CN217133947U

CN217133947U - Post-processing PCB substrate solves single module and single module splicing height difference structure

Info

Publication number: CN217133947U
Application number: CN202221070487.7U
Authority: CN
Inventors: 江伟芳; 游锋; 吴钊剑; 何胜斌
Original assignee: Shenzhen Zhaochi Jingxian Technology Co ltd
Current assignee: Shenzhen Zhaochi Jingxian Technology Co ltd
Priority date: 2022-05-06
Filing date: 2022-05-06
Publication date: 2022-08-05
Anticipated expiration: 2032-05-06

Abstract

The embodiment of the utility model discloses post-processing PCB base plate solves single module and single module concatenation height difference structure, and it includes: the PCB comprises a plurality of PCB substrates, wherein a first step structure is formed at four corners of each PCB substrate; the bottom plate is provided with a supporting part, the supporting part is arranged between the PCB substrate and the bottom plate, and meanwhile, the end surface of the PCB substrate borne by the supporting part is parallel to the first lower step of the first step structure; wherein, every the first step of first stair structure all is in same horizontal plane, the supporting part with the first step of first stair structure contacts, in order to realize the bottom plate bears the PCB base plate has solved the not easy control of the difference in height of PCB base plate supplied materials, appears the technical problem of difference in height when leading to polylith PCB base plate concatenation, has eliminated the side visual angle of Mini LED product and has appeared bright, dark line, and the phenomenon of light leak appears in the front visual angle.

Description

Post-processing PCB substrate structure for solving single module and single module splicing height difference

Technical Field

The utility model relates to a RGB directly shows technical field, especially relates to a post processing PCB base plate solves single module and single module concatenation height difference structure.

Background

The Mini LED is the most mature LED screen display technology after small spacing, has the characteristics of seamless splicing of the small-spacing LEDs, wide color gamut, low power, long service life and the like, and also has better protection and higher information degree.

Usually, the Mini LED product is formed by splicing a plurality of PCB substrates, and the light emitting surface of the Mini LED product is a smooth surface, so that the flatness requirement of the light emitting surface of the Mini LED product formed by splicing the plurality of PCB substrates is high.

At present, PCB base plate and bottom plate adopt magnet or screw fixation mode with PCB base plate and bottom plate direct contact usually in the trade, the height difference control that PCB base plate supplied materials is within 0.3mm simultaneously, but PCB base plate supplied materials and carry out finished product preparation in-process height difference and be difficult to control, and through the easy inflation that produces of PCB base plate behind high low temperature, lead to installing back splice position on the bottom plate and appear the height different, produce the light leak of positive visual angle, and then lead to appearing bright line after the concatenation of polylith PCB base plate, dark line, the light leak scheduling problem.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a poor structure of single module and single module concatenation height is solved to postprocessing PCB base plate aims at solving among the prior art PCB substrate mounting and appears the technical problem of unevenness on the base.

In order to solve the above problem, an embodiment of the utility model provides a post processing PCB base plate solves single module and single module concatenation height difference structure, and it includes:

the PCB comprises a plurality of PCB substrates, wherein a first step structure is formed at four corners of each PCB substrate;

the bottom plate is provided with a supporting part, the supporting part is arranged between the PCB substrate and the bottom plate, and meanwhile, the end surface of the PCB substrate borne by the supporting part is parallel to the first lower step of the first step structure;

the first lower steps of each first step structure are positioned on the same horizontal plane, and the supporting part is in contact with the first lower steps of the first step structures, so that the bottom plate bears the PCB substrate.

Further, in the post-processing of the PCB substrate to solve the problem of the single module and single module splicing height difference structure, a second step structure is formed at four edges of each PCB substrate, a second lower step of each second step structure and a first lower step of each first step structure are located on the same horizontal plane, and the support portion is in contact with the second lower step of the second step structure.

Still further, the post-processing PCB base plate solve among single module and the single module concatenation difference in height structure, the supporting part includes first supporting part and second supporting part, first supporting part with the first lower step of first stair structure contacts, the second supporting part with the second lower step of second stair structure contacts.

Still further, post-processing PCB base plate solve among single module and the single module concatenation difference in height structure, first supporting part includes four first supporting platforms, every first supporting platform and four the first step structure's first lower step contacts to bear four a corner of PCB base plate.

Furthermore, in the post-processing PCB substrate structure for solving the height difference between the single module and the single module, the second supporting portion includes two second supporting tables, and each of the second supporting tables contacts with the second lower step of the two second step structures to bear one edge of the two PCB substrates.

Furthermore, in the post-processing PCB substrate for solving the problem of the height difference structure between the single module and the single module, the end surface of the PCB substrate borne by the first supporting part and the end surface of the PCB substrate borne by the second supporting part are both located on the same horizontal plane.

Furthermore, in the post-processing PCB substrate for solving the problem of the single module and single module splicing height difference structure, a plurality of PCB substrates are arranged on the bottom plate in an array manner.

Further, the post-processing PCB base plate solve among the single module and the single module concatenation difference in height structure, still include adsorption component, adsorption component sets up the bottom plate with between the PCB base plate, and will the PCB base plate is fixed on the bottom plate.

Furthermore, post-processing PCB base plate solve among the difference in height structure of single module and single module concatenation, the adsorption component includes ironware and magnetic component, ironware is fixed on the PCB base plate, magnetic component fixes on the bottom plate, ironware with magnetic component carries out magnetism and connects, with will the PCB base plate is fixed on the bottom plate.

Furthermore, in the post-processing PCB substrate structure for solving the problem of the splicing height difference between the single module and the single module, the iron piece is magnetically connected with the magnetic assembly in a non-contact manner.

Compared with the prior art, the embodiment of the utility model provides a post processing PCB base plate solves single module and single module concatenation height difference structure, directly form first stair structure through four edges at every PCB base plate, set up the supporting part simultaneously on the bottom plate in order to bear the PCB base plate, the terminal surface that the supporting part bore the PCB base plate is parallel with the first lower step of first stair structure, the first lower step of every first stair structure all is in same horizontal plane, and then when making the PCB base plate install on the bottom plate, the supporting part can directly carry out parallel contact with all lower steps on the PCB base plate. The utility model provides a single module and single module concatenation difference in height structure are solved to postprocessing PCB base plate, have solved the difference in height wayward of PCB base plate supplied materials, appear the technical problem of difference in height when leading to polylith PCB base plate concatenation, and the side visual angle of having eliminated the Mini LED product appears bright, dark line, and the phenomenon of light leak appears in the front visual angle.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic diagram of a post-processing PCB substrate structure for solving the problem of difference in height between a single module and a single module;

fig. 2 is a schematic structural diagram of a PCB substrate in a post-processing PCB substrate solution single module and single module splicing height difference structure provided by the embodiment of the present invention;

fig. 3 is a schematic view of a partial structure of a PCB substrate in a post-processing PCB substrate solution single module and single module splicing height difference structure provided by an embodiment of the present invention;

fig. 4 is another schematic view of a partial structure of a PCB substrate in a post-processing PCB substrate solution single module and single module splicing height difference structure provided by an embodiment of the present invention;

fig. 5 is a schematic diagram of a post-processing PCB substrate structure for solving the problem of difference in height between a single module and a single module;

fig. 6 is a schematic view of a partial structure of a PCB substrate in a post-processing PCB substrate solution single module and single module splicing height difference structure according to another embodiment of the present invention;

fig. 7 is a partial schematic view of a post-processing PCB substrate according to an embodiment of the present invention, illustrating a single module and a single module splicing height difference structure;

fig. 8 is the embodiment of the utility model provides a post-processing PCB base plate solves the structure sketch map of magnet seat in single module and the poor structure of single module concatenation height.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the present application, the term "some embodiments" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as exemplary is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the invention with unnecessary detail. Thus, the present invention is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles disclosed herein.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic diagram illustrating a post-processing PCB substrate structure for solving the problem of difference in height between a single module and a single module; fig. 2 is the embodiment of the utility model provides a PCB base plate's in post-processing PCB base plate solution single module and the poor structure of single module concatenation height schematic diagram. As shown in fig. 1 and 2, a post-processing PCB substrate for solving the problem of the single module and single module splicing height difference structure includes:

the PCB comprises a plurality of PCB substrates 20, wherein a first step structure 201 is formed at four corners of each PCB substrate 20;

a bottom plate 10, wherein a support portion is arranged on the bottom plate 10, the support portion is arranged between the PCB substrate 20 and the bottom plate 10, and meanwhile, an end surface of the support portion bearing the PCB substrate 20 is parallel to the first lower step 2011 of the first step structure 201;

the first lower step 2011 of each first step structure 201 is located at the same horizontal plane, and the support portion is in contact with the first lower step 2011 of the first step structure 201, so that the bottom plate 10 bears the PCB substrate 20.

The embodiment of the utility model provides a post processing PCB base plate 20 solves single module and single module concatenation height difference structure, mainly be applied to in the big straight following formula LCD TV of size or the commercial display, through directly forming first stair structure 201 at four edges of every PCB base plate 20, set up the supporting part simultaneously on bottom plate 10 in order to bear PCB base plate 20, the terminal surface that the supporting part bore PCB base plate 20 is parallel with first stair 2011 of first stair structure 201, first stair 2011 of every first stair structure 201 all is in same horizontal plane, and then when making PCB base plate 20 install on bottom plate 10, the supporting part can directly carry out parallel contact with all stair on PCB base plate 20, the difficult control of height difference of PCB base plate 20 supplied materials has been solved, appear the technical problem of height difference when leading to polylith PCB base plate 20 to splice, the side visual angle of having eliminated the Mini LED product appears bright, Dark lines, the phenomenon of light leakage at the front viewing angle.

Specifically, as shown in fig. 3, before the PCB substrate 20 is mounted on the bottom plate 10, four corners of each PCB substrate 20 need to be processed, so that the first step structure 201 is formed at the four corners. The first stepped structure 201 may be a section of step, the first lower step 2011 of the first stepped structure 201 at each corner is formed by machining, the first stepped structure 201 includes a first lower step 2011 and a first upper step, and the height difference between the first upper step and the first lower step 2011 is the same. Because the end face of the supporting part on the bottom plate 10 bearing the first stepped structure 201 is parallel to the first lower step 2011 of the first stepped structure 201, after the bottom plate 10 is provided with the spliced PCB substrate 20, the requirement of the splicing flatness of the PCB substrate 20 can be met, and meanwhile, the phenomena that bright lines and dark lines appear at the side view angle and light leakage appears at the front view angle of a Mini LED product are eliminated.

It is understood that the first step structure 201 can be designed as a single step, but not limited to a single step, and can also be designed as multiple steps. In order to reduce the processing cost of the PCB substrate 20 in this embodiment, the first step structure 201 is directly designed to be a section of step, and when the bottom plate 10 is assembled and spliced with the PCB substrate 20, the supporting portion can be directly contacted with the first lower step 2011 of the first step structure 201 to bear the PCB substrate 20, so as to solve the problem of the flatness of the splicing of the PCB substrate 20.

It can also be understood that, a single PCB substrate 20 may be mounted on the bottom plate 10, or a plurality of PCB substrates 20 may also be mounted on the bottom plate 10, the number of the PCB substrates 20 mounted on the bottom plate 10 may be selected according to practical applications, in this embodiment, a plurality of PCB substrates 20 are preferably mounted and spliced on the bottom plate 10, and the plurality of PCB substrates 20 are arranged in an array on the bottom plate 10.

In some embodiments, as shown in fig. 2 and 4, second step structures 202 are formed at four sides of each PCB substrate 20, a second lower step 2021 of each second step structure 202 is at the same level as the first lower step 2011 of each first step structure 201, and the support portion is in contact with the second lower step 2021 of the second step structure 202. Specifically, the second step structure 202 is formed at four sides of the PCB substrate 20, and the support portion is in parallel contact with the second lower step 2021 of the second step structure 202, so as to increase the carrying area of the PCB substrate 20, and further increase the stability of the PCB substrate 20 on the bottom plate 10. The first step structure 201 and the second step structure 202 are both designed as a section of step, the first step structure 201 includes a first lower step 2011 and a first upper step, the second step structure 202 includes a second lower step 2021 and a second upper step, and a height difference between the first upper step and the first lower step 2011 is equal to a height difference between the second upper step and the second lower step 2021. When the PCB substrate 20 is mounted on the bottom plate 10 in a splicing manner, the supporting portions on the bottom plate 10 are in parallel contact with the upper step of the first step structure 201 and the second lower step 2021 of the second step structure 202, so that the stability of the PCB substrate 20 on the bottom plate 10 is increased.

It is understood that the first step structure 201 and the second step structure 202 may be the same or different in shape, and may be selected according to the area on the PCB substrate 20. Since the first step structure 201 in this embodiment is located at four corners of the PCB substrate 20, and the second step structure 202 is located at four sides of the PCB substrate 20, it is preferable that the first step structure 201 is an L-shaped step structure, and the second step structure 202 is an arc-shaped step structure in this embodiment.

In some embodiments, the supports include a first support 1011 and a second support 1012, the first support 1011 contacting the first lower step 2011 of the first step structure 201, the second support 1012 contacting the second lower step 2021 of the second step structure 202; the end surface of the first supporting portion 1011 carrying the PCB substrate 20 and the end surface of the second supporting portion 1012 carrying the PCB substrate 20 are all located on the same horizontal plane. Specifically, in this embodiment, the PCB substrates 20 are mounted on the bottom plate 10 in a splicing manner, and the PCB substrates 20 are arranged in an array on the bottom plate 10. In order to reduce the processing complexity of the base plate 10, the first supporting portion 1011 contacts the first lower step 2011 of the first step structure 201 to realize the bearing of one corner of four PCB substrates 20; the second supporting portion 1012 contacts the second lower step 2021 of the second stepped structure 202 to realize an edge for carrying the two PCB substrates 20. In addition, when the corner of the PCB substrate 20 is overlapped with the corner of the base plate 10, the first supporting portion 1011 may be directly designed at the corner of the base plate 10 and only one corner of one PCB substrate 20 needs to be carried; when the edge end of the PCB substrate 20 is overlapped with the edge end of the base plate 10, the second supporting part 1012 may be directly designed at the edge end of the base plate 10 and only needs to carry one edge of one PCB substrate 20.

In some specific embodiments, the first supporting portion 1011 includes four first supporting stages, each of which is in contact with the first lower steps 2011 of the four first step structures 201 to support one corner of the four PCB substrates 20; the second supporting portion 1012 includes two second supporting steps, each of which is in contact with the second lower steps 2021 of the two second step structures 202 to support one edge of the two PCB substrates 20. Four first supporting platforms may be integrally formed to form the first supporting portion 1011, two second supporting platforms may be integrally formed to form the second supporting portion 1012, and the shape of each first supporting platform may be designed according to the first lower step 2011 of the first stepped structure 201, and similarly, the shape of each second supporting platform may be designed according to the second lower step 2021 of the second stepped structure 202. In addition, the end surfaces of the bottom plate 10, on which the PCB substrate 20 is supported by all the first supporting tables and the second supporting tables, are located on the same horizontal plane.

In some embodiments, the post-processed PCB substrate 20 further includes an adsorption component in the structure for solving the difference between the single module and the single module splicing height, the adsorption component is disposed between the bottom plate 10 and the PCB substrate 20, and fixes the PCB substrate 20 on the bottom plate 10. Wherein, adsorption component mainly used fixes a position the PCB base plate 20 and prevents staying, and when PCB base plate 20 was installed on bottom plate 10, can directly fix PCB base plate 20 on bottom plate 10 through adsorption component, alright realize the location and prevent staying the function.

In some specific embodiments, as shown in fig. 5 and 6, the absorption assembly includes an iron member 203 and a magnetic assembly 102, the iron member 203 is fixed on the PCB substrate 20, the magnetic assembly 102 is fixed on the bottom plate 10, and the iron member 203 is magnetically connected to the magnetic assembly 102 to fix the PCB substrate 20 on the bottom plate 10. The magnet base 1021 may be integrally formed with the base plate 10, or may be detachably fixed on the base plate 10, and the magnet 1022 may be attached to the magnet base 1021 by adsorption or fastening.

Specifically, a plurality of iron pieces 203 and a plurality of groups of magnetic assemblies 102 are arranged between the PCB substrate 20 and the bottom plate 10, wherein the iron pieces 203 are fixed on the PCB substrate 20, and the magnetic assemblies 102 are fixed on the bottom plate 10. When installing PCB base plate 20 on bottom plate 10, only need through magnetic component 102 magnetism connection ironware 203, need not to set up bottom plate 10 reference column on bottom plate 10, alright realize direction and fix a position and prevent slow-witted function, reduced the post-processing degree of difficulty of bottom plate 10, improved the degree of accuracy of PCB base plate 20 installation, convenience when having improved PCB base plate 20 and bottom plate 10 installation to processing cost and material cost have been saved. In addition, the PCB substrate 20 can eliminate the controlled deep hole, so that the board layer of the PCB substrate 20 can be reduced to a certain extent, the risk of designing and routing is reduced, and the processing cost of the PCB substrate 20 is reduced.

Wherein, a Min-LED array is arranged on one end face of the PCB substrate 20, and a plurality of iron pieces 203 are fixed on the other end face. The iron piece 203 may be directly welded on the PCB substrate 20, the iron piece 203 may be an iron sheet with a certain thickness, the thickness of the iron piece 203 may be selected according to practical applications, and the specific thickness is not specifically limited in this embodiment.

In addition, a plurality of sets of magnetic assemblies 102 may be disposed on the bottom plate 10, or only one set of magnetic assemblies 102 may be disposed, each set of magnetic assemblies 102 may be magnetically connected to one or more iron pieces 203, and one or more iron pieces 203 may be welded to each PCB substrate 20.

It should be noted that the PCB substrate 20 is mounted on the bottom plate 10 to realize the positioning fool-proof function, which is unrelated to the number of the magnetic assemblies 102 disposed on the bottom plate 10 and the number of the iron pieces 203 welded on each PCB substrate 20, and is not specifically limited in the embodiment of the present application. In the embodiment of the present application, preferably, a group of magnetic assemblies 102 is magnetically connected to an iron member 203, so that the PCB substrate 20 is mounted on the bottom plate 10 to achieve the positioning fool-proof function.

In some embodiments, as shown in fig. 6, the PCB substrate 20 is further provided with a guiding mark 204, and when the PCB substrate 20 is mounted on the base plate 10 in a splicing manner, the mounting operation can be performed according to the guiding mark 204, so as to improve the efficiency of mounting the Mini LED product.

In some embodiments, as shown in fig. 7 and 8, the magnet holder 1021 is provided with an open cavity, and the magnet 1022 is disposed in the open cavity. Wherein, the magnet 1022 can be fixed in the open cavity by adsorption or snap-fit. When the PCB substrate 20 is mounted on the bottom plate 10, one magnet 1022 is magnetically connected to one iron member 203 on the PCB substrate 20, and the iron member 203 is directly embedded into the open cavity to be magnetically connected to the magnet 1022, so as to achieve the positioning foolproof function in the open cavity.

Meanwhile, the magnet 1022 may be directly magnetically connected to the iron member 203 in a contact manner, or may be magnetically connected to the iron member 203 in a non-contact manner. In this embodiment, the magnets 1022 are magnetically coupled to the iron member 203 in a non-contact manner, so that a non-contact magnetic coupling between the group of magnetic assemblies 102 and one iron member 203 is realized.

In the embodiment shown in fig. 7 and 8, the open cavity includes an inner cavity 102a and an outer cavity 102b, the inner cavity 102a is communicated with the outer cavity 102b, and the magnet 1022 is fixedly connected to the magnet holder 1021 in the inner cavity 102 a. The outer cavity 102b and the inner cavity 102a are both cylindrical cavities, and the magnet 1022 is fixed in the inner cavity 102a in an adsorption or snap-fit manner.

In a specific implementation process, the diameter of the inner cavity 102a is smaller than that of the outer cavity 102b, and the height of the open cavity is at least 0.5 mm higher than that of the magnet 1022, so that when the PCB substrate 20 is mounted on the bottom plate 10, the iron piece 203 can be magnetically connected with the magnet 1022 in the outer cavity 102b, and meanwhile, the iron piece 203 can move back and forth and left and right in the outer cavity 102b, so as to slightly adjust the mounting position of the PCB substrate 20. In addition, the height of the magnet 1022 may be equal to the height of the cavity 102a, may also be smaller than the height of the cavity 102a, and may also be higher than the height of the cavity 102a, only the height of the open cavity is at least 0.5 mm higher than the height of the magnet 1022, so that the PCB substrate 20 is attracted and positioned at a predetermined position after the iron member 203 is magnetically connected with the magnet 1022 in the open cavity.

In some embodiments, the magnet holder 1021 may be a pin-shaped magnet holder 1021; the magnet base 1021 can be a magnet base 1021 made of hardware or a magnet base 1021 made of plastic. Wherein, the lower extreme of magnet seat 1021 can set to screw thread form 1023, can set up the screw that corresponds the size on the bottom plate 10 to realize dismantling fixed connection of magnet seat 1021 and bottom plate 10.

In some embodiments, one iron member 203 is disposed at each of four corners of each PCB substrate 20, and a set of magnetic assemblies 102 is disposed at a corresponding position of the bottom plate 10, that is, one iron member 203 is magnetically connected to a set of magnetic assemblies 102. When the PCB substrate 20 is mounted on the bottom plate 10, the iron members 203 at the four corners of the PCB substrate 20 are magnetically connected to the magnetic assembly 102 on the corresponding bottom plate 10, and the iron members 203 are fastened to the magnetic assembly 102, so that the PCB substrate 20 can be mounted. In addition, in order to further ensure the positioning and fool-proofing of the PCB substrate 20 mounted on the bottom plate 10, an iron member 203 is welded on four sides of each PCB substrate 20, and a set of magnetic assemblies 102 is disposed at corresponding positions on the bottom plate 10.

For each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, the entire contents of which are hereby incorporated by reference into this application, except for application history documents that are inconsistent with or conflict with the contents of this application, and except for documents that are currently or later become incorporated into this application as though fully set forth in the claims below. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the present disclosure.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a poor structure of single module and single module concatenation height is solved to post processing PCB base plate which characterized in that includes:

2. The post-processed PCB substrate according to claim 1, wherein a second step structure is formed at four sides of each PCB substrate, a second lower step of each second step structure is at the same level as a first lower step of each first step structure, and the supporting portion is in contact with the second lower step of the second step structure.

3. The post-processed PCB substrate of claim 2, wherein the support part comprises a first support part contacting a first lower step of the first stepped structure and a second support part contacting a second lower step of the second stepped structure.

4. The post-processed PCB substrate of claim 3, wherein the first supporting portion comprises four first supporting platforms, and each first supporting platform is in contact with the first lower steps of the four first step structures to support one corner of the four PCB substrates.

5. The post-processed PCB substrate of claim 3, wherein the second supporting portion comprises two second supporting platforms, each of the second supporting platforms contacts with the second lower steps of the two second step structures to bear one edge of the two PCB substrates.

6. The post-processing PCB substrate of claim 3, wherein the end surface of the first supporting part for bearing the PCB substrate and the end surface of the second supporting part for bearing the PCB substrate are all positioned on the same horizontal plane.

7. The post-processing PCB substrate of claim 1, wherein a plurality of PCB substrates are arranged in an array on the bottom plate.

8. The post-processing PCB substrate of claim 1, further comprising an adsorption component, wherein the adsorption component is arranged between the bottom plate and the PCB substrate and fixes the PCB substrate on the bottom plate.

9. The post-processing PCB substrate of claim 8, wherein the absorption assembly comprises an iron piece and a magnetic assembly, the iron piece is fixed on the PCB substrate, the magnetic assembly is fixed on the bottom plate, and the iron piece is magnetically connected with the magnetic assembly to fix the PCB substrate on the bottom plate.

10. The post-processing PCB substrate of claim 9, wherein the iron member is magnetically connected with the magnetic assembly in a non-contact manner.