CN217179869U - Vibration testing device for integrated circuit - Google Patents
Vibration testing device for integrated circuit Download PDFInfo
- Publication number
- CN217179869U CN217179869U CN202221103114.5U CN202221103114U CN217179869U CN 217179869 U CN217179869 U CN 217179869U CN 202221103114 U CN202221103114 U CN 202221103114U CN 217179869 U CN217179869 U CN 217179869U
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- integrated circuit
- mounting panel
- plate
- fixedly connected
- vibration
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- 230000035939 shock Effects 0.000 claims abstract description 10
- 238000005192 partition Methods 0.000 claims description 10
- 239000006260 foam Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- Vibration Prevention Devices (AREA)
Abstract
The utility model relates to the technical field of integrated circuits, and discloses a vibration testing device for integrated circuits, which comprises a box body, wherein a vibration motor is fixedly arranged in the box body, and the upper end of the vibration motor is positioned in the box body and is provided with a vibration component; the vibrations subassembly includes the mounting panel with shock dynamo output end fixed connection, the both sides fixedly connected with of mounting panel a plurality of and box inner wall fixed connection's shock spring, two boards of placing of upper end fixedly connected with of mounting panel, two board intermediate position fixedly connected with baffles of placing, this kind of integrated circuit is with vibrations testing arrangement, through setting up shock dynamo at the box internal fixation, shock dynamo's output sets up the mounting panel, the both sides of mounting panel set up a plurality of and box inner wall fixed connection's shock spring, the upper end of mounting panel sets up two and places the board, two are placed the board intermediate position and are set up the baffle, make the setting of board is placed to the accessible, be convenient for once only place a plurality of integrated circuit boards, the work efficiency of the staff has been increased.
Description
Technical Field
The utility model relates to an integrated circuit technical field specifically is a vibration testing arrangement for integrated circuit.
Background
An integrated circuit is a miniature electronic device or component, and the components such as transistor, resistor, capacitor and inductor, etc. required in a circuit and wiring are interconnected together by adopting a certain process, and then are made on a small piece or a plurality of small pieces of semiconductor wafers or medium substrates, and then are packaged in a tube shell to form a miniature structure with the required circuit function.
However, most of the existing vibration testing devices cannot simultaneously perform simultaneous vibration testing of multiple integrated circuits during the use process, which causes frequent manufacturing of workers and further reduces the working efficiency of the workers.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a vibration testing device for integrated circuit to the problem that the background art provided has been solved.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: a vibration testing device for an integrated circuit comprises a box body, wherein a vibration motor is fixedly arranged in the box body, and the upper end of the vibration motor is positioned in the box body and is provided with a vibration assembly;
the vibrations subassembly includes the mounting panel with shock dynamo output end fixed connection, the both sides fixedly connected with of mounting panel a plurality of with box inner wall fixed connection's vibrations spring, two of the upper end fixedly connected with of mounting panel place the board, two place board intermediate position fixedly connected with baffle, it is provided with fixed subassembly to place the board both sides.
Preferably, the fixing assembly comprises an L-shaped sliding plate which is located on two sides of the placing plate and is in sliding connection with the two sides of the placing plate, a bolt is connected to the L-shaped sliding plate in a threaded mode, and the bolt penetrates through one end of the L-shaped sliding plate and is rotatably connected with a pushing plate which is in sliding connection with the L-shaped sliding plate.
Preferably, place the board both ends and set up the spacing hole that runs through L type slide, it is provided with the gag lever post to slide in the spacing hole, the gag lever post is located and places the equal threaded connection in board both ends and has the screw ring.
Preferably, the placing plate is fixedly connected with two cushion blocks positioned at two sides of the partition plate.
Preferably, rubber layers are fixedly connected to two sides of the partition plate.
Preferably, the side of the push plate, which is positioned on the partition plate, is glued with a foam layer, and the foam layer is provided with anti-skid grains.
(III) advantageous effects
Compared with the prior art, the utility model discloses possess following beneficial effect:
1. this kind of integrated circuit is with vibrations testing arrangement through at the internal fixed shock dynamo that sets up of box, shock dynamo's output sets up the mounting panel, and the both sides of mounting panel set up a plurality of and box inner wall fixed connection's vibrations spring, and the upper end of mounting panel sets up two and places the board, and two are placed the board intermediate position and are set up the baffle for the setting of board is placed to the accessible, are convenient for once only place a plurality of integrated circuit boards, have increased staff's work efficiency.
2. This kind of integrated circuit is with vibrations testing arrangement sets up L type slide through placing board both sides, sets up the bolt on the L type slide, and the bolt runs through L type slide one end and rotates the connection push pedal for the setting of accessible push pedal is convenient for pressurize fixedly a plurality of integrated circuit boards, avoids in vibrations in-process integrated circuit board and places the board and break away from, causes integrated circuit board's damage.
Drawings
FIG. 1 is a schematic view of the overall front cross-sectional structure of the present invention;
FIG. 2 is a schematic view of the sectional structure of the present invention in a partial state;
FIG. 3 is a schematic view of the structure of the present invention in a partial state;
fig. 4 is a schematic view of another partial front view structure of the present invention;
fig. 5 is an enlarged structural diagram of a in fig. 4.
In the figure: 1. a box body; 2. vibrating a motor; 3. a vibration assembly; 301. mounting a plate; 302. vibrating the spring; 303. placing the plate; 304. a partition plate; 305. a rubber layer; 306. cushion blocks; 4. a fixing assembly; 401. an L-shaped slide plate; 402. a bolt; 403. pushing the plate; 404. a foam layer; 405. a limiting hole; 406. a limiting rod; 407. a threaded ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in fig. 1 to 5, a vibration testing device for an integrated circuit includes a box 1, a vibration motor 2 is fixedly disposed in the box 1, and a vibration assembly 3 is disposed in the box 1 at an upper end of the vibration motor 2;
As shown in fig. 1, 2, 3, 4 and 5, the fixing assembly 4 further includes an L-shaped sliding plate 401 located at two sides of the placing plate 303 and slidably connected to the placing plate, a bolt 402 is threadedly connected to the L-shaped sliding plate 401, and the bolt 402 is rotatably connected to a push plate 403 slidably connected to the L-shaped sliding plate 401 through one end of the L-shaped sliding plate 401, so that the plurality of integrated circuit boards can be fixed by pressing through the push plate 403, and the integrated circuit boards are prevented from being separated from the placing plate 303 during a vibration process, which may cause damage to the integrated circuit boards.
As shown in fig. 1, 2, 3, 4 and 5, furthermore, two ends of the placing plate 303 are provided with a limiting hole 405 penetrating through the L-shaped sliding plate 401, a limiting rod 406 is slidably disposed in the limiting hole 405, the limiting rod 406 is located at two ends of the placing plate 303, and is in threaded connection with a threaded ring 407, so that the distance between the L-shaped sliding plate 401 and the placing plate 303 can be increased by sliding the L-shaped sliding plate 401, which is convenient for adapting to the sizes of different integrated circuit boards, and meanwhile, the limiting rod 406 is convenient for fixing the L-shaped sliding plate 401 on the placing plate 303.
As shown in fig. 2, fig. 3, fig. 4 and fig. 5, two pads 306 located on two sides of the partition 304 are fixedly connected to the placing board 303, and the pads 306 are made of rubber, so that the integrated circuit board can be conveniently placed through the arrangement of the pads 306, and the integrated circuit board is not damaged.
As shown in fig. 4, a rubber layer 305 is further fixedly connected to two sides of the spacer 304, so that the integrated circuit board can be prevented from being damaged in the process of clamping the integrated circuit board through the arrangement of the rubber layer 305.
As shown in fig. 5, further, the push plate 403 is glued to the foam layer 404 on one side of the partition plate 304, and the foam layer 404 is provided with anti-slip stripes, so that the integrated circuit board can be protected by the arrangement of the foam layer 404, and the integrated circuit board can be prevented from being damaged by extrusion.
The working principle is as follows: when the integrated circuit board vibration detection device is used, a user drives the bolt 402 to rotate in the push plate 403 by rotating the bolt 402, meanwhile, the push plate 403 is moved backwards, so that the push plate 403 slides on the placing plate 303, other push plates 403 are installed for operation, then a plurality of integrated circuit boards are placed on the cushion block 306, after the placing is completed, the bolts 402 are rotated again, the foam layer 404 on the push plate 403 is driven to abut against the integrated circuit boards, the integrated circuit boards are abutted against the rubber layer 305 on one side of the partition plate 304, the integrated circuit boards are fixed at the moment, the vibration motor 2 is started, and simultaneously, the vibration motor 2 drives the mounting plate 301 to vibrate to enable the integrated circuit boards to vibrate, so that the integrated circuit boards can carry out detection operation, when the size of the integrated circuit boards is increased, the two threaded rings 407 are rotated to separate the integrated circuit boards from the limiting rods 406, then the limiting rods 406 are pulled to separate from the limiting holes 405, pulling L type slide 401 again, drive L type slide 401 and remove in placing board 303 for spacing hole 405 on L type slide 401 misplaces with placing spacing hole 405 on board 303, then insert spacing hole 405 on L type slide 401 with gag lever post 406 again and place spacing hole 405 on board 303 in, again with the both ends threaded connection of screw ring 407 with gag lever post 406, at this moment, L type slide 401 and place the increase of distance between the board 303, can adapt to not unidimensional integrated circuit board's joint.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A vibration testing device for an integrated circuit comprises a box body (1), and is characterized in that a vibration motor (2) is fixedly arranged in the box body (1), and the upper end of the vibration motor (2) is positioned in the box body (1) and is internally provided with a vibration assembly (3);
vibrations subassembly (3) include mounting panel (301) with shock dynamo (2) output end fixed connection, the both sides fixedly connected with of mounting panel (301) a plurality of and box (1) inner wall fixed connection's vibrations spring (302), two of the upper end fixedly connected with of mounting panel (301) place board (303), two place board (303) intermediate position fixedly connected with baffle (304), it is provided with fixed subassembly (4) to place board (303) both sides.
2. The vibration testing device for the integrated circuit according to claim 1, wherein the fixing component (4) comprises an L-shaped sliding plate (401) which is located at two sides of the placing plate (303) and is slidably connected with the placing plate, a bolt (402) is connected with the L-shaped sliding plate (401) in a threaded manner, and a push plate (403) which is slidably connected with the L-shaped sliding plate (401) is rotatably connected with the bolt (402) through one end of the L-shaped sliding plate (401).
3. The vibration testing device for the integrated circuit according to claim 2, wherein two ends of the placing plate (303) are provided with limiting holes (405) penetrating through the L-shaped sliding plate (401), a limiting rod (406) is slidably arranged in the limiting holes (405), and two ends of the limiting rod (406) of the placing plate (303) are both connected with threaded rings (407) in a threaded manner.
4. The vibration testing device of claim 1, wherein two pads (306) are fixedly connected to the placing plate (303) and located on two sides of the partition (304).
5. The vibration testing apparatus for integrated circuits according to claim 1, wherein a rubber layer (305) is fixedly connected to both sides of the partition (304).
6. The vibration testing device for the integrated circuit according to claim 2, wherein the pushing plate (403) is glued with a foam layer (404) on one side of the partition plate (304), and the foam layer (404) is provided with anti-skid grains.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221103114.5U CN217179869U (en) | 2022-05-09 | 2022-05-09 | Vibration testing device for integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221103114.5U CN217179869U (en) | 2022-05-09 | 2022-05-09 | Vibration testing device for integrated circuit |
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CN217179869U true CN217179869U (en) | 2022-08-12 |
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CN202221103114.5U Active CN217179869U (en) | 2022-05-09 | 2022-05-09 | Vibration testing device for integrated circuit |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116429364A (en) * | 2023-06-13 | 2023-07-14 | 成都实时技术股份有限公司 | Test vibration device for information processing board |
CN117517924A (en) * | 2023-11-07 | 2024-02-06 | 湖北迈诺电路科技有限公司 | PCB preparation test system and process |
-
2022
- 2022-05-09 CN CN202221103114.5U patent/CN217179869U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116429364A (en) * | 2023-06-13 | 2023-07-14 | 成都实时技术股份有限公司 | Test vibration device for information processing board |
CN116429364B (en) * | 2023-06-13 | 2023-08-29 | 成都实时技术股份有限公司 | Test vibration device for information processing board |
CN117517924A (en) * | 2023-11-07 | 2024-02-06 | 湖北迈诺电路科技有限公司 | PCB preparation test system and process |
CN117517924B (en) * | 2023-11-07 | 2024-05-17 | 湖北永创鑫电子有限公司 | PCB preparation test system and process |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231214 Address after: 518110, Building 2, 101, No. 69 Guanlan Avenue, Xinhe Community, Fucheng Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Hertz Power Semiconductor Co.,Ltd. Address before: East 5th Floor, Entrepreneurship Center, No. 6 Beijing West Road, Taicang Economic Development Zone, Suzhou City, Jiangsu Province, 215400 Patentee before: Suzhou Pangu power supply Co.,Ltd. |
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TR01 | Transfer of patent right |