CN217182029U - Ultrahigh field intensity metallized polypropylene film structure - Google Patents

Ultrahigh field intensity metallized polypropylene film structure Download PDF

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CN217182029U
CN217182029U CN202220106845.9U CN202220106845U CN217182029U CN 217182029 U CN217182029 U CN 217182029U CN 202220106845 U CN202220106845 U CN 202220106845U CN 217182029 U CN217182029 U CN 217182029U
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layer
polypropylene film
evaporated
metal thickening
inclined transition
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肖俊
王勇平
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Foshan Kenbo Electronics Co ltd
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Foshan Kenbo Electronics Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13Energy storage using capacitors

Abstract

The utility model relates to a metallization polypropylene film structure of ultra high field intensity, including the polypropylene film, be provided with the layer of aluminizing on the polypropylene film, be provided with the metal thickening layer on the layer of aluminizing, be provided with the slope transition layer between metal thickening layer and the layer of aluminizing. This structure is provided with the metal thickening layer on evaporating the aluminium layer of plating, is provided with the slope transition layer simultaneously between metal thickening layer and the aluminium layer of evaporating plating, not only reduces the off-the-shelf loss of condenser and ESR, but also can strengthen the off-the-shelf current-resisting ability of condenser and pulse life grade, also can reduce the product volume simultaneously, increases product energy density ratio.

Description

Ultrahigh field intensity metallized polypropylene film structure
Technical Field
The utility model relates to a metallization polypropylene film structure of ultra high field intensity.
Background
The existing evaporation process for the metallized polypropylene film adopts a structural mode of evaporating zinc and aluminum by thickening the edge, wherein the width of the thickened area is generally between 3 and 10mm, the aluminum is evaporated in the rest non-thickened areas, and the square resistance is 250-400 omega/□. After evaporation, the coating is improved by adopting an oxidation resistant oil vacuum coating technologyAntioxidant capacity of 6 × 10 -4 In the high vacuum environment, the metallization coating is coated on line, thereby achieving the anti-oxidation effect.
The high energy storage pulse capacitor is produced by adopting the process at home and abroad, the conventional plating method adopts edge aluminum to prime zinc for thickening, the square resistance of the edge thickened area is 1-4 omega/□, the width of the thickened area is generally 3-10mm, aluminum is evaporated in the other non-thickened areas, the square resistance is 150 plus 250 omega/□, the highest square resistance is 250 plus 450 omega/□, however, with the high-speed development of energy storage density, the square resistance of the film evaporation plating at home and abroad is large, the larger the square resistance is, the thinner the plating layer is, when the square resistance is plated to a certain degree, the withstand voltage of the film after evaporation is ensured to be infinitely close to that of a polypropylene base film, but because the pulse energy storage capacitor adopts ultrahigh square resistance, the loss of the capacitor is too large, the through-flow capacity of a metal electrode of the capacitor is greatly reduced, the discharge current is too low, the discharge power is too low, the application of the high energy storage pulse capacitor is greatly limited.
The specific defects are as follows: firstly, the electrode sheet resistance is ultrahigh sheet resistance, and the loss of the capacitor is overlarge. The dielectric loss of the capacitor core is generally about 9% calculated according to 100 HZ. Secondly, the electrode square resistance is the super high square resistance, and the ESR of the capacitor is too large, so that the whole over-current capacity of the capacitor is poor, the capacitor is seriously heated, and the service life of the capacitor is short. (the core generates heat according to the rise of voltage, Q = I2 × ESR × t, and the heat generation amount is proportional to the equivalent series resistance, which is proportional to the dielectric loss of the capacitor core, as can be seen from the equation).
Therefore, further improvements are necessary.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an ultra high field intensity metallization polypropylene film structure to overcome the weak point among the prior art.
The ultrahigh field intensity metallized polypropylene film structure designed according to the purpose comprises a polypropylene film and is characterized in that: the polypropylene film is provided with a vapor plating aluminum layer, the vapor plating aluminum layer is provided with a metal thickening layer, and an inclined transition layer is arranged between the metal thickening layer and the vapor plating aluminum layer.
The inclined transition layer is evaporated zinc evaporated on the surface of the evaporated aluminum layer, the thickness of one side of the inclined transition layer is the same as that of the thickened metal layer, the inclined transition layer and the thickened metal layer are connected, and the thickness of the other side of the inclined transition layer is gradually reduced in a straight line mode and is connected with the surface of the evaporated aluminum layer.
The width of the inclined transition layer is 3-10mm, the sheet resistance value is 10-20 omega/□, and the sheet resistance value is gradually increased in the thickness inclination process.
The metal thickening layer is evaporated zinc evaporated on the surface of the evaporated aluminum layer, the sheet resistance of the metal thickening layer is 1-4 omega/□, and the width of the metal thickening layer is 3-8 mm.
The vapor plating aluminum layer is distributed on one side or two sides of the polypropylene film and is also provided with a remaining edge.
The vapor plating aluminum layer is distributed on one side of the polypropylene film; the metal thickening layer and the inclined transition layer are arranged in the middle position and/or the end position of the aluminum evaporation layer; the edge is arranged at the middle position and/or the end position of the evaporated aluminum layer.
The vapor plating aluminum layers are distributed on the upper surface and the lower surface of the polypropylene film; the metal thickening layer and the inclined transition layer are arranged at the end part of one diagonal of the aluminum evaporation coating on the upper and lower double surfaces; the remaining edges are respectively arranged at the other diagonal end parts of the aluminum evaporation coating on the upper and lower double surfaces.
The utility model discloses an improvement of above-mentioned structure is provided with the metal thickening layer on evaporating the layer of aluminizing, is provided with the slope transition layer simultaneously between metal thickening layer and the layer of aluminizing, not only reduces off-the-shelf loss of condenser and ESR, but also can strengthen off-the-shelf withstand current ability of condenser and pulse life grade, also can reduce the product volume simultaneously, increases product energy density ratio.
In sum, the novel plastic pipe has the characteristics of simple and reasonable structure, excellent performance, easiness in production, easiness in implementation and the like, and is high in practicability.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a second embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a third embodiment of the present invention.
Fig. 4-9 are schematic structural diagrams of different application examples.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
First embodiment
Referring to fig. 1, the ultrahigh field intensity metallized polypropylene film structure comprises a polypropylene film 1, wherein an evaporated aluminum layer 2 is arranged on the polypropylene film 1, a metal thickening layer 3 is arranged on the evaporated aluminum layer 2, and an inclined transition layer 4 is arranged between the metal thickening layer 3 and the evaporated aluminum layer 2.
The embodiment is provided with the metal thickening layer 3 on the aluminum evaporation coating 2, and the inclined transition layer 4 is arranged between the metal thickening layer 3 and the aluminum evaporation coating 2, so that the loss and ESR of the finished capacitor are reduced, the current resistance and the pulse service life grade of the finished capacitor are enhanced, the product volume is reduced, and the energy density ratio of the product is increased.
The inclined transition layer 4 is evaporated zinc evaporated on the surface of the evaporated aluminum layer 2, the thickness of one side of the inclined transition layer is the same as that of the metal thickening layer 3, the inclined transition layer and the metal thickening layer are connected, and the thickness of the other side of the inclined transition layer is gradually reduced in a straight line mode and is connected with the surface of the evaporated aluminum layer 2.
The metal thickening layer 3 and the sloped transition layer 4 of this embodiment together form a thickened region having a thickened region width L2.
The metal thickening layer 3 is evaporated zinc evaporated on the surface of the evaporated aluminum layer 2, the sheet resistance of the metal thickening layer is 1-4 omega/□, the width L1 is 3-8mm, and the metal thickening layer is a non-thickening area.
The width L2-L1 of the inclined transition layer 4 is 3-10mm, the square resistance value is 10-20 omega/□, and the square resistance value is gradually increased in the thickness inclination process.
The evaporated aluminum layer 2 is distributed on one side of the polypropylene film 1, the width L3 of the evaporated aluminum layer is larger than the width L2 of the thickened area, and meanwhile, the evaporated aluminum layer 2 is also provided with a remaining edge 5. The polypropylene film 1 has a thickness T.
The above structure can be used for manufacturing a capacitor core comprising upper and lower polypropylene films 1, wherein the width W1 of the upper polypropylene film 1 is larger than the width W2 of the lower polypropylene film 1.
The left end part and the right end part of the upper surface of the polypropylene film 1 positioned above are both provided with a metal thickening layer 3 and an inclined transition layer 4, and the middle position of the upper surface is provided with a reserved edge 5; wherein, the inclined transition layers 4 at the left end part and the right end part are respectively inclined towards the remaining edge 5 at the middle position.
The left and right ends of the upper surface of the lower polypropylene film 1 are provided with reserved edges 5, and the middle position of the upper surface is provided with a metal thickening layer 3 and two inclined transition layers 4; wherein, the two inclined transition layers 4 are respectively inclined towards the left and right end part reserved edges 5.
The width b of the margin 5 at the middle position of the polypropylene film 1 positioned above is larger than the width b/2 of the margin 5 at the left and right end parts of the polypropylene film 1 positioned below, and the width ratio of the two is 2: 1.
and aligning the centers of the polypropylene film 1 positioned above and the polypropylene film 1 positioned below, and winding to finally manufacture the inner-string capacitor core.
As shown in fig. 4 and 6, the method can be used for manufacturing a high energy storage pulse capacitor, and the capacitor core is provided with a plurality of capacitors and is positioned inside the shell.
As shown in fig. 6 and 7, the capacitor core can be used for manufacturing medical supplies, and the capacitor core is arranged in a protective shell.
As shown in fig. 8 and 9, the capacitor core can be used for manufacturing a dc support capacitor, and is disposed inside a case.
According to 100HZ calculation, the sheet resistance of a non-thickening region is 60-100 omega/□ (the average value of the sheet resistance is about 80 omega/□), the dielectric loss of a capacitor core is generally within 0.1% by 100Hz calculation, and the withstand voltage field strength can reach 600V/um. The square resistance of the non-thickening region is 100-250 omega/□ (the average value of the square resistance is about 170 omega/□), the dielectric loss of the capacitor core is generally calculated within 0.3 percent at 100Hz, and the withstand voltage field strength can reach more than 680V/um. The sheet resistance of the non-thickening region is 220-350 omega/□ (the average value of the sheet resistance is about 270 omega/□), the dielectric loss of the capacitor core is generally calculated within 0.5 percent at 100Hz, and the withstand voltage field strength can reach above 790V/um.
From the aforesaid can, this structure not only reduces the off-the-shelf loss of condenser and ESR, can also strengthen the off-the-shelf current resistance of condenser and pulse life grade simultaneously, and the practicality is strong.
Second embodiment
Referring to fig. 2, the present ultra-high field metallized polypropylene film structure differs from the first embodiment in that: the polypropylene film 1 for manufacturing the capacitor core is provided with two, wherein the width of the polypropylene film 1 positioned at the upper part is the same as that of the polypropylene film 1 positioned at the lower part, and the two are W.
The left end part of the upper surface of the polypropylene film 1 positioned above is provided with a metal thickening layer 3 and an inclined transition layer 4, and the right end of the upper surface is provided with a reserved edge 5; wherein, the inclined transition layer 4 at the left end part inclines towards the left edge 5 at the right end part.
The right end part of the upper surface of the lower polypropylene film 1 is provided with a metal thickening layer 3 and an inclined transition layer 4, and the left end of the upper surface is provided with a reserved edge 5; wherein, the inclined transition layer 4 at the right end part inclines towards the left edge 5 at the left end part.
The width of the left end margin 5 of the polypropylene film 1 positioned above is the same as the width of the left end margin 5 of the polypropylene film 1 positioned below, and the widths are both b.
And aligning the polypropylene film 1 positioned above and the polypropylene film 1 positioned below left and right, and winding to finally manufacture the inner-string capacitor core.
The other parts not described are the same as those of the first embodiment.
Third embodiment
Referring to fig. 3, the present ultra-high field metallized polypropylene film structure differs from the first embodiment in that: the polypropylene film 1 for manufacturing the capacitor core is provided with two, wherein the width of the polypropylene film 1 positioned at the upper part is the same as that of the polypropylene film 1 positioned at the lower part, and the two are W.
The left end part of the upper surface of the polypropylene film 1 positioned above is provided with a metal thickening layer 3 and an inclined transition layer 4, and the right end of the upper surface is provided with a reserved edge 5; wherein, the inclined transition layer 4 at the left end part inclines towards the left edge 5 at the right end part.
The right end part of the lower surface of the polypropylene film 1 positioned above is provided with a metal thickening layer 3 and an inclined transition layer 4, and the left end of the lower surface is provided with a reserved edge 5; wherein, the inclined transition layer 4 at the right end part inclines towards the left edge 5 at the left end part.
The right end part of the upper surface of the lower polypropylene film 1 is provided with a metal thickening layer 3 and an inclined transition layer 4, and the left end of the upper surface is provided with a reserved edge 5; wherein, the inclined transition layer 4 at the right end part inclines towards the left edge 5 at the left end part.
The left end part of the lower surface of the polypropylene film 1 positioned below is provided with a metal thickening layer 3 and an inclined transition layer 4, and the right end of the lower surface is provided with a reserved edge 5; wherein, the inclined transition layer 4 at the left end part inclines towards the left edge 5 at the right end part.
The metal thickening layers 3 are the same in width, the inclined transition layers 4 are the same in width, and the reserved edges 5 are the same in width.
The upper polypropylene film 1 and the lower polypropylene film 1 are overlapped and then wound to be overlapped with each other as shown in figure 3, two films are wound by misalignment of 0.8-1.0mm to be overlapped and wound, an electrode layer is formed at the edge of a thickening area, the wound coating is overlapped in the mode, a vapor deposition layer is thickened, namely, an aluminum foil is clamped between the two polypropylene films 1, the overcurrent capacity of the capacitor is improved, the heat dissipation capacity of the capacitor core is improved, and the heat generated in the capacitor core can be quickly taken out after the two-sided vapor deposition film coatings are overlapped.
In the embodiment, the sheet resistance of the non-thickened region is 60-100 omega/□ (the average value of the sheet resistance is about 80 omega/□) calculated according to 100HZ, the dielectric loss of the capacitor core is generally within 0.1% calculated according to 100Hz, and the withstand voltage field strength can reach 600V/um. The square resistance of the non-thickening region is 100-250 omega/□ (the average value of the square resistance is about 170 omega/□), the dielectric loss of the capacitor core is generally calculated within 0.3 percent, and the withstand voltage field strength can reach more than 750V/um. The square resistance of the non-thickening region is 220-350 omega/□ (the average value of the square resistance is about 270 omega/□), the dielectric loss of the capacitor core is generally calculated within 0.5 percent, and the withstand voltage field strength can reach more than 800V/um.
The other parts not described are the same as those of the first embodiment.
The foregoing is a preferred embodiment of the present invention showing and describing the basic principles, main features and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are intended to illustrate the principles of the invention, but rather that various changes and modifications may be made without departing from the spirit and scope of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims (7)

1. An ultra-high field strength metallized polypropylene film structure comprising a polypropylene film (1) characterized by: the polypropylene film (1) is provided with an evaporated aluminum layer (2), the evaporated aluminum layer (2) is provided with a metal thickening layer (3), and an inclined transition layer (4) is arranged between the metal thickening layer (3) and the evaporated aluminum layer (2).
2. The ultra-high field metallized polypropylene film structure of claim 1, wherein: the inclined transition layer (4) is evaporated zinc evaporated on the surface of the evaporated aluminum layer (2), the thickness of one side of the inclined transition layer is the same as that of the metal thickening layer (3), and the inclined transition layer and the metal thickening layer are connected, and the thickness of the other side of the inclined transition layer is gradually reduced in a straight line and is connected with the surface of the evaporated aluminum layer (2).
3. The ultra-high field metallized polypropylene film structure of claim 2, wherein: the width of the inclined transition layer (4) is 3-10mm, the square resistance value is 10-20 omega/□, and the square resistance value is gradually increased in the thickness inclination process.
4. The ultra-high field metallized polypropylene film structure of claim 1, wherein: the metal thickening layer (3) is evaporated zinc evaporated on the surface of the evaporated aluminum layer (2), the sheet resistance of the metal thickening layer is 1-4 omega/□, and the width of the metal thickening layer is 3-8 mm.
5. The ultra-high field metallized polypropylene film structure of any one of claims 1-4, wherein: the vapor plating aluminum layer (2) is distributed on one side or two sides of the polypropylene film (1) and is also provided with a margin (5).
6. The ultra-high field metallized polypropylene film structure of claim 5, wherein: the vapor plating aluminum layer (2) is distributed on one side of the polypropylene film (1); the metal thickening layer (3) and the inclined transition layer (4) are arranged in the middle position and/or the end position of the evaporated aluminum layer (2); the edge (5) is arranged at the middle position and/or the end position of the evaporated aluminum layer (2).
7. The ultra-high field metallized polypropylene film structure of claim 5, wherein: the vapor plating aluminum layers (2) are distributed on the upper and lower surfaces of the polypropylene film (1); the metal thickening layer (3) and the inclined transition layer (4) are arranged at the end part of one diagonal of the evaporated aluminum layer (2) on the upper and lower double surfaces; the remaining edges (5) are respectively arranged at the end part of the other diagonal of the evaporated aluminum layer (2) on the upper and lower surfaces.
CN202220106845.9U 2022-01-15 2022-01-15 Ultrahigh field intensity metallized polypropylene film structure Active CN217182029U (en)

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