CN217167807U - Grinding wheel feeding device and silicon wafer thinning machine - Google Patents
Grinding wheel feeding device and silicon wafer thinning machine Download PDFInfo
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- CN217167807U CN217167807U CN202221114163.9U CN202221114163U CN217167807U CN 217167807 U CN217167807 U CN 217167807U CN 202221114163 U CN202221114163 U CN 202221114163U CN 217167807 U CN217167807 U CN 217167807U
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Abstract
The utility model provides a emery wheel feeding device and silicon chip attenuate machine, emery wheel feeding device include fixing base, grinding head, locate the fixing base with fine-tuning between the grinding head, fine-tuning includes: the first moving block is connected to the fixed seat in a sliding mode along a first direction in the horizontal direction; the second moving block is fixed on the grinding wheel main shaft and matched with the first moving block in an inclined plane; a limit guide part which enables the second moving block to move only along the up-down direction; the first driving assembly drives the first moving block to move back and forth along the first direction, and drives the second moving block to move up and down when the first moving block moves along the first direction; the grinding wheel feeding device is simple in structure, can improve the longitudinal movement precision of the grinding head, achieves high-precision movement of the grinding head in the Z-axis direction, and enables the grinding wheel feeding device to feed in a micro-scale mode.
Description
Technical Field
The utility model relates to a field of semiconductor processing production especially relates to a emery wheel feeding device and silicon chip attenuate machine.
Background
The development of the integrated circuit manufacturing process has more and more strict requirements on the quality of materials such as silicon wafers and the like, and the waviness and the thickness of the surface of the material can only be realized through a thinning process, so that a thinning machine becomes indispensable special equipment. As integrated circuits are becoming smaller, thinner and lighter, thinner silicon wafers are inevitably used in packaging.
The grinding wheel feeding device in the existing silicon wafer thinning machine is generally set as a set of motor screw mechanism for driving a grinding wheel to move up and down. However, the feeding precision of the grinding wheel driven by the motor screw mechanism is difficult to meet the existing process requirements, the micro-crack surface is easily generated on the surface of the silicon wafer, and finally the micro-crack surface is removed by a polishing process, so that the process is complex, and the final product yield is low.
In view of the above, it is desirable to provide an improved grinding wheel feeding device and silicon wafer thinning machine to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a emery wheel feeding device and have this emery wheel feeding device's silicon chip attenuate machine.
In order to realize the purpose of the utility model, the utility model adopts the following technical scheme: a grinding wheel feeding device comprises a fixed seat with a mounting hole which penetrates through the grinding wheel feeding device along the vertical direction, and a grinding head which is movably mounted in the mounting hole along the vertical direction, wherein the grinding head comprises a grinding wheel main shaft and a grinding wheel connected below the grinding wheel main shaft; the grinding wheel feeding device further comprises a fine adjustment mechanism arranged between the fixing seat and the grinding wheel spindle, and the fine adjustment mechanism comprises:
the first moving block is connected to the fixed seat in a sliding mode along a first direction in the horizontal direction, and a first inclined surface extending obliquely along the first direction is arranged on one side, far away from the fixed seat, of the first moving block along the vertical direction;
the second moving block is fixed on the grinding wheel spindle and provided with a second inclined surface opposite to and parallel to the first inclined surface, and the second inclined surface is connected with the first inclined surface in a sliding mode along the first direction;
the limiting guide piece is arranged between the second moving block and the fixed seat, so that the second moving block can only move in the vertical direction;
the first driving assembly is arranged between the fixed seat and the first moving block to drive the first moving block to move back and forth along the first direction, and when the first moving block moves along the first direction, the first driving assembly drives the second moving block to move along the up-and-down direction.
As a further improved technical scheme of the utility model, the second movable block cover is located on the emery wheel main shaft.
As a further improved technical solution of the present invention, the fine adjustment mechanism further includes a set of at least first guide rail assembly disposed between the first inclined plane and the second inclined plane, the first guide rail assembly is used to connect the second inclined plane with the first inclined plane is along the first direction sliding connection.
As a further improved technical scheme of the utility model, fine-tuning includes at least two sets ofly first guide rail set spare, at least two sets ofly first guide rail set spare is divided and is located the relative both sides of emery wheel main shaft.
As a further improved technical solution of the present invention, the fine adjustment mechanism further includes a set of at least second guide rail assemblies disposed between the first moving block and the fixing base, the second guide rail assemblies will the first moving block is followed in the first direction sliding connection on the fixing base.
As a further improved technical scheme of the utility model, the first moving block is provided with a step-down hole which is arranged in a penetrating way along the up-down direction, and the grinding wheel spindle passes through the step-down hole; the fine adjustment mechanism comprises at least two groups of second guide rail assemblies, and the at least two groups of second guide rail assemblies are respectively arranged on two opposite sides of the grinding wheel spindle.
As the utility model discloses further modified technical scheme, spacing guiding piece is the guide rail set spare.
As a further improved technical solution of the present invention, the fixing seat includes a horizontal portion and a vertical portion connected to one end of the horizontal portion, and the first direction is perpendicular to a plane where the vertical portion is located; the first inclined plane extends obliquely upwards from one end, close to the vertical portion, of the first moving block to the direction far away from the vertical portion.
As the utility model discloses further modified technical scheme, emery wheel feeding device still include the stand, connect in the stand with second drive assembly between the fixing base, second drive assembly is used for the drive the fixing base reciprocates.
In order to realize the above object, the utility model also provides a silicon chip thinning machine, including foretell emery wheel feeding device.
The utility model has the advantages that: the utility model provides a emery wheel feeding device, through setting up fine-tuning in addition, just through setting up first movable block and the second movable block of mutual inclined plane complex in the fine-tuning, will the lateral motion of first movable block converts the longitudinal movement of second movable block into, in order to drive the grinding head vertically feeds. The grinding head feeding device is simple in structure and capable of improving the longitudinal movement precision of the grinding head, the grinding head moves in the Z-axis direction in a high-precision mode, the grinding wheel feeding device can feed in a micro mode, accordingly, the stability of a thinning process can be improved, stress cracks on the surface of a silicon wafer are reduced, the yield of products is improved, and the quality of the products is improved.
Drawings
Fig. 1 is a schematic structural view of a grinding wheel feeding device according to an embodiment of the present invention;
figure 2 is a partially exploded view of the grinding wheel feed apparatus shown in figure 1;
Detailed Description
The present invention will be described in detail with reference to the embodiments shown in the drawings, and reference is made to fig. 1 to 2 for illustrating a preferred embodiment of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, not all embodiments, and that other embodiments obtained from these embodiments will fall within the scope of protection of the present invention for a person of ordinary skill in the art without inventive step.
It is to be noted that the terms first, second, third and the like in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated; furthermore, unless expressly stated or limited otherwise, the term "coupled" is intended to be inclusive, i.e., that a connection may be direct or indirect via intermediate media, either permanent or flexible, or may be detachable or integral. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, a grinding wheel feeding device 10 according to an embodiment of the present invention is shown, the grinding wheel feeding device 10 is used for driving a grinding wheel 22 to press down to grind and thin a silicon wafer on a supporting workpiece.
The grinding wheel feeding device 10 comprises a fixed seat 1 with a mounting hole 11 which is arranged in a penetrating manner along the vertical direction, a grinding head 2 which is movably mounted in the mounting hole 11 along the vertical direction, and a fine adjustment mechanism 3 which is arranged between the fixed seat 1 and the grinding head 2. In the fine grinding stage of the silicon wafer, the fine adjustment mechanism 3 controls the grinding head 2 to perform Z-axis micro-feeding, so that the feeding precision of the grinding wheel feeding device 10 is improved, the stability of the thinning process is improved, the product yield is improved, the product quality is improved, stress cracks on the surface of the silicon wafer can be reduced, and even the subsequent polishing process is omitted, thereby further shortening the thinning process flow.
Specifically, the grinding head 2 includes a grinding wheel spindle 21, and a grinding wheel 22 connected below the grinding wheel spindle 21. In the process of grinding the silicon wafer, the grinding wheel spindle 21 drives the grinding wheel 22 to rotate so as to grind and thin the silicon wafer on the bearing workpiece.
The grinding wheel spindle 21 may be any spindle that can be used as long as it can rotate the grinding wheel 22. Preferably, the grinding wheel spindle 21 is an air-floating spindle to realize ultra-precise grinding, and the specific structure of the air-floating spindle can follow the structure of the existing air-floating spindle. Meanwhile, it should be noted that the specific structure inside the grinding wheel spindle 21 is not shown in detail in the drawings of the specification of the present invention, and the grinding wheel spindle 21 in the prior art can be used in the specific structure inside the grinding wheel spindle 21, which is not described herein again.
The fine adjustment mechanism 3 includes a first moving block 31 slidably connected to the fixed base 1 in a first direction of the horizontal direction, a second moving block 32 fixed to the grinding wheel spindle 21 and in inclined-plane engagement with the first moving block 31, a limit guide 33 enabling the second moving block 32 to move only in the up-down direction, and a first driving assembly 34 driving the first moving block 31 to move back and forth in the first direction. One side of the first moving block 31, which is far away from the fixed base 1 along the up-down direction, is provided with a first inclined surface 311 extending obliquely along the first direction, the second moving block 32 is provided with a second inclined surface 321 opposite to and parallel to the first inclined surface 311, and the second inclined surface 321 is connected with the first inclined surface 311 in a sliding manner along the first direction. When the first driving assembly 34 drives the first moving block 31 to move towards the higher end of the second inclined surface 321 along the first direction, the second moving block 32 is driven to move downwards, and the second moving block 32 drives the grinding head 2 to move downwards. I.e. the transverse movement of the first moving block 31 is converted into a longitudinal feed of the grinding head 2. The reduction ratio is controlled by controlling the inclination angles of the first inclined surface 311 and the second inclined surface 321 to improve the longitudinal movement precision of the grinding head 2, so that the grinding head 2 can move longitudinally and precisely, namely move precisely in the Z-axis direction, and the grinding wheel feeding device 10 can feed a small amount of silicon wafers, thereby improving the stability of the thinning process, reducing stress cracks on the surfaces of the silicon wafers, improving the yield of the silicon wafers, improving the quality of the silicon wafers, even omitting the subsequent polishing process, and further shortening the thinning process flow.
In one embodiment, the first moving block 31 may move 5mm in the first direction, and the second moving block 32 may move 1mm in the up-down direction, that is, the reduction ratio is 5: 1, the feeding precision of the Z axis can be improved to 1/5. Of course, it is understood that the inclination angles of the first inclined surface 311 and the second inclined surface 321 can be designed according to the requirement, that is, the speed reduction ratio can be designed according to the requirement to achieve different precision requirements of micro-feeding.
Specifically, the fixing base 1 includes a horizontal portion 12 and a vertical portion 13 connected to one end of the horizontal portion 12, and the mounting hole 11 is disposed through the horizontal portion 12.
Specifically, in the present embodiment, the first moving block 31 is located above the horizontal portion 12, and the second moving block 32 is located above the first moving block 31, so that the fixed base 1 can support the fine adjustment mechanism 3. Of course, this is not a limitation.
In the present embodiment, the first direction is perpendicular to a plane in which the vertical portion 13 is located. The first inclined surface 311 extends along a first direction and inclines upwards from one end of the first moving block 31 close to the vertical portion 13 to a direction far away from the vertical portion 13. In the process of fine grinding of the silicon wafer, the first driving assembly 34 drives the first moving block 31 to move in the direction away from the vertical portion 13, so as to drive the second moving block 32 to move downwards, and further drive the grinding head 2 to perform micro-feeding downwards. The installation and fixation of the structures of all parts are facilitated. Of course, this is not a limitation.
Further, the fine adjustment mechanism 3 further includes at least one set of first guide rail assembly 35 disposed between the first inclined surface 311 and the second inclined surface 321, and the first guide rail assembly 35 is configured to slidably connect the second inclined surface 321 and the first inclined surface 311 along the first direction, and is capable of limiting a direction of relative movement between the first inclined surface 311 and the second inclined surface 321.
In one embodiment, each set of the first guiding track assemblies 35 includes a first guiding track 351 disposed on one of the first inclined surface 311 and the second inclined surface 321, and at least one first guiding block 352 disposed on the other and slidably connected to the first guiding track 351, wherein the first guiding track 351 extends obliquely along the first direction. When the first moving block 31 moves in the first direction, the movement of the second moving block 32 in the horizontal direction is restricted by the stopper guide 33, so that the first guide 352 moves along the first guide rail 351 and at the same time, the second moving block is driven to move in the vertical direction. The first moving block 31 and the second moving block 32 move relatively in an interlocking manner through the first guide rail assembly 35, so that the stability of the interlocking can be enhanced, the friction of the relative movement between the first inclined surface 311 and the second inclined surface 321 can be reduced, and the feeding precision of the grinding wheel feeding device 10 can be further improved. Of course, the present invention is not limited thereto, and in other embodiments, the first guide rail assembly 35 may also be configured as other types of guide rail assemblies, such as a cross roller guide rail, and the structure of the cross roller guide rail may be the structure of the cross roller guide rail in the prior art, which is not described herein again.
In this embodiment, the fine adjustment mechanism 3 includes at least two sets of the first guide rail assemblies 35, and the at least two sets of the first guide rail assemblies 35 are respectively disposed on two opposite sides of the grinding wheel spindle 21. And each set of the first guide rail assemblies 35 includes two first guide blocks 352 arranged at intervals along the first direction. The grinding head 2 is stressed uniformly, and the feeding precision of the grinding wheel feeding device 10 is further improved.
In this embodiment, the second moving block 32 is sleeved on the grinding wheel spindle 21, that is, the second moving block 32 is integrally disposed, so that the grinding head 2 is stressed more uniformly, and the feeding precision of the grinding wheel feeding device 10 is further improved. Of course, the present invention is not limited thereto, and in other embodiments, the second moving block 32 may be provided as two sub-moving blocks which are separately arranged, and the two sub-moving blocks are fixed to two opposite sides of the grinding wheel spindle 21 so as to be fixed to the two sets of first track assemblies 35, respectively.
Further, the first moving block 31 has a relief hole 312 penetrating in the vertical direction, and the grinding wheel spindle 21 passes through the relief hole 312. That is, the first moving block 31 is also integrally provided, so that the first moving block 31 on the opposite sides of the grinding wheel spindle 21 can be moved synchronously, that is, there is no movement deviation between the structures of the first moving block 31 corresponding to the two sets of first rail assemblies 35, respectively, and the feeding accuracy of the grinding wheel feeding device 10 is further improved.
It is understood that, in the first direction, a relief space is provided between the relief hole 312 and the grinding wheel spindle 21 so as not to interfere with the grinding wheel spindle 21 when the first moving block 31 moves back and forth in the first direction.
Further, the fine adjustment mechanism 3 further includes at least one set of second track assemblies 36 disposed between the first moving block 31 and the fixed base 1. The second track assembly 36 is disposed between the first moving block 31 and the horizontal portion 12, so as to lower the first moving block 31 to be slidably connected to the fixed base 1 along the first direction.
In one embodiment, each set of the second track assemblies 36 includes a second track 361 disposed on one of the first moving block 31 and the fixed base 1, and at least one second guide 362 disposed on the other and slidably connected to the second track 361, and the second track 361 extends obliquely along the first direction. The second guide rail 361 and the second guide 362 are engaged with each other, so that the first moving block 31 can move back and forth only in the first direction. Of course, the present invention is not limited thereto, and in other embodiments, the second guide rail assembly 36 may also be configured as other types of guide rail assemblies, such as a cross roller guide rail, and the structure of the cross roller guide rail may be similar to that of the cross roller guide rail in the prior art, which is not described herein again.
In this embodiment, the fine adjustment mechanism 3 includes at least two sets of the second guide rail assemblies 36, and the at least two sets of the second guide rail assemblies 36 are respectively disposed on two opposite sides of the grinding wheel spindle 21. The stability of the movement of the first moving block 31 is enhanced, and the micro-feeding precision of the grinding wheel feeding device 10 is further improved.
Further, the limit guide 33 is disposed between the second moving block 32 and the fixed base 1. Preferably, the limit guide 33 is provided between the second moving block 32 and the vertical portion 13.
Further, the limit guide 33 is a guide rail assembly, and has a simple structure and good stability.
In an embodiment, the limit guiding element 33 includes a third guiding rail 331 disposed on one of the second moving block 32 and the fixed base 1, and a third guiding block 332 disposed on the other and slidably connected to the third guiding rail 331, and the third guiding rail 331 extends in an up-down direction. So that the first moving block 31 can move only in the up-down direction. Of course, the invention is not limited thereto, and in other embodiments, the limit guide 33 may also be configured as other types of guide rail assemblies, such as a cross roller guide rail, and the structure of the cross roller guide rail may be similar to that of the cross roller guide rail in the prior art, and thus, the description thereof is omitted.
Specifically, in the present embodiment, the limiting guides are arranged on the vertical portion 13 at intervals along the horizontal direction, so as to enhance the stability of the movement of the second moving block 32 and further improve the micro-feeding precision of the grinding wheel feeding device 10.
Further, the first driving assembly 34 is disposed between the fixed base 1 and the first moving block 31. In this embodiment, the first driving assembly 34 includes a first motor 341, a first lead screw 342 connected to an output end of the first motor 341 and extending along the first direction, and a first driving block 343 threadedly connected to the first lead screw 342, wherein the first driving block 343 is connected to the first moving block 31. When the first motor 341 is started to drive the first lead screw 342 to rotate, the first driving block 343 moves along a first direction to drive the first moving block 31 to move along the first direction. Of course, the present invention is not limited thereto, and in other embodiments, other driving structures may be adopted to drive the first moving block 31 to move along the first direction, for example, a piezoelectric ceramic, a rack and pinion structure, a hydraulic driving structure, etc., as long as the first moving block 31 can be driven to move along the first direction, which is within the scope of the present invention.
Specifically, the first motor 341 is fixed to the vertical portion 13, which simplifies the fixing structure of the first driving assembly 34.
Further, the grinding wheel feeding device 10 further comprises an upright post 4 and a second driving assembly 5 connected between the upright post 4 and the fixed seat 1, wherein the second driving assembly 5 is used for driving the fixed seat 1 to move up and down to drive the grinding head 2 to move up and down. In the coarse grinding stage of the silicon wafer, the second driving component 5 drives the fixing base 1 to move downwards, and the grinding head 2 is driven to press downwards to perform coarse grinding on the silicon wafer. In the fine grinding stage of the silicon wafer, the grinding head 2 is subjected to Z-axis micro-feeding through the micro-adjusting mechanism 3 according to specific requirements, so that microcracks of the silicon wafer are avoided, and the grinding precision of the silicon wafer is improved.
Specifically, the second driving assembly 5 includes a second motor 51 fixed on the upright post 4, a second lead screw 52 connected to the second motor 51 and extending in the vertical direction, a second driving block 53 fixed on the fixing base 1 and in threaded fit with the second lead screw 52, slide rails 54 disposed on the fixing base 1 and located on two opposite sides of the second lead screw 52, and a slider 55 disposed on the fixing base 1 and engaged with the slide rails 54. The slide rail 54 extends in the up-down direction. When the second motor 51 is started to drive the second lead screw 52 to rotate, the sliding block 55 moves up and down along the sliding rail 54 to limit the rotation of the fixing base 1, so that the second driving block 53 can only move up and down relative to the second lead screw 52 to drive the fixing base 1 to move up and down.
Further, the utility model also provides a silicon chip thinning machine, silicon chip thinning machine includes foretell emery wheel feed arrangement 10.
The structure of the grinding wheel feeding device 10 is as described above, and will not be described herein.
To sum up, the utility model provides a emery wheel feeding device 10 is through setting up fine-tuning 3 in addition, just through setting up first movable block 31 and the second movable block 32 of mutual inclined plane complex in the fine-tuning 3, will the lateral motion of first movable block 31 converts the longitudinal movement of second movable block 32 into, in order to drive grinding head 2 vertically feeds. Simple structure, just, can promote the fore-and-aft motion precision of grinding head 2 realizes grinding head 2 makes at fore-and-aft high-precision motion, the high-precision removal of Z axle direction promptly emery wheel feeding device 10 can the trace feed to, can promote the stability of attenuate technology, the stress crack on reducible silicon chip surface promotes the product yield, improves product quality, saves subsequent polishing process even, thereby further shortens the technological process of attenuate.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. A grinding wheel feeding device comprises a fixed seat with a mounting hole which penetrates through the grinding wheel feeding device along the vertical direction, and a grinding head which is movably mounted in the mounting hole along the vertical direction, wherein the grinding head comprises a grinding wheel main shaft and a grinding wheel connected below the grinding wheel main shaft; the method is characterized in that: the grinding wheel feeding device further comprises a fine adjustment mechanism arranged between the fixing seat and the grinding wheel spindle, and the fine adjustment mechanism comprises:
the first moving block is connected to the fixed seat in a sliding mode along a first direction in the horizontal direction, and a first inclined surface extending obliquely along the first direction is arranged on one side, far away from the fixed seat, of the first moving block along the vertical direction;
the second moving block is fixed on the grinding wheel spindle and provided with a second inclined surface opposite to and parallel to the first inclined surface, and the second inclined surface is connected with the first inclined surface in a sliding mode along the first direction;
the limiting guide piece is arranged between the second moving block and the fixed seat, so that the second moving block can only move in the vertical direction;
the first driving assembly is arranged between the fixed seat and the first moving block to drive the first moving block to move back and forth along the first direction, and when the first moving block moves along the first direction, the first driving assembly drives the second moving block to move along the up-and-down direction.
2. The grinding wheel feed apparatus of claim 1, wherein: the second moving block is sleeved on the grinding wheel spindle.
3. The grinding wheel feed apparatus of claim 1, wherein: the fine adjustment mechanism further comprises at least one group of first guide rail assemblies arranged between the first inclined plane and the second inclined plane, and the first guide rail assemblies are used for enabling the second inclined plane to be in sliding connection with the first inclined plane along the first direction.
4. The grinding wheel feed apparatus of claim 3, wherein: the fine adjustment mechanism comprises at least two groups of first guide rail assemblies, and the at least two groups of first guide rail assemblies are respectively arranged on two opposite sides of the grinding wheel spindle.
5. The grinding wheel feed apparatus of claim 1, wherein: the fine adjustment mechanism further comprises at least one group of second guide rail assemblies arranged between the first moving block and the fixed seat, and the second guide rail assemblies enable the first moving block to be connected to the fixed seat in a sliding mode along the first direction.
6. The grinding wheel feed apparatus of claim 5, wherein: the first moving block is provided with a yielding hole which penetrates through the first moving block along the vertical direction, and the grinding wheel spindle penetrates through the yielding hole; the fine adjustment mechanism comprises at least two groups of second guide rail assemblies, and the at least two groups of second guide rail assemblies are respectively arranged on two opposite sides of the grinding wheel spindle.
7. The grinding wheel feed apparatus of claim 1, wherein: the limiting guide piece is a guide rail assembly.
8. The grinding wheel feed apparatus of claim 1, wherein: the fixing seat comprises a horizontal part and a vertical part connected to one end of the horizontal part, and the first direction is perpendicular to the plane of the vertical part; the first inclined plane extends obliquely upwards from one end, close to the vertical portion, of the first moving block to the direction far away from the vertical portion.
9. The grinding wheel feed apparatus of claim 1, wherein: the grinding wheel feeding device further comprises an upright post and a second driving assembly connected between the upright post and the fixed seat, and the second driving assembly is used for driving the fixed seat to move up and down.
10. The utility model provides a silicon chip attenuate machine which characterized in that: the silicon wafer thinning machine comprises the grinding wheel feeding device of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221114163.9U CN217167807U (en) | 2022-05-10 | 2022-05-10 | Grinding wheel feeding device and silicon wafer thinning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221114163.9U CN217167807U (en) | 2022-05-10 | 2022-05-10 | Grinding wheel feeding device and silicon wafer thinning machine |
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| Publication Number | Publication Date |
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| CN217167807U true CN217167807U (en) | 2022-08-12 |
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| CN202221114163.9U Active CN217167807U (en) | 2022-05-10 | 2022-05-10 | Grinding wheel feeding device and silicon wafer thinning machine |
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