality of magnetic component 101 of group between PCB base plate 20 and bottom plate 10, wherein, ironware 201 is fixed on PCB base plate 20, and magnetic component 101 is fixed on bottom plate 10. When installing PCB base plate 20 on bottom plate 10, only need through magnetic component 101 magnetism connection ironware 201, need not to set up bottom plate 10 reference column on bottom plate 10, alright realize the location and prevent slow-witted function, reduced the post-processing degree of difficulty of bottom plate 10, improved the degree of accuracy of PCB base plate 20 installation, convenience when having improved PCB base plate 20 and bottom plate 10 installation to processing cost and material cost have been saved. In addition, the PCB substrate 20 can eliminate the controlled deep hole, so that the board layer of the PCB substrate 20 can be reduced to a certain extent, the risk of designing and routing is reduced, and the processing cost of the PCB substrate 20 is reduced.

Specifically, a Min-LED array is arranged on one end surface of the PCB substrate 20, and a plurality of iron pieces 201 are fixed on the other end surface. The iron piece 201 may be directly welded on the PCB substrate 20, the iron piece 201 may be an iron sheet with a certain thickness, the thickness of the iron piece 201 may be selected according to practical applications, and the specific thickness is not specifically limited in this embodiment.

It can be understood that, the base plate 10 may be mounted with one PCB substrate 20, or may be mounted with a plurality of PCB substrates 20, and the number of the PCB substrates 20 mounted on the base plate 10 may be selected according to practical applications, and is not specifically limited in this embodiment.

In addition, a plurality of sets of magnetic assemblies 101 may be disposed on the bottom plate 10, or only one set of magnetic assemblies 101 may be disposed, each set of magnetic assemblies 101 may be magnetically connected to one or more iron pieces 201, and one or more iron pieces 201 may be welded to each PCB substrate 20.

It should be noted that the PCB substrate 20 is mounted on the bottom plate 10 to achieve the positioning fool-proof function, which is unrelated to the number of the magnetic assemblies 101 disposed on the bottom plate 10 and the number of the iron pieces 201 welded on each PCB substrate 20, and is not specifically limited in the embodiment of the present application. In the embodiment of the present application, it is preferable that a group of magnetic assemblies 101 is magnetically connected to an iron member 201, so that the PCB substrate 20 is mounted on the bottom plate 10 to achieve the positioning fool-proof function.

In some embodiments, the magnetic assembly 101 includes a magnet seat 1011 and a magnet 1012, and the magnet 1012 is fixed to the base plate 10 by the magnet seat 1011. The magnet base 1011 may be integrally formed with the base plate 10, or may be detachably fixed to the base plate 10, and the magnet 1012 may be attached to the magnet base 1011 by adsorption or fastening.

Specifically, please refer to fig. 3, fig. 3 is a partial schematic view of a positioning structure for the PCB substrate using an iron member and a magnetic component for adsorption according to an embodiment of the present invention. As shown in fig. 3, the magnet holder 1011 can be fixed to the base plate 10 by a screw or a snap to achieve a detachable fixed connection with the base plate 10. The bottom plate 10 is provided with a protrusion 1014 integrally formed with the bottom plate 10, and the magnet seat 1011 is detachably and fixedly connected to the protrusion 1014 through a screw or a buckle, so that the magnet seat 1011 is detachably and fixedly connected to the bottom plate 10.

In some embodiments, as shown in fig. 3, 4 and 5, the magnet base 1011 has an open cavity, and the magnet 1012 is disposed in the open cavity. Wherein, the magnet 1012 can be fixed in the open cavity by adsorption or buckling. When the PCB substrate 20 is mounted on the bottom plate 10, one magnet 1012 is magnetically connected to one iron piece 201 on the PCB substrate 20, and the iron piece 201 is directly embedded into the opening cavity and magnetically connected to the magnet 1012, so as to realize the positioning fool-proofing function in the opening cavity.

Meanwhile, the magnet 1012 may be directly magnetically connected to the iron member 201 in a contact manner, or may be magnetically connected to the iron member 201 in a non-contact manner. In this embodiment, the magnet 1012 and the iron 201 are magnetically connected in a non-contact manner, so that a non-contact type magnetic connection between one set of magnetic assemblies 101 and one iron 201 is realized.

In the embodiment shown in fig. 3, 4 and 5, the open cavity comprises an inner cavity 101a and an outer cavity 101b, the inner cavity 101a is communicated with the outer cavity 101b, and the magnet 1012 is fixedly connected with the magnet base 1011 in the inner cavity 101 a. The outer cavity 101b and the inner cavity 101a are both cylindrical cavities, and the magnet 1012 is fixed in the inner cavity 101a in an adsorption or buckling manner.

In a specific implementation process, the diameter of the inner cavity 101a is smaller than that of the outer cavity 101b, and the height of the open cavity is at least 0.5 mm higher than that of the magnet 1012, so that when the PCB substrate 20 is mounted on the bottom plate 10, the iron 201 can be magnetically connected with the magnet 1012 in the outer cavity 101b, and meanwhile, the iron 201 can move back and forth and left and right in the outer cavity 101b, so as to slightly adjust the mounting position of the PCB substrate 20. In addition, the height of the magnet 1012 may be equal to the height of the inner cavity 101a, may also be smaller than the height of the inner cavity 101a, and may also be higher than the height of the inner cavity 101a, only the height of the open cavity is at least 0.5 mm higher than the height of the magnet 1012, so that after the iron member 201 is magnetically connected with the magnet 1012 in the open cavity, the PCB substrate 20 is attracted and positioned at a predetermined position.

In some embodiments, the magnet holder 1011 may be a pin-shaped magnet holder 1011; the magnet seat 1011 can be the magnet seat 1011 of five metals material or the magnet seat 1011 of plastic material. The lower end of the magnet seat 1011 can be configured as a thread 1013, and the bottom plate 10 can be configured with a screw hole with a corresponding size, so as to realize the detachable and fixed connection between the magnet seat 1011 and the bottom plate 10.

In some embodiments, one iron 201 is disposed at each of four corners of each PCB substrate 20, and a set of magnetic components 101 is disposed at a corresponding position of the bottom plate 10, that is, one iron 201 is magnetically connected to a set of magnetic components 101. When the PCB substrate 20 is mounted on the bottom plate 10, the iron pieces 201 at the four corners of the PCB substrate 20 are magnetically connected to the magnetic assembly 101 on the corresponding bottom plate 10, and the iron pieces 201 are fastened in the magnetic assembly 101, so that the PCB substrate 20 can be mounted. In addition, in order to further ensure the positioning and fool-proofing of the PCB substrate 20 mounted on the bottom plate 10, an iron member 201 needs to be welded on four edges of each PCB substrate 20, and a set of magnetic assemblies 101 is disposed at corresponding positions on the bottom plate 10.

In some embodiments, as shown in fig. 6 and 7, a first step structure is formed at four corners of each PCB substrate 20, a support portion is disposed on the bottom plate 10, and is disposed between the PCB substrate 20 and the bottom plate 10, and an end surface of the PCB substrate 20 supported by the support portion is parallel to a first lower step 2021 of the first step structure; the first lower step 2021 of each first step structure is located at the same horizontal plane, and the support portion is in contact with the first lower step 2021 of the first step structure, so that the bottom plate 10 can carry the PCB substrate 20.

Specifically, through the direct first stair structure that forms in four edges of every PCB base plate 20, set up the supporting part simultaneously on bottom plate 10 in order to bear PCB base plate 20, the terminal surface that the supporting part bore PCB base plate 20 is parallel with first stair 2021 of first stair structure, first stair 2021 of every first stair structure all is in same horizontal plane, and then when making PCB base plate 20 install on bottom plate 10, the supporting part can directly carry out parallel contact with all stair on PCB base plate 20, the difference in height that PCB base plate 20 supplied materials is not easy to control has been solved, the technical problem who appears the difference in height when leading to polylith PCB base plate 20 to splice, bright, dark line appears in the side visual angle of having eliminated Mini LED product, the phenomenon of light leak appears in the front visual angle.

In some embodiments, as shown in fig. 7, the PCB substrate 20 is further provided with a guide mark 203, and when the PCB substrate 20 is mounted on the base plate 10 in a splicing manner, the mounting of the Mini LED product can be performed according to the guide mark 203, so as to improve the efficiency of mounting the Mini LED product.

Specifically, as shown in fig. 8, before the PCB substrate 20 is mounted on the bottom plate 10, four corners of each PCB substrate 20 need to be processed, so that the four corners form a first step structure. The first step structure may be a section of step, the first lower step 2021 of the first step structure at each corner is formed by machining, the first step structure includes a first lower step 2021 and a first upper step, and the height difference between the first upper step and the first lower step 2021 is the same. Because the end face of the supporting part on the bottom plate 10 bearing the first step structure is parallel to the first lower step 2021 of the first step structure, after the bottom plate 10 is provided with the spliced PCB substrate 20, the requirement of the splicing flatness of the PCB substrate 20 can be met, and the phenomena that bright lines and dark lines appear at the side view angle and light leakage appears at the front view angle of the Mini LED product are eliminated.

It is understood that the first step structure can be designed as a single step, but not limited to a single step, and can also be designed as multiple steps. In order to reduce the processing cost of the PCB substrate 20 in this embodiment, the first step structure is directly designed to be a section of step, and when the bottom plate 10 is assembled and spliced with the PCB substrate 20, the supporting portion can be directly contacted with the first lower step 2021 of the first step structure to bear the PCB substrate 20, so as to solve the problem of the flatness of the PCB substrate 20 in splicing.

It can also be understood that, a single PCB substrate 20 may be mounted on the bottom plate 10, or a plurality of PCB substrates 20 may also be mounted on the bottom plate 10, the number of the PCB substrates 20 mounted on the bottom plate 10 may be selected according to practical applications, in this embodiment, a plurality of PCB substrates 20 are preferably mounted and spliced on the bottom plate 10, and the plurality of PCB substrates 20 are arranged in an array on the bottom plate 10.

In some embodiments, as shown in fig. 9, second step structures are formed at four sides of each PCB substrate 20, a second lower step 2022 of each second step structure is at the same level as a first lower step 2021 of each first step structure, and the support part is in contact with the second lower step 2022 of the second step structure. Specifically, the second step structure is formed at four sides of the PCB substrate 20, and the support portion is in parallel contact with the second lower step 2022 of the second step structure, so as to increase the carrying area of the PCB substrate 20, and further increase the stability of the PCB substrate 20 on the bottom plate 10. The first step structure and the second step structure are both designed into a section of step, the first step structure comprises a first lower step 2021 and a first upper step, the second step structure comprises a second lower step 2022 and a second upper step, and the height difference between the first upper step and the first lower step 2021 is equal to the height difference between the second upper step and the second lower step 2022. When the PCB substrate 20 is mounted on the bottom plate 10 in a splicing manner, the supporting portions on the bottom plate 10 are in parallel contact with the upper step of the first step structure and the second lower step 2022 of the second step structure, so that the stability of the PCB substrate 20 on the bottom plate 10 is increased.

It is understood that the first step structure and the second step structure may be the same or different, and may be selected according to the area on the PCB substrate 20. Since the first step structure in this embodiment is located at four corners of the PCB substrate 20, and the second step structure is located at four sides of the PCB substrate 20, the first step structure is preferably an L-shaped step structure, and the second step structure is preferably an arc-shaped step structure.

In some embodiments, the support comprises a first support 1021 and a second support 1022, the first support 1021 being in contact with a first lower step 2021 of the first step structure, the second support 1022 being in contact with a second lower step 2022 of the second step structure; the end surface of the first supporting portion 1021 bearing the PCB substrate 20 and the end surface of the second supporting portion 1022 bearing the PCB substrate 20 are all located at the same horizontal plane. Specifically, in this embodiment, the PCB substrates 20 are mounted on the bottom plate 10 in a splicing manner, and the PCB substrates 20 are arranged in an array on the bottom plate 10. In order to reduce the complexity of the processing of the base plate 10, the first supporting part 1021 is in contact with the first lower step 2021 of the first step structure to realize the bearing of one corner of four PCB substrates 20; the second supporting portion 1022 contacts the second lower step 2022 of the second step structure to realize an edge for carrying the two PCB substrates 20. In addition, when the corner of the PCB substrate 20 is overlapped with the corner of the base plate 10, the first supporting part 1021 may be directly designed at the corner of the base plate 10 and only one corner of one PCB substrate 20 needs to be loaded; when the edge of the PCB substrate 20 is overlapped with the edge of the base plate 10, the second supporting part 1022 may be directly designed at the edge of the base plate 10 and only needs to carry one edge of one PCB substrate 20.

In some specific embodiments, the first support portion 1021 includes four first support tables, each of which contacts with the first lower steps 2021 of the four first step structures to support one corner of the four PCB substrates 20; the second supporting portion 1022 includes two second supporting stages, each of which contacts the second lower steps 2022 of the two second step structures to support one side of the two PCB substrates 20. The four first supporting platforms may be integrally formed to form the first supporting portion 1021, the two second supporting platforms may be integrally formed to form the second supporting portion 1022, and the shape of each first supporting platform may be designed according to the first lower step 2021 of the first step structure, and similarly, the shape of each second supporting platform may also be designed according to the second lower step 2022 of the second step structure. In addition, the end surfaces of the bottom plate 10, on which the PCB substrate 20 is supported by all the first supporting tables and the second supporting tables, are located on the same horizontal plane.

For each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, the entire contents of which are hereby incorporated by reference into this application, except for application history documents that are inconsistent with or conflict with the contents of this application, and except for documents that are currently or later become incorporated into this application as though fully set forth in the claims below. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the present disclosure.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a PCB base plate adopts ironware and magnetic component to adsorb location structure which characterized in that includes:

a base plate;

the iron pieces are fixed on the PCB substrate;

the magnetic assemblies are arranged between the iron piece and the bottom plate and fixed on the bottom plate;

the magnetic assembly is magnetically connected with the iron piece to realize that the PCB substrates are adsorbed and positioned on the bottom plate.

2. The PCB substrate of claim 1, wherein the magnetic assembly comprises a magnet seat and a magnet, and the magnet is fixed on the bottom plate through the magnet seat.

3. The PCB substrate of claim 2, wherein the magnet holder is provided with an open cavity, and the magnet is disposed in the open cavity.

4. The PCB substrate of claim 3, wherein the open cavity comprises an inner cavity and an outer cavity, the inner cavity is communicated with the outer cavity, and the magnet is fixedly connected with the magnet holder in the inner cavity.

5. The PCB substrate of claim 4, wherein the diameter of the inner cavity is smaller than the diameter of the outer cavity.

6. The PCB substrate of claim 4, wherein the height of the open cavity is at least 0.5 mm higher than the height of the magnet.

7. The PCB substrate of claim 2, wherein the magnet holder is a nail-shaped magnet holder.

8. The PCB substrate of claim 2, wherein the magnet holder is a hardware magnet holder or a plastic magnet holder.

9. The PCB substrate of claim 1, wherein the four corners of each PCB substrate are provided with one iron member.

10. The PCB substrate of claim 1, wherein each group of magnetic assemblies is magnetically connected to one of the iron members in a non-contact manner.

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